FPGA & CPLD
Produtos (6666)
LCMXO3L-1300E-5UWG36CTR - MachXO3 1280 LUTs FPGA 36-WLCSP
The Lattice Semiconductor LCMXO3L-1300E-5UWG36CTR is a member of the ultra-low-power MachXO3L family of Field Programmable Gate Arrays (FPGAs) with 1280 Look-Up Tables (LUTs), housed in a 36-ball WLCSP (Wafer-Level Chip-Scale Package, UWG designation). Built on a 65 nm CMOS process node, the device integrates non-volatile configuration memory, 65 kbits of embedded Block RAM (EBR), and up to 28 user I/O pins, making it a compact glue-logic and control PLD solution. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose digital logic function is defined after manufacturing by the user via a configuration bitstream. FPGAs sit hierarchically between ASICs (Application Specific Integrated Circuits, which are fixed at fabrication) and CPLDs (Complex Programmable Logic Devices, typically non-volatile and lower density). The MachXO3 family is positioned as a control-PLD: bridging logic, bus bridging, power-sequencing, and I/O expansion in systems that also contain a host ASIC, ASSP, or processor. MachXO3L is the low-static-power variant, designed for always-on or battery-backed applications. Key features of this specific LCMXO3L-1300E part include 1280 LUTs, integrated 65 kbit user flash memory for user-defined parameters, on-chip User Flash Memory (UFM), a hardened I2C, SPI, and timer/counter IP core library, and programmable I/O supporting LVCMOS 1.2 V through 3.3 V standards. The 'E' speed grade provides extended commercial temperature operation, while the 1.2 V core voltage enables ultra-low static current consumption. Technically, the MachXO3L architecture uses four look-up tables per slice (LUT4) with dedicated carry logic, distributed RAM, and shift-register capability. The 36-ball WLCSP footprint suits space-critical designs such as wearable sensors, mobile accessories, and miniature IoT endpoints where PCB real estate is severely constrained. The device supports Lattice Diamond or Radiant design software for HDL synthesis, place-and-route, and bitstream generation. Typical applications include I/O expansion and bus bridging in industrial control boards, glue logic and power sequencing in consumer electronics, LED control and backlight management, portable medical sensor hubs, and low-power IoT edge nodes. It is particularly suited to battery-powered or energy-harvesting systems where the low-static-power 'L' sub-family variant minimises quiescent drain. When designing with this WLCSP variant, pay attention to PCB routing: the 0.4 mm ball pitch requires laser-drilled microvia stack-ups and ENIG or ENEPIG surface finishes for reliable assembly. Use Lattice's reference design PCB footprints in Diamond or Radiant to guarantee ball-to-pad alignment and to minimise tombstoning during reflow. Also account for the device's 1.2 V core supply, which is generated internally by an internal voltage regulator when VCC is applied at the standard 1.2 V rail. This page synthesizes distributor pricing, drop-in Lattice same-package alternatives, and practical design notes not found in the bare datasheet, giving engineers a single decision-ready reference for selecting the LCMXO3L-1300E-5UWG36CTR against competing control-PLD options.
LCMXO3LF-1300C-5BG256C - 1280 LUTs MachXO3LF FPGA, 256-BGA | Lattice
The Lattice Semiconductor LCMXO3LF-1300C-5BG256C is a non-volatile, ultra-low-power MachXO3LF family Field-Programmable Gate Array (FPGA) delivering 1280 Look-Up Tables (LUTs), 206 user I/O, and 65 kbit of embedded user Flash memory (EBR + CFG = 64 kbit per public listing, supplemented by distributed RAM) in a 256-ball caBGA (BG256) package. It targets glue logic, bus bridging, power sequencing, and instant-on control-plane tasks in industrial, consumer, and compute platforms.
