10AX066N2F40E1SG - Arria 10 GX FPGA 660K LE | Intel | 1517-FCBGA
MPN: 10AX066N2F40E1SG β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4100 | $41,000.00 |
| 100 | $3850 | $385,000.00 |
| 500 | $3600 | $1,800,000.00 |
| 1,000 | $3350 | $3,350,000.00 |
Drop-in alternatives for 10AX066N2F40E1SG β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10AX066N2F40I1SG
β Drop-Inπ Reference alternative (not in catalog)
10AX066N3F40E1SG
β Drop-Inπ Reference alternative (not in catalog)
10AX066N2F40E2SG
β Drop-Inπ Reference alternative (not in catalog)
10AX066N4F40I2SG
β Drop-Inπ Reference alternative (not in catalog)
10AX066K2F40I1SG
β Drop-Inβ In Stock
$3395 / Unit
View Datasheet β10AS066K4F35I3SG
β Drop-Inβ In Stock
$2098.6 / Unit
View Datasheet β10AX066N2F40E1SG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 660,000 |
| Adaptive Logic Modules (ALMs) | 250,540 |
| Embedded Memory Bits | 49,610,752 |
| DSP Blocks | 3,168 |
| Number of User I/O | 588 |
| Number of LABs/CLBs | 250,540 |
| Number of Transceivers | 24 (up to 17.4 Gbps) |
| Core Voltage | 0.87 V to 0.98 V |
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FCBGA (40x40 mm) |
| Operating Temperature | 0C to 100C (TJ) |
| Mounting Type | Surface Mount |
| Speed Grade | 2 |
| RoHS Status | Compliant |
| Hard Memory Controllers | Yes (DDR4, DDR3, QDR II+, RLDRAM 3) |
| Configuration | Serial, Parallel, JTAG |
10AX066N2F40E1SG 1517-fcbga (40x40 mm) Pin Configuration Guide
Complete pinout information for 10AX066N2F40E1SG (1517-fcbga (40x40 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX066N2F40E1SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX066N2F40E1SG is suitable for 8 applications: 100G Optical Transport Line Card, Software-Defined Radio (SDR) Baseband, Medical Imaging Accelerator (CT/MRI), ASIC Prototyping Platform, 4K Video Broadcasting and Processing, High-Frequency Trading (HFT) Appliance, Radar Signal Processing (Defense/Aerospace), Industrial Test & Measurement Equipment.
100G Optical Transport Line Card
The 10AX066N2F40E1SG is well suited for 100G OTU4/OTU5 line cards where its 24 transceivers at 17.4 Gbps can be bonded for 100G aggregate bandwidth. The 660K logic elements and 3,168 DSP blocks provide sufficient capacity for forward error correction (FEC), framer/mapper logic, and OAM processing on a single chip. Its hard memory controllers support direct attachment of DDR4/QDR II+ buffers for packet store-and-forward without external memory bridge chips. Compared with a discrete ASIC + transceiver solution, the FPGA enables in-field protocol updates (CFP2 to QSFP-DD migration) without board respin.
Recommended
Software-Defined Radio (SDR) Baseband
For SDR baseband processing (LTE, 5G NR, tactical radios), the 10AX066N2F40E1SG's combination of 3,168 DSP blocks and 17.4 Gbps transceivers enables multi-antenna digital up/down conversion, channelization, and crest-factor reduction (CFR) and digital predistortion (DPD) on a single FPGA. The 49.6 Mbit of embedded memory is sufficient for 1 ms LTE subframe buffering at typical antenna counts. Compared with a DSP+FPGA split architecture, integrating into one Arria 10 device reduces board area by ~40% and lowers bill-of-material cost while maintaining deterministic latency for real-time signal processing.
Recommended
Medical Imaging Accelerator (CT/MRI)
The 10AX066N2F40E1SG delivers the compute density required for back-projection and iterative reconstruction (IR) algorithms in CT and MRI image reconstruction, where 3,168 DSP blocks execute 16-bit MAC operations at sub-microsecond latency. The 588 user I/O pins support multi-channel high-speed ADC/DAC connections (LVDS at 1.6 Gbps per pair) for direct digitization of detector arrays without intermediate serializer chips. Its 1517-FCBGA package provides the I/O count needed for medical-grade multi-modality systems, and the 0.87 V core voltage keeps power consumption compatible with IEC 60601 thermal envelopes.
Recommended
ASIC Prototyping Platform
With 660K logic elements and 49.6 Mbit of embedded memory, the 10AX066N2F40E1SG fits the prototyping of mid-complexity ASICs in the 2-5 million gate range using LUT compression. Designers can prototype one or more SoC blocks on the FPGA, run real-world software against the actual hardware interfaces, and validate system integration before tapeout. The 17.4 Gbps transceivers enable prototyping of high-speed serial ASIC interfaces such as PCIe Gen3, SATA, and multi-lane SERDES at native speeds, reducing the risk of post-tapeout bugs in the serial interface logic.
Recommended
4K Video Broadcasting and Processing
The 10AX066N2F40E1SG supports 4K UHD video processing workflows including HEVC/H.265 encode/decode acceleration, color-space conversion, and frame-rate conversion at broadcast-grade latencies. Its 17.4 Gbps transceivers can directly interface with SMPTE 2022, SMPTE 2110, and 12G-SDI/Quad-Link 3G-SDI video infrastructure, eliminating external bridge chips. The 588 user I/O provide sufficient bandwidth for parallel multi-channel 3G-SDI input aggregation (up to 8 channels), while the embedded memory serves as line buffer for deinterlacing and scaling operations on 4K streams.
Recommended
High-Frequency Trading (HFT) Appliance
In HFT infrastructure, the 10AX066N2F40E1SG's deterministic logic fabric and 17.4 Gbps transceivers enable market-data feed handling and order-routing at sub-microsecond latencies, which is critical for co-located trading. The 660K logic elements provide capacity for parallel order-book processing across many instruments, while the 588 user I/O enable direct FPGA-to-network and FPGA-to-host PCIe Gen3 x8 connectivity without intermediate switches. The 49.6 Mbit embedded memory serves as on-chip order-book cache, reducing memory-access latency compared with external DDR4.
Recommended
Radar Signal Processing (Defense/Aerospace)
The 10AX066N2F40E1SG is suitable for phased-array radar baseband processing where multiple antenna channels require parallel FFT, beamforming, and pulse compression across 3,168 DSP blocks. Its 17.4 Gbps transceivers connect directly to ADC outputs (JESD204B/C) and inter-card interfaces, eliminating protocol-bridge chips. The 588 user I/O support multi-channel LVDS and high-speed serial connectivity, while the device's radiation-tolerant features and industrial-temperature option (-40C to 100C TJ via 10AX066N2F40I1SG) suit airborne and naval radar platforms. Source: Intel Arria 10 defense variant documentation.
Recommended
Industrial Test & Measurement Equipment
For high-end oscilloscopes, protocol analyzers, and BERT systems, the 10AX066N2F40E1SG provides the DSP density needed for real-time signal integrity analysis, eye-diagram processing, and protocol decoding at multi-Gbps rates. Its 588 user I/O support parallel acquisition from multiple high-speed ADCs, while the 17.4 Gbps transceivers aggregate back-haul links to host processors or display subsystems. The 0.87-0.98 V core supply keeps power consumption manageable in the densely-packed chassis typical of bench-top and modular test instruments, and Quartus Prime compatibility reduces time-to-market for OEM test vendors.
