XC7K420T-2FFG1156I - Kintex-7 FPGA 416K Cells | AMD
MPN: XC7K420T-2FFG1156I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3990.35 | $3,990.35 |
| 10 | $3720 | $37,200.00 |
| 100 | $3450 | $345,000.00 |
| 500 | $3200 | $1,600,000.00 |
| 1,000 | $3087.54 | $3,087,540.00 |
Drop-in alternatives for XC7K420T-2FFG1156I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC7K420T-2FFG1156C
✅ Drop-In📋 Reference alternative (not in catalog)
XC7K420T-1FFG1156C
✅ Drop-In✓ In Stock
$990 / Unit
View Datasheet →XC7K420T-L2FFG1156I
✅ Drop-In📋 Reference alternative (not in catalog)
XC7K480T-1FFG1156C
✅ Drop-In📋 Reference alternative (not in catalog)
XC7K480T-2FFG1156I
✅ Drop-In✓ In Stock
$4500 / Unit
View Datasheet →XC7K420T-2FFG1156I Maximum Ratings & Electrical Characteristics
| Family | Kintex-7 |
| Number of Logic Elements/Cells | 416960 |
| Number of LABs/CLBs | 32575 |
| Total RAM Bits | 30781440 |
| Number of I/O | 400 |
| Package / Case | 1156-FCBGA (35x35 mm) |
| Mounting Type | SMD (SMT) |
| Operating Temperature | -40°C to 100°C (TJ) |
| Supply Voltage | 1V (nominal) |
| Process Technology | 28nm |
| Speed Grade | -2 |
| Number of Terminals | 1156 |
| Package Code | BGA |
| Package Shape | SQUARE |
| RoHS Status | Compliant |
| Lead-Free Status | Lead Free |
XC7K420T-2FFG1156I Pin Configuration
| Pin A1 | IO_L1P_T0 — User I/O Bank 0, differential pair P |
| Pin A2 | IO_L1N_T0 — User I/O Bank 0, differential pair N |
| Pin B1 | VCCINT — Internal core supply 1.0V |
| Pin B2 | GND — Ground |
| Pin C1 | IO_L2P_T0 — User I/O Bank 0, differential pair P |
| Pin C2 | IO_L2N_T0 — User I/O Bank 0, differential pair N |
| Pin D1 | VCCAUX — Auxiliary supply 1.8V |
| Pin D2 | GND — Ground |
| Pin E1 | IO_L3P_T0 — User I/O Bank 0, differential pair P |
| Pin E2 | IO_L3N_T0 — User I/O Bank 0, differential pair N |
| Pin F1 | VCCIO_0 — I/O Bank 0 supply |
| Pin F2 | GND — Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7K420T-2FFG1156I is suitable for 6 applications: High-Performance Computing, Aerospace and Defense Signal Processing, Medical Imaging, Wired and Wireless Communications, Video Processing, Industrial Automation.
High-Performance Computing
The XC7K420T-2FFG1156I excels in high-performance computing applications such as data acceleration and network processing. With 416,960 logic cells and 400 I/Os, it can implement complex parallel processing architectures. The 28nm process and -2 speed grade provide high clock rates, while the 30.7 Mb of block RAM supports large data buffers. Its 1.0V core supply reduces power consumption compared to older FPGAs, making it suitable for power-constrained data centers. The industrial temperature range ensures reliable operation in demanding environments.
Recommended
Aerospace and Defense Signal Processing
In aerospace and defense, the XC7K420T-2FFG1156I is used for radar, electronic warfare, and secure communications. Its industrial temperature range (-40°C to +100°C) meets military environmental requirements. The 400 I/Os interface with high-speed ADCs and DACs, while the 28nm technology provides radiation-tolerant performance for space applications. The large logic capacity enables complex beamforming and signal processing algorithms. The FC-BGA package offers excellent thermal performance for high-reliability systems.