LCMXO3LF-1300E-5UWG36CTR - 1280 LUTs FPGA, 36-WLCSP | Lattice
The Lattice Semiconductor LCMXO3LF-1300E-5UWG36CTR is a MachXO3 family Field Programmable Gate Array (FPGA) with 1280 Look-Up Tables (LUTs) and 65536 bits of embedded block RAM, housed in a 36-ball WLCSP/UFBGA wafer-level chip-scale package with 28 user I/O. It is built on a 40 nm process node, operates from a single 1.14 V to 1.26 V (1.2 V nominal) core supply, and is rated for the 0 °C to 85 °C commercial temperature range. A Field Programmable Gate Array (FPGA) is a programmable logic device that engineers configure after manufacture to implement custom digital circuits. FPGAs occupy a middle position in the programmable-logic hierarchy: above fixed-function ASICs in flexibility, above CPLDs in density and DSP performance, and alongside microcontrollers in the broader hierarchy of programmable semiconductors. The MachXO3 family specifically targets low-power, instant-on control-plane tasks such as I/O expansion, bus bridging, and glue-logic aggregation. Key differentiating features of the LCMXO3LF-1300E-5UWG36CTR include its extremely small 36-ball WLCSP footprint for ultra-compact PCBs, integrated 64 kbit user Flash memory for self-configuration without external boot ROM, embedded block RAM up to 64 kbit, and hardened I/O banks supporting multiple single-ended and differential standards (LVCMOS, LVTTL, LVDS, SSTL). The "5" speed grade and "E" enhanced-feature designation identify its performance tier within the MachXO3LF sub-family. Typical applications include mobile device I/O expansion and bridge logic, consumer electronics control planes, IoT edge nodes requiring small-footprint programmable glue, and portable/wearable products where board area is constrained. The 28 available user I/Os are partitioned across multiple I/O banks supporting mixed signaling levels. Designers should plan WLCSP PCB assembly carefully (NSMD pads, micro-via stacking, and underfill are strongly recommended for board-level reliability), observe the 1.2 V core supply tolerance window, and verify bank-voltage compatibility when mixing 1.8 V, 2.5 V, and 3.3 V peripherals. This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet.
LCMXO3LF-1300E-5UWG36ITR - 1280 LUT MachXO3 FPGA, 36-WLCSP | Lattice
The Lattice Semiconductor LCMXO3LF-1300E-5UWG36ITR is a member of the MachXO3LF family of non-volatile, instant-on Field Programmable Gate Arrays (FPGAs) integrating 1280 Look-Up Tables (LUTs), 65 kbits of embedded user flash memory, and 28 kbits of distributed memory in a compact 36-ball WLCSP (Wafer-Level Chip-Scale Package). It is built on a low-power 40 nm CMOS process and operates from a 1.2 V core supply with built-in 1.0 V and 2.5 V supporting rails for I/O and configuration, and is qualified to the AEC-Q100 automotive temperature grade (-40C to +100C junction) due to the "I" suffix. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that contains an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs occupy a tier above generic CPLDs because they integrate embedded memory blocks, hardware multipliers, PLLs, and high-speed I/O serializers. Within the programmable logic hierarchy, the MachXO3LF belongs to the "control PLD" category - bridging the gap between simple glue-logic CPLDs and high-density FPGAs such as Lattice ECP5 or Xilinx Artix-7. The L (low-power) and F (flash-based) attributes distinguish it from SRAM-based FPGAs because it is instant-on (configuration time <1 ms), single-chip, and supports live update without external boot memory. Key features include ultra-low static power (~1 mW typical), embedded Block RAM of 64 kbits, embedded User Flash Memory (UFM) of 65 kbits, two on-chip PLLs, support for LVCMOS 1.2/1.5/1.8/2.5/3.3 V I/O standards with mixed-voltage banks, and per-pin programmability. The device integrates a hardened I2C, SPI, and JTAG controller, plus a TransFR (Transparent Field Reconfiguration) engine that allows in-system bitstream updates without halting user logic. The 5UWG36ITR ordering code decodes to speed grade -5 (mid-performance), the WLCSP-36 package, Industrial/automotive temperature grade I, and Tape-and-Reel TR packaging. Architecturally, the MachXO3LF-1300E arranges 1280 LUT4-based logic elements in a fabric of Programmable Function Units (PFUs), supplemented by distributed SRAM and dual 18x18 hardware multipliers. Two sysCLOCK PLLs (each with four outputs) provide frequency synthesis, and an embedded hard IP block implements I2C, SPI, and timer/Counter functions - reducing the need for soft IP cores and saving logic resources. The non-volatile configuration cell uses floating-gate technology, eliminating external boot flash and supporting 10,000+ in-system reprogramming cycles. Typical applications of the LCMXO3LF-1300E-5UWG36ITR include I/O expansion and bridging in industrial control boards, automotive infotainment and ADAS glue logic, consumer electronics power sequencing, video interface bridging (MIPI, LVDS), robotics and motor-control timing blocks, and secure boot / system health monitoring. Designers also deploy the MachXO3LF as a companion PLD next to an applications processor or SoM to provide flexible I/O mapping and fail-safe logic. When designing with this part, pay attention to the WLCSP-36 (UWG36) land pattern requirements: WLCSP packages demand NSMD pads with 0.4 mm pitch and precise solder-mask openings (consult the Lattice MachXO3 Hardware Checklist, TN1088). Use the free Lattice Diamond or Radiant toolchain for synthesis, place-and-route, and bitstream generation. Always program a known-good golden image in the primary configuration page and a fallback image in the secondary page for field-update safety. This page synthesizes distributor pricing, package-level drop-in alternatives, and practical WLCSP-handling design notes that are not collected in a single datasheet, providing a practical reference for hardware engineers evaluating the LCMXO3LF-1300E-5UWG36ITR for low-density control PLD applications.
