W989D6DBGX6I-TR - 512Mb Mobile LPSDR SDRAM, x16, 166MHz | Winbond
MPN: W989D6DBGX6I-TR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.45 | $2.45 |
| 10 | $2.18 | $21.80 |
| 100 | $1.85 | $185.00 |
| 500 | $1.52 | $760.00 |
| 1,000 | $1.31 | $1,310.00 |
| 3,000 | $1.18 | $3,540.00 |
W989D6DBGX6I-TR Overview
A Mobile LPSDR SDRAM is a class of low-power dynamic random-access memory that follows the JEDEC LPSDR standard (a low-voltage derivative of the SDR SDRAM family) designed for portable consumer electronics. It fits into the hierarchy LPSDR -> SDR SDRAM -> DRAM -> volatile memory -> semiconductor. LPSDR devices traditionally serve mobile phones, PMPs, GPS modules and other handhelds where 1.8 V I/O, low standby current and deep power-down modes are required. Compared with classic 3.3 V SDR SDRAM, Mobile LPSDR cuts I/O power roughly in half.
Key features of the W989D6DBGX6I-TR include: 512 Mbit density, x16 organization (32M words x 16 bits), 166 MHz / 5 ns maximum clock rate, 1.8 V single supply, four internal banks, and selectable CAS Latency (CL=2/3). The 46 nm process enables lower active current than the previous 60-90 nm generations of Winbond Mobile SDR. The device supports standard SDRAM commands: MRS, REF, ACT, PRE, RD, WR, plus partial-array self-refresh (PASR) and a deep power-down (DPD) mode for battery saving.
Architecturally, the W989D6DBGX6I-TR uses a 4-bank page-mode architecture with a 1024-cycle refresh window. Each bank contains 8K rows of 1K x 16 bits. The 16-bit wide host bus simplifies connection to mobile application processors with 16-bit SDR controllers, eliminating external bus-width conversion. The 54-ball VFBGA (8 mm x 9 mm) footprint allows reflow-compatible SMT assembly with controlled impedance routing for clock, DQS and data nets.
Typical applications include mobile phone main displays and user-interface framebuffers, portable media players (PMP), handheld gaming devices, GPS/PDA terminals, digital photo frames, low-end tablet controllers, automotive infotainment secondary displays, and embedded Linux devices that need a low-cost 16-bit external RAM expansion. The industrial temperature range also makes the part suitable for in-cabin automotive, outdoor signage, and rugged industrial handhelds.
When designing with this device, pay attention to PCB layout: route CK, CK# and DQS as length-matched, 50 ohm controlled-impedance pairs; place 0.1 uF plus 1 uF decoupling near each VDD/VDDQ ball; and follow the Winbond Mobile LPSDR layout checklist for VFBGA break-out. Power-rail sequencing must observe tRCD=18 ns, tRP=18 ns, and tRFC=110 ns; failure to meet these will corrupt refresh and lose data.
This page synthesizes distributor pricing (Mouser, DigiKey, LCSC, Octopart), 5-8 drop-in alternatives, application notes, and design guidance not found on the manufacturer datasheet, giving buyers and engineers a single source for selection.