Recommended
Medical Imaging
The XC7K420T-2FFG1156I is ideal for medical imaging systems like CT scanners and MRI machines. Its 416,960 logic cells handle real-time image reconstruction and filtering. The 400 I/Os connect to high-resolution sensors and display interfaces. The 30.7 Mb block RAM stores image frames for processing. The -2 speed grade enables high-throughput data pipelines, while the industrial temperature range supports the thermal environment of medical equipment. The 28nm process ensures low power for portable devices.
Recommended
Wired and Wireless Communications
For communications infrastructure, the XC7K420T-2FFG1156I provides the logic density for baseband processing in 5G and LTE systems. Its 400 I/Os interface with high-speed transceivers and network processors. The 28nm technology supports low-latency packet processing. The large block RAM enables deep FIFOs for data buffering. The -2 speed grade handles high data rates, while the industrial temperature range suits outdoor base station environments. The FC-BGA package supports high-density PCB designs.
Recommended
Video Processing
The XC7K420T-2FFG1156I is well-suited for video processing in broadcast and surveillance systems. Its 416,960 logic cells implement video codecs, scaling, and enhancement algorithms. The 400 I/Os connect to HDMI, SDI, and camera interfaces. The 30.7 Mb block RAM stores video lines and frames. The -2 speed grade supports 4K and 8K video processing at real-time rates. The industrial temperature range allows deployment in outdoor surveillance cameras. The 28nm process balances performance and power for continuous operation.
Recommended
Industrial Automation
In industrial automation, the XC7K420T-2FFG1156I enables advanced motor control, robotics, and machine vision. Its 400 I/Os interface with sensors, actuators, and industrial networks. The 28nm technology provides high reliability for 24/7 operation. The large logic capacity implements complex control algorithms and safety functions. The -2 speed grade ensures fast response times, while the industrial temperature range (-40°C to +100°C) suits factory environments. The FC-BGA package offers robust mechanical stability.
Recommended
Recommended Products Summary
Engineering reference data for XC7K420T-2FFG1156I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7K420T-2FFG1156C | XC7K420T-1FFG1156C | XC7K420T-L2FFG1156I | XC7K480T-1FFG1156C |
|---|---|---|---|---|---|
| Package | 1156-FCBGA | 1156-FCBGA | 1156-FCBGA | 1156-FCBGA | 1156-FCBGA |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 416960 | 416960 | 416960 | 416960 | 477760 |
| Number of I/O | 400 | 400 | 400 | 400 | 400 |
| RAM Bits | 30781440 | 30781440 | 30781440 | 30781440 | 38338560 |
| Speed Grade | -2 | -2 | -1 | -2L | -1 |
| Temperature Range | -40°C to +100°C | 0°C to +85°C | 0°C to +85°C | -40°C to +100°C | 0°C to +85°C |
| Supply Voltage | 1V | 1V | 1V | 1V | 1V |
Key Differentiators
- Industrial temperature range (vs XC7K420T-2FFG1156C)
- Higher speed grade (vs XC7K420T-1FFG1156C)
- Standard power vs low-power (vs XC7K420T-L2FFG1156I)
Design Notes
The XC7K420T-2FFG1156I requires a robust power delivery network for its 1.0V core supply. Use multiple low-ESR ceramic capacitors (0.1uF and 1uF) placed close to the VCCINT pins, and a bulk capacitor (10uF) per power pin group. The VCCAUX supply (1.8V) also needs adequate decoupling. Refer to the AMD Kintex-7 power management application note for detailed recommendations.
With a 1156-FCBGA package and industrial temperature range, thermal management is critical. The device can dissipate significant power at high utilization. Use a heatsink or active cooling for designs exceeding 10W dissipation. Ensure adequate airflow and consider the thermal resistance of the PCB. The junction temperature must not exceed 100°C for reliable operation.
For high-speed signals, maintain controlled impedance traces (50 ohm single-ended, 100 ohm differential) and minimize via stubs. The FC-BGA package requires a multi-layer PCB with dedicated power and ground planes. Follow AMD's PCB design guidelines for the FFG1156 package to ensure signal integrity and manufacturability.
Compliance Information
RoHS compliant and lead-free per distributor data. AEC-Q100 not applicable for FPGA devices.
