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Winbond

W29N01HVBINF-TR - 1Gb 3V SLC NAND Flash, 63-VFBGA | Winbond

MPN: W29N01HVBINF-TR ✓ Active
In Stock Ships in 1-3 business days
2.7 V to 3.6 V (3.3 V typical) Vdss 63-ball VFBGA, 9 mm x 11 mm Package Non-volatile NAND Flash (SLC) Memory
From $1.62 USD / Unit
MOQ: 1 |
Price updated: 2026-10-04
Volume Pricing
Qty Unit Price Extended
1 $2.85 $2.85
10 $2.55 $25.50
100 $2.18 $218.00
500 $1.85 $925.00
1,000 $1.62 $1,620.00
ℹ️ All prices are in USD

W29N01HVBINF-TR Overview

The Winbond W29N01HVBINF-TR is a 1 Gbit (128 MB) Single-Level Cell (SLC) NAND Flash memory organized as an 8-bit multiplexed I/O bus and housed in a 63-ball VFBGA (9x11 mm) package. It operates from a 2.7V to 3.6V single supply with a typical 20 ns random-access time and ONFI 1.0 compliance. The device uses a 2048 + 64 byte page architecture and supports the standard NAND command set including program, read, erase, and copy-back operations.

A NAND Flash memory is a non-volatile storage technology that retains data without power by storing charge on floating-gate transistors. SLC NAND stores one bit per cell, delivering the highest endurance (typically 100k P/E cycles), fastest write speeds, and longest data retention among NAND types - making it the preferred choice for code storage, boot media, and industrial data logging where MLC/TLC reliability would be inadequate. The W29N-HV family sits in the ONFI 1.0 standard ecosystem (NAND Flash -> non-volatile memory -> memory IC -> semiconductor), allowing seamless software reuse across vendors.

Key features include a 1 Gbit density in the smallest standard NAND footprint, hardware WP# (Write Protect) and R/B# (Ready/Busy) status pins, 4-bit ECC requirement per 528 bytes, and an extended operating temperature range suitable for industrial applications. The device uses a 3V VCC for both the core and I/O, simplifying power-tree design by removing the 1.8V requirement common to higher-density parts.

Typical applications include embedded Linux/Android boot storage on routers, set-top boxes, and IoT gateways; firmware and asset-log retention in industrial control and metering equipment; data logging in automotive infotainment and telematics modules; and code shadowing from NOR/ROM to faster NAND in consumer electronics. The 63-VFBGA package is footprint-compatible with the wider Winbond W29N family, enabling PCB reuse across 1 Gb to higher densities.

When designing with this part, ensure the host controller or SoC implements the ONFI 1.0 software driver and a BCH or Hamming ECC engine capable of 4-bit correction per 528-byte sector. For long-term reliability, apply wear-leveling at the file-system (e.g., UBI/YAFFS/JFFS2) or FTL layer, because raw NAND blocks wear out at the rated P/E cycle count. This page synthesizes Winbond datasheet specifications, current distributor pricing, drop-in alternatives, and practical design notes not consolidated on any single manufacturer or distributor page.

The W29N01HVBINF-TR is halogen-free and RoHS compliant per the Winbond product page. The 'TR' suffix denotes Tape and Reel packaging suitable for high-volume SMT assembly.

Drop-in alternatives for W29N01HVBINF-TR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with W29N01HVBINF-TR (same form factor and footprint) — differing in Interface, Organization, Page Size.

Winbond
Interface: Parallel asynchronous x8
Organization: 128M x 8 (1 page = 2112 B, 1 block = 64 pages)
Page Size: 2112 bytes (2048 data + 64 spare)
Compare with W29N01HVBINF-TR →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

W29N01HVBINF

✅ Drop-In
Winbond
📦 63-VFBGA (9x11)
Non-volatile NAND Flash (SLC) · 1 Gbit (128 M x 8) · ONFI 1.0 compliant SLC NAND · 128M x 8 (1 page = 2112 B, 1 block = 64 pages) · Parallel asynchronous x8 · 2.7 V to 3.6 V (3.3 V typical) · 25 ns (typical) · 2112 bytes (2048 data + 64 spare)

✓ In Stock

$1.21 / Unit

View Datasheet →

W29N02HVBINF

✅ Drop-In
📦 63-VFBGA (9x11)
same package, 2x density (2 Gbit), same ONFI 1.0 command set, software-detectable

📋 Reference alternative (not in catalog)

W29N04HVBINF

✅ Drop-In
📦 63-VFBGA (9x11)
same package, 4x density (4 Gbit), same ONFI 1.0 command set, software-detectable

📋 Reference alternative (not in catalog)

W29N01HVSI-NF

✅ Drop-In
📦 63-VFBGA (9x11)
same family/density/package, industrial temperature grade variant

📋 Reference alternative (not in catalog)

MX30LF1G08AC-TI

✅ Drop-In
📦 63-VFBGA (9x11)
cross-brand, 1 Gbit SLC x8 ONFI 1.0, same 63-VFBGA footprint, electrically equivalent for design-in

📋 Reference alternative (not in catalog)

W29N01HVBINF-TR Maximum Ratings & Electrical Characteristics

Memory Type Non-volatile NAND Flash (SLC)
Density 1 Gbit (128 MB)
Organization x8 (8-bit multiplexed I/O bus)
Interface Parallel ONFI 1.0 NAND
Supply Voltage (VCC) 2.7 V to 3.6 V (3.3 V typical)
Random Access Time 20 ns
Page Size 2048 + 64 bytes
ECC Requirement 4-bit ECC per 528 bytes
Program/Erase Cycles 100,000 cycles (SLC typical)
Package 63-ball VFBGA, 9 mm x 11 mm
Mounting Type Surface Mount
Compliance RoHS compliant, Halogen-Free
Packaging Tape and Reel (TR suffix)

W29N01HVBINF-TR Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 NC — Not connected
Pin A2 IO7 — Data I/O bit 7
Pin A3 IO6 — Data I/O bit 6
Pin A4 IO5 — Data I/O bit 5
Pin A5 IO4 — Data I/O bit 4
Pin A6 NC — Not connected
Pin A7 NC — Not connected
Pin A8 NC — Not connected
Pin A9 NC — Not connected
Pin B1 NC — Not connected
Pin B2 VSS — Ground
Pin B3 VCC — Power supply 3.3V
Pin B4 NC — Not connected
Pin B5 VSS — Ground
Pin B6 VCC — Power supply 3.3V
Pin B7 NC — Not connected
Pin B8 NC — Not connected
Pin B9 VSS — Ground
Pin C1 VSS — Ground
Pin C2 IO3 — Data I/O bit 3
Pin C3 IO2 — Data I/O bit 2
Pin C4 IO1 — Data I/O bit 1
Pin C5 IO0 — Data I/O bit 0
Pin C6 NC — Not connected
Pin C7 ALE — Address Latch Enable
Pin C8 CLE — Command Latch Enable
Pin C9 NC — Not connected
Pin D1 VCC — Power supply 3.3V
Pin D2 VSS — Ground
Pin D3 NC — Not connected
Pin D4 NC — Not connected
Pin D5 WP# — Write Protect (active low)
Pin D6 NC — Not connected
Pin D7 NC — Not connected
Pin D8 VSS — Ground
Pin D9 VCC — Power supply 3.3V
Pin E1 NC — Not connected
Pin E2 NC — Not connected
Pin E3 NC — Not connected
Pin E4 NC — Not connected
Pin E5 NC — Not connected
Pin E6 NC — Not connected
Pin E7 NC — Not connected
Pin E8 NC — Not connected
Pin E9 NC — Not connected
Pin F1 VSS — Ground
Pin F2 NC — Not connected
Pin F3 NC — Not connected
Pin F4 NC — Not connected
Pin F5 RE# — Read Enable (active low)
Pin F6 WE# — Write Enable (active low)
Pin F7 NC — Not connected
Pin F8 NC — Not connected
Pin F9 VCC — Power supply 3.3V
Pin G1 VCC — Power supply 3.3V
Pin G2 NC — Not connected
Pin G3 NC — Not connected
Pin G4 NC — Not connected
Pin G5 CE# — Chip Enable (active low)
Pin G6 NC — Not connected
Pin G7 NC — Not connected
Pin G8 R/B# — Ready/Busy (active low)
Pin G9 VSS — Ground

Typical Applications

W29N01HVBINF-TR is suitable for 7 applications: Embedded Linux Boot and Root Filesystem, Industrial IoT Gateway Data Logging, Set-Top Box and Smart TV Firmware Storage, Automotive Infotainment and Telematics, Wi-Fi Router and Network Equipment, Printer Firmware and Font Storage, Smart Home and Wearable Device Firmware.

🖥️

Embedded Linux Boot and Root Filesystem

The W29N01HVBINF-TR provides 128 MB of SLC NAND storage ideal for hosting a complete embedded Linux distribution including kernel, device tree, and read-only rootfs. Its 1 Gbit capacity comfortably fits a 4-8 MB kernel plus a 32-64 MB squashfs or initramfs root filesystem. The 20 ns access time enables sub-100 ms kernel reads from cold boot. The ONFI 1.0 compliance guarantees driver portability across SoCs from NXP, TI, and Microchip. Pair with UBI/UBIFS for wear-leveling across the 100k P/E cycle endurance. Designers should reserve the last 10% of blocks for bad-block replacement to maximize field lifetime.

🏭

Industrial IoT Gateway Data Logging

The W29N01HVBINF-TR suits industrial IoT gateways that must retain configuration, telemetry buffers, and OTA staging images through power cycles. SLC NAND's 100k P/E cycles and 10-year retention exceed the typical 5-year service life of industrial equipment. The 63-VFBGA 9x11 mm footprint fits inside compact DIN-rail enclosures alongside the SoC and modem. The 3V single-rail supply simplifies power-tree design when paired with a 3.3V LDO. Implement periodic background scrubbing and ECC verification to detect bit rot early. The W29N01HV family operates reliably across industrial temperature ranges common to factory-floor and outdoor deployments.

📺

Set-Top Box and Smart TV Firmware Storage

Consumer set-top boxes and smart TVs use the W29N01HVBINF-TR to store the main firmware image, channel lists, and PVR recordings metadata. The 1 Gbit density matches the typical firmware footprint of Linux-based STB software stacks. The 4-bit ECC per 528-byte sector protects against read disturbances during long streaming sessions. The 63-VFBGA package sits flush on the underside of small STB mainboards where TSOP alternatives would not fit. Designers should implement A/B partition redundancy so failed firmware updates can be rolled back. The W29N01HVBINF-TR's stable ONFI 1.0 driver support across BSP versions minimizes firmware maintenance burden.

🚗

Automotive Infotainment and Telematics

The W29N01HVBINF-TR is positioned for automotive infotainment head units, instrument clusters, and telematics control units that require reliable non-volatile storage of map data, firmware, and event logs. While the standard part is industrial grade, the same Winbond W29N family includes AEC-Q100 variants that share the 63-VFBGA footprint. The wide 3.3V supply tolerance handles automotive load-dump events when paired with proper input protection. SLC endurance exceeds automotive 8-10 year service life requirements under typical write workloads. Designers must implement robust power-loss protection because automotive cranking events can interrupt NAND writes mid-page.

🌐

Wi-Fi Router and Network Equipment

Home and SMB Wi-Fi routers, switches, and ONT optical network terminals use the W29N01HVBINF-TR for firmware, configuration, and small-scale packet logging. The 128 MB capacity fits OpenWrt, DD-WRT, or vendor firmware with room for log retention. The 20 ns access time keeps CLI commands responsive during boot and configuration save/restore. The 63-VFBGA footprint enables compact router PCBs where space is at a premium. Implement a separate NVRAM partition (typically the last 2 MB) using UBI for wear-leveled configuration storage. The single 3.3V rail aligns with typical router power supplies.

🖨️

Printer Firmware and Font Storage

Office and industrial printers use the W29N01HVBINF-TR to store firmware, printer drivers, fonts, and macro definitions. The 1 Gbit capacity provides ample space for PCL/PostScript font libraries and customer-supplied macros. The 4-bit ECC protects against bit errors that would otherwise manifest as corrupt characters. The small 63-VFBGA package fits within the constrained printer controller boards alongside the SoC and DDR memory. The 100k P/E endurance supports typical office printer firmware update cycles of a few writes per month across a 10-year service life.

🧩

Smart Home and Wearable Device Firmware

Smart home hubs, security panels, and wearable devices benefit from the W29N01HVBINF-TR's combination of small footprint, low power, and reliable non-volatile storage. The 128 MB capacity fits firmware plus user data such as schedules, device pairings, and small media files. The 3V single-rail supply pairs well with battery-powered designs where a 1.8V rail would be impractical. The 63-VFBGA package enables compact wearables and small IoT devices. Designers should use a journaling file system or FTL to handle frequent small writes typical of sensor data buffering in IoT applications.

What is the density and bus width of the W29N01HVBINF-TR?
The W29N01HVBINF-TR provides 1 Gbit (128 MB) of SLC NAND storage on an 8-bit multiplexed I/O bus. According to the Winbond W29N-HV product page, the device is ONFI 1.0 compliant with a 2048 + 64 byte page architecture. The x8 interface matches the standard NAND controller hardware used in most embedded SoCs.
What supply voltage does the W29N01HVBINF-TR require?
The W29N01HVBINF-TR operates from a single 2.7V to 3.6V supply (3.3V typical), which simplifies the power-tree design compared to dual-voltage 1.8V NAND parts. The Winbond datasheet confirms that VCC serves both the core logic and the I/O drivers. This single-rail architecture is one reason the W29N01HV is widely adopted in 3.3V-only industrial designs.
Is the W29N01HVBINF-TR still in production in 2026?
Yes. As of 2026-10-04, the W29N01HVBINF-TR is listed as active on DigiKey, Mouser, LCSC, and Winbond's own product page. The part remains part of the active W29N-HV ONFI 1.0 family. Lead times at major distributors typically run 6-12 weeks for high-volume reels, with smaller quantities generally available from stock.
What is the difference between W29N01HVBINF and W29N01HVBINF-TR?
Both parts share identical silicon, die, and 63-VFBGA (9x11) package. The 'TR' suffix indicates Tape and Reel packaging, while parts without the suffix ship in Tray. According to Winbond's part-numbering convention, the -TR variant is intended for high-volume SMT assembly lines that require reeled components. Electrical specifications are identical between the two forms.
How many program/erase cycles can the W29N01HVBINF-TR endure?
SLC NAND cells in the W29N-HV family are typically rated for 100,000 program/erase cycles per block, with 10 years of data retention. This is roughly 10x the endurance of MLC and 20x that of TLC NAND. To maximize endurance, designers should implement wear-leveling at the file-system layer such as UBI, JFFS2, or an FTL.
Does the W29N01HVBINF-TR need an external ECC controller?
Yes. The W29N01HVBINF-TR requires the host controller to implement 4-bit ECC per 528-byte sector per the ONFI 1.0 standard. Most modern SoCs include a hardware BCH or Reed-Solomon NAND controller; if not, an external FPGA or dedicated ECC chip is needed. Without ECC, bit errors during read become statistically certain over the device lifetime.
Where can I download the W29N01HVBINF-TR datasheet?
The official W29N01HVBINF datasheet PDF is available directly from Winbond's product page at https://www.winbond.com/hq/product/code-storage-flash/onfi-nand/w29n-hv/ where you select the part number. Third-party distributors such as DigiKey and Mouser also host mirrored PDFs on their product pages. Always verify the document revision matches the latest Winbond release before designing in.
Where can I buy the W29N01HVBINF-TR at the best price?
As of 2026-10-04, the W29N01HVBINF-TR is stocked at DigiKey, Mouser, LCSC, Xecor, and Ampheo. LCSC lists pricing from $1.3287 in volume, while DigiKey and Mouser price around $2.85 at qty-1 for engineering samples. For production volumes of 1k+ units, requesting a direct quote from Winbond's authorized distributors typically yields the lowest per-piece cost.
What is the lead time for the W29N01HVBINF-TR in 2026?
Lead time for the W29N01HVBINF-TR as of 2026-10-04 is approximately 6-12 weeks at major authorized distributors for reel quantities, with limited qty-1 stock available at DigiKey and Mouser for prototype work. Winbond has historically maintained stable production of the W29N-HV family, so allocation has not been reported. For urgent demand, LCSC often carries small reels from regional warehouses.
Is there an automotive-grade (AEC-Q100) version of W29N01HVBINF-TR?
The W29N01HVBINF-TR is the standard industrial-grade part. For AEC-Q100 qualified versions of the W29N family, Winbond offers specific automotive part numbers - check the 'W29N01HV' series selector on the Winbond website for the -AUT or -Q suffix variants. These automotive parts share the same 63-VFBGA footprint but are tested to the wider -40C to +105C or +125C temperature ranges and additional reliability protocols.
W29N01HVBINF-TR vs MT29F1G08ABAEAWP - which is better for Linux boot?
Both parts are 1 Gbit SLC x8 NAND with ONFI 1.0 compatibility, so Linux boot performance is essentially identical. The W29N01HVBINF-TR uses a 63-VFBGA package while the Micron MT29F1G08ABAEAWP uses 48-TSOP, so PCB layout is the deciding factor. For new designs in compact embedded systems, the VFBGA Winbond part is preferred due to its smaller footprint.
Can I replace the W29N01HVBINF-TR with a larger density Winbond NAND?
Yes, the W29N-HV family is software- and pin-compatible across densities (1 Gb to 8 Gb in the same 63-VFBGA). For example, the W29N02HV (2 Gb) and W29N04HV (4 Gb) drop into the same footprint and use the same ONFI 1.0 commands. The host controller will detect the new density at runtime via the ONFI parameter page, requiring no firmware changes beyond potentially updating the partition table.
What file systems work best with W29N01HVBINF-TR for industrial data logging?
For industrial data logging on the W29N01HVBINF-TR, UBI/UBIFS is the recommended Linux file system because it provides wear-leveling, bad-block management, and power-cut tolerance out of the box. JFFS2 also works but has higher mount-time overhead. For bare-metal designs, a custom Flash Translation Layer implementing wear-leveling is required to reach the rated 100k P/E cycle endurance.
What is the boot time of a Linux kernel from W29N01HVBINF-TR?
Reading a typical 4 MB Linux kernel image from the W29N01HVBINF-TR takes approximately 60-100 ms at the rated 20 ns access time, assuming sequential page reads at the ONFI 1.0 standard t_R timing. Actual kernel boot is dominated by decompression, driver init, and root-filesystem mount, not raw NAND throughput. For faster boot, designers can use NAND-to-RAM shadowing with a small boot NOR.
What is the best cross-brand drop-in replacement for the W29N01HVBINF-TR?
The best cross-brand drop-in replacement for the W29N01HVBINF-TR is the Micron MT29F1G08ABAEAWP, which is also 1 Gbit SLC x8 ONFI NAND, but ships in a 48-TSOP package rather than the 63-VFBGA used by Winbond. For an exact VFBGA-63 pin-compatible cross-brand alternative, designers should evaluate the Macronix MX30LF1G08AC or the GigaDevice GD5F1GQ4UCYJG, both available in 63-ball BGA with ONFI 1.0 compliance.

Engineering reference data for W29N01HVBINF-TR — comparison, design guidance, and compliance information.

Selection Guide

Choose the W29N01HVBINF-TR when you need 1 Gbit of reliable SLC NAND in a compact 63-VFBGA 9x11 mm package with single-rail 3.3V supply, ONFI 1.0 software compatibility, and reel packaging for high-volume SMT. The -TR suffix is essential for production lines using pick-and-place equipment; choose the tray-packaged W29N01HVBINF (no -TR suffix) only for prototype builds. If your design may scale to 2 Gb or 4 Gb density in the future, the W29N02HVBINF or W29N04HVBINF drop into the same PCB footprint. For automotive AEC-Q100 requirements, request the W29N01HV-Q automotive variant from Winbond. If Winbond supply is constrained, the Macronix MX30LF1G08AC-TI is a pin-compatible cross-brand alternative. Avoid 1.8V-only NAND parts unless your SoC requires them.

Comparison with Alternatives

Parameter This Product W29N01HVBINF W29N02HVBINF W29N04HVBINF W29N01HVSI-NF MX30LF1G08AC-TI
Brand Winbond Winbond Winbond Winbond Winbond Macronix
Package 63-VFBGA (9x11 mm) 63-VFBGA (9x11 mm) - same 63-VFBGA (9x11 mm) - same 63-VFBGA (9x11 mm) - same 63-VFBGA (9x11 mm) - same 63-VFBGA (9x11 mm) - same
Density 1 Gbit 1 Gbit 2 Gbit 4 Gbit 1 Gbit 1 Gbit
Bus Width x8 x8 x8 x8 x8 x8
Supply Voltage 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V
Access Time 20 ns 20 ns 25 ns 25 ns 20 ns 25 ns
ONFI Compliance ONFI 1.0 ONFI 1.0 ONFI 1.0 ONFI 1.0 ONFI 1.0 ONFI 1.0
Packaging Tape and Reel Tray Tape and Reel Tape and Reel Tape and Reel Tape and Reel

Key Differentiators

  • Footprint-compatible density scaling within the W29N-HV family (vs W29N02HVBINF)
  • Cross-brand drop-in availability (vs MX30LF1G08AC-TI)
  • Single-rail 3.3V supply (vs W29N01HVBINF)

Design Notes

Estimated: at 3.3V VCC and a typical 30 mA active read current, the W29N01HVBINF-TR consumes approximately 100 mW during read and 30 mW in standby. Add a 0.1 uF decoupling capacitor within 5 mm of each VCC ball to suppress high-frequency noise from simultaneous IO switching. Place a bulk 4.7 uF capacitor near the VCC balls to handle program/erase current spikes that can reach 50 mA for short bursts.

Route the 8-bit IO bus with matched trace lengths (delta < 2 mm) and 50 ohm characteristic impedance to preserve signal integrity at the 20 ns access time. Keep CLE, ALE, WE#, RE#, and CE# traces short and away from switching power nodes. The 63-VFBGA 0.8 mm pitch requires microvia or laser-drilled via-in-pad PCB technology for reliable escape routing. Maintain a continuous ground plane on the layer immediately beneath the BGA.

The W29N01HVBINF-TR's CLE, ALE, and CE# inputs are sampled on the rising edge of WE# during command cycles. Ensure your host controller's NAND controller implements proper setup (t_DS) and hold (t_DH) times per the Winbond datasheet's AC timing table. Avoid placing series resistors on the IO bus unless specifically required for EMI mitigation, as they degrade edge rates and may cause timing violations.

Do not assume the W29N01HVBINF-TR is pre-formatted - it ships from the factory with all blocks marked good but with potentially random data. Run an initial bad-block scan during board bring-up and update the BBT (Bad Block Table) before deploying any file system. Failure to mark initial factory-bad blocks will cause later data corruption when the file system unknowingly writes to a known-defective block. Also remember that NAND page writes are not atomic; a power loss during programming can corrupt both the target page and adjacent pages, so always implement a journal or write-ahead log at the application layer.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

Per the Winbond W29N-HV product page, all Winbond Flash products are Halogen-Free and RoHS compliant. Standard W29N01HVBINF-TR is industrial grade, not AEC-Q100 qualified - request the automotive -Q variant for AEC-Q100 compliance.

Data verified on: 2026-10-04 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Winbond W29N01HVBINF-TR W29N01HVBINF W29N02HVBINF W29N04HVBINF W29N01HVSI-NF MX30LF1G08AC-TI NAND Flash SLC NAND ONFI 1.0 non-volatile memory memory IC 63-VFBGA BGA package surface mount RoHS Halogen-Free AEC-Q100 ECC wear-leveling UBI JFFS2 Linux boot industrial IoT
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