LCMXO3LF-1300E-5UWG36ITR1K - 1280 LUT MachXO3LF FPGA, 36-WLCSP | Lattice
The Lattice Semiconductor LCMXO3LF-1300E-5UWG36ITR1K is a MachXO3LF family field-programmable gate array (FPGA) integrating 1280 LUTs (logic elements), 160 LABs/CLBs, 65536 bits of embedded block RAM, and 28 user I/O in a 36-ball WLCSP (Wafer-Level Chip-Scale Package) measuring only 2.54 x 2.59 mm. The device operates from a single 1.14 V to 1.26 V core supply and supports the -40 °C to +100 °C industrial temperature range, making it suitable for space-constrained, low-power applications. The "LF" suffix denotes the low-power, low-static variant of the MachXO3 family with on-chip flash configuration memory, eliminating the need for an external boot PROM. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells that can be customized after manufacturing to implement arbitrary digital functions, glue logic, or compute pipelines. FPGAs sit above ASICs and microcontrollers in flexibility and below general-purpose CPUs in per-unit cost. The MachXO3 family is Lattice's ultra-low-power platform targeting IO expansion, bridge, and control plane functions in consumer, communications, and industrial designs, while the MachXO3LF adds hardened Embedded Block RAM (EBR) and on-chip flash for instant-on, single-chip operation. Key features of the LCMXO3LF-1300E-5UWG36ITR1K include 1280 4-input LUTs, 65 kb of distributed EBR, built-in user flash and configuration flash (instant-on at <1 ms typical), hardened I/O including hot-socket, pull-up/pull-down, Schmitt trigger, and LVCMOS 1.2/1.5/1.8/2.5/3.3 V support. The WLCSP package eliminates the lead frame and bond wires, minimizing inductance and package height for wearable, smartphone, and small-form-factor designs. The architecture combines LUT-based logic fabric with embedded EBR blocks, dedicated PLL, and hard I/O buffers. Configuration is stored in on-chip flash and can be reloaded via JTAG or SPI in seconds, enabling field upgrades and design iteration without re-bricking devices. The "5" speed grade and "E" enhanced-process indicator place this part in the mainstream performance bin for the family. Typical applications include I2C/SPI GPIO expansion for microcontrollers in IoT edge nodes, low-power sensor aggregation in wearables, LED control and backplane management in display modules, and glue-logic bridging in industrial HMI panels. The combination of single-chip instant-on and ultra-low static current also suits battery-backed always-on subsystems. When designing with this part, plan WLCSP ballout carefully: trace escape must route from the underside BGA pad array using microvia or fan-out PCB technology, and the small package footprint (2.54 x 2.59 mm) requires precise solder paste stencil aperture control. Power sequencing of the 1.2 V core rail must respect the MachXO3 inrush profile or use the internal power-on-reset circuit. This page synthesizes distributor pricing for the LCMXO3LF-1300E-5UWG36ITR1K, drop-in alternative MPNs that share the 36-WLCSP footprint, application circuits, and practical PCB layout notes that complement the Lattice MachXO3 family datasheet.
LCMXO3LF-2100C-5BG324C - 2112 LUT MachXO3LF FPGA | Lattice
The Lattice Semiconductor LCMXO3LF-2100C-5BG324C is a low-power, non-volatile MachXO3LF series Field Programmable Gate Array (FPGA) featuring 2112 Look-Up Tables (LUTs), 279 user I/O, and 75,776 bits of embedded block RAM, housed in a 324-ball CABGA (BG324) package. It operates from a 2.5V/3.3V core supply and supports a commercial temperature range, with a -5 (slower) speed grade optimized for low static power dissipation. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to implement custom digital circuits using arrays of configurable logic blocks (LUTs), programmable interconnect, and dedicated I/O. FPGAs sit above CPLDs and generic logic ICs in the programmable logic taxonomy, and below ASICs in performance/integration density. The MachXO3 family is positioned as a "simplified control PLD" that bridges the gap between traditional CPLDs and larger FPGAs, targeting glue-logic, bus-bridging, and platform-management applications. Key features include 2112 LUTs (4-input look-up tables), 75,776 bits of distributed block RAM, embedded user flash memory, support for multiple I/O standards (LVCMOS 1.2/3.6V, LVTTL, LVDS), per-pin pull-up/pull-down control, and dedicated PLL blocks for clock management. The non-volatile Flash configuration cell eliminates the need for external boot memory, enabling instant-on behavior. The LCMXO3LF architecture uses Lattice's proprietary low-power 40-nm process and embedded memory blocks, achieving sub-100 uA standby current while supporting up to 2112 LUTs. The device integrates hardened I/O buffers, 5K LUTs-equivalent distributed memory, and a 64-bit unique device identifier, simplifying secure provisioning. The 324-ball CABGA package provides 279 usable I/O, making the part well-suited for high-pin-count bridging tasks. Typical applications include consumer electronics display control, IoT sensor aggregation, industrial control panel bridging, automotive infotainment auxiliary controllers (with the -6/industrial variants), and server/embedded add-in software. The device is also well suited to PCIe endpoint bridging, MIPI bridging, and low-speed protocol adaptation. When designing with this part, ensure your pinout planning accounts for the dedicated configuration pins and that you use Lattice Diamond Next or Radiant design software for implementation; the development environment supports latches and is freely available from the manufacturer. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
LCMXO3LF-4300E-5MG121I - 4320 LUT MachXO3LF FPGA | Lattice Semiconductor
The Lattice Semiconductor LCMXO3LF-4300E-5MG121I is a low-density, ultra-low-power Field-Programmable Gate Array (FPGA) from the MachXO3LF series, with 4320 Look-Up Tables (LUTs), 94,208 bits of embedded memory (approximately 11.5 Kbit per LUT-block equivalent), 100 user I/O pins, and integrated 1.2V core supply delivered in a 121-ball Chip-Scale Fine-pitch Ball Grid Array (CSFBGA) surface-mount package. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks, interconnect, and I/O after manufacture. Within the broader taxonomy, this part sits at: MachXO3LF FPGA -> low-density FPGA -> programmable logic device -> logic IC -> semiconductor. The MachXO3LF family specifically targets glue-logic, bridging, control-plane, and instant-on applications where traditional CPLDs or low-end FPGAs are deployed, with ultra-low static and dynamic power suitable for battery-backed and always-on designs. Key features of the LCMXO3LF-4300E-5MG121I include 4,320 LUTs with up to 100 user I/O, embedded block-RAM of approximately 94,208 bits, a hardened I2C/SPI/UART/JTAG configuration interface, built-in user-internal and external oscillators, and on-chip PLLs. The device is built on a 65nm CMOS process technology, operates from a 1.2V core supply, and supports multiple I/O standards across several I/O banks. The "E" speed grade indicates an enhanced performance level and the "I" suffix denotes the industrial temperature range of -40C to +100C. Technically, the MachXO3LF architecture combines LUT-based logic fabric with hardened IP blocks for common functions, allowing very high I/O count for the LUT density. The embedded sleep mode reduces standby current to microamp levels, and instant-on capability allows sub-millisecond wake from configuration memory. The 121-ball CSFBGA (also denoted 121-VFBGA) package offers a compact 8x8 mm ball footprint suitable for space-constrained control-plane PCB designs. Typical applications for this part include I/O expansion and bridging in industrial controllers, glue-logic replacement, platform management for servers and storage, LED control and human-machine interface (HMI) systems, video signal multiplexing in consumer displays, secure boot and control PLD functions in communications infrastructure, and sensor aggregation in IoT edge nodes. When designing with this device, ensure the JTAG programming header (TCK/TMS/TDI/TDO) is accessible for in-system programming and that all VCCIO bank rails are properly decoupled with 100 nF ceramic capacitors adjacent to each power pin. Verify that the chosen configuration mode (typically SPI master from a serial flash) leaves the SPI flash footprint compatible with the Lattice Diamond toolchain. This page synthesizes distributor pricing, same-family drop-in alternatives within the MachXO3LF 121-ball CSFBGA package, and practical design notes that supplement the Lattice datasheet and family reference manual.