Drop-in alternatives for W989D6DBGX6I-TR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with W989D6DBGX6I-TR (same form factor and footprint) — differing in MSL Level, Memory Type, Organization, Package, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
W989D6DBGX6I
✅ Drop-In✓ In Stock
$6.1 / Unit
View Datasheet →W989D6DBGX5I
✅ Drop-In📋 Reference alternative (not in catalog)
W949D6DBGX5I
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IS42S16160J-7TLI
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MT48LC16M16S
✅ Drop-In📋 Reference alternative (not in catalog)
W989D6DBGX6I-TR Maximum Ratings & Electrical Characteristics
| Memory Type | Mobile LPSDR SDR SDRAM (Volatile DRAM) |
| Density | 512 Mbit |
| Organization | 32M x 16 (16-bit data bus) |
| Maximum Clock Frequency | 166 MHz |
| Clock Access Time | 5 ns |
| Supply Voltage (VDD/VDDQ) | 1.8 V (typical); 1.7 V to 1.95 V range |
| Number of Internal Banks | 4 |
| CAS Latency (CL) | 2 / 3 selectable via MRS |
| Burst Length | 1, 2, 4, 8, full page |
| Refresh Window | 1024 cycles / 16 ms |
| Operating Temperature | -40C to +85C (Industrial) |
| Package | 54-ball VFBGA, 8 mm x 9 mm |
| Process Technology | 46 nm |
| Mounting Type | Surface Mount |
| Packaging Option | Tape & Reel (-TR suffix) |
| Low-Power Modes | Partial-Array Self-Refresh (PASR), Deep Power-Down (DPD) |
| RoHS Status | Compliant |
| MSL Level | 3 (168 hours) |
| Lead-Free | Yes |
W989D6DBGX6I-TR 54-ball vfbga, 8 mm x 9 mm Pin Configuration Guide
Pin configuration for W989D6DBGX6I-TR (54-ball vfbga, 8 mm x 9 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for W989D6DBGX6I-TR.
Refer to the datasheet for full pin configuration.
Typical Applications
W989D6DBGX6I-TR is suitable for 6 applications: Mobile Phone Display Framebuffer, Portable Media Player (PMP), GPS / PDA Handheld Terminal, Digital Photo Frame, Handheld Industrial Scanner, Automotive Infotainment Secondary Display.
Mobile Phone Display Framebuffer
The W989D6DBGX6I-TR provides 16-bit-wide, 1.8 V Mobile LPSDR backing store for the main LCD framebuffer in entry-level 2.5G/3G feature phones. Its 512 Mbit density comfortably holds a QVGA/WQVGA 16-bpp frame plus GUI tiles, and the x16 data bus avoids external width conversion against MediaTek/RDA-class mobile SoCs. Compared with classic 3.3 V SDR SDRAM, the 1.8 V rail roughly halves memory I/O power, directly improving talk-time on the handset battery. PASR and DPD modes let the firmware retain just the wake-state pixels during sleep, while CL=2/3 selectable latency keeps the interface simple for legacy SDR controllers. Reference designs at 166 MHz deliver smooth 30 fps panel refresh without bus contention. Industrial temperature grade is suitable for outdoor phones used in cold-climate markets. The 54-ball VFBGA footprint reflows cleanly on 4-layer 0.8 mm mobile phone PCBs.
Recommended
Portable Media Player (PMP)
The W989D6DBGX6I-TR acts as the external code/data memory expansion for low-cost PMP designs that decode MP3, AVI, and JPEG on a single 16-bit SDR SoC. 512 Mbit is enough to buffer a full CD-quality album plus playlists in code-and-data space. The 166 MHz clock rate supports MPEG-4 decode at 30 fps without bus stalls, while 1.8 V operation extends AAA-cell runtime by 30-40% versus 3.3 V SDR parts. Partial-Array Self-Refresh keeps recently played songs resident while the radio is paused, and Deep Power-Down drops quiescent current into the single-digit uA range for shipping mode. The 46 nm Winbond process keeps thermal output low inside enclosed plastic housings, avoiding the need for any heat-spreader. Industrial temperature rating supports cold-weather outdoor use of fitness and sports PMPs. Industrial temp grade covers operation from -40C to +85C.
Recommended
GPS / PDA Handheld Terminal
The W989D6DBGX6I-TR serves as the main system memory for handheld GPS receivers and PDA-style data terminals running WinCE / Linux / Nucleus on 16-bit SDR controllers. 512 Mbit holds maps for region-sized navigation plus UI strings, with the 166 MHz bandwidth keeping route recalculation under 1 s. 1.8 V operation enables GPS devices to run for 8-12 hours on a single Li-ion charge. PASR is leveraged during standby so only the last-known-position and clock rows stay refreshed. Industrial temperature rating is essential for outdoor handheld logistics scanners and surveying tools that operate in direct sunlight and freezing warehouses. The 8 mm x 9 mm VFBGA fits inside slim GPS enclosures that are otherwise constrained by antenna keep-out zones. The device's 1024-cycle / 16 ms refresh preserves data integrity during intermittent vehicle-power dropouts.
Recommended
Digital Photo Frame
The W989D6DBGX6I-TR functions as the image buffer in mid-range digital photo frames that decode JPEG slideshows from a 16-bit SDR-attached controller. 512 Mbit is sufficient to cache 30-50 medium-resolution photos in RAM for instant swipe-through, eliminating the flash read latency at each transition. The 166 MHz bandwidth keeps transition animation smooth, while the 1.8 V supply cuts standby power when the frame enters slideshow pause - a major concern in always-on consumer appliances. Deep Power-Down is used during shipping mode and overnight standby, drawing micro-amps and preserving calendar wake. The 46 nm Winbond process is reliable in long-life products that remain powered for years. Industrial temperature rating handles warm indoor-shelf environments and shipping trailers. The 54-ball VFBGA's small footprint enables slim 8-inch frames with narrow bezels.
Recommended
Handheld Industrial Scanner
The W989D6DBGX6I-TR is used in rugged handheld bar-code and QR-code scanners that run inventory-management firmware on a 16-bit SDR-hosted microcontroller. 512 Mbit supports both application code and the scanned-image audit log without constant flash writes, prolonging embedded flash lifetime. Industrial temperature range (-40C to +85C) lets the scanner operate in cold-storage warehouses and hot loading docks. 1.8 V operation preserves battery life on 18650 cells during long shifts. PASR is used to retain just the operational mode while the trigger is released, allowing instant wake on next scan. The 46 nm process contributes to low failure rate in devices that survive drops from 1.5 m onto concrete. The 54-ball VFBGA enables compact grip-form-factor PCBs with a dedicated antenna cutout.
Recommended
Automotive Infotainment Secondary Display
The W989D6DBGX6I-TR powers the secondary rear-seat entertainment display controller in entry-level automotive infotainment systems, where a low-cost 16-bit SDR SoC drives the panel. 512 Mbit holds the navigation map cache, video subtitle buffer, and audio codec scratch memory simultaneously. The industrial temperature rating (-40C to +85C) survives vehicle cabin conditions in summer sun and winter cold. 1.8 V rail keeps the auxiliary display module within tight seat-wiring harness current budgets, and PASR is used during ignition-off periods to retain climate-control preferences without draining the battery. The 46 nm Winbond mobile platform has a strong field-reliability record in long-lifecycle automotive programs. The 54-ball VFBGA enables slim PCB modules that fit behind headrest bezels. The 5 ns clock access supports 60 fps panel refresh without dropped frames.
Recommended
Recommended Products Summary
Engineering reference data for W989D6DBGX6I-TR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | W989D6DBGX6I | W989D6DBGX5I | W949D6DBGX5I | IS42S16160J-7TLI | MT48LC16M16S |
|---|---|---|---|---|---|---|
| Brand | Winbond | Winbond (same brand) | Winbond (same brand) | Winbond (same brand) | ISSI (cross-brand) | Micron Technology (cross-brand) |
| Package | 54-ball VFBGA (8x9) | 54-ball VFBGA (8x9) - same | 54-ball VFBGA (8x9) - same | 54-ball VFBGA (8x9) - same | 54-ball VFBGA (8x9) - same | 54-ball VFBGA (8x9) - same |
| Memory Type | Mobile LPSDR SDRAM | Mobile LPSDR SDRAM | Mobile LPSDR SDRAM | Mobile LPSDR SDRAM | Standard SDR SDRAM | Standard SDR SDRAM |
| Density | 512 Mbit | 512 Mbit | 512 Mbit | 256 Mbit | 256 Mbit | 256 Mbit |
| Organization | 32M x 16 | 32M x 16 | 32M x 16 | 16M x 16 | 16M x 16 | 16M x 16 |
| Maximum Clock Frequency | 166 MHz | 166 MHz | 166 MHz | 166 MHz | 143 MHz | 125 MHz |
| Supply Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Mobile LPSDR low-power architecture with PASR and DPD (vs IS42S16160J-7TLI (ISSI))
- 46 nm process node for lower active power (vs MT48LC16M16S (Micron))
- 512 Mb density on the same footprint as the 256 Mb family (vs W949D6DBGX5I (Winbond 256 Mb))
Design Notes
Route CK, CK# and DQS as length-matched, 50 ohm controlled-impedance pairs with no more than one via per signal. Place 0.1 uF plus 1 uF decoupling capacitors within 100 mil of each VDD/VDDQ ball. For 4-layer mobile-phone PCBs use a continuous GND plane under the VFBGA to control impedance and reduce EMI. Critical: do not run digital IO through the inner region beneath the BGA - keep it clear for power/ground via stitching. The Winbond Mobile LPSDR layout application note gives a worked 4-layer reference. Estimated: with 1 oz copper and 54-ball VFBGA at 0.8 mm pitch, the breakout via-in-pad micro-via stackup can be 8-mil pad / 12-mil drill, requiring 0.4 mm HDI PCB process. Cross-check your manufacturer supports BGA pitch before committing layout.
Power-rail sequencing: VDDQ must not exceed VDD by more than 0.3 V at any time during power-up or power-down to prevent latch-up. Recommended sequence: drive VDD first, then VDDQ within 5 ms, then enable CK with CKE held low for at least 100 us. During operation, tRCD=18 ns, tRP=18 ns, tRFC=110 ns must be respected. Enable PASR (Partial-Array Self-Refresh) in standby and DPD (Deep Power-Down) in shipping mode to reduce quiescent current by 90%. For battery-powered applications, a 1.8 V LDO with PSRR greater than 50 dB at 1 MHz is recommended to keep VDD ripple under 50 mV peak-to-peak during refresh bursts.
Do not use 3.3 V-only SDR firmware routines on the W989D6DBGX6I-TR: it operates at 1.8 V and 3.3 V input levels will damage the device. Do not exceed the maximum refresh interval of 16 ms - missing a refresh window causes data corruption that looks like a stuck-at fault. Do not pull CKE high before stable clock is present; CKE going high with unstable CK is a known source of boot failures on first prototypes. Note: the 166 MHz / CL=3 mode requires tCK greater than or equal to 5 ns and tAC less than 5 ns; if your controller cannot meet this, fall back to 133 MHz / CL=2 mode by setting the MRS bits accordingly.
Place a 50 ohm termination (or internal LDO bypass) close to CK and CK# pins if the trace length exceeds 25 mm. Use Vref = VDDQ/2 from a low-impedance divider at the controller side, not at the DRAM end, to avoid coupling. Series resistors on DQ and DQM of 22-33 ohm dampen reflections on long bus traces. Eye-diagram validation at 166 MHz should achieve a horizontal eye opening greater than 0.7 UI and vertical opening greater than 0.5 V at the DRAM balls. For multi-rank designs, use a fly-by CK topology and isolate ranks with a T-branch. Estimated: at 0.8 mm VFBGA pitch, fanout escape length should be less than 6 mm before via-in-pad to maintain 50 ohm impedance.
Compliance Information
RoHS compliant per Winbond product page. Industrial temperature range -40C to +85C. Not AEC-Q100 qualified; the industrial temp grade is suitable for in-cabin automotive infotainment but not for under-hood or safety-critical ECUs.
