W25X40CLZPIG-TR - 4Mbit SPI NOR Flash 104MHz 8-WSON | Winbond
MPN: W25X40CLZPIG-TR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0.85 | $0.85 |
| 10 | $0.78 | $7.80 |
| 100 | $0.69 | $69.00 |
| 500 | $0.62 | $310.00 |
| 1,000 | $0.55 | $550.00 |
| 5,000 | $0.49 | $2,450.00 |
W25X40CLZPIG-TR Overview
A serial NOR flash is a non-volatile memory that stores data persistently and communicates over a low pin-count SPI bus. The W25X40 belongs to the spiFlash family, a category of small-footprint flash memories widely used for boot code, firmware, and configuration storage in embedded systems. Compared to parallel NOR flash, spiFlash devices trade raw bandwidth for fewer pins (4-8 vs. 32+), enabling compact PCB layouts in cost-sensitive designs.
Key features of the W25X40CLZPIG-TR include 104 MHz maximum SPI clock, 8 ns access time, page program (up to 256 bytes per command), 4 KB sector erase granularity, 32 KB and 64 KB block erase options, hardware write-protect pin, software write-protection via status register, JEDEC standard manufacturer and device ID read, and an operating temperature range of -40C to +85C. The 8-WSON package with exposed pad provides a small footprint (6 mm x 5 mm) and good thermal dissipation.
The W25X40CLZPIG-TR uses a single 2.5V to 3.3V supply and is fully static, requiring no external clock. Internally the device implements a state-machine-based command interpreter that decodes instruction opcodes (Read, Page Program, Sector/Block Erase, Read Status, etc.) issued over the SPI bus. Dual-SPI mode doubles throughput by using two data lines for read operations, useful for XIP (execute-in-place) boot from flash.
Typical applications include router and home gateway firmware storage, set-top box boot loaders, IoT device firmware, industrial sensor data logging, and Bluetooth/Wi-Fi module configuration storage. It is frequently paired with low-cost MCUs that lack internal flash of sufficient capacity.
When designing with this part, place a 0.1 uF decoupling capacitor as close as possible to the VCC pin and connect the exposed pad to a solid ground plane for thermal relief. The /WP and /HOLD pins should be tied to VCC via pull-ups if unused, to prevent accidental write protection or bus stalls during firmware updates.
This page consolidates distributor pricing, same-brand and cross-brand drop-in alternatives, and practical design notes beyond what the Winbond datasheet alone provides, helping engineers select and source the right SPI flash for cost-sensitive embedded designs.
Drop-in alternatives for W25X40CLZPIG-TR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with W25X40CLZPIG-TR (same form factor and footprint) — differing in Memory Size, Memory Type, Package, RoHS Status, Sector Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
W25X40CLZPIG
✅ Drop-In✓ In Stock
$0.58 / Unit
View Datasheet →W25Q40JVSSIQ
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MX25L4006EM2I-12G
✅ Drop-In📋 Reference alternative (not in catalog)
GD25Q40CSIGR
✅ Drop-In📋 Reference alternative (not in catalog)
IS25LP040D-JBLE
✅ Drop-In📋 Reference alternative (not in catalog)
W25X40CLZPIG-TR Maximum Ratings & Electrical Characteristics
| Memory Type | Non-Volatile NOR Flash |
| Memory Size | 4 Mbit (512 Kbit x 8) |
| Memory Organization | 512K x 8 |
| Memory Interface | SPI (Standard and Dual SPI) |
| Maximum SPI Clock Frequency | 104 MHz |
| Access Time | 8 ns |
| Operating Voltage | 2.5 V / 3.3 V |
| Sector Size | 4 KB (uniform sector) |
| Block Erase Sizes | 32 KB and 64 KB |
| Page Program Size | Up to 256 bytes per command |
| Write Protection | Hardware (/WP pin) and Software (status register) |
| Operating Temperature | -40C to +85C |
| Package | 8-WSON (6 x 5 mm) with Exposed Pad |
| Package Designator | ZP |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (per Winbond product page) |
W25X40CLZPIG-TR Pin Configuration
| Pin 1 | /CS — Chip Select, active low |
| Pin 2 | SO — Serial Data Out (MISO) |
| Pin 3 | /WP — Write Protect, active low |
| Pin 4 | GND — Ground |
| Pin 5 | SI — Serial Data In (MOSI) |
| Pin 6 | SCK — Serial Clock |
| Pin 7 | /HOLD — Hold, active low |
| Pin 8 | VCC — Power Supply (2.5V or 3.3V) |
Typical Applications
W25X40CLZPIG-TR is suitable for 6 applications: MCU Boot Loader and Firmware Storage, IoT Sensor Data Logging, Home Router and Gateway Firmware, Industrial Sensor Module Configuration, Consumer Display and Smart Home Device Firmware, Set-Top Box and Media Player Boot.
MCU Boot Loader and Firmware Storage
The W25X40CLZPIG-TR stores boot loaders and application firmware for low-cost microcontrollers lacking sufficient internal flash. With 4 Mbit (512 KB) of non-volatile storage and 104 MHz SPI bandwidth, the part supports fast boot times and XIP (execute-in-place) operation in many ARM Cortex-M designs. The 4 KB uniform sector erase granularity enables efficient firmware updates with minimal write amplification. Hardware /WP prevents accidental corruption during brown-out events.
Recommended
IoT Sensor Data Logging
Battery-powered IoT sensor nodes leverage the W25X40CLZPIG-TR for local data buffering before transmission. The 4 Mbit capacity stores up to 500 KB of historical sensor logs, more than enough for weeks of compressed environmental or motion data. Low-power operation at 2.5 V extends battery life, while the 8 ns access time supports rapid log retrieval during BLE/Wi-Fi transmit windows. Sector erase is ideal for log rotation.
