TMS5701227CPGEQQ1 - 160MHz Cortex-R4F Dual-Core MCU | Texas Instruments
MPN: TMS5701227CPGEQQ1 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.1 | $12,050.00 |
| 1,000 | $21.5 | $21,500.00 |
TMS5701227CPGEQQ1 Overview
A safety microcontroller (MCU) is a microcontroller designed for functional-safety-critical applications, integrating hardware diagnostics such as dual CPUs in lockstep, built-in self-test (BIST) for CPU and memory, ECC on flash and SRAM, and peripheral parity/loopback features. The TMS570 family occupies the high-end of TI's safety MCU portfolio alongside the RM4x series, and is widely used in chassis, braking, and body-domain automotive electronic control units that require ISO 26262 ASIL-D capability.
Key features include dual ARM Cortex-R4F cores running in lockstep for fault detection, single-bit error correction and double-bit error detection (SECDED) on the 1.25 MB flash and 192 KB SRAM, an IEEE-754 compliant single-precision floating-point unit, integrated FlexRay and EMAC peripherals, an enhanced PWM (ePWM) module with trip-zone protection synchronized to the on-chip 12-bit MibADC, and a rich connectivity set including multiple CAN, SPI, LIN, and UART channels. The AEC-Q100 qualification ensures operation across the automotive -40C to +125C temperature range.
The architecture supports up to 160 MHz system clock with separate instruction and data buses for deterministic execution, hardware floating-point acceleration reducing software overhead for control-loop math, and tightly-coupled memory for low-latency interrupt response - critical for real-time motor control and sensor-fusion loops. The FlexRay + EMAC combination makes the device equally well-suited to vehicle network nodes and industrial safety PLCs requiring deterministic Ethernet.
Typical applications include automotive electronic stability control (ESC), electric power steering (EPS), anti-lock braking systems (ABS), battery management in hybrid and electric vehicles, and industrial servo drives. The on-chip floating-point unit accelerates field-oriented control (FOC) math, while the FlexRay interface suits time-triggered chassis networks, and the EMAC supports industrial Ethernet protocols such as EtherCAT or PROFINET.
When designing with this device, allocate PCB area for the 144-pin LQFP thermal pad, route the JTAG/Trace 14-pin header for boundary-scan and code development, and ensure decoupling on each supply rail per the datasheet. The lockstep cores require software partitions that tolerate both cores reporting diverged diagnostics, and the SECDED-enabled flash must use TI's safe-RTI library for ASIL-D workflows.
This page synthesizes distributor pricing for the TMS5701227CPGEQQ1, validated drop-in Hercules family alternatives, and practical design notes that go beyond the manufacturer datasheet.
Drop-in alternatives for TMS5701227CPGEQQ1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with TMS5701227CPGEQQ1 (same form factor and footprint) — differing in Core Architecture, RoHS Status, ADC, AEC-Q100 Qualification, Functional Safety.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
TMS5701227CPGEQQ1
✅ Drop-In✓ In Stock
$21.5 / Unit
View Datasheet →TMS5701227BZWTQQ1
✅ Drop-In📋 Reference alternative (not in catalog)
TMS5701225BPGEQQ1
✅ Drop-In📋 Reference alternative (not in catalog)
TMS5702125BPGEQQ1
✅ Drop-In📋 Reference alternative (not in catalog)
TMS5701114CPGEQQ1
✅ Drop-In📋 Reference alternative (not in catalog)
TMX5701227APGEQQ1
✅ Drop-In📋 Reference alternative (not in catalog)
TMS5701227CPGEQQ1 Maximum Ratings & Electrical Characteristics
| Manufacturer | Texas Instruments |
| Series | Hercules TMS570 ARM Cortex-R4F |
| Core Processor | ARM Cortex-R4F (dual-core, lockstep) |
| Core Architecture | 32-bit RISC with IEEE-754 single-precision FPU |
| Maximum Clock Speed | 160 MHz |
| Program Memory (Flash) | 1.25 MB (1.25M x 8) with ECC |
| Data RAM | 192 KB with ECC (SECDED) |
| Bus Width | 32-bit (64-bit flash bus per TI documentation) |
| Operating Voltage Range | 1.2 V core / 3.3 V I/O (typical dual-rail) |
| Operating Temperature Range | -40C to +125C (automotive grade) |
| Package | 144-LQFP (PGE) 20x20 mm |
| Mounting Type | Surface Mount |
| Automotive Qualification | AEC-Q100 Grade (-40C to +125C) |
| Connectivity | FlexRay, EMAC, CAN, SPI, LIN, UART, I2C |
| ADC | 12-bit MibADC (Multi-buffered ADC) |
| PWM Channels | Enhanced ePWM with trip-zone protection (per TI datasheet) |
| RoHS Status | Compliant |
| Functional Safety | Dual lockstep cores + ECC + parity + peripheral loopback (ASIL-D capable per datasheet) |
| Supplier Device Package | 144-LQFP (PGE) |
TMS5701227CPGEQQ1 144-lqfp (pge) Pin Configuration Guide
Pin configuration for TMS5701227CPGEQQ1 (144-lqfp (pge) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for TMS5701227CPGEQQ1.
Refer to the datasheet for full pin configuration.
Typical Applications
TMS5701227CPGEQQ1 is suitable for 6 applications: Automotive Electronic Stability Control (ESC), Electric Power Steering (EPS), Battery Management System (BMS) for Hybrid/EV, Industrial Safety PLC with EtherCAT, Automotive Braking Systems (ABS / i-Booster), Body-Domain Controller with CAN/LIN Gateway.
Automotive Electronic Stability Control (ESC)
The TMS5701227CPGEQQ1 is well-suited for ESC/ECU chassis controllers because its dual Cortex-R4F lockstep cores at 160 MHz deliver deterministic computation of vehicle dynamics while the SECDED ECC on 1.25 MB flash and 192 KB SRAM meets ISO 26262 ASIL-D diagnostic coverage. The on-chip enhanced ePWM module with trip-zone protection can drive FET bridges directly for solenoid actuation, and the 12-bit MibADC samples wheel-speed sensors with synchronized conversion. The FlexRay interface connects the ESC node to time-triggered chassis networks. Choose this part over an RM4x alternative when FlexRay + EMAC connectivity is required on the same die.
Recommended
Electric Power Steering (EPS)
Electric power steering systems require torque-loop control with sub-millisecond latency, fault detection on motor position, and ASIL-D compliance. The TMS5701227CPGEQQ1's hardware FPU accelerates the FOC (field-oriented control) math for brushless-DC torque motors, while the lockstep cores detect single-point faults within one clock cycle. The 192 KB SRAM buffers position-sensor samples from the MibADC, and the 1.25 MB flash stores the SafeTI safety library plus application firmware. The EMAC peripheral enables diagnostics logging over industrial Ethernet. The 144-LQFP package with thermal pad supports under-hood operating temperatures.
Recommended
Battery Management System (BMS) for Hybrid/EV
High-voltage battery management for hybrid and electric vehicles demands cell-voltage sampling across many channels with strict isolation and fault containment. The TMS5701227CPGEQQ1 supports up to multiple CAN channels for cell-monitoring ASIC communication and provides the safety architecture (dual-core lockstep, ECC, peripheral parity) needed for ASIL-C/D battery-pack controllers. The 160 MHz Cortex-R4F cores compute state-of-charge and state-of-health algorithms in real time using the hardware FPU, and the 1.25 MB flash stores BMS firmware plus diagnostic libraries. The ePWM trip-zone feature protects against over-current shutdown within microseconds.
Recommended
Industrial Safety PLC with EtherCAT
Functional-safety industrial PLCs targeting SIL-3 (IEC 61508) or PL d (ISO 13849) often pair a Cortex-R safety MCU with industrial Ethernet such as EtherCAT or PROFINET. The TMS5701227CPGEQQ1's EMAC peripheral supports 10/100 Mbps Ethernet with deterministic latency suitable for EtherCAT slave nodes, while the dual Cortex-R4F cores implement the safety logic and diagnostics. The 1.25 MB flash accommodates the EtherCAT slave stack plus application logic, and the AEC-Q100 grade provides extended-temperature operation for harsh industrial cabinets. The 144-LQFP package simplifies manufacturing for industrial volumes.
Recommended
Automotive Braking Systems (ABS / i-Booster)
Anti-lock braking and integrated electronic brake booster systems need deterministic, fault-tolerant computation of slip and pressure loops. The TMS5701227CPGEQQ1's lockstep dual-core architecture, SECDED ECC memories, and on-chip enhanced PWM with trip-zone protection are tailored to ISO 26262 ASIL-D brake controllers. The FlexRay and CAN-FD connectivity link the brake ECU to chassis and powertrain domains, while the 12-bit MibADC samples pressure transducers at synchronized intervals. The 192 KB SRAM buffers control-loop variables without contention, and the hardware FPU accelerates the slip-control math at 160 MHz.
Recommended
Body-Domain Controller with CAN/LIN Gateway
Central body-domain controllers aggregate signals from dozens of ECUs across CAN, LIN, and FlexRay. The TMS5701227CPGEQQ1's multiple CAN controllers, LIN, UART, and FlexRay interfaces let a single MCU act as a gateway between powertrain, chassis, and body networks. The 160 MHz Cortex-R4F cores handle gateway routing with deterministic latency, while the 1.25 MB flash stores routing tables and diagnostic firmware. The AEC-Q100 grade and 144-LQFP package are ideal for under-dash mounting with extended thermal tolerance. The hardware FPU accelerates signal-processing tasks such as CAN-FD payload validation.
Recommended
Recommended Products Summary
Engineering reference data for TMS5701227CPGEQQ1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TMS5701227BZWTQQ1 | TMS5701225BPGEQQ1 | TMS5702125BPGEQQ1 | TMS5701114CPGEQQ1 | TMX5701227APGEQQ1 |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 144-LQFP (PGE) 20x20 mm | 144-LQFP (PGE) 20x20 mm - same | 144-LQFP (PGE) 20x20 mm - same | 144-LQFP (PGE) 20x20 mm - same | 144-LQFP (PGE) 20x20 mm - same | 144-LQFP (PGE) 20x20 mm - same |
| Core | Dual Cortex-R4F lockstep, 160 MHz | Dual Cortex-R4F lockstep, 160 MHz | Dual Cortex-R4F lockstep, 160 MHz | Dual Cortex-R4F lockstep, 160 MHz | Dual Cortex-R4F lockstep, 160 MHz | Dual Cortex-R4F lockstep, 160 MHz (engineering sample) |
| Flash | 1.25 MB | 1.25 MB | 1.0 MB | 2.0 MB | 1.0 MB | 1.25 MB |
| SRAM | 192 KB | 192 KB | 192 KB | 256 KB | 128 KB | 192 KB |
| AEC-Q100 Qualified | Yes (-40C to +125C) | Yes | Yes | Yes | Yes | No (engineering sample) |
| FlexRay | Yes | Yes | Yes | Yes | Yes | Yes |
| EMAC (Ethernet) | Yes (10/100 Mbps) | Yes | Yes | Yes | Yes | Yes |
| Approx Unit Price (qty-1, USD) | 38.50 | 37.80 | 32.40 | 44.60 | 30.10 | Not for production |
Key Differentiators
- Highest-density flash in TMS570LS1227 family with same footprint (vs TMS5701225BPGEQQ1)
- Production-qualified AEC-Q100 part rather than engineering sample (vs TMX5701227APGEQQ1)
- Dual Cortex-R4F lockstep for ASIL-D with FlexRay + EMAC on a single die (vs RM46L852 (industrial TMS570 cousin))
Design Notes
Estimated: The TMS5701227CPGEQQ1 requires separate core (1.2 V) and I/O (3.3 V) supply rails per TI Hercules datasheet. Place a 10 uF bulk plus 0.1 uF decoupling capacitor on each VCC pin, with the ceramic caps located within 2 mm of the package. Keep the two ground planes stitched together under the LQFP thermal pad, and bond the thermal pad to the internal ground plane with at least 9 thermal vias to dissipate ~1 W of MCU power.
Route the JTAG/Trace signals to a 14-pin compact header (TI standard 0.05" pitch) with 4.7 kohm pull-ups on TMS, TDI, and TRSTn. The EMAC MII/RMII lines should be impedance-controlled to 50 ohm single-ended with matched-length pairs; isolate the analog AVSS/AVCC pair from the digital ground with a ferrite to reduce MibADC noise coupling. The 20 MHz crystal traces should be guarded by a ground ring on both sides to suppress harmonics.
Do not skip the JTAG TRSTn pull-up - missing TRSTn causes boundary-scan lockouts that lock out the device. The Hercules lockstep cores require software partitions that tolerate both cores reporting diverged diagnostics, and the SECDED flash must use TI's safe-RTI library for ASIL-D workflows. Avoid stacking the ePWM high-side/low-side traces over each other for >5 mm to prevent shoot-through glitches; keep the trip-zone input filtered with an RC of <1 us time constant.
Estimated: At 160 MHz system clock, the FlexRay signals should be routed as 100 ohm differential with <2 mm intra-pair skew and <10 mm inter-pair skew across 50 mm trace length. The EMAC MII/RMII clock should not exceed 50 MHz without series termination to dampen reflections. If using the MibADC at >1 MSPS, sample the analog supply with a separate LDO (e.g. TLV1117-3.3) to prevent digital switching noise from aliasing into the ADC result.
Compliance Information
AEC-Q100 qualified per TI's TMS570LS1227 product page; -40C to +125C automotive grade. RoHS compliance confirmed via TI's compliance disclosure.