LCMXO3LF-6900C-5BG256C - 6864-LUT MachXO3LF FPGA | Lattice
The Lattice Semiconductor LCMXO3LF-6900C-5BG256C is a non-volatile, instant-on MachXO3LF field-programmable gate array with 6,864 LUTs, 240 Kbits of embedded RAM, and 206 I/Os in a 256-pin BGA package. It is designed for low-power system expansion, signal bridging, interface control, and general-purpose programmable logic. The verified distributor data identifies a commercial, slow speed grade and supports operation from 2.5 V and 3.3 V supply rails. Its configuration memory allows the FPGA to retain its programmed logic without continuously powering a separate SRAM-based configuration memory. An FPGA is a programmable digital semiconductor whose lookup tables, registers, interconnects, and I/O blocks are configured to implement custom parallel logic. Within the hierarchy of programmable-logic devices, an FPGA sits above simple programmable logic and below application-specific programmable devices. The MachXO3 family emphasizes low-power operation, instant-on configuration, flexible I/O, and a high I/O-to-logic ratio for control, bridging, and interface-management designs. Key verified features of the LCMXO3LF-6900C-5BG256C include 6,864 LUTs, 240 Kbits of embedded RAM, 206 I/O, a commercial temperature grade, and a slow speed grade. Its 256-LFBGA package supports dense board integration while providing a substantial pin count for high-fanout interfaces. The part is identified as a 2.5 V and 3.3 V programmable device, making it relevant to systems that need configurable logic without committing to an ASIC. The MachXO3LF architecture combines programmable logic, embedded block RAM, and flexible I/O resources in a single device. The 240 Kbits of RAM can be used for buffers, state machines, protocol translation, or small data-processing functions when a design does not require a larger external memory. Its 206 I/Os are useful for bridging legacy peripherals, translating interface signaling, or implementing control logic around processors and sensors. Typical applications include industrial interface expansion, camera and display control, communication bridging, embedded control, and low-power consumer electronics. The LCMXO3LF family is also supported by the MachXO3LF Starter Kit, which contains an LCMXO3LF-6900C-5BG256C device and provides a practical evaluation platform with SPI Flash for boot and dual-boot experiments. Designers should verify pin assignments, voltage-bank requirements, configuration pins, supported I/O standards, clocking, and power sequencing against the manufacturer datasheet before layout. BGA assembly also requires controlled PCB escape routing, inspection, and thermal design. The page combines verified distributor information, lifecycle caveats, datasheet links, and application guidance while leaving unspecified electrical values explicitly marked for data completion.
LCMXO3LF-6900E-5MG256I - 6864 LUT MachXO3LF FPGA | Lattice
The Lattice Semiconductor LCMXO3LF-6900E-5MG256I is a member of the ultra-low-density MachXO3LF family of non-volatile Field Programmable Gate Arrays (FPGAs) that delivers 6,864 Look-Up Tables (LUTs), 206 user I/O, and 245,760 bits of embedded memory in a 256-ball 0.5 mm pitch csfBGA package, with a 1.2 V core voltage and -40C to +100C industrial operating range. FPGAs (Field Programmable Gate Arrays) are user-programmable semiconductor devices built from a sea of configurable logic blocks (LUTs), programmable interconnect, and I/O cells, allowing engineers to implement any digital logic function post-fabrication. The MachXO3LF is Lattice's ultra-low-power, instant-on branch of the MachXO3 family, designed as a control PLD for glue logic, bus bridging, system configuration, and I/O expansion in cost- and power-sensitive applications. Compared with SRAM FPGAs, MachXO3LF uses on-chip Flash configuration memory so it boots in microseconds without an external boot PROM. Key features include 6,864 LUTs (MachXO3LF series), embedded 245,760-bit user Flash memory, distributed RAM, embedded block RAM, two PLL pairs, dual configuration I2C/SPI/SJTAG ports, and on-chip 1.2 V core regulator. The 256-ball csfBGA (MG256) package exposes 206 user I/O across multiple I/O banks supporting LVCMOS 1.2 V to 3.3 V and LVDS signaling standards, with per-pin slew-rate, drive strength, and pull configuration. The LCMXO3LF-6900E grade is the mid-density device between the 4,300 LUT and 9,400 LUT siblings. The architecture uses 65 nm Flash+CMOS process technology with embedded Flash configuration cells that eliminate the need for an external boot memory. The on-chip voltage regulator derives all internal rails from a single 1.2 V core or a 2.5 V/3.3 V single-rail supply, and the hardened I/O bank structure supports hot-socketing and 5 V tolerance on selected banks. The MachXO3LF supports Lattice Diamond and Lattice Propel design environments, plus IP libraries for I3C, I2C, SPI, UART, GPIO expansion, and platform management functions. Typical applications include I/O expansion and bridging in industrial controllers, machine vision cameras, and motor drives; control logic in LED/LCD displays and human-machine interface panels; secure boot monitors and platform management in servers and routers; and as a glue-logic replacement for CPLDs and discