W29N01HVBINF-TR - 1Gb 3V SLC NAND Flash, 63-VFBGA | Winbond
部品番号: W29N01HVBINF-TR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.55 | $25.50 |
| 100 | $2.18 | $218.00 |
| 500 | $1.85 | $925.00 |
| 1,000 | $1.62 | $1,620.00 |
W29N01HVBINF-TR 概要
A NAND Flash memory is a non-volatile storage technology that retains data without power by storing charge on floating-gate transistors. SLC NAND stores one bit per cell, delivering the highest endurance (typically 100k P/E cycles), fastest write speeds, and longest data retention among NAND types - making it the preferred choice for code storage, boot media, and industrial data logging where MLC/TLC reliability would be inadequate. The W29N-HV family sits in the ONFI 1.0 standard ecosystem (NAND Flash -> non-volatile memory -> memory IC -> semiconductor), allowing seamless software reuse across vendors.
Key features include a 1 Gbit density in the smallest standard NAND footprint, hardware WP# (Write Protect) and R/B# (Ready/Busy) status pins, 4-bit ECC requirement per 528 bytes, and an extended operating temperature range suitable for industrial applications. The device uses a 3V VCC for both the core and I/O, simplifying power-tree design by removing the 1.8V requirement common to higher-density parts.
Typical applications include embedded Linux/Android boot storage on routers, set-top boxes, and IoT gateways; firmware and asset-log retention in industrial control and metering equipment; data logging in automotive infotainment and telematics modules; and code shadowing from NOR/ROM to faster NAND in consumer electronics. The 63-VFBGA package is footprint-compatible with the wider Winbond W29N family, enabling PCB reuse across 1 Gb to higher densities.
When designing with this part, ensure the host controller or SoC implements the ONFI 1.0 software driver and a BCH or Hamming ECC engine capable of 4-bit correction per 528-byte sector. For long-term reliability, apply wear-leveling at the file-system (e.g., UBI/YAFFS/JFFS2) or FTL layer, because raw NAND blocks wear out at the rated P/E cycle count. This page synthesizes Winbond datasheet specifications, current distributor pricing, drop-in alternatives, and practical design notes not consolidated on any single manufacturer or distributor page.
The W29N01HVBINF-TR is halogen-free and RoHS compliant per the Winbond product page. The 'TR' suffix denotes Tape and Reel packaging suitable for high-volume SMT assembly.
ドロップイン代替品: W29N01HVBINF-TR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: W29N01HVBINF-TR （同一形状・フットプリント） — 相違点: Interface, Organization, Page Size.
クイック比較ツール — 並列比較する代替部品を選択:
W29N01HVBINF
✅ ドロップイン✓ 在庫あり
$1.21 / 個
データシートを見る →W29N02HVBINF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
W29N04HVBINF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
W29N01HVSI-NF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MX30LF1G08AC-TI
✅ ドロップイン📋 参考代替品（カタログ未掲載）
W29N01HVBINF-TR 最大定格＆電気的特性
| メモリタイプ | Non-volatile NAND Flash (SLC) |
| Density | 1 Gbit (128 MB) |
| メモリ構成 | x8 (8-bit multiplexed I/O bus) |
| インターフェース | Parallel ONFI 1.0 NAND |
| Supply Voltage (VCC) | 2.7 V to 3.6 V (3.3 V typical) |
| Random Access Time | 20 ns |
| Page Size | 2048 + 64 bytes |
| ECC Requirement | 4-bit ECC per 528 bytes |
| Program/Erase Cycles | 100,000 cycles (SLC typical) |
| パッケージ | 63-ball VFBGA, 9 mm x 11 mm |
| 実装タイプ | Surface Mount |
| Compliance | RoHS compliant, Halogen-Free |
| Packaging | Tape and Reel (TR suffix) |
W29N01HVBINF-TR ピン構成
| ピン A1 | NC — Not connected |
| ピン A2 | IO7 — Data I/O bit 7 |
| ピン A3 | IO6 — Data I/O bit 6 |
| ピン A4 | IO5 — Data I/O bit 5 |
| ピン A5 | IO4 — Data I/O bit 4 |
| ピン A6 | NC — Not connected |
| ピン A7 | NC — Not connected |
| ピン A8 | NC — Not connected |
| ピン A9 | NC — Not connected |
| ピン B1 | NC — Not connected |
| ピン B2 | VSS — Ground |
| ピン B3 | VCC — Power supply 3.3V |
| ピン B4 | NC — Not connected |
| ピン B5 | VSS — Ground |
| ピン B6 | VCC — Power supply 3.3V |
| ピン B7 | NC — Not connected |
| ピン B8 | NC — Not connected |
| ピン B9 | VSS — Ground |
| ピン C1 | VSS — Ground |
| ピン C2 | IO3 — Data I/O bit 3 |
| ピン C3 | IO2 — Data I/O bit 2 |
| ピン C4 | IO1 — Data I/O bit 1 |
| ピン C5 | IO0 — Data I/O bit 0 |
| ピン C6 | NC — Not connected |
| ピン C7 | ALE — Address Latch Enable |
| ピン C8 | CLE — Command Latch Enable |
| ピン C9 | NC — Not connected |
| ピン D1 | VCC — Power supply 3.3V |
| ピン D2 | VSS — Ground |
| ピン D3 | NC — Not connected |
| ピン D4 | NC — Not connected |
| ピン D5 | WP# — Write Protect (active low) |
| ピン D6 | NC — Not connected |
| ピン D7 | NC — Not connected |
| ピン D8 | VSS — Ground |
| ピン D9 | VCC — Power supply 3.3V |
| ピン E1 | NC — Not connected |
| ピン E2 | NC — Not connected |
| ピン E3 | NC — Not connected |
| ピン E4 | NC — Not connected |
| ピン E5 | NC — Not connected |
| ピン E6 | NC — Not connected |
| ピン E7 | NC — Not connected |
| ピン E8 | NC — Not connected |
| ピン E9 | NC — Not connected |
| ピン F1 | VSS — Ground |
| ピン F2 | NC — Not connected |
| ピン F3 | NC — Not connected |
| ピン F4 | NC — Not connected |
| ピン F5 | RE# — Read Enable (active low) |
| ピン F6 | WE# — Write Enable (active low) |
| ピン F7 | NC — Not connected |
| ピン F8 | NC — Not connected |
| ピン F9 | VCC — Power supply 3.3V |
| ピン G1 | VCC — Power supply 3.3V |
| ピン G2 | NC — Not connected |
| ピン G3 | NC — Not connected |
| ピン G4 | NC — Not connected |
| ピン G5 | CE# — Chip Enable (active low) |
| ピン G6 | NC — Not connected |
| ピン G7 | NC — Not connected |
| ピン G8 | R/B# — Ready/Busy (active low) |
| ピン G9 | VSS — Ground |
主な用途
W29N01HVBINF-TR の用途: 7 件s: Embedded Linux Boot and Root Filesystem, Industrial IoT Gateway Data Logging, Set-Top Box and Smart TV Firmware Storage, Automotive Infotainment and Telematics, Wi-Fi Router and Network Equipment, Printer Firmware and Font Storage, Smart Home and Wearable Device Firmware.
Embedded Linux Boot and Root Filesystem
The W29N01HVBINF-TR provides 128 MB of SLC NAND storage ideal for hosting a complete embedded Linux distribution including kernel, device tree, and read-only rootfs. Its 1 Gbit capacity comfortably fits a 4-8 MB kernel plus a 32-64 MB squashfs or initramfs root filesystem. The 20 ns access time enables sub-100 ms kernel reads from cold boot. The ONFI 1.0 compliance guarantees driver portability across SoCs from NXP, TI, and Microchip. Pair with UBI/UBIFS for wear-leveling across the 100k P/E cycle endurance. Designers should reserve the last 10% of blocks for bad-block replacement to maximize field lifetime.
おすすめ
Industrial IoT Gateway Data Logging
The W29N01HVBINF-TR suits industrial IoT gateways that must retain configuration, telemetry buffers, and OTA staging images through power cycles. SLC NAND's 100k P/E cycles and 10-year retention exceed the typical 5-year service life of industrial equipment. The 63-VFBGA 9x11 mm footprint fits inside compact DIN-rail enclosures alongside the SoC and modem. The 3V single-rail supply simplifies power-tree design when paired with a 3.3V LDO. Implement periodic background scrubbing and ECC verification to detect bit rot early. The W29N01HV family operates reliably across industrial temperature ranges common to factory-floor and outdoor deployments.
おすすめ
Set-Top Box and Smart TV Firmware Storage
Consumer set-top boxes and smart TVs use the W29N01HVBINF-TR to store the main firmware image, channel lists, and PVR recordings metadata. The 1 Gbit density matches the typical firmware footprint of Linux-based STB software stacks. The 4-bit ECC per 528-byte sector protects against read disturbances during long streaming sessions. The 63-VFBGA package sits flush on the underside of small STB mainboards where TSOP alternatives would not fit. Designers should implement A/B partition redundancy so failed firmware updates can be rolled back. The W29N01HVBINF-TR's stable ONFI 1.0 driver support across BSP versions minimizes firmware maintenance burden.
おすすめ
Automotive Infotainment and Telematics
The W29N01HVBINF-TR is positioned for automotive infotainment head units, instrument clusters, and telematics control units that require reliable non-volatile storage of map data, firmware, and event logs. While the standard part is industrial grade, the same Winbond W29N family includes AEC-Q100 variants that share the 63-VFBGA footprint. The wide 3.3V supply tolerance handles automotive load-dump events when paired with proper input protection. SLC endurance exceeds automotive 8-10 year service life requirements under typical write workloads. Designers must implement robust power-loss protection because automotive cranking events can interrupt NAND writes mid-page.
おすすめ
Wi-Fi Router and Network Equipment
Home and SMB Wi-Fi routers, switches, and ONT optical network terminals use the W29N01HVBINF-TR for firmware, configuration, and small-scale packet logging. The 128 MB capacity fits OpenWrt, DD-WRT, or vendor firmware with room for log retention. The 20 ns access time keeps CLI commands responsive during boot and configuration save/restore. The 63-VFBGA footprint enables compact router PCBs where space is at a premium. Implement a separate NVRAM partition (typically the last 2 MB) using UBI for wear-leveled configuration storage. The single 3.3V rail aligns with typical router power supplies.
おすすめ
Printer Firmware and Font Storage
Office and industrial printers use the W29N01HVBINF-TR to store firmware, printer drivers, fonts, and macro definitions. The 1 Gbit capacity provides ample space for PCL/PostScript font libraries and customer-supplied macros. The 4-bit ECC protects against bit errors that would otherwise manifest as corrupt characters. The small 63-VFBGA package fits within the constrained printer controller boards alongside the SoC and DDR memory. The 100k P/E endurance supports typical office printer firmware update cycles of a few writes per month across a 10-year service life.
おすすめ
Smart Home and Wearable Device Firmware
Smart home hubs, security panels, and wearable devices benefit from the W29N01HVBINF-TR's combination of small footprint, low power, and reliable non-volatile storage. The 128 MB capacity fits firmware plus user data such as schedules, device pairings, and small media files. The 3V single-rail supply pairs well with battery-powered designs where a 1.8V rail would be impractical. The 63-VFBGA package enables compact wearables and small IoT devices. Designers should use a journaling file system or FTL to handle frequent small writes typical of sensor data buffering in IoT applications.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: W29N01HVBINF-TR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | W29N01HVBINF | W29N02HVBINF | W29N04HVBINF | W29N01HVSI-NF | MX30LF1G08AC-TI |
|---|---|---|---|---|---|---|
| Brand | Winbond | Winbond | Winbond | Winbond | Winbond | Macronix |
| Package | 63-VFBGA (9x11 mm) | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same |
| Density | 1 Gbit | 1 Gbit | 2 Gbit | 4 Gbit | 1 Gbit | 1 Gbit |
| Bus Width | x8 | x8 | x8 | x8 | x8 | x8 |
| Supply Voltage | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V |
| Access Time | 20 ns | 20 ns | 25 ns | 25 ns | 20 ns | 25 ns |
| ONFI Compliance | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 |
| Packaging | Tape and Reel | Tray | Tape and Reel | Tape and Reel | Tape and Reel | Tape and Reel |
主な差別化要因
- Footprint-compatible density scaling within the W29N-HV family （vs W29N02HVBINF)
- Cross-brand drop-in availability （vs MX30LF1G08AC-TI)
- Single-rail 3.3V supply （vs W29N01HVBINF)
設計ノート
Estimated: at 3.3V VCC and a typical 30 mA active read current, the W29N01HVBINF-TR consumes approximately 100 mW during read and 30 mW in standby. Add a 0.1 uF decoupling capacitor within 5 mm of each VCC ball to suppress high-frequency noise from simultaneous IO switching. Place a bulk 4.7 uF capacitor near the VCC balls to handle program/erase current spikes that can reach 50 mA for short bursts.
Route the 8-bit IO bus with matched trace lengths (delta < 2 mm) and 50 ohm characteristic impedance to preserve signal integrity at the 20 ns access time. Keep CLE, ALE, WE#, RE#, and CE# traces short and away from switching power nodes. The 63-VFBGA 0.8 mm pitch requires microvia or laser-drilled via-in-pad PCB technology for reliable escape routing. Maintain a continuous ground plane on the layer immediately beneath the BGA.
The W29N01HVBINF-TR's CLE, ALE, and CE# inputs are sampled on the rising edge of WE# during command cycles. Ensure your host controller's NAND controller implements proper setup (t_DS) and hold (t_DH) times per the Winbond datasheet's AC timing table. Avoid placing series resistors on the IO bus unless specifically required for EMI mitigation, as they degrade edge rates and may cause timing violations.
Do not assume the W29N01HVBINF-TR is pre-formatted - it ships from the factory with all blocks marked good but with potentially random data. Run an initial bad-block scan during board bring-up and update the BBT (Bad Block Table) before deploying any file system. Failure to mark initial factory-bad blocks will cause later data corruption when the file system unknowingly writes to a known-defective block. Also remember that NAND page writes are not atomic; a power loss during programming can corrupt both the target page and adjacent pages, so always implement a journal or write-ahead log at the application layer.
コンプライアンス情報
Per the Winbond W29N-HV product page, all Winbond Flash products are Halogen-Free and RoHS compliant. Standard W29N01HVBINF-TR is industrial grade, not AEC-Q100 qualified - request the automotive -Q variant for AEC-Q100 compliance.
