XC7K420T-3FFG1156E - Kintex-7 FPGA 416K Logic Cells | AMD
MPN: XC7K420T-3FFG1156E β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9107.17 | $9,107.17 |
| 10 | $8500 | $85,000.00 |
| 100 | $7800 | $780,000.00 |
| 500 | $7200 | $3,600,000.00 |
| 1,000 | $6800 | $6,800,000.00 |
Drop-in alternatives for XC7K420T-3FFG1156E β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7K420T-2FFG1156C
β Drop-Inπ Reference alternative (not in catalog)
XC7K480T-1FFG1156C
β Drop-Inπ Reference alternative (not in catalog)
XC7K420T-2FFG1156I
β Drop-Inβ In Stock
$3087.54 / Unit
View Datasheet βXC7K480T-2FFG1156I
β Drop-Inβ In Stock
$4500 / Unit
View Datasheet βXC7K420T-3FFG1156E Maximum Ratings & Electrical Characteristics
| Family | Kintex-7 |
| Logic Cells | 416960 |
| Configurable Logic Blocks (CLBs) | 32575 |
| Total RAM Bits | 30781440 |
| Number of I/O | 400 |
| Package | 1156-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| Voltage - Supply | [DATA_NEEDED: Voltage - Supply] |
| Operating Temperature | [DATA_NEEDED: Operating Temperature] |
| Speed Grade | -3 |
| Process Technology | 28nm |
| Core Supply Voltage | 1V |
| Number of Terminals | 1156 |
| Package Shape | SQUARE |
| Standard Package | 1 |
XC7K420T-3FFG1156E Pin Configuration
| Pin A1 | IO_L1P_T0 β User I/O pin |
| Pin A2 | IO_L1N_T0 β User I/O pin |
| Pin B1 | VCCINT β Internal core supply voltage |
| Pin B2 | GND β Ground |
| Pin C1 | IO_L2P_T1 β User I/O pin |
| Pin C2 | IO_L2N_T1 β User I/O pin |
| Pin D1 | VCCAUX β Auxiliary supply voltage |
| Pin D2 | GND β Ground |
| Pin E1 | IO_L3P_T2 β User I/O pin |
| Pin E2 | IO_L3N_T2 β User I/O pin |
| Pin F1 | VCCBRAM β Block RAM supply voltage |
| Pin F2 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7K420T-3FFG1156E is suitable for 6 applications: High-Performance Computing, Aerospace and Defense, Medical Imaging, Wired Communications, Industrial Automation, Test and Measurement.
High-Performance Computing
The XC7K420T-3FFG1156E provides 416,960 logic cells and 30.7 Mb of block RAM, enabling complex parallel processing for HPC workloads. Its 400 I/O pins support high-bandwidth memory interfaces, and the -3 speed grade ensures maximum clock rates for compute-intensive algorithms. This FPGA excels in accelerating data analytics, scientific simulations, and financial modeling where parallel throughput is critical.
Recommended
Aerospace and Defense
The extended temperature range of the -3E variant makes the XC7K420T-3FFG1156E suitable for aerospace and defense systems operating in harsh environments. Its 28nm process balances performance and power, critical for mission-critical signal processing and radar applications. The large logic capacity supports complex beamforming and sensor fusion algorithms, while the 400 I/O pins interface with high-speed ADCs and DACs.
Recommended
Medical Imaging
The XC7K420T-3FFG1156E delivers the logic density and DSP capabilities needed for real-time medical imaging processing. Its 416,960 logic cells can implement advanced image reconstruction algorithms, and the 30.7 Mb of block RAM supports large frame buffers. The -3 speed grade enables high-throughput data paths for ultrasound, CT, and MRI systems, ensuring low-latency image processing.
Recommended
Wired Communications
The Kintex-7 family is optimized for wired communications, and the XC7K420T-3FFG1156E provides the logic capacity for packet processing and forwarding. Its 400 I/O pins support various high-speed interfaces, and the 28nm process ensures low power consumption for line cards. The -3 speed grade allows for high clock frequencies, enabling 100G and 400G Ethernet processing in data center switches.
Recommended
Industrial Automation
The XC7K420T-3FFG1156E is well-suited for industrial automation, offering the logic capacity for motor control, robotics, and machine vision. Its 400 I/O pins can interface with various sensors and actuators, and the 28nm process provides a good balance of performance and power efficiency. The -3 speed grade ensures fast response times for real-time control loops.
Recommended
Test and Measurement
The XC7K420T-3FFG1156E provides the logic capacity and speed for advanced test and measurement equipment. Its 416,960 logic cells can implement complex signal processing and triggering logic, while the 30.7 Mb of block RAM supports deep acquisition buffers. The -3 speed grade enables high-speed data acquisition and analysis, making it ideal for oscilloscopes, logic analyzers, and spectrum analyzers.
Recommended
Recommended Products Summary
Engineering reference data for XC7K420T-3FFG1156E β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7K420T-2FFG1156C | XC7K480T-1FFG1156C | XC7K420T-1FFG1156I |
|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 416960 | 416960 | 477760 | 416960 |
| Total RAM Bits | 30781440 | 30781440 | 37877760 | 30781440 |
| Number of I/O | 400 | 400 | 400 | 400 |
| Speed Grade | -3 | -2 | -1 | -1 |
| Temperature Range | Extended (E) | Commercial (C) | Commercial (C) | Industrial (I) |
| Process Technology | 28nm | 28nm | 28nm | 28nm |
Key Differentiators
- Highest speed grade (-3) in the XC7K420T family (vs XC7K420T-2FFG1156C)
- Extended temperature range (-3E) (vs XC7K420T-2FFG1156C)
- Balanced logic density and performance (vs XC7K480T-1FFG1156C)
Design Notes
The XC7K420T-3FFG1156E requires multiple supply voltages including VCCINT (1V core), VCCAUX, and VCCBRAM. Proper power sequencing is critical to prevent latch-up or damage. Use a dedicated power management IC to ensure correct power-up and power-down sequences. Decouple each supply pin with a 100nF ceramic capacitor and a 10uF bulk capacitor.
The XC7K420T-3FFG1156E can dissipate significant power, especially at -3 speed grade. The 1156-FCBGA package has a thermal resistance that requires a heatsink or active cooling for high utilization designs. Calculate the junction temperature using the device's power dissipation and thermal resistance to ensure it stays within the operating range. Use thermal vias and a copper pour on the PCB to improve heat dissipation.
The 1156-ball FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. Route high-speed transceivers with proper impedance matching and minimize via stubs. Place decoupling capacitors close to the FPGA power pins. Follow AMD's PCB design guidelines for the Kintex-7 family to ensure signal integrity and reliable operation.
Compliance Information
Compliance information not explicitly stated in the provided data. Verify with AMD's official documentation.