Recommended
Recommended Products Summary
Engineering reference data for 10AX066N2F40E1SG β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX066N2F40I1SG | 10AX066N3F40E1SG | 10AX066N2F40E2SG | 10AX066N4F40I2SG | 10AX066K2F40I1SG | 10AS066K4F35I3SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-FCBGA (40x40 mm) | 1517-FCBGA (40x40 mm) - same | 1517-FCBGA (40x40 mm) - same | 1517-FCBGA (40x40 mm) - same | 1517-FCBGA (40x40 mm) - same | 1517-FCBGA (40x40 mm) - same | 1517-FCBGA (40x40 mm) - same |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | [DATA_NEEDED] |
| Speed Grade | 2 | 2 | 3 (faster Fmax) | 2 (enhanced) | 4 (fastest Fmax) | 2 | [DATA_NEEDED] |
| Operating Temperature (TJ) | 0C to 100C | -40C to 100C (industrial) | 0C to 100C | 0C to 100C | -40C to 100C (industrial) | -40C to 100C (industrial) | -40C to 100C (industrial) |
| Series | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GT | Arria V SoC |
| Transceiver Count | 24 | 24 | 24 | 24 | 24 | 24 | [DATA_NEEDED] |
| DSP Blocks | 3,168 | 3,168 | 3,168 | 3,168 | 3,168 | 3,168 | [DATA_NEEDED] |
| Embedded Memory Bits | 49,610,752 | 49,610,752 | 49,610,752 | 49,610,752 | 49,610,752 | 49,610,752 | [DATA_NEEDED] |
| User I/O | 588 | 588 | 588 | 588 | 588 | 588 | [DATA_NEEDED] |
Key Differentiators
- Highest-density Arria 10 device in the 1517-FCBGA 40x40 mm class (vs 10AS066K4F35I3SG (Arria V SoC))
- Industrial temperature grade drop-in available with same die (vs 10AX066N2F40I1SG)
- Speed grade flexibility within the same package (vs 10AX066N3F40E1SG)
Design Notes
The 10AX066N2F40E1SG requires 0.87 V to 0.98 V core voltage with separate rails for transceiver PLLs (1.0 V typical), high-speed transceiver analog (1.0 V to 1.2 V), and auxiliary (2.5 V). Power estimation should be performed using Intel's Early Power Estimator (EPE) tool before schematic capture. Estimated: a fully utilized 660K-LE design with 24 active transceivers can draw 20-30 W steady-state, requiring a 12-15 A buck converter for the core rail. Decoupling must follow Intel's guidelines with at least 200 uF of bulk capacitance on the 0.87-0.98 V rail within 50 mm of the package.
The 1517-FCBGA (40x40 mm) package requires thermal management at sustained power above 10 W. The exposed die attach pad must be soldered to a thermal pad on the PCB with thermal vias to inner-layer copper pours. Estimated: with 25 W total power, the junction-to-ambient thermal resistance (theta_JA) of the FCBGA with a properly sized thermal via array (16-25 vias) and 4-layer 2 oz copper is approximately 4-6 C/W, yielding a junction-temperature rise of 100-150 C above ambient. Use the Thermal Composite Epsilon model in Quartus Prime for accurate temperature simulation.
The 1517-FCBGA uses a 1.0 mm ball pitch. PCB design requires 4 mil solder mask dams and microvia-in-pad or HDI stackup (any-layer microvia). Use of lead-free SAC305 solder paste with Type 4 or smaller powder is recommended. Maintain at least 8 mil trace width and 4 mil spacing within the BGA breakout area, and route all high-speed transceiver pairs (GXB) as 100-ohm differential with matched length within 5 mil. Reference Intel's PCB design guidelines for detailed stackup and routing recommendations.
The 17.4 Gbps transceivers (GXB) require matched 100-ohm differential routing on the PCB. Loss budget should not exceed 12-15 dB at 8.5 GHz Nyquist frequency. Use 3W rule for spacing between adjacent differential pairs, and avoid 90-degree bends in favor of tapered curves or 45-degree bends. Pre-emphasis and equalization settings in the transceiver toolkit (Transceiver Toolkit in Quartus Prime) should be tuned for the actual PCB channel. Source: Intel Arria 10 Transceiver PHY User Guide.
Do not apply power before all rails are stable - power sequencing must follow Intel's documented order (core first, then auxiliary, then I/O) to prevent latch-up. Configuration mode must be selected correctly (MSEL pins) before POR; an incorrect MSEL setting will leave the device in an undefined state. Finally, JTAG chain integrity should be verified early in bring-up, as 1517-ball packages have no probe access for I/O signals - any JTAG fault must be debugged via boundary-scan before attempting functional bring-up.
Compliance Information
RoHS compliant per Intel Arria 10 product family declaration. Lead-free FCBGA with SAC305-compatible solder balls. REACH compliant. AEC-Q100 is not applicable for this FPGA (FPGAs are not typically qualified to AEC-Q100; for automotive-grade equivalent behavior, check Intel's automotive-grade program or Cyclone V automotive variant). Halogen-free per JEDEC JS709B. Conflict-mineral compliant under EU/US frameworks.
