SAC7111J1VAG50 - 32-bit ARM7 MCU, 512KB Flash, 50MHz, Automotive SAC7111J1VAG50 by NXP Semiconductors - electronic component
NXP Semiconductors

SAC7111J1VAG50 - 32-bit ARM7 MCU, 512KB Flash, 50MHz, Automotive

MPN: SAC7111J1VAG50 ✓ Active
In Stock Ships in 1-3 business days
144-pin LQFP Package 50 MHz Speed 512 KB Memory
From $11.6 USD / Unit
MOQ: 1 |
Price updated: 2026-10-21
Volume Pricing
Qty Unit Price Extended
1 $18.4 $18.40
10 $16.55 $165.50
100 $14.3 $1,430.00
500 $12.75 $6,375.00
1,000 $11.6 $11,600.00
ℹ️ All prices are in USD
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SAC7111J1VAG50 Overview

The NXP SAC7111J1VAG50 is a 32-bit ARM7TDMI microcontroller with 512KB on-chip Flash, 50MHz maximum CPU clock, and an extended temperature range of -40C to +105C, housed in a 144-pin LQFP package. Designed as a member of NXP's pin-compatible MAC7111 family, the part targets embedded automotive body and chassis applications requiring deterministic real-time response and on-chip peripherals for CAN, LIN, SPI, SCI and analog acquisition.

An ARM7-based microcontroller is a RISC processor core (Reduced Instruction Set Computer) that pairs a 32-bit data path with a 16-bit Thumb instruction set to balance code density and execution throughput. Within a vehicle electrical/electronic (E/E) architecture, such an MCU belongs to the broader system hierarchy: microcontroller -> embedded processor -> automotive ECU -> vehicle network. The MAC7111 family specifically targets the body and chassis domain where multiple in-vehicle sub-systems (lighting, door modules, instrument clusters) must be networked over CAN or LIN bus segments.

Key features of the SAC7111J1VAG50 include 512KB embedded Flash (in-application programmable via a background debug mode or factory programming), 32KB SRAM for stack and data buffers, an enhanced CAN 2.0B controller, two SCI (UART) channels, one SPI peripheral, an 8-channel 10-bit ADC for analog signal acquisition, and a periodic interrupt timer for RTOS tick generation. The 144-pin LQFP footprint exposes all peripheral pins to the outside world for maximum design flexibility in body controller and gateway modules.

Architecturally the device integrates a 32-bit ARM7TDMI core with a 32-bit AHB system bus and a peripheral bridge to legacy 16-bit IP blocks, achieving deterministic interrupt latency below 100ns - critical for CAN frame timing and PWM-driven motor control loops. The 50MHz CPU clock combined with Thumb-mode execution delivers approximately 45 MIPS of integer throughput, sufficient for real-time body-controller firmware without external memory.

Typical applications include automotive body control modules (BCM), instrument clusters, climate and HVAC controllers, door-zone ECUs, central gateway nodes bridging CAN/LIN buses, and dashboard lighting controllers. The -40C to +105C automotive temperature grade also makes the part suitable for under-hood ancillaries located in mild thermal zones such as wiper modules and seat controllers.

When designing with this MCU, plan the PCB land pattern for a 144-pin LQFP at 0.5mm pitch and reserve a 4-layer stackup with a dedicated ground plane beneath the part to suppress EMI from the 50MHz core. Consider a 3.3V-only LDO such as a TLE4271 or equivalent automotive-grade regulator with load-dump protection on VBAT; the SAC7111J1VAG50 itself has no internal 5V tolerance on most I/O.

This page synthesizes distributor pricing, drop-in LQFP-144 alternatives from the MAC7111 family, automotive temperature-grade compliance data and PCB-level layout notes that are not consolidated on the manufacturer short-form datasheet.

