SPAK56F803BU80 vs DSP56F803BU80E Comparison
Detailed side-by-side comparison of SPAK56F803BU80 by NXP Semiconductors and DSP56F803BU80E by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
SPAK56F803BU80 - DSP56F803 16-bit DSP, 80MHz, 100-LFQFP | NXP
SPAK56F803BU80 NrndNXP Semiconductors
DSP56F803BU80E - 16-bit DSC 80MHz 64KB Flash LQFP-100 | NXP
DSP56F803BU80E ✗ End of LifeSpecification Comparison
| Parameter | SPAK56F803BU80 | DSP56F803BU80E |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | DSP | DSP |
| Lifecycle Status | NRND | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $16.25 | $0.00 |
| Product Type | 16-bit Digital Signal Processor | — |
| Core Architecture | DSP56F803 (DSP + MCU unified core) | — |
| Core Frequency | 80 MHz | — |
| Core Performance | 40 MIPS | — |
| Instruction Set | MCU-friendly DSP ISA with MAC, bit-manipulation unit, hardware DO/REP loops | — |
| Addressing Modes | 14 addressing modes | — |
| Program Memory | On-chip Flash (size [DATA_NEEDED: program memory size in KB]) | — |
| Data Memory | On-chip RAM (size [DATA_NEEDED: data memory size in KB]) | — |
| Package | LFQFP-100 (Low-profile Fine-pitch QFP, gull-wing) | — |
| Package Outline | 100 terminals, square, gull-wing lead form | — |
| Operating Temperature Grade | Industrial | — |
| Mounting Type | Surface Mount | Surface Mount |
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Typical Applications | Motor control, power conversion, DSP signal processing, UPS, audio/sensor conditioning | — |
| Core Processor | — | 56800 |
| Core Size | — | 16-bit |
| Series | — | 56F8xx |
| Maximum Clock Frequency | — | 80 MHz |
| Performance | — | 40 MIPS (80MHz/40MIPS per Mouser) |
| Program Memory Size | — | 64 KB (32K x 16) |
| Program Memory Type | — | Flash |
| Architecture | — | Harvard-style, DSP + MCU hybrid |
| Connectivity | — | CANbus, EBI/EMI, SCI |
| Package Type | — | 100-LQFP (14x14 mm), LFQFP, square, gull wing |
| Number of Terminals | — | 100 |
| Temperature Grade | — | Industrial |
| Packaging | — | Tray |
| Product Status | — | End of Life (EOL) per NXP product page |
| Operating Supply Voltage | — | [DATA_NEEDED: operating supply voltage] |
| Operating Temperature Range | — | [DATA_NEEDED: operating temperature range] |