STM32F446ZEJ7 - 180MHz 512KB Cortex-M4 MCU | STMicroelectronics
MPN: STM32F446ZEJ7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
STM32F446ZEJ7 Overview
A microcontroller is a programmable system-on-chip that combines a processor core, memory, peripherals, and communication interfaces. The STM32F4 series belongs to the embedded-microcontroller hierarchy, where the Cortex-M4 core executes real-time control and signal-processing software while dedicated peripherals handle data acquisition, communications, timing, and external interfaces. This product is therefore suitable for systems that need more processing capability than a basic control MCU without moving every function to an external processor.
The verified manufacturer data identifies the STM32F446 family as supporting 180 MHz operation, 225 DMIPS, 512 KB Flash, DSP, an FPU, dual Quad-SPI, SDRAM, and audio interfaces. These features make the STM32F446ZEJ7 appropriate for connected industrial equipment, audio systems, instrumentation, data acquisition, and embedded control platforms. The exact RAM, peripheral complement, voltage range, and temperature limits are not provided in the supplied verified data and therefore require manufacturer-datasheet confirmation before design release.
The Cortex-M4 architecture is important because it combines a conventional processor core with instruction-level support useful for digital signal processing. The floating-point unit can accelerate arithmetic-heavy control and audio workloads, while the high clock rate supports responsive multitasking and peripheral data movement. The dual Quad-SPI and SDRAM interfaces expand options for high-speed external memory, display subsystems, storage, and other bandwidth-oriented peripherals, subject to the device's verified electrical and pin-level requirements.
Typical applications include industrial monitoring, medical instrumentation, audio processing, communications infrastructure, robotics, and compact embedded gateways. In each case, the MCU can consolidate control logic and peripheral management into one device, reducing system complexity compared with a discrete processor plus multiple supporting ICs. The principal design tradeoff is that the compact UFBGA package requires careful PCB layout, fine-pitch assembly, thermal planning, and validated firmware support.
For a new design, begin with the STMicroelectronics STM32F446 product page and verify the exact electrical characteristics, pin multiplexing, memory map, package dimensions, and programming requirements in the official datasheet. Use the device within the confirmed supply voltage and temperature limits, preserve decoupling and power-sequence requirements, and validate all high-speed interfaces in the target PCB stack-up.
This page combines verified manufacturer capabilities, distributor availability context, package information, and practical design guidance. It is intended to accelerate component selection while preserving the distinction between confirmed technical facts and parameters that still require datasheet verification.
Drop-in alternatives for STM32F446ZEJ7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with STM32F446ZEJ7 (same form factor and footprint) — differing in Architecture, Core.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
No drop-in alternatives available for this product.
Request AlternativesSTM32F446ZEJ7 Maximum Ratings & Electrical Characteristics
| Core | Arm Cortex-M4 |
| Maximum CPU Frequency | 180 MHz |
| Architecture | 32-bit RISC |
| Flash Memory | 512 KB |
| Flash Organization | 512K x 8 bits |
| DMIPS | 225 DMIPS |
| DSP Support | Supported |
| Floating-Point Unit | Supported |
| External Memory Interfaces | SDRAM and dual Quad-SPI |
| Audio Interfaces | Supported |
| Package | 144-UFBGA (10 x 10 mm) |
| Package Type | UFBGA |
| Number of Pins | 144 pins |
| Operating Supply | 2.5 V / 3.3 V |
STM32F446ZEJ7 ufbga Pin Configuration Guide
Pin configuration for STM32F446ZEJ7 (ufbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for STM32F446ZEJ7.
Refer to the datasheet for full pin configuration.
Typical Applications
STM32F446ZEJ7 is suitable for 6 applications: Industrial Data Acquisition, Medical Monitoring Equipment, Audio Processing Platform, Industrial Communication Gateway, Robotics and Motion Control, Portable Sensor Hub.
Industrial Data Acquisition
The STM32F446ZEJ7 fits industrial data-acquisition equipment that must combine real-time sampling control with external memory and high-speed serial storage. Its 180 MHz Cortex-M4 core and 225-DMIPS class performance provide headroom for control loops, filtering, and protocol handling, while the family’s SDRAM and dual Quad-SPI interfaces can support buffered data transfer. Use the MCU for sensor aggregation, filtering, local storage, and supervisory communications. Before layout release, verify the exact ADC, timer, DMA, pin-mux, voltage, and temperature details in the STM32F446ZE datasheet.
Recommended
Medical Monitoring Equipment
The STM32F446ZEJ7 can serve as the control and signal-processing MCU in medical monitoring equipment where compactness, real-time responsiveness, and peripheral integration matter. The Cortex-M4 DSP and FPU features are useful for sampled-signal conditioning and control algorithms, while 512 KB Flash supports embedded firmware and configuration data. SDRAM can buffer larger workloads when required, and audio interfaces may assist in acoustic or diagnostic signal paths. Medical designs still require application-specific validation, isolation review, electrical verification, and confirmation of any regulatory claims.
Recommended
Audio Processing Platform
The STM32F446ZEJ7 is a strong candidate for embedded audio platforms that need local signal processing without relying exclusively on a host processor. Its 180 MHz Cortex-M4 core, DSP capability, and floating-point unit support efficient real-time filtering, mixing, and control, while the STM32F446 family explicitly lists audio interfaces. External SDRAM or serial storage can hold larger buffers and audio assets when internal memory is insufficient. The exact audio peripherals, sample rates, DMA paths, and package pin assignments must be confirmed from the manufacturer documentation for the selected board.
Recommended
Industrial Communication Gateway
The STM32F446ZEJ7 can act as a compact communications gateway for industrial equipment that aggregates local sensor data and forwards it over a host or network interface. The high-performance Cortex-M4 core can handle protocol processing and buffering alongside application control, while dual Quad-SPI and SDRAM connectivity provide options for high-speed transceivers and external memory. Choose a UART, USB, Ethernet, or other communications peripheral only after checking the exact device peripheral map and package pinout. Use the USB interface or RS-485 transceiver as examples only after electrical validation.
Recommended
Robotics and Motion Control
The STM32F446ZEJ7 is suitable for robotics and embedded motion-control systems that require deterministic control, sensor fusion, and communication in one compact component. The Cortex-M4 architecture and DSP/FPU support can execute control calculations while peripheral blocks handle timers, communication, and data movement. External memory options can improve buffering for vision or trajectory data, although the exact timer and encoder interfaces must be validated against the STM32F446ZE documentation. Keep high-current motor drivers and power stages separate from the MCU and verify isolation, grounding, and fault handling.
Recommended
Portable Sensor Hub
The STM32F446ZEJ7 can serve as the processing center in a portable sensor hub that combines local sensing, signal filtering, and short-range communications. Its 180 MHz core provides processing capacity for sensor fusion and event handling, while 512 KB Flash supports firmware updates and configuration storage. The UFBGA package helps reduce board area in compact systems, but it also demands careful assembly capability, thermal design, and high-density PCB layout. Verify the exact low-power modes, radio integration, battery voltage range, and package-level I/O requirements before choosing it for a battery-powered product.
Recommended
Recommended Products Summary
Engineering reference data for STM32F446ZEJ7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Package | 144-UFBGA (10 x 10 mm) |
| Brand | STMicroelectronics |
| Core | Arm Cortex-M4 |
| Maximum Frequency | 180 MHz |
| Flash Memory | 512 KB |
| DSP Support | Supported |
| External Memory | SDRAM and dual Quad-SPI |
| Audio Interfaces | Supported |
| Operating Supply | 2.5 V / 3.3 V |
| Drop-In Status | Reference device |
Key Differentiators
- High-performance Cortex-M4 integration (vs STM32F407ZET6)
- Memory and peripheral integration (vs STM32F407ZET6)
- Package-specific design target (vs STM32F407ZET6)
Design Notes
The STM32F446ZEJ7 uses a 144-UFBGA package, so PCB design must account for fine-pitch balls, package land patterns, solder-mask definition, and assembly capability. Route power, ground, decoupling, and high-speed signals according to the official package drawing and reference layout. Do not infer pad geometry from a generic UFBGA symbol. Validate escape routing, via strategy, solder mask, and thermal-via placement with the selected assembler before fabrication.
The verified distributor data identifies a 2.5 V / 3.3 V operating context, but the complete power requirements are not supplied. Before connecting external rails, confirm the official STM32F446ZE datasheet for supply tolerance, regulator architecture, internal core voltage, I/O limits, startup timing, and peripheral-specific current. Place required decoupling close to the package power balls and confirm the regulator’s transient response against the MCU’s verified current profile. Estimated power figures require the actual supply, core voltage, I/O activity, and clock configuration.
The 180 MHz Cortex-M4 core and the family’s SDRAM and dual Quad-SPI interfaces make board-level signal integrity important. Use the manufacturer’s recommended stack-up and pinout guidance, keep clock and high-speed serial routes short where possible, provide continuous return paths, and control crosstalk between adjacent balls. SDRAM and Quad-SPI timing must be validated with the actual memory device, trace topology, termination strategy, and measurement equipment rather than inferred from nominal frequency alone.
The compact UFBGA package can concentrate heat, and the supplied data does not provide a verified thermal resistance or maximum junction temperature. In a new design, estimate worst-case dissipation using the actual core voltage, clock, peripheral load, and ambient temperature, then verify the result against the official thermal data and application environment. Provide copper area, thermal vias, and enclosure airflow only after confirming the package’s specified thermal design guidance. Do not treat the package size alone as evidence of adequate cooling.
Do not replace the STM32F446ZEJ7 with a merely similar STM32F4 device. The supplied comparison identifies STM32F407ZET6 as LQFP while the target is UFBGA, demonstrating how package construction can prevent a drop-in substitution. Before approving an alternate part, compare ball assignment, alternate functions, power pins, clock pins, memory, peripherals, boot behavior, voltage limits, and firmware configuration. A different package requires PCB changes even when the processor family is related.
Compliance Information
The supplied verified web data identifies STMicroelectronics, the STM32F446 family, and the STM32F446ZEJ7 package, but does not provide explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements. These fields remain unknown pending manufacturer or authorized-distributor documentation.
