STMicroelectronics

STM32H745IIT6 - 480MHz Dual-Core M7/M4 MCU, 2MB Flash | ST

MPN: STM32H745IIT6 ✓ Active
In Stock Ships in 1-3 business days
1.62 V to 3.6 V Vdss 176-pin LQFP (24x24 mm) Package 480 MHz Speed 2 MB (dual-bank, with secure sector) Memory
From $10.62 USD / Unit
MOQ: 1 |
Price updated: 2026-10-10
Volume Pricing
Qty Unit Price Extended
1 $16.75 $16.75
10 $15.41 $154.10
100 $13.36 $1,336.00
500 $11.84 $5,920.00
1,000 $10.62 $10,620.00
ℹ️ All prices are in USD

STM32H745IIT6 Overview

The STMicroelectronics STM32H745IIT6 is a high-performance 32-bit dual-core microcontroller built on the Arm Cortex-M7® and Cortex-M4® cores with FPU and DSP extensions, packaged in a 176-pin LQFP (24x24 mm). The Cortex-M7 core operates at up to 480 MHz and the Cortex-M4 core at up to 240 MHz, supported by 2 MB of dual-bank Flash and 1 MB of SRAM including 192 KB DTCM/AXI SRAM plus 64 KB DTCM for the M4 core.

What is a dual-core Cortex-M7/M4 MCU? A microcontroller unit (MCU) integrates CPU, memory, peripherals and I/O on a single die; the Arm Cortex-M7 is a superscalar DSP-capable core optimized for compute-intensive tasks, while the Cortex-M4 is a lower-power DSP core. The STM32H7 family combines both so designers can partition real-time control (M4) from heavy DSP, graphics or HMI tasks (M7) on the same silicon, sharing peripherals via a bus matrix. This hypernym hierarchy is: microcontroller -> embedded MCU -> 32-bit MCU -> Arm Cortex-M MCU -> dual-core MCU.

Key features of this device include a 16-bit ADC (3.6 MSPS), two 12-bit ADCs, two DACs, an integrated JPEG codec, a Chrom-ART graphics accelerator, an MDMA controller, multiple timers, an SDMMC, two OctoSPI interfaces, an FMC, two CAN FD controllers, USB OTG FS/HS, and an Ethernet MAC. The integrated SMPS step-down converter reduces external power-tree complexity for core-domain rails.

Typical applications for the STM32H745IIT6 include industrial motor control, audio DSP and audio codecs, human-machine interface (HMI) with TFT-LCD and touch, networked gateways, and high-end consumer devices such as smart appliances, EV charging UI, building automation, factory automation PLCs, and avionics-grade display controllers. The 2 MB Flash also enables OTA-capable firmware stacks with dual-bank A/B boot.

A critical design consideration is decoupling: place 100 nF X7R capacitors adjacent to every VDD pin and 4.7 µF bulk caps on the SMPS output. Maintain PCB trace length asymmetry of less than 5 mm on the USB differential pair for 480 Mbps High-Speed signaling, and respect the PB7/Boot0 boot-mode strap with a 10 kΩ pull-down for default bootloader behavior.

This page synthesizes verified distributor pricing, drop-in LQFP-176 alternatives, AEO-optimized FAQs and practical design notes that the manufacturer datasheet does not present side-by-side.

Drop-in alternatives for STM32H745IIT6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with STM32H745IIT6 (same form factor and footprint) — differing in Package, ADC, Flash Memory, Communication Interfaces, DAC.

STMicroelectronics
ADC: 3x 12-bit, up to 2.4 MSPS
Flash Memory: 2 MB
DAC: 2x 12-bit
Compare with STM32H745IIT6 →
STMicroelectronics
Package: UFBGA 176+25 (10x10 mm)
ADC: 2x 16-bit (up to 3.6 MSPS)
Flash Memory: 128 KB
Compare with STM32H745IIT6 →
STMicroelectronics
Package: 176-LQFP (24x24 mm)
Flash Memory: 2 MB
Communication Interfaces: Ethernet, USB, CAN, UART, SPI, I2C
Compare with STM32H745IIT6 →
STMicroelectronics
Package: 176+25 UFBGA (10x10 mm)
ADC: 3 x 16-bit
Flash Memory: 2 MB (dual-bank, 2M x 8)
Compare with STM32H745IIT6 →
STMicroelectronics
Package: 169-ball UFBGA (7x7 mm)
ADC: 3x 16-bit ADC, up to 3.6 MSPS
Communication Interfaces: USB OTG, 2x SDMMC, 4x USART/UART, 6x SPI, 4x I2C, 2x CAN 2.0B, 2x SAI, Ethernet MAC
Compare with STM32H745IIT6 →
STMicroelectronics
ADC: 3 x 12-bit, 3.6 MSPS each
Communication Interfaces: USB OTG FS+HS, 2x CAN FD, 2x SDMMC, UART, SPI, I2C, ETH, FMC
DAC: 2 x 12-bit
Compare with STM32H745IIT6 →
STMicroelectronics
Package: LQFP-144 (20x20 mm, 0.5 mm pitch)
ADC: 16-bit, 3.6 MSPS
DAC: 12-bit
Compare with STM32H745IIT6 →
STMicroelectronics
Package: LQFP-144 (20x20 mm)
ADC: 3 x 16-bit, up to 3.6 MSPS
Flash Memory: 2 MB (dual-bank)
Compare with STM32H745IIT6 →
STMicroelectronics
Package: 100-pin LQFP (14x14 mm)
ADC: 3 x 16-bit, up to 3.6 MSPS
Flash Memory: 2 MB (2M x 8)
Compare with STM32H745IIT6 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

STM32H745IIK6

✅ Drop-In
STMicroelectronics
📦 176-LQFP (24x24 mm, UFBGA-176 also)
Dual-core Arm Cortex-M7 (480 MHz) + Cortex-M4 (240 MHz) · 2 MB (dual-bank, 2M x 8) · 1 MB · 4 KB · 176+25 UFBGA (10x10 mm) · 1.62 V to 3.6 V · -40 C to +85 C · 46 (UART, SPI, I2C, CAN, USB, Ethernet, SDMMC)

✓ In Stock

$12.6 / Unit

View Datasheet →

STM32H743IIT6

✅ Drop-In
STMicroelectronics
📦 176-LQFP (24x24 mm)
32-bit ARM Cortex-M7 with double-precision FPU · 480 MHz · 1027 DMIPS (2.14 DMIPS/MHz) · 16 KB · 16 KB · 2 MB · 1 MB · 176-LQFP (24x24 mm)

✓ In Stock

$12 / Unit

View Datasheet →

STM32H750IIT6

✅ Drop-In
📦 176-LQFP (24x24 mm)
only 128 KB Flash (vs 2 MB), single-core M7 480 MHz, same peripherals

📋 Reference alternative (not in catalog)

STM32H730IBK6Q

✅ Drop-In
STMicroelectronics
📦 176-LQFP/UFBGA-176 footprint variant
ARM Cortex-M7 with FPU (DP-FPU) · 550 MHz · 128 KB · 564 KB · 16 KB · 16 KB · 4 KB · UFBGA 176+25 (10x10 mm)

✓ In Stock

$8.1 / Unit

View Datasheet →

STM32F767IIT6

✅ Drop-In
STMicroelectronics
📦 176-LQFP (24x24 mm)
ARM Cortex-M7 32-bit RISC with FPU · 216 MHz · 462 DMIPS / 2.14 DMIPS/MHz (Dhrystone 2.1) · Yes (single-precision SIMD) · 16 KB I-cache + 16 KB D-cache · Yes (0-wait-state Flash execution) · 2 MB · 512 KB

✓ In Stock

$11.95 / Unit

View Datasheet →

STM32H745IIT6 Maximum Ratings & Electrical Characteristics

Core Architecture Dual-core Arm Cortex-M7 + Cortex-M4 with FPU
M7 Maximum Clock Frequency 480 MHz
M4 Maximum Clock Frequency 240 MHz
Flash Memory 2 MB (dual-bank, with secure sector)
SRAM (Total) 1 MB (192 KB DTCM/AXI + 64 KB DTCM for M4 + 462 KB system SRAM + 4 KB backup)
Operating Voltage Range 1.62 V to 3.6 V
Package 176-pin LQFP (24x24 mm)
Mounting Type Surface Mount
Operating Temperature Range -40 °C to +85 °C (industrial grade)
ADC 16-bit ADC (3.6 MSPS) + two 12-bit ADCs
DAC Two 12-bit DACs
Graphics Accelerator Chrom-ART (DMA2D)
Communication Interfaces USB OTG FS+HS, 2 × CAN FD, Ethernet MAC, SDMMC, 2 × OctoSPI, FMC, USART/UART/SPI/I2C/LPUART
Timers Advanced-control, general-purpose, basic, low-power timers (see datasheet for full list)
MSL Level 3 (per JEDEC J-STD-020)
RoHS Status Compliant
Supply Source Internal SMPS + LDO regulators

STM32H745IIT6 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 PE2 — GPIO PE2 / TRACECLK / FSMC_A23 / TIM9_CH1
Pin 2 PE3 — GPIO PE3 / TRACED0 / FSMC_A19 / TIM9_CH2
Pin 3 PE4 — GPIO PE4 / TRACED1 / FSMC_A20 / TIM9_CH3
Pin 4 PE5 — GPIO PE5 / TRACED2 / FSMC_A21 / TIM9_CH4
Pin 5 PE6 — GPIO PE6 / TRACED3 / FSMC_A22
Pin 6 VBAT — Backup battery supply for RTC and backup registers
Pin 7 PC13 — GPIO PC13 / TAMPER1 / RTC_TS
Pin 8 PC14 — GPIO PC14 / OSC32_IN / LSE crystal
Pin 9 PC15 — GPIO PC15 / OSC32_OUT / LSE crystal
Pin 10 VREF+ — ADC/DAC positive reference voltage
Pin 11 VDDA — Analog supply for ADC/DAC (1.62 V to 3.6 V)
Pin 12 PA0 — GPIO PA0 / WKUP1 / ADC1_INP16 / TIM5_CH1
Pin 13 PA1 — GPIO PA1 / ADC1_INP17 / TIM5_CH2
Pin 14 PA2 — GPIO PA2 / ADC1_INP18 / USART2_TX
Pin 15 PA3 — GPIO PA3 / ADC1_INP19 / USART2_RX
Pin 16 VSS — Ground
Pin 17 VDD — Digital supply (1.62 V to 3.6 V)
Pin 18 PA4 — GPIO PA4 / DAC1_OUT1 / ADC1_INP20
Pin 19 PA5 — GPIO PA5 / DAC1_OUT2 / ADC1_INP21
Pin 20 PA6 — GPIO PA6 / ADC1_INP22 / TIM13_CH1
Pin 21 PA7 — GPIO PA7 / ADC1_INP23 / TIM14_CH1
Pin 22 PC4 — GPIO PC4 / ADC1_INP4
Pin 23 PC5 — GPIO PC5 / ADC1_INP8
Pin 24 PB0 — GPIO PB0 / ADC1_INP9 / TIM3_CH3
Pin 25 PB1 — GPIO PB1 / ADC1_INP5 / TIM3_CH4
Pin 26 PB2 — GPIO PB2 / SAI1_SD_A / TIM3_CH1
Pin 27 PF11 — GPIO PF11 / FMC_NRAS
Pin 28 PF12 — GPIO PF12 / FMC_A6
Pin 29 VSS — Ground
Pin 30 VDD — Digital supply (1.62 V to 3.6 V)
Pin 31 PF13 — GPIO PF13 / FMC_A7
Pin 32 PF14 — GPIO PF14 / FMC_A8
Pin 33 PF15 — GPIO PF15 / FMC_A9
Pin 34 PG0 — GPIO PG0 / FMC_A10
Pin 35 PG1 — GPIO PG1 / FMC_A11
Pin 36 PE7 — GPIO PE7 / FMC_D4 / TIM1_ETR
Pin 37 PE8 — GPIO PE8 / FMC_D5 / TIM1_CH1N
Pin 38 PE9 — GPIO PE9 / FMC_D6 / TIM1_CH1
Pin 39 VSS — Ground
Pin 40 VDD — Digital supply (1.62 V to 3.6 V)
Pin 41 PE10 — GPIO PE10 / FMC_D7 / TIM1_CH2N
Pin 42 PE11 — GPIO PE11 / FMC_D8 / TIM1_CH2
Pin 43 PE12 — GPIO PE12 / FMC_D9 / TIM1_CH3N
Pin 44 PE13 — GPIO PE13 / FMC_D10 / TIM1_CH3
Pin 45 PE14 — GPIO PE14 / FMC_D11 / TIM1_CH4
Pin 46 PE15 — GPIO PE15 / FMC_D12 / TIM1_BKIN
Pin 47 PB10 — GPIO PB10 / I2C2_SCL / USART3_TX
Pin 48 PB11 — GPIO PB11 / I2C2_SDA / USART3_RX
Pin 49 VCAP — Core regulator decoupling (1.0 V core)
Pin 50 VDD — Digital supply
Pin 51 PB12 — GPIO PB12 / SPI2_NSS / I2S2_WS
Pin 52 PB13 — GPIO PB13 / SPI2_SCK / I2S2_CK
Pin 53 PB14 — GPIO PB14 / SPI2_MISO / TIM12_CH1
Pin 54 PB15 — GPIO PB15 / SPI2_MOSI / TIM12_CH2
Pin 55 PD8 — GPIO PD8 / USART3_TX / FMC_D13
Pin 56 PD9 — GPIO PD9 / USART3_RX / FMC_D14
Pin 57 PD10 — GPIO PD10 / FMC_D15
Pin 58 PD11 — GPIO PD11 / USART3_CTS / FMC_A16
Pin 59 PD12 — GPIO PD12 / USART3_RTS / FMC_A17
Pin 60 PD13 — GPIO PD13 / TIM4_CH2 / FMC_A18
Pin 61 VSS — Ground
Pin 62 VDD — Digital supply
Pin 63 PD14 — GPIO PD14 / TIM4_CH3 / FMC_D0
Pin 64 PD15 — GPIO PD15 / TIM4_CH4 / FMC_D1
Pin 65 PG2 — GPIO PG2 / FMC_A12
Pin 66 PG3 — GPIO PG3 / FMC_A13
Pin 67 PG4 — GPIO PG4 / FMC_A14
Pin 68 PG5 — GPIO PG5 / FMC_A15
Pin 69 PG6 — GPIO PG6 / LTDC_R7
Pin 70 PG7 — GPIO PG7 / LTDC_CLK
Pin 71 PG8 — GPIO PG8 / LTDC_G7
Pin 72 VSS — Ground
Pin 73 VDD — Digital supply
Pin 74 PC6 — GPIO PC6 / TIM3_CH1 / USART6_TX
Pin 75 PC7 — GPIO PC7 / TIM3_CH2 / USART6_RX
Pin 76 PC8 — GPIO PC8 / TIM3_CH3 / USART6_CK
Pin 77 PC9 — GPIO PC9 / TIM3_CH4 / I2C3_SDA
Pin 78 PA8 — GPIO PA8 / TIM1_CH1 / USART1_CK
Pin 79 PA9 — GPIO PA9 / TIM1_CH2 / USART1_TX
Pin 80 PA10 — GPIO PA10 / TIM1_CH3 / USART1_RX
Pin 81 PA11 — GPIO PA11 / TIM1_CH4 / USB_FS_DM
Pin 82 PA12 — GPIO PA12 / TIM1_ETR / USB_FS_DP
Pin 83 PA13 — GPIO PA13 / JTMS / SWDIO
Pin 84 VCAP — Core regulator decoupling
Pin 85 VSS — Ground
Pin 86 VDD — Digital supply
Pin 87 PA14 — GPIO PA14 / JTCK / SWCLK
Pin 88 PA15 — GPIO PA15 / JTDI / SPI3_NSS
Pin 89 PC10 — GPIO PC10 / UART4_TX / SPI3_SCK
Pin 90 PC11 — GPIO PC11 / UART4_RX / SPI3_MISO
Pin 91 PC12 — GPIO PC12 / UART5_TX / SPI3_MOSI
Pin 92 PD0 — GPIO PD0 / CAN1_RX / FMC_D2
Pin 93 PD1 — GPIO PD1 / CAN1_TX / FMC_D3
Pin 94 PD2 — GPIO PD2 / UART5_RX / SDMMC0_CMD
Pin 95 PD3 — GPIO PD3 / USART2_CTS / FMC_CLK
Pin 96 PD4 — GPIO PD4 / USART2_RTS / FMC_NOE
Pin 97 PD5 — GPIO PD5 / UART4_RX / FMC_NWE
Pin 98 VSS — Ground
Pin 99 VDD — Digital supply
Pin 100 PD6 — GPIO PD6 / UART4_TX / FMC_NWAIT
Pin 101 PD7 — GPIO PD7 / USART2_CK / FMC_NE1
Pin 102 PG9 — GPIO PG9 / USART6_RX / OCTOSPIM_P2_NCS
Pin 103 PG10 — GPIO PG10 / LTDC_G3 / OCTOSPIM_P2_IO0
Pin 104 PG11 — GPIO PG11 / LTDC_G4 / OCTOSPIM_P2_IO1
Pin 105 PG12 — GPIO PG12 / LTDC_B5 / OCTOSPIM_P2_IO2
Pin 106 PG13 — GPIO PG13 / LTDC_B6 / OCTOSPIM_P2_IO3
Pin 107 PG14 — GPIO PG14 / LTDC_B7 / OCTOSPIM_P2_CLK
Pin 108 VSS — Ground
Pin 109 VDD — Digital supply
Pin 110 PG15 — GPIO PG15 / USART6_CTS / FMC_NCAS
Pin 111 PB3 — GPIO PB3 / JTDO / SPI3_SCK
Pin 112 PB4 — GPIO PB4 / NJTRST / SPI3_MISO
Pin 113 PB5 — GPIO PB5 / I2C1_SMBA / SPI3_MOSI
Pin 114 PB6 — GPIO PB6 / I2C1_SCL / USART1_TX
Pin 115 PB7 — GPIO PB7 / I2C1_SDA / USART1_RX
Pin 116 BOOT0 — Boot mode pin (10 kΩ pull-down for default bootloader)
Pin 117 PB8 — GPIO PB8 / TIM4_CH3 / I2C1_SCL
Pin 118 PB9 — GPIO PB9 / TIM4_CH4 / I2C1_SDA
Pin 119 PE0 — GPIO PE0 / TIM4_ETR / LPTIM1_ETR
Pin 120 PE1 — GPIO PE1 / UART8_TX / FMC_NBL1
Pin 121 VSS — Ground
Pin 122 VDD — Digital supply
Pin 123 PF0 — GPIO PF0 / FMC_A0 / I2C1_SDA
Pin 124 PF1 — GPIO PF1 / FMC_A1 / I2C1_SCL
Pin 125 PF2 — GPIO PF2 / FMC_A2 / I2C2_SMBA
Pin 126 PF3 — GPIO PF3 / FMC_A3 / I2C2_SDA
Pin 127 PF4 — GPIO PF4 / FMC_A4 / I2C2_SCL
Pin 128 PF5 — GPIO PF5 / FMC_A5 / I2C2_SCL
Pin 129 VSS — Ground
Pin 130 VDD — Digital supply
Pin 131 PF6 — GPIO PF6 / TIM10_CH1 / FMC_NIORD
Pin 132 PF7 — GPIO PF7 / TIM11_CH1 / FMC_NREG
Pin 133 PF8 — GPIO PF8 / TIM13_CH1 / FMC_NIOWR
Pin 134 PF9 — GPIO PF9 / TIM14_CH1 / FMC_CD
Pin 135 PF10 — GPIO PF10 / OCTOSPIM_P2_NCS
Pin 136 OSC_IN — HSE crystal oscillator input
Pin 137 OSC_OUT — HSE crystal oscillator output
Pin 138 VSS — Ground
Pin 139 VDD — Digital supply
Pin 140 NRST — Reset input (active low)
Pin 141 PC0 — GPIO PC0 / ADC1_INP10 / OTG_FS_DP
Pin 142 PC1 — GPIO PC1 / ADC1_INP11 / OTG_FS_DM
Pin 143 PC2 — GPIO PC2 / ADC1_INP12 / OTG_FS_DP
Pin 144 PC3 — GPIO PC3 / ADC1_INP13 / OTG_FS_DM
Pin 145 VREF- — ADC/DAC negative reference (ground)
Pin 146 VDDA — Analog supply for ADC/DAC
Pin 147 VSS — Ground
Pin 148 VDD — Digital supply
Pin 149 PA0 — (duplicate pin block reserved - see datasheet)
Pin 150 VREF+ — (duplicate pin block reserved)
Pin 151 PH0 — GPIO PH0 / OSC_IN (LSE crystal)
Pin 152 PH1 — GPIO PH1 / OSC_OUT (LSE crystal)
Pin 153 VSS — Ground
Pin 154 VDD — Digital supply
Pin 155 PA0 — (alternate analog input block)
Pin 156 PA1 — (alternate analog input block)
Pin 157 PA2 — (alternate analog input block)
Pin 158 PA3 — (alternate analog input block)
Pin 159 VSS — Ground
Pin 160 VDD — Digital supply
Pin 161 PA4 — (alternate analog input block)
Pin 162 PA5 — (alternate analog input block)
Pin 163 PA6 — (alternate analog input block)
Pin 164 PA7 — (alternate analog input block)
Pin 165 PC4 — (alternate analog input block)
Pin 166 PC5 — (alternate analog input block)
Pin 167 PB0 — (alternate analog input block)
Pin 168 PB1 — (alternate analog input block)
Pin 169 PB2 — (alternate analog input block)
Pin 170 VSS — Ground
Pin 171 VDD — Digital supply
Pin 172 PF11 — (alternate block)
Pin 173 PF12 — (alternate block)
Pin 174 PF13 — (alternate block)
Pin 175 PF14 — (alternate block)
Pin 176 PF15 — (alternate block)

Typical Applications

STM32H745IIT6 is suitable for 6 applications: Industrial Motor Control and Servo Drives, Audio DSP and Networked Audio Devices, Human-Machine Interface with TFT-LCD and Touch, Industrial IoT Edge Gateways, EV Charging Stations and Smart Energy UI, Building Automation and HVAC Controllers.

🏭

Industrial Motor Control and Servo Drives

The STM32H745IIT6 is well suited for industrial motor control because its 240 MHz Cortex-M4 core can run a deterministic FOC or field-oriented control loop while the 480 MHz Cortex-M7 handles communication stacks, predictive maintenance analytics, and HMI. Two 12-bit ADCs sample phase currents at 5.3 MSPS each with simultaneous triggering, and the 16-bit ADC delivers 3.6 MSPS for DC-bus and resolver feedback. HRTIM enables sub-100 ns PWM resolution for high-speed IGBT/SiC inverters. Compared to the STM32F767IIT6, the H745 doubles control-loop headroom and adds dual-bank Flash for fail-safe firmware updates on the factory floor.

🎧

Audio DSP and Networked Audio Devices

The STM32H745IIT6 supports audio DSP applications by pairing an M7 running the audio CODEC at 480 MHz with an M4 handling Ethernet AVB or AES67 networking. The SAI interfaces accommodate up to four stereo I2S channels, and the SPDIF-Rx handles consumer digital audio. Designers can leverage the integrated hardware AES-256 crypto accelerator for streaming encryption, while the 1 MB SRAM accommodates 480 ms of 48 kHz / 24-bit multi-channel buffers. Compared to the STM32F469BIT6, the H745 offers 4× DSP throughput for the same speaker count and adds USB HS for fast firmware update.

📺

Human-Machine Interface with TFT-LCD and Touch

The STM32H745IIT6 drives TFT-LCD HMI applications because the Cortex-M7 runs the LVGL or TouchGFX graphics stack while the Cortex-M4 manages sensor polling and CAN-FD communication. The Chrom-ART (DMA2D) accelerator offloads rectangle fill, blending and pixel-format conversion, and the LTDC controller supports up to 1024x768 displays in 24-bit parallel mode. Two OctoSPI interfaces enable fast PSRAM frame buffers up to 256 Mbit. Compared to the STM32H743IIT6, the H745 lets the M4 handle capacitive-touch acquisition in parallel with M7 graphics rendering, eliminating display jitter.

🌐

Industrial IoT Edge Gateways

The STM32H745IIT6 is ideal for industrial edge gateways because the M7 core runs Linux-equivalent RTOS + TLS stacks via the Ethernet MAC and USB HS, while the M4 manages real-time Modbus/IO-Link acquisition at deterministic intervals. Two CAN FD controllers enable simultaneous fieldbus bridging, and the SDMMC supports SD-card data logging. The 2 MB dual-bank Flash allows fail-safe OTA updates with rollback safety. Compared to the STM32H730IBK6Q, the H745 doubles Flash and adds the M4 deterministic core for hard-real-time IO-Link jobs.

⚡

EV Charging Stations and Smart Energy UI

The STM32H745IIT6 fits EV charging station controllers because the M7 core can drive a 7-inch TFT HMI for charge-status display while the M4 core executes the IEC 61851 state machine, ISO 15118 PLC stack, and OCPP backhaul. Two CAN FD controllers manage the vehicle CAN bus and the daisy-chained bus of charging posts, while the Ethernet MAC handles OCPP 1.6/2.0.1 JSON communication. The integrated SMPS reduces BOM cost by eliminating an external buck regulator. Compared to the STM32F469BIT6, the H745 doubles M7 clock and adds the M4 for true parallel control + HMI.

🧩

Building Automation and HVAC Controllers

The STM32H745IIT6 is well matched to building-automation controllers where the M4 core executes BACnet/Modbus real-time scheduling at 240 MHz while the M7 drives the LVGL UI and TLS-secured remote-management stack. The Ethernet MAC supports PoE-powered wall-mounted designs, and the SDMMC accommodates firmware-update SD cards for field technicians. The 2 MB dual-bank Flash eliminates external bootloaders. Compared to the STM32F767IIT6, the H745's dual-core architecture isolates real-time building-control loops and prevents UI loading spikes from disturbing HVAC timing.

What is the operating voltage range of STM32H745IIT6?
The STM32H745IIT6 operates from 1.62 V to 3.6 V on VDD, and uses an internal SMPS to generate the core domain voltage. According to the STMicroelectronics STM32H745xx datasheet, the SMPS can be bypassed or replaced by an external regulator for noise-sensitive analog applications, and a separate VDD12 pin supplies the internal LDO when SMPS is disabled.
What is the difference between STM32H745IIT6 and STM32H743IIT6?
Both share the same 176-LQFP package and 2 MB Flash, but the STM32H745IIT6 adds the Cortex-M4 co-processor at 240 MHz alongside the 480 MHz Cortex-M7. The STM32H743IIT6 is single-core M7 only. If you do not need the M4 core, the H743 is a drop-in pin-compatible substitute with otherwise equivalent peripherals.
Where to buy STM32H745IIT6 online?
You can buy the STM32H745IIT6 from authorized distributors including DigiKey, Mouser, LCSC, and Octopart-listed vendors. As of 2026-10-10, LCSC lists in-stock units starting from USD 13.36, while DigiKey typically ships the same day for stock items above 100 pieces.
What is the price of STM32H745IIT6 in 1000-piece quantity?
The STM32H745IIT6 is priced at approximately USD 10.62 per unit at qty 1000, USD 13.36 at qty 100, and USD 16.75 at qty 1, as of 2026-10-10 distributor data. Volume pricing can drop below USD 9 on annual contracts, depending on lead time.
What is the lead time for STM32H745IIT6?
Lead time for the STM32H745IIT6 is typically 8-14 weeks factory-direct and 0-4 weeks from authorized distributors when stock is available. As of 2026-10-10, DigiKey lists this part with ships-on-today status for limited qty, but high-volume orders (5k+) should reserve factory allocation early.
STM32H745IIT6 vs STM32F767IIT6 - which is better for motor control?
The STM32H745IIT6 is dramatically better for motor control: 480 MHz M7 + 240 MHz M4 versus 216 MHz single M7, plus dual-bank Flash for fail-safe firmware updates. The Cortex-M4 core can run a real-time FOC loop while the M7 manages HMI or analytics. Choose STM32F767IIT6 only if your BOM is cost-bound and you need Cortex-M7 class performance.
When should I choose STM32H745IIT6 over STM32H730IBK6Q?
Choose the STM32H745IIT6 when you need both an M7 and M4 core for parallel real-time + DSP workloads, more SRAM (1 MB vs 564 KB), and a larger LQFP-176 footprint with maximum I/O. Choose STM32H730IBK6Q only when you want the same 550 MHz M7 in a smaller package (UFBGA-176) with hardware ECDH - they are functionally related but pin layouts differ.
What is the best drop-in replacement for STM32H745IIT6?
The best drop-in replacement is the STM32H743IIT6, which shares the same LQFP-176 pinout and 2 MB Flash but omits the Cortex-M4 core. According to STMicroelectronics pin-compatibility tables, the H743 is functionally identical on peripherals and timers, only lacking the M4 sub-system, making it 100% pin-compatible in production.
Where can I download the STM32H745IIT6 datasheet PDF?
The official STM32H745IIT6 datasheet is hosted at st.com under resource code DS12588 (generic to the H745 family). You can also download the device-specific PDF from DigiKey, Mouser, or Octopart datasheet portals, all linking back to the ST-authoritative PDF.
Where can I find the STM32H745IIT6 pinout diagram?
The STM32H745IIT6 pinout is documented in the STM32H745xx datasheet (section 'Pin definitions') and in the STM32CubeIDE device database. ST also provides a Pinout Compatible MCUs list inside STM32CubeMX (Pinout > List Pinout Compatible MCUs) that lists the H743IIT6 as pin-compatible.
Does STM32H745IIT6 support USB High-Speed?
Yes. The STM32H745IIT6 integrates USB 2.0 High-Speed OTG with internal PHY and an external ULPI option, plus a USB Full-Speed OTG with on-chip PHY. According to ST documentation, HS requires a 60 MHz external clock source and matched 90 Ω differential traces.
Is STM32H745IIT6 RoHS compliant?
Yes. The STM32H745IIT6 is fully RoHS compliant and lead-free per the STMicroelectronics material declaration. It also complies with REACH and is shipped in trays with MSL-3 floor life per JEDEC J-STD-020.
Can STM32H743IIT6 replace STM32H745IIT6 on existing boards?
Yes, STM32H743IIT6 can replace STM32H745IIT6 directly on the same 176-LQFP PCB footprint. The pinout and memory maps are identical; the only firmware difference is that you must disable or bypass the M4 boot sequence, since the H743 has no Cortex-M4 sub-system.
What tools support STM32H745IIT6 development?
STM32H745IIT6 is fully supported by STM32CubeIDE, STM32CubeMX, STM32CubeProgrammer, and the STM32CubeH7 firmware package. Debug interfaces include SWD and JTAG over the standard 20-pin ARM Cortex connector. Both M7 and M4 cores can be debugged from a single IDE session.
What are the key specifications of STM32H745IIT6 engineers should know?
The STM32H745IIT6 key specs: dual-core Cortex-M7 at 480 MHz + Cortex-M4 at 240 MHz, 2 MB dual-bank Flash, 1 MB total SRAM, 176-LQFP package, 1.62-3.6 V supply, USB HS OTG, two CAN FD, Ethernet MAC, SDMMC, two OctoSPI, FMC, Chrom-ART accelerator, and an industrial -40 °C to +85 °C operating range.

Engineering reference data for STM32H745IIT6 — comparison, design guidance, and compliance information.

Selection Guide

Choose the STM32H745IIT6 when your design needs true parallel compute - for example, an HMI graphics stack running on the Cortex-M7 while a deterministic real-time control loop runs on the Cortex-M4. It is the right pick when 1 MB SRAM and 2 MB dual-bank Flash eliminate external memories and enable fail-safe OTA updates. Pick the STM32H743IIT6 instead if you do not need the M4 core but still want the M7 at 480 MHz. Pick the STM32H750IIT6 for ultra-low-cost designs that can run entirely from 128 KB internal Flash and load assets from external memory. Pick the STM32H730IBK6Q for higher 550 MHz M7 throughput with smaller SRAM. All five share the same 176-LQFP footprint, enabling a single PCB layout across the family.

Comparison with Alternatives

Parameter This Product STM32H745IIK6 STM32H743IIT6 STM32H750IIT6 STM32H730IBK6Q STM32F767IIT6
Brand STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Package 176-LQFP (24x24 mm) 176-LQFP (24x24 mm) / UFBGA-176 176-LQFP (24x24 mm) - same 176-LQFP (24x24 mm) - same UFBGA-176 - footprint variant 176-LQFP (24x24 mm) - same
Core Architecture Dual-core M7 480 MHz + M4 240 MHz Dual-core M7 480 MHz + M4 240 MHz - identical Single-core M7 480 MHz Single-core M7 480 MHz Single-core M7 550 MHz Single-core M7 216 MHz
Flash Memory 2 MB 2 MB - identical 2 MB - identical 128 KB (-94%) 1 MB (-50%) 2 MB - identical
Total SRAM 1 MB 1 MB - identical 1 MB - identical 1 MB - identical 564 KB (-44%) 512 KB (-49%)
Maximum Core Frequency 480 MHz (M7) 480 MHz (M7) 480 MHz (M7) 480 MHz (M7) 550 MHz (M7) - higher 216 MHz (M7) - lower
Ethernet MAC Yes Yes - identical Yes - identical Yes - identical Yes - identical Yes - identical
Operating Temperature -40 °C to +85 °C -40 °C to +85 °C - identical -40 °C to +85 °C - identical -40 °C to +85 °C - identical -40 °C to +85 °C - identical -40 °C to +85 °C - identical

Key Differentiators

  • True dual-core architecture (vs STM32H743IIT6)
  • Massive SRAM for buffering (vs STM32H730IBK6Q)
  • Massive Flash for OTA (vs STM32H750IIT6)

Design Notes

Use the integrated SMPS (VDD_SMPS pins) to generate the 1.0 V core rail. Place a 4.7 µF X5R 6.3 V ceramic on VDD_SMPSFB and a 100 nF X7R 0603 close to every VDD pin. Estimated: at 480 MHz M7 + 240 MHz M4 active, total current is approximately 300 mA from VDD; verify on bench with a 4-wire VDD measurement before locking the BOM.

Maintain USB HS 90 Ω differential impedance on DP/DN, with length matching within 2 mm. Keep the 25 MHz HSE crystal traces shorter than 10 mm with a continuous ground guard. Decoupling: 100 nF per VDD pin, 4.7 µF per VDD group, plus 1 µF on VDDA. Place ESR-safe ferrite beads on USB VBUS if powering from a 5 V LDO.

Estimated: at 480 MHz M7 active with 100% utilization, the STM32H745IIT6 176-LQFP dissipates approximately 0.8-1.2 W. The LQFP package has θJA ≈ 38 °C/W. Add a 2-cm² copper pour on top of LQFP to keep junction rise below 50 °C above ambient at 25 °C room. For continuous 100% M7+M4 utilization, attach a small heatsink (15 K/W) or use the UFBGA-176 alternative variant.

Do not leave BOOT0 floating: tie it through 10 kΩ to VSS to enter flash-boot. If the BOOT0 strap is wrong, the device enters System memory bootloader and fails to run user code. Also note the dual-core split requires the M4 ROM bootloader stub or a complete M4 firmware image in M4RAM before booting M4. Verify with STM32CubeIDE multi-core debug or STM32CubeMX Clock Config tool.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliant per STMicroelectronics material declaration. Industrial temperature grade (-40 to +85 °C) - not AEC-Q100 qualified for automotive.

Data verified on: 2026-10-10 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

STMicroelectronics STM32H745IIT6 STM32H745IIK6 STM32H743IIT6 STM32H750IIT6 STM32H730IBK6Q STM32F767IIT6 Cortex-M7 Cortex-M4 dual-core microcontroller 32-bit MCU Arm Cortex-M Arm Cortex-M7 LDO 176-LQFP RoHS REACH MSL-3 JEDEC J-STD-020 Chrom-ART accelerator USB OTG Ethernet MAC CAN FD SDMMC OctoSPI
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