Recommended
Home Router and Gateway Firmware
Consumer and SMB routers use the W25X40CLZPIG-TR to hold Linux kernel images, device trees, and configuration data. The 4 Mbit capacity is enough for compressed root filesystems in entry-level gateways. SPI interface integrates easily with SoCs like Qualcomm IPQ40xx and MediaTek MT7621, where the flash boots the SoC during power-up. Hardware write protection prevents firmware corruption from network-borne attacks.
Recommended
Industrial Sensor Module Configuration
Industrial sensors and PLC modules use the W25X40CLZPIG-TR to store calibration constants, device configuration, and runtime logs. The -40C to +85C industrial temperature range supports factory and outdoor deployments. Software write-protection via the status register locks configuration from field modification, while the hardware /WP pin can be tied to a tamper-detection circuit. The small 8-WSON footprint fits compact DIN-rail modules.
Recommended
Consumer Display and Smart Home Device Firmware
Smart displays, smart speakers, and connected home appliances boot and store firmware on the W25X40CLZPIG-TR. Its low cost makes it attractive for high-volume consumer electronics, while the 104 MHz SPI bandwidth supports quick boot times that consumers expect. Dual SPI mode doubles read throughput for fast GUI rendering at startup. Surface-mount 8-WSON simplifies automated assembly.
Recommended
Set-Top Box and Media Player Boot
Set-top boxes, smart TVs, and streaming sticks use the W25X40CLZPIG-TR to hold bootloader, kernel, and small initramfs images. The 4 Mbit capacity fits compressed boot images for many ARM-based media SoCs. SPI bandwidth at 104 MHz enables fast cold-boot times - critical for the user experience. Status-register write-protection locks the bootloader from accidental overwrites.
Recommended
Recommended Products Summary
Engineering reference data for W25X40CLZPIG-TR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | W25X40CLZPIG | W25Q40JVSSIQ | MX25L4006EM2I-12G | GD25Q40CSIGR | IS25LP040D-JBLE |
|---|---|---|---|---|---|---|
| Package | 8-WSON (6x5 mm) | 8-WSON (6x5 mm) - same | 8-SOIC (150 mil) | 8-MSON (5x6 mm) - same WSON family | 8-SOIC (150 mil) | 8-SOIC (150 mil) |
| Brand | Winbond | Winbond (same brand) | Winbond (same brand) | Macronix (cross-brand) | GigaDevice (cross-brand) | ISSI (cross-brand) |
| Memory Size | 4 Mbit (512K x 8) | 4 Mbit | 4 Mbit | 4 Mbit | 4 Mbit | 4 Mbit |
| Maximum SPI Clock | 104 MHz | 104 MHz | 104 MHz | 86 MHz (-17%) | 120 MHz (+15%) | 80 MHz (-23%) |
| Operating Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.7 V - 3.6 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| SPI Modes Supported | Standard, Dual SPI | Standard, Dual SPI | Standard, Dual, Quad SPI | Standard, Dual SPI | Standard, Dual, Quad SPI | Standard, Dual, Quad SPI |
| Sector Erase Size | 4 KB uniform | 4 KB uniform | 4 KB uniform | 4 KB uniform | 4 KB uniform | 4 KB uniform |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +105C | -40C to +85C | -40C to +85C | -40C to +85C |
| Automotive Grade | No | No | Yes (AEC-Q100) | Optional | No | No |
Key Differentiators
- Higher 104 MHz SPI clock than most cross-brand 4 Mbit competitors (vs Macronix MX25L4006EM2I-12G)
- Wide 2.5V / 3.3V dual-voltage support (vs Winbond W25Q40JVSSIQ)
- Compact 8-WSON 6x5 mm footprint (vs IS25LP040D-JBLE (SOIC-8))
- JEDEC-standard command set compatible with all major MCUs (vs GigaDevice GD25Q40CSIGR)
Design Notes
Place a 0.1 uF decoupling capacitor as close as possible to the VCC pin (pin 8). Connect the exposed thermal pad to a solid ground plane with multiple vias for thermal relief and stable reference. Keep SPI traces short (under 25 mm if possible) and route SCK away from noisy signals. Avoid running SPI traces parallel to high-current switching traces for more than a few millimeters.
Add 10-100 kohm pull-up resistors on /CS, /WP, and /HOLD lines to prevent floating pins from selecting the chip or triggering unintended write-protect events during power-up. In noisy industrial environments, add small series resistors (22-33 ohm) on SCK and SI lines near the MCU side to dampen ringing. Match trace lengths on SO and SI within 2-3 mm if the bus runs over 50 mm at 80+ MHz.
Do not issue Page Program or Sector Erase commands without first checking the BUSY bit in the Status Register - previous commands may still be executing. The Write Enable Latch (WEL) bit must be set before each program/erase command. Power-down during a write operation can corrupt the target sector - ensure VCC stays above 2.25 V until the BUSY bit clears. Use unique JEDEC IDs (0xEF3013 for Winbond) in production code to validate part authenticity.
Estimated: at 104 MHz SPI read, the W25X40CLZPIG-TR draws approximately 15 mA active and 1-5 uA in deep power-down. During sector erase and page program operations, peak current rises to 20-30 mA for 1-3 ms per command. Ensure the upstream 3.3V LDO can source at least 50 mA transient headroom to prevent rail collapse during flash writes. For battery-powered designs, issue the Deep Power-Down (0xB9) command before sleep to minimize standby current.
Compliance Information
RoHS and REACH compliant per Winbond product page. Not AEC-Q100 qualified - for automotive designs migrate to W25Q40JVSSIQ (AEC-Q100 Grade 1) or equivalent. Halogen-free per Winbond green-product declaration.