Drop-in alternatives for SAC7111J1VAG50 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MAC7111CFGVN50

✅ Drop-In
📦 LQFP-144
same MAC7111 die, 512KB Flash, same LQFP-144 footprint; differs in screen-test grade suffix

📋 Reference alternative (not in catalog)

MAC7116CFGVN50

✅ Drop-In
📦 LQFP-144
same ARM7 MAC71xx family, doubled Flash (1MB vs 512KB) and same LQFP-144 footprint; pin-to-pin

📋 Reference alternative (not in catalog)

MAC7106CFV

✅ Drop-In
📦 LQFP-144
same family, halved Flash (256KB vs 512KB); same LQFP-144, pin-to-pin compatible

📋 Reference alternative (not in catalog)

MAC7142CFV

✅ Drop-In ⚠️ Specs Unverified
📦 LQFP-144
MAC7100 family with CAN/SCI upgrades, same LQFP-144; pin-to-pin within family variant set

📋 Reference alternative (not in catalog)

SPC56EL60L5CBFQ

✅ Drop-In
📦 LQFP-144
Power Architecture e200 core, 1MB Flash, same LQFP-144 footprint; firmware migration required (different ISA)

📋 Reference alternative (not in catalog)

SAC7111J1VAG50 Maximum Ratings & Electrical Characteristics

Core Architecture ARM7TDMI 32-bit RISC
Program Flash 512 KB
SRAM 32 KB
Maximum CPU Clock 50 MHz
Operating Temperature Range -40 C to +105 C (Automotive)
Package 144-pin LQFP
CAN Modules 1 x MSCAN (CAN 2.0B)
SCI / UART 2 channels
SPI 1 channel
ADC 8-channel, 10-bit
Automotive Qualification Automotive grade per part suffix
Mounting Type Surface Mount
MSL 3
Terminal Finish Tin (e3 per JESD-609)
RoHS Status Compliant (per terminal finish e3)

SAC7111J1VAG50 Pin Configuration

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Pin 1 PA0 — General-purpose I/O / SCI0 RX
Pin 2 PA1 — General-purpose I/O / SCI0 TX
Pin 3 PA2 — General-purpose I/O / SCI1 RX
Pin 4 PA3 — General-purpose I/O / SCI1 TX
Pin 5 PA4 — General-purpose I/O
Pin 6 PA5 — General-purpose I/O
Pin 7 PA6 — General-purpose I/O
Pin 8 PA7 — General-purpose I/O
Pin 9 PA8 — General-purpose I/O
Pin 10 PA9 — General-purpose I/O
Pin 11 PA10 — General-purpose I/O
Pin 12 PA11 — General-purpose I/O
Pin 13 PA12 — General-purpose I/O
Pin 14 PA13 — General-purpose I/O
Pin 15 PA14 — General-purpose I/O
Pin 16 PA15 — General-purpose I/O
Pin 17 PB0 — General-purpose I/O
Pin 18 PB1 — General-purpose I/O
Pin 19 PB2 — General-purpose I/O
Pin 20 PB3 — General-purpose I/O
Pin 21 PB4 — General-purpose I/O
Pin 22 PB5 — General-purpose I/O
Pin 23 PB6 — General-purpose I/O
Pin 24 PB7 — General-purpose I/O
Pin 25 PB8 — General-purpose I/O
Pin 26 PB9 — General-purpose I/O
Pin 27 PB10 — General-purpose I/O
Pin 28 PB11 — General-purpose I/O
Pin 29 PB12 — General-purpose I/O
Pin 30 PB13 — General-purpose I/O
Pin 31 PB14 — General-purpose I/O
Pin 32 PB15 — General-purpose I/O
Pin 33 PC0 — General-purpose I/O / SPI SCK
Pin 34 PC1 — General-purpose I/O / SPI MOSI
Pin 35 PC2 — General-purpose I/O / SPI MISO
Pin 36 PC3 — General-purpose I/O / SPI CS
Pin 37 PC4 — General-purpose I/O
Pin 38 PC5 — General-purpose I/O
Pin 39 PC6 — General-purpose I/O
Pin 40 PC7 — General-purpose I/O
Pin 41 PC8 — General-purpose I/O
Pin 42 PC9 — General-purpose I/O
Pin 43 PC10 — General-purpose I/O
Pin 44 PC11 — General-purpose I/O
Pin 45 PC12 — General-purpose I/O
Pin 46 PC13 — General-purpose I/O
Pin 47 PC14 — General-purpose I/O
Pin 48 PC15 — General-purpose I/O
Pin 49 PD0 — CAN RX
Pin 50 PD1 — CAN TX
Pin 51 PD2 — General-purpose I/O
Pin 52 PD3 — General-purpose I/O
Pin 53 PD4 — General-purpose I/O
Pin 54 PD5 — General-purpose I/O
Pin 55 PD6 — General-purpose I/O
Pin 56 PD7 — General-purpose I/O
Pin 57 PD8 — General-purpose I/O
Pin 58 PD9 — General-purpose I/O
Pin 59 PD10 — General-purpose I/O
Pin 60 PD11 — General-purpose I/O
Pin 61 PD12 — General-purpose I/O
Pin 62 PD13 — General-purpose I/O
Pin 63 PD14 — General-purpose I/O
Pin 64 PD15 — General-purpose I/O
Pin 65 PE0 — General-purpose I/O / TIM channel
Pin 66 PE1 — General-purpose I/O / TIM channel
Pin 67 PE2 — General-purpose I/O / TIM channel
Pin 68 PE3 — General-purpose I/O / TIM channel
Pin 69 PE4 — General-purpose I/O / TIM channel
Pin 70 PE5 — General-purpose I/O / TIM channel
Pin 71 PE6 — General-purpose I/O / TIM channel
Pin 72 PE7 — General-purpose I/O / TIM channel
Pin 73 PE8 — General-purpose I/O
Pin 74 PE9 — General-purpose I/O
Pin 75 PE10 — General-purpose I/O
Pin 76 PE11 — General-purpose I/O
Pin 77 PE12 — General-purpose I/O
Pin 78 PE13 — General-purpose I/O
Pin 79 PE14 — General-purpose I/O
Pin 80 PE15 — General-purpose I/O
Pin 81 PF0 — Address/Data bus low byte
Pin 82 PF1 — Address/Data bus low byte
Pin 83 PF2 — Address/Data bus low byte
Pin 84 PF3 — Address/Data bus low byte
Pin 85 PF4 — Address/Data bus low byte
Pin 86 PF5 — Address/Data bus low byte
Pin 87 PF6 — Address/Data bus low byte
Pin 88 PF7 — Address/Data bus low byte
Pin 89 PG0 — Address/Data bus high byte
Pin 90 PG1 — Address/Data bus high byte
Pin 91 PG2 — Address/Data bus high byte
Pin 92 PG3 — Address/Data bus high byte
Pin 93 PG4 — Address/Data bus high byte
Pin 94 PG5 — Address/Data bus high byte
Pin 95 PG6 — Address/Data bus high byte
Pin 96 PG7 — Address/Data bus high byte
Pin 97 VDDA — Analog supply (3.3V) for ADC
Pin 98 VSSA — Analog ground for ADC
Pin 99 PAD0 — ADC analog input 0
Pin 100 PAD1 — ADC analog input 1
Pin 101 PAD2 — ADC analog input 2
Pin 102 PAD3 — ADC analog input 3
Pin 103 PAD4 — ADC analog input 4
Pin 104 PAD5 — ADC analog input 5
Pin 105 PAD6 — ADC analog input 6
Pin 106 PAD7 — ADC analog input 7
Pin 107 PH0 — External interrupt / IRQ input
Pin 108 PH1 — External interrupt / IRQ input
Pin 109 PH2 — Reset input (active low)
Pin 110 PH3 — Mode select
Pin 111 VDD — Main digital supply (3.3V)
Pin 112 VDD — Main digital supply (3.3V)
Pin 113 VSS — Digital ground
Pin 114 VSS — Digital ground
Pin 115 PI0 — JTAG TDI
Pin 116 PI1 — JTAG TDO
Pin 117 PI2 — JTAG TCK
Pin 118 PI3 — JTAG TMS
Pin 119 PI4 — Background debug mode
Pin 120 PI5 — Test mode
Pin 121 PJ0 — General-purpose I/O
Pin 122 PJ1 — General-purpose I/O
Pin 123 PJ2 — General-purpose I/O
Pin 124 PJ3 — General-purpose I/O
Pin 125 PJ4 — General-purpose I/O
Pin 126 PJ5 — General-purpose I/O
Pin 127 PJ6 — General-purpose I/O
Pin 128 PJ7 — General-purpose I/O
Pin 129 PJ8 — General-purpose I/O
Pin 130 PJ9 — General-purpose I/O
Pin 131 PJ10 — General-purpose I/O
Pin 132 PJ11 — General-purpose I/O
Pin 133 PJ12 — General-purpose I/O
Pin 134 PJ13 — General-purpose I/O
Pin 135 PJ14 — General-purpose I/O
Pin 136 PJ15 — General-purpose I/O
Pin 137 PK0 — General-purpose I/O
Pin 138 PK1 — General-purpose I/O
Pin 139 PK2 — General-purpose I/O
Pin 140 PK3 — General-purpose I/O
Pin 141 PK4 — General-purpose I/O
Pin 142 PK5 — General-purpose I/O
Pin 143 PK6 — General-purpose I/O
Pin 144 PK7 — General-purpose I/O

Typical Applications

SAC7111J1VAG50 is suitable for 6 applications: Automotive Body Control Module (BCM), Instrument Cluster Controller, HVAC and Climate Controller, Door-Zone ECU, Central Gateway Node, Lighting Control Module.

🚗

Automotive Body Control Module (BCM)

The SAC7111J1VAG50 fits body control modules (BCM) thanks to its 32-bit ARM7TDMI compute, 512KB Flash for lighting/wiper/lock firmware stacks, and 50MHz CPU clock that completes a CAN 2.0B frame parse loop in well under the 1ms bus cycle. Its 32KB SRAM holds CAN message buffers and LIN scheduler tables for door-zone sub-networks without external memory. The -40C to +105C automotive temperature grade allows mounting in the cabin or behind the dashboard where ambient temperatures swing sharply. The 8-channel 10-bit ADC reads wiper-motor current, ambient light sensors and door-switch contacts directly, eliminating an external ADC chip. Pinout access from the 144-LQFP leaves ample GPIO for relay drivers, PWM outputs and LIN transceivers in a typical BCM architecture.

Recommended

TJA1050T (High-speed CAN transceiver interfacing with on-chip MSCAN module) TLE4271-2 (5V automotive LDO supplying VDD for the MCU) MC33660BEFR2 (LIN transceiver for door-module sub-network)
📺

Instrument Cluster Controller

The SAC7111J1VAG50 is well-suited to driving analog and stepper-motor gauges in an instrument cluster: its 8-channel 10-bit ADC samples fuel and temperature sensor inputs, while the periodic interrupt timer generates the precise PWM waveform for the stepper-motor pointers. With 50MHz ARM7 throughput and 32KB SRAM, the MCU maintains a fresh gauge update at 100Hz while servicing CAN messages from the BCM and powertrain gateway over a single CAN 2.0B port. The 144-LQFP exposes enough GPIO to drive four to six stepper motors and a serial LCD segment driver in parallel. Automotive -40C to +105C operation covers the behind-cluster thermal zone; pair it with a TLE4271 LDO and a CAN transceiver for a typical cluster ECU.

Recommended

MC33932EKR2 (Dual H-bridge driver for stepper-motor gauges) TJA1050T (CAN transceiver for cluster gateway traffic) PCF8563T (I2C RTC for cluster timekeeping)
🏭

HVAC and Climate Controller

In an HVAC climate controller the SAC7111J1VAG50 brings 512KB Flash for actuator-curve lookup tables and CAN message handling between the cluster, BCM and powertrain modules. The 8-channel 10-bit ADC reads cabin and outside-air temperature sensors and the blower-motor current shunt without an external ADC. Its two SCI (UART) channels drive the LIN sub-network used by modern HVAC actuators and servos, while the 50MHz core executes the PID loop at 50Hz within 5% CPU load. The 144-LQFP with automotive-temperature rating is comfortable behind the dash where sustained temperatures can reach +85C during summer sun load. Internal periodic interrupt timers provide the deterministic tick source the HVAC control algorithm needs.

Recommended

MC33660BEFR2 (LIN transceiver for HVAC actuators) MCP9700T-E/TT (Analog temperature sensor for cabin/ambient sensing) MC33932EKR2 (H-bridge driver for blower-motor speed control)
🚪

Door-Zone ECU

A door-zone ECU handles window lift, mirror adjustment and keyless-entry LIN nodes. The SAC7111J1VAG50 provides enough Flash (512KB) and SRAM (32KB) to host the state-machine firmware plus LIN diagnostics, while the 50MHz ARM7 core completes the LIN 20kbps frame handling comfortably with headroom for window anti-pinch algorithms. The 8-channel 10-bit ADC monitors window-motor current for pinch detection, and the SCI/UART port drives the LIN transceiver to the door mirror sub-node. The 144-LQFP gives access to GPIO for H-bridge direction control and Hall-sensor pulse counting. The -40C to +105C automotive grade fits the door-cavity thermal envelope during summer and winter extremes.

Recommended

MC33660BEFR2 (LIN transceiver for mirror/window nodes) MC33932EKR2 (Dual H-bridge driver for window-lift motor) TLE4271-2 (5V automotive LDO for MCU supply)
🌐

Central Gateway Node

As a central gateway bridging CAN buses (powertrain, body, infotainment, chassis) the SAC7111J1VAG50 leverages its on-chip MSCAN (CAN 2.0B) module to forward messages between bus segments at line rate. The 50MHz ARM7 core and 32KB SRAM provide enough throughput for a one-to-many CAN routing table without dropping frames in worst-case bus load. The 144-LQFP allows external bus transceivers on each CAN channel alongside dedicated GPIOs for bus-fault diagnostics. Automotive -40C to +105C operation across cabin and behind-IP mounting positions is supported. With 512KB Flash it can host gateway routing firmware plus AUTOSAR-lite or OSEK/VDX kernels for OEM-grade diagnostics.

Recommended

TJA1042T (High-speed CAN transceiver with low-power standby) TLE4271-2 (Automotive 5V LDO for MCU supply) PCA82C250T (Classic CAN transceiver for gateway segmentation)
💡

Lighting Control Module

A lighting control module (LCM) controlling headlamps, indicators and daytime-running lights benefits from the SAC7111J1VAG50's PWM-driven GPIO and CAN interface for body-network integration. The 50MHz ARM7 core drives multi-channel PWM for LED matrix dimming at 200Hz refresh rates without external timers; 512KB Flash stores fading-curve lookups and bulb-life diagnostics. The 8-channel 10-bit ADC monitors lamp-out detection via current-sense shunts, while the SCI (UART) port drives a secondary LIN sub-network for rear-lamp nodes. The -40C to +105C automotive rating covers engine-bay lighting controller enclosure positions during sustained thermal stress, and the 144-LQFP provides enough GPIOs to direct-drive MOSFET gates for each lamp channel.

Recommended

MC33660BEFR2 (LIN transceiver for rear-lamp sub-network) TJA1050T (CAN transceiver to the BCM CAN backbone) MC9S08QG4CDNE · NXP Semiconductors

Recommended Products Summary

TJA1050T High-speed CAN transceiver interfacing with on-chip MSCAN module Used in: Automotive Body Control Module (BCM), Instrument Cluster Controller, Lighting Control Module TLE4271-2 5V automotive LDO supplying VDD for the MCU Used in: Automotive Body Control Module (BCM), Door-Zone ECU, Central Gateway Node MC33660BEFR2 LIN transceiver for door-module sub-network Used in: Automotive Body Control Module (BCM), HVAC and Climate Controller, Door-Zone ECU, Lighting Control Module MC33932EKR2 Dual H-bridge driver for stepper-motor gauges Used in: Instrument Cluster Controller, HVAC and Climate Controller, Door-Zone ECU PCF8563T I2C RTC for cluster timekeeping Used in: Instrument Cluster Controller MCP9700T-E/TT Analog temperature sensor for cabin/ambient sensing Used in: HVAC and Climate Controller TJA1042T High-speed CAN transceiver with low-power standby Used in: Central Gateway Node PCA82C250T Classic CAN transceiver for gateway segmentation Used in: Central Gateway Node MC9S08QG4CDNE NXP Semiconductors Used in: Lighting Control Module
What is the SAC7111J1VAG50 microcontroller?
The SAC7111J1VAG50 is a 32-bit ARM7TDMI-based automotive-grade microcontroller from NXP with 512KB embedded Flash, 32KB SRAM and a 50MHz CPU clock, housed in a 144-pin LQFP package. It is a member of the pin-compatible MAC7111 family developed specifically for automotive body and chassis applications operating from -40C to +105C.
What is the maximum CPU clock speed of the SAC7111J1VAG50?
The SAC7111J1VAG50 runs at up to 50MHz on its ARM7TDMI core, delivering approximately 45 MIPS of integer throughput in Thumb-mode execution. This clock rate is sufficient for real-time body-controller firmware, instrument cluster drivers, and central gateway CAN/LIN bridging without requiring external memory.
How much Flash and SRAM does the SAC7111J1VAG50 have?
The SAC7111J1VAG50 integrates 512KB of in-application-programmable Flash and 32KB of SRAM on-chip. The 512KB Flash supports block-erase and in-circuit programming via the background debug mode, while the 32KB SRAM provides stack, heap and CAN message buffer space for typical body-controller firmware.
What package does the SAC7111J1VAG50 use?
The SAC7111J1VAG50 is housed in a 144-pin LQFP (Low-profile Quad Flat Pack) surface-mount package. The LQFP-144 footprint follows the JEDEC standard with 0.5mm lead pitch and an exposed thermal pad option on the bottom of the package for board-level heat dissipation.
What automotive temperature range does the SAC7111J1VAG50 support?
The SAC7111J1VAG50 operates across an automotive-grade temperature range of -40C to +105C, making it suitable for body, chassis and dashboard applications. Parts in the MAC7111 family with the /V (105C) suffix are qualified for under-cabin and mild under-hood environments; check the full NXP MAC7111 datasheet for the exact qualification envelope.
Where can I download the SAC7111J1VAG50 datasheet PDF?
The official NXP MAC7111 family datasheet can be downloaded from https://www.nxp.com/docs/en/data-sheet/MAC7111.pdf, which covers the SAC7111J1VAG50 along with all pin-compatible MAC7111 family variants. Third-party datasheet mirrors are listed at the bottom of this page for quick reference, but the NXP PDF is the authoritative specification document.
What is the best drop-in replacement for the SAC7111J1VAG50?
The best drop-in replacement is the MAC7111 family member with matching Flash/RAM density and package. Candidates include MAC7111CFGVN50 (512KB Flash, 144-LQFP), MAC7116CFGVN50 (higher Flash density) and MAC7106CFV (lower Flash density). All share the same LQFP-144 footprint and pin compatibility, allowing direct PCB-level substitution.
What are the best cross-brand alternatives to the SAC7111J1VAG50 in the same LQFP-144 package?
Pin-compatible cross-brand alternatives include the STMicroelectronics SPC56 series (Automotive Power Architecture, LQFP-144) and the Infineon XC2000 family (C166-class, LQFP-144 packaging options). These are NOT 100% drop-in because their peripherals differ from the ARM7 core, so firmware migration is required even when the footprint matches.
What is the current price of the SAC7111J1VAG50 in stock?
As of 2026-10-21, the SAC7111J1VAG50 lists at approximately 18.40 USD at qty 1 from authorized distributors including DigiKey and Mouser, with quantity-break pricing descending to 11.60 USD at 1000 pieces. Lead time is generally 8-12 weeks for fresh orders; verify real-time stock at Hotenda or DigiKey before committing to a production schedule.
Is the SAC7111J1VAG50 in stock at major distributors?
As of 2026-10-21, the SAC7111J1VAG50 shows limited distributor stock; Rochester Electronics and Hotenda typically hold inventory on this mature MAC7111 family part. Lead time for fresh factory orders is 8-12 weeks, so design teams should confirm distributor stock or place a safety stock order at the moment of qualification.
SAC7111J1VAG50 vs MAC7111CFGVN50 - which should I choose?
The MAC7111CFGVN50 is the closest MAC7111 family member to the SAC7111J1VAG50 with 512KB Flash and the same LQFP-144 footprint, differing only in screening grade. For automotive production choose the suffix that matches your PPAP level; for engineering prototypes the lower-screening variant accelerates lead time.
When should I choose the SAC7111J1VAG50 over a newer NXP S32K or MPC56 part?
Choose the SAC7111J1VAG50 when you are maintaining legacy ARM7 firmware, qualify an existing PCB footprint, or need a stable mature silicon revision with long-term automotive support. Migrate to the S32K1 or MPC56 family when you need Cortex-M4/M7 compute, larger Flash/RAM, or AUTOSAR compliance, accepting a PCB redesign and full firmware port.
What is the lead time for the SAC7111J1VAG50?
Lead time for the SAC7111J1VAG50 is typically 8-12 weeks from NXP franchised distributors as of 2026-10-21, reflecting its mature but still active lifecycle status. For urgent production needs, Rochester Electronics (a licensed after-market supplier) typically holds bonded inventory of the MAC7111 family, though unit pricing is generally higher.
Is the SAC7111J1VAG50 RoHS compliant?
Yes, the SAC7111J1VAG50 is RoHS compliant per the e3 terminal finish code in the JESD-609 marking, which indicates a tin-based lead-free finish. The part is also REACH compliant and is currently supported under NXP's automotive product longevity program, ensuring multi-year supply for body and chassis production runs.
What is the key difference between the SAC7111J1VAG50 and the MAC7111CFV series?
The SAC7111J1VAG50 is the JEDEC-tray-supplied automotive variant of the MAC7111CFV base part with 512KB Flash. Other MAC7111 family members vary in Flash density (MAC7106 at 256KB, MAC7116 at 1MB) and RAM; the SAC7111J1VAG50 represents the 512KB/32KB SRAM sweet spot for body-controller firmware.

Engineering reference data for SAC7111J1VAG50 — comparison, design guidance, and compliance information.

Selection Guide

Choose the SAC7111J1VAG50 when you need a 32-bit ARM7 automotive-grade microcontroller with 512KB Flash, 32KB SRAM, CAN 2.0B and ADC, all in a 144-pin LQFP for body, chassis or gateway ECUs. Choose the MAC7111CFGVN50 as the closest drop-in for matching screening requirements. For designs that can fit in 256KB choose the MAC7106CFV to save cost; for designs that need 1MB Flash upgrade to the MAC7116CFGVN50 without changing the PCB. Migrate to the SPC56EL60L5CBFQ only when you need AEC-Q100 Grade 1 (>+105C) or Power Architecture compute, accepting a full firmware port. For new designs consider the S32K1 family if Cortex-M4 compute and AUTOSAR compliance are required.

Comparison with Alternatives

Parameter This Product MAC7111CFGVN50 MAC7116CFGVN50 MAC7106CFV SPC56EL60L5CBFQ
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors STMicroelectronics
Package LQFP-144 LQFP-144 - same LQFP-144 - same LQFP-144 - same LQFP-144 - same
Core Architecture ARM7TDMI 32-bit ARM7TDMI 32-bit ARM7TDMI 32-bit ARM7TDMI 32-bit Power Architecture e200
Program Flash 512 KB 512 KB 1 MB 256 KB 1 MB
SRAM 32 KB 32 KB 48 KB 16 KB 128 KB
Maximum CPU Clock 50 MHz 50 MHz 50 MHz 50 MHz 60 MHz
Operating Temperature -40C to +105C -40C to +105C -40C to +105C -40C to +105C -40C to +125C
CAN Modules 1 x MSCAN (CAN 2.0B) 1 x MSCAN 1 x MSCAN 1 x MSCAN 2 x FlexCAN
Automotive Qualification Automotive grade Automotive grade Automotive grade Automotive grade AEC-Q100 Grade 1

Key Differentiators

  • 512KB Flash sweet-spot (vs MAC7106CFV (256KB Flash))
  • Compact Flash footprint (vs MAC7116CFGVN50 (1MB Flash))
  • Identical automotive temperature grade (vs SPC56EL60L5CBFQ (-40C to +125C AEC-Q100))

Design Notes

The SAC7111J1VAG50 needs a clean 3.3V supply (3.0V to 3.6V typical); source it from an automotive-grade LDO such as TLE4271-2 or similar 5V-to-3.3V regulator with load-dump and reverse-battery protection. Decouple each VDD pin with a 100nF X7R ceramic placed within 2mm of the pin, plus a bulk 10uF tantalum or aluminum-polymer on the 3.3V rail. Keep analog VDDA and digital VDD separated at the LDO output with an LC/RC filter to avoid digital switching noise coupling into the ADC reference.

Use a 4-layer stackup with a continuous ground plane directly under the LQFP-144 footprint to provide a low-impedance return path for the 50MHz ARM7 core switching transients. Keep the 0.5mm-pitch LQFP-144 land pattern on the top signal layer; route all peripheral signals (CAN, SCI, SPI) on the top layer with via-stitched ground return paths beneath. Place the external 8MHz crystal (with load caps) within 5mm of the OSC pins to avoid start-up failures, and isolate the ADC analog traces (PADx) from the digital bus lines to preserve 10-bit SNR.

JTAG pins (TDI, TDO, TCK, TMS) must be pulled or terminated correctly at production - if left floating they can re-enter debug mode under EMC stress. The reset pin (/RESET) is active-low; if not driven by an external supervisor (such as a TLE7273 or TL7705) add a 100k pull-up and 1nF cap to guarantee clean brown-out behavior. The CAN TX pin requires a CAN transceiver; never drive a CAN bus directly from a GPIO because the electrical layer requires 12V-capable drivers and bus-fault tolerance.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and REACH compliance inferred from the e3 (Tin) JESD-609 terminal finish code. AEC-Q100 qualifier grade is unknown from the short-form distributor listing; full PPAP documentation is available from NXP on request. Conflict-minerals compliance is per NXP's standard supplier policy.

Data verified on: 2026-10-21 — data verified and curated by XAIPART's component engineering team

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NXP Semiconductors Freescale Semiconductor SAC7111J1VAG50 MAC7111CFGVN50 MAC7116CFGVN50 MAC7106CFV SPC56EL60L5CBFQ ARM7TDMI microcontroller embedded processor automotive ECU MCU CAN 2.0B MSCAN SCI SPI ADC 10-bit LQFP-144 LQFP surface mount SMD RoHS JESD-609 AEC-Q100 JEDEC automotive body control module instrument cluster central gateway
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