SAC7111J1VAG50 - 32-bit ARM7 MCU, 512KB Flash, 50MHz, Automotive
부품 번호: SAC7111J1VAG50 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.4 | $18.40 |
| 10 | $16.55 | $165.50 |
| 100 | $14.3 | $1,430.00 |
| 500 | $12.75 | $6,375.00 |
| 1,000 | $11.6 | $11,600.00 |
SAC7111J1VAG50 개요
An ARM7-based microcontroller is a RISC processor core (Reduced Instruction Set Computer) that pairs a 32-bit data path with a 16-bit Thumb instruction set to balance code density and execution throughput. Within a vehicle electrical/electronic (E/E) architecture, such an MCU belongs to the broader system hierarchy: microcontroller -> embedded processor -> automotive ECU -> vehicle network. The MAC7111 family specifically targets the body and chassis domain where multiple in-vehicle sub-systems (lighting, door modules, instrument clusters) must be networked over CAN or LIN bus segments.
Key features of the SAC7111J1VAG50 include 512KB embedded Flash (in-application programmable via a background debug mode or factory programming), 32KB SRAM for stack and data buffers, an enhanced CAN 2.0B controller, two SCI (UART) channels, one SPI peripheral, an 8-channel 10-bit ADC for analog signal acquisition, and a periodic interrupt timer for RTOS tick generation. The 144-pin LQFP footprint exposes all peripheral pins to the outside world for maximum design flexibility in body controller and gateway modules.
Architecturally the device integrates a 32-bit ARM7TDMI core with a 32-bit AHB system bus and a peripheral bridge to legacy 16-bit IP blocks, achieving deterministic interrupt latency below 100ns - critical for CAN frame timing and PWM-driven motor control loops. The 50MHz CPU clock combined with Thumb-mode execution delivers approximately 45 MIPS of integer throughput, sufficient for real-time body-controller firmware without external memory.
Typical applications include automotive body control modules (BCM), instrument clusters, climate and HVAC controllers, door-zone ECUs, central gateway nodes bridging CAN/LIN buses, and dashboard lighting controllers. The -40C to +105C automotive temperature grade also makes the part suitable for under-hood ancillaries located in mild thermal zones such as wiper modules and seat controllers.
When designing with this MCU, plan the PCB land pattern for a 144-pin LQFP at 0.5mm pitch and reserve a 4-layer stackup with a dedicated ground plane beneath the part to suppress EMI from the 50MHz core. Consider a 3.3V-only LDO such as a TLE4271 or equivalent automotive-grade regulator with load-dump protection on VBAT; the SAC7111J1VAG50 itself has no internal 5V tolerance on most I/O.
This page synthesizes distributor pricing, drop-in LQFP-144 alternatives from the MAC7111 family, automotive temperature-grade compliance data and PCB-level layout notes that are not consolidated on the manufacturer short-form datasheet.
드롭인 대체품: SAC7111J1VAG50 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MAC7111CFGVN50
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MAC7116CFGVN50
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MAC7106CFV
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MAC7142CFV
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
SPC56EL60L5CBFQ
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SAC7111J1VAG50 최대 정격 & 전기적 특성
| Core Architecture | ARM7TDMI 32-bit RISC |
| Program Flash | 512 KB |
| SRAM | 32 KB |
| Maximum CPU Clock | 50 MHz |
| 동작 온도 범위 | -40 C to +105 C (Automotive) |
| 패키지 | 144-pin LQFP |
| CAN Modules | 1 x MSCAN (CAN 2.0B) |
| SCI / UART | 2 channels |
| SPI | 1 channel |
| ADC | 8-channel, 10-bit |
| Automotive Qualification | Automotive grade per part suffix |
| 실장 유형 | Surface Mount |
| MSL | 3 |
| Terminal Finish | Tin (e3 per JESD-609) |
| RoHS 상태 | Compliant (per terminal finish e3) |
SAC7111J1VAG50 핀 구성
| 핀 1 | PA0 — General-purpose I/O / SCI0 RX |
| 핀 2 | PA1 — General-purpose I/O / SCI0 TX |
| 핀 3 | PA2 — General-purpose I/O / SCI1 RX |
| 핀 4 | PA3 — General-purpose I/O / SCI1 TX |
| 핀 5 | PA4 — General-purpose I/O |
| 핀 6 | PA5 — General-purpose I/O |
| 핀 7 | PA6 — General-purpose I/O |
| 핀 8 | PA7 — General-purpose I/O |
| 핀 9 | PA8 — General-purpose I/O |
| 핀 10 | PA9 — General-purpose I/O |
| 핀 11 | PA10 — General-purpose I/O |
| 핀 12 | PA11 — General-purpose I/O |
| 핀 13 | PA12 — General-purpose I/O |
| 핀 14 | PA13 — General-purpose I/O |
| 핀 15 | PA14 — General-purpose I/O |
| 핀 16 | PA15 — General-purpose I/O |
| 핀 17 | PB0 — General-purpose I/O |
| 핀 18 | PB1 — General-purpose I/O |
| 핀 19 | PB2 — General-purpose I/O |
| 핀 20 | PB3 — General-purpose I/O |
| 핀 21 | PB4 — General-purpose I/O |
| 핀 22 | PB5 — General-purpose I/O |
| 핀 23 | PB6 — General-purpose I/O |
| 핀 24 | PB7 — General-purpose I/O |
| 핀 25 | PB8 — General-purpose I/O |
| 핀 26 | PB9 — General-purpose I/O |
| 핀 27 | PB10 — General-purpose I/O |
| 핀 28 | PB11 — General-purpose I/O |
| 핀 29 | PB12 — General-purpose I/O |
| 핀 30 | PB13 — General-purpose I/O |
| 핀 31 | PB14 — General-purpose I/O |
| 핀 32 | PB15 — General-purpose I/O |
| 핀 33 | PC0 — General-purpose I/O / SPI SCK |
| 핀 34 | PC1 — General-purpose I/O / SPI MOSI |
| 핀 35 | PC2 — General-purpose I/O / SPI MISO |
| 핀 36 | PC3 — General-purpose I/O / SPI CS |
| 핀 37 | PC4 — General-purpose I/O |
| 핀 38 | PC5 — General-purpose I/O |
| 핀 39 | PC6 — General-purpose I/O |
| 핀 40 | PC7 — General-purpose I/O |
| 핀 41 | PC8 — General-purpose I/O |
| 핀 42 | PC9 — General-purpose I/O |
| 핀 43 | PC10 — General-purpose I/O |
| 핀 44 | PC11 — General-purpose I/O |
| 핀 45 | PC12 — General-purpose I/O |
| 핀 46 | PC13 — General-purpose I/O |
| 핀 47 | PC14 — General-purpose I/O |
| 핀 48 | PC15 — General-purpose I/O |
| 핀 49 | PD0 — CAN RX |
| 핀 50 | PD1 — CAN TX |
| 핀 51 | PD2 — General-purpose I/O |
| 핀 52 | PD3 — General-purpose I/O |
| 핀 53 | PD4 — General-purpose I/O |
| 핀 54 | PD5 — General-purpose I/O |
| 핀 55 | PD6 — General-purpose I/O |
| 핀 56 | PD7 — General-purpose I/O |
| 핀 57 | PD8 — General-purpose I/O |
| 핀 58 | PD9 — General-purpose I/O |
| 핀 59 | PD10 — General-purpose I/O |
| 핀 60 | PD11 — General-purpose I/O |
| 핀 61 | PD12 — General-purpose I/O |
| 핀 62 | PD13 — General-purpose I/O |
| 핀 63 | PD14 — General-purpose I/O |
| 핀 64 | PD15 — General-purpose I/O |
| 핀 65 | PE0 — General-purpose I/O / TIM channel |
| 핀 66 | PE1 — General-purpose I/O / TIM channel |
| 핀 67 | PE2 — General-purpose I/O / TIM channel |
| 핀 68 | PE3 — General-purpose I/O / TIM channel |
| 핀 69 | PE4 — General-purpose I/O / TIM channel |
| 핀 70 | PE5 — General-purpose I/O / TIM channel |
| 핀 71 | PE6 — General-purpose I/O / TIM channel |
| 핀 72 | PE7 — General-purpose I/O / TIM channel |
| 핀 73 | PE8 — General-purpose I/O |
| 핀 74 | PE9 — General-purpose I/O |
| 핀 75 | PE10 — General-purpose I/O |
| 핀 76 | PE11 — General-purpose I/O |
| 핀 77 | PE12 — General-purpose I/O |
| 핀 78 | PE13 — General-purpose I/O |
| 핀 79 | PE14 — General-purpose I/O |
| 핀 80 | PE15 — General-purpose I/O |
| 핀 81 | PF0 — Address/Data bus low byte |
| 핀 82 | PF1 — Address/Data bus low byte |
| 핀 83 | PF2 — Address/Data bus low byte |
| 핀 84 | PF3 — Address/Data bus low byte |
| 핀 85 | PF4 — Address/Data bus low byte |
| 핀 86 | PF5 — Address/Data bus low byte |
| 핀 87 | PF6 — Address/Data bus low byte |
| 핀 88 | PF7 — Address/Data bus low byte |
| 핀 89 | PG0 — Address/Data bus high byte |
| 핀 90 | PG1 — Address/Data bus high byte |
| 핀 91 | PG2 — Address/Data bus high byte |
| 핀 92 | PG3 — Address/Data bus high byte |
| 핀 93 | PG4 — Address/Data bus high byte |
| 핀 94 | PG5 — Address/Data bus high byte |
| 핀 95 | PG6 — Address/Data bus high byte |
| 핀 96 | PG7 — Address/Data bus high byte |
| 핀 97 | VDDA — Analog supply (3.3V) for ADC |
| 핀 98 | VSSA — Analog ground for ADC |
| 핀 99 | PAD0 — ADC analog input 0 |
| 핀 100 | PAD1 — ADC analog input 1 |
| 핀 101 | PAD2 — ADC analog input 2 |
| 핀 102 | PAD3 — ADC analog input 3 |
| 핀 103 | PAD4 — ADC analog input 4 |
| 핀 104 | PAD5 — ADC analog input 5 |
| 핀 105 | PAD6 — ADC analog input 6 |
| 핀 106 | PAD7 — ADC analog input 7 |
| 핀 107 | PH0 — External interrupt / IRQ input |
| 핀 108 | PH1 — External interrupt / IRQ input |
| 핀 109 | PH2 — Reset input (active low) |
| 핀 110 | PH3 — Mode select |
| 핀 111 | VDD — Main digital supply (3.3V) |
| 핀 112 | VDD — Main digital supply (3.3V) |
| 핀 113 | VSS — Digital ground |
| 핀 114 | VSS — Digital ground |
| 핀 115 | PI0 — JTAG TDI |
| 핀 116 | PI1 — JTAG TDO |
| 핀 117 | PI2 — JTAG TCK |
| 핀 118 | PI3 — JTAG TMS |
| 핀 119 | PI4 — Background debug mode |
| 핀 120 | PI5 — Test mode |
| 핀 121 | PJ0 — General-purpose I/O |
| 핀 122 | PJ1 — General-purpose I/O |
| 핀 123 | PJ2 — General-purpose I/O |
| 핀 124 | PJ3 — General-purpose I/O |
| 핀 125 | PJ4 — General-purpose I/O |
| 핀 126 | PJ5 — General-purpose I/O |
| 핀 127 | PJ6 — General-purpose I/O |
| 핀 128 | PJ7 — General-purpose I/O |
| 핀 129 | PJ8 — General-purpose I/O |
| 핀 130 | PJ9 — General-purpose I/O |
| 핀 131 | PJ10 — General-purpose I/O |
| 핀 132 | PJ11 — General-purpose I/O |
| 핀 133 | PJ12 — General-purpose I/O |
| 핀 134 | PJ13 — General-purpose I/O |
| 핀 135 | PJ14 — General-purpose I/O |
| 핀 136 | PJ15 — General-purpose I/O |
| 핀 137 | PK0 — General-purpose I/O |
| 핀 138 | PK1 — General-purpose I/O |
| 핀 139 | PK2 — General-purpose I/O |
| 핀 140 | PK3 — General-purpose I/O |
| 핀 141 | PK4 — General-purpose I/O |
| 핀 142 | PK5 — General-purpose I/O |
| 핀 143 | PK6 — General-purpose I/O |
| 핀 144 | PK7 — General-purpose I/O |
일반적인 애플리케이션
SAC7111J1VAG50 적합 용도: 6 애플리케이션s: Automotive Body Control Module (BCM), Instrument Cluster Controller, HVAC and Climate Controller, Door-Zone ECU, Central Gateway Node, Lighting Control Module.
Automotive Body Control Module (BCM)
The SAC7111J1VAG50 fits body control modules (BCM) thanks to its 32-bit ARM7TDMI compute, 512KB Flash for lighting/wiper/lock firmware stacks, and 50MHz CPU clock that completes a CAN 2.0B frame parse loop in well under the 1ms bus cycle. Its 32KB SRAM holds CAN message buffers and LIN scheduler tables for door-zone sub-networks without external memory. The -40C to +105C automotive temperature grade allows mounting in the cabin or behind the dashboard where ambient temperatures swing sharply. The 8-channel 10-bit ADC reads wiper-motor current, ambient light sensors and door-switch contacts directly, eliminating an external ADC chip. Pinout access from the 144-LQFP leaves ample GPIO for relay drivers, PWM outputs and LIN transceivers in a typical BCM architecture.
추천
Instrument Cluster Controller
The SAC7111J1VAG50 is well-suited to driving analog and stepper-motor gauges in an instrument cluster: its 8-channel 10-bit ADC samples fuel and temperature sensor inputs, while the periodic interrupt timer generates the precise PWM waveform for the stepper-motor pointers. With 50MHz ARM7 throughput and 32KB SRAM, the MCU maintains a fresh gauge update at 100Hz while servicing CAN messages from the BCM and powertrain gateway over a single CAN 2.0B port. The 144-LQFP exposes enough GPIO to drive four to six stepper motors and a serial LCD segment driver in parallel. Automotive -40C to +105C operation covers the behind-cluster thermal zone; pair it with a TLE4271 LDO and a CAN transceiver for a typical cluster ECU.
추천
HVAC and Climate Controller
In an HVAC climate controller the SAC7111J1VAG50 brings 512KB Flash for actuator-curve lookup tables and CAN message handling between the cluster, BCM and powertrain modules. The 8-channel 10-bit ADC reads cabin and outside-air temperature sensors and the blower-motor current shunt without an external ADC. Its two SCI (UART) channels drive the LIN sub-network used by modern HVAC actuators and servos, while the 50MHz core executes the PID loop at 50Hz within 5% CPU load. The 144-LQFP with automotive-temperature rating is comfortable behind the dash where sustained temperatures can reach +85C during summer sun load. Internal periodic interrupt timers provide the deterministic tick source the HVAC control algorithm needs.
추천
Door-Zone ECU
A door-zone ECU handles window lift, mirror adjustment and keyless-entry LIN nodes. The SAC7111J1VAG50 provides enough Flash (512KB) and SRAM (32KB) to host the state-machine firmware plus LIN diagnostics, while the 50MHz ARM7 core completes the LIN 20kbps frame handling comfortably with headroom for window anti-pinch algorithms. The 8-channel 10-bit ADC monitors window-motor current for pinch detection, and the SCI/UART port drives the LIN transceiver to the door mirror sub-node. The 144-LQFP gives access to GPIO for H-bridge direction control and Hall-sensor pulse counting. The -40C to +105C automotive grade fits the door-cavity thermal envelope during summer and winter extremes.
추천
Central Gateway Node
As a central gateway bridging CAN buses (powertrain, body, infotainment, chassis) the SAC7111J1VAG50 leverages its on-chip MSCAN (CAN 2.0B) module to forward messages between bus segments at line rate. The 50MHz ARM7 core and 32KB SRAM provide enough throughput for a one-to-many CAN routing table without dropping frames in worst-case bus load. The 144-LQFP allows external bus transceivers on each CAN channel alongside dedicated GPIOs for bus-fault diagnostics. Automotive -40C to +105C operation across cabin and behind-IP mounting positions is supported. With 512KB Flash it can host gateway routing firmware plus AUTOSAR-lite or OSEK/VDX kernels for OEM-grade diagnostics.
추천
Lighting Control Module
A lighting control module (LCM) controlling headlamps, indicators and daytime-running lights benefits from the SAC7111J1VAG50's PWM-driven GPIO and CAN interface for body-network integration. The 50MHz ARM7 core drives multi-channel PWM for LED matrix dimming at 200Hz refresh rates without external timers; 512KB Flash stores fading-curve lookups and bulb-life diagnostics. The 8-channel 10-bit ADC monitors lamp-out detection via current-sense shunts, while the SCI (UART) port drives a secondary LIN sub-network for rear-lamp nodes. The -40C to +105C automotive rating covers engine-bay lighting controller enclosure positions during sustained thermal stress, and the 144-LQFP provides enough GPIOs to direct-drive MOSFET gates for each lamp channel.
추천
추천 제품 요약
엔지니어링 참조 데이터: SAC7111J1VAG50 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MAC7111CFGVN50 | MAC7116CFGVN50 | MAC7106CFV | SPC56EL60L5CBFQ |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | STMicroelectronics |
| Package | LQFP-144 | LQFP-144 - same | LQFP-144 - same | LQFP-144 - same | LQFP-144 - same |
| Core Architecture | ARM7TDMI 32-bit | ARM7TDMI 32-bit | ARM7TDMI 32-bit | ARM7TDMI 32-bit | Power Architecture e200 |
| Program Flash | 512 KB | 512 KB | 1 MB | 256 KB | 1 MB |
| SRAM | 32 KB | 32 KB | 48 KB | 16 KB | 128 KB |
| Maximum CPU Clock | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 60 MHz |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +125C |
| CAN Modules | 1 x MSCAN (CAN 2.0B) | 1 x MSCAN | 1 x MSCAN | 1 x MSCAN | 2 x FlexCAN |
| Automotive Qualification | Automotive grade | Automotive grade | Automotive grade | Automotive grade | AEC-Q100 Grade 1 |
주요 차별점
- 512KB Flash sweet-spot (vs MAC7106CFV (256KB Flash))
- Compact Flash footprint (vs MAC7116CFGVN50 (1MB Flash))
- Identical automotive temperature grade (vs SPC56EL60L5CBFQ (-40C to +125C AEC-Q100))
설계 노트
The SAC7111J1VAG50 needs a clean 3.3V supply (3.0V to 3.6V typical); source it from an automotive-grade LDO such as TLE4271-2 or similar 5V-to-3.3V regulator with load-dump and reverse-battery protection. Decouple each VDD pin with a 100nF X7R ceramic placed within 2mm of the pin, plus a bulk 10uF tantalum or aluminum-polymer on the 3.3V rail. Keep analog VDDA and digital VDD separated at the LDO output with an LC/RC filter to avoid digital switching noise coupling into the ADC reference.
Use a 4-layer stackup with a continuous ground plane directly under the LQFP-144 footprint to provide a low-impedance return path for the 50MHz ARM7 core switching transients. Keep the 0.5mm-pitch LQFP-144 land pattern on the top signal layer; route all peripheral signals (CAN, SCI, SPI) on the top layer with via-stitched ground return paths beneath. Place the external 8MHz crystal (with load caps) within 5mm of the OSC pins to avoid start-up failures, and isolate the ADC analog traces (PADx) from the digital bus lines to preserve 10-bit SNR.
JTAG pins (TDI, TDO, TCK, TMS) must be pulled or terminated correctly at production - if left floating they can re-enter debug mode under EMC stress. The reset pin (/RESET) is active-low; if not driven by an external supervisor (such as a TLE7273 or TL7705) add a 100k pull-up and 1nF cap to guarantee clean brown-out behavior. The CAN TX pin requires a CAN transceiver; never drive a CAN bus directly from a GPIO because the electrical layer requires 12V-capable drivers and bus-fault tolerance.
규정 준수 정보
RoHS and REACH compliance inferred from the e3 (Tin) JESD-609 terminal finish code. AEC-Q100 qualifier grade is unknown from the short-form distributor listing; full PPAP documentation is available from NXP on request. Conflict-minerals compliance is per NXP's standard supplier policy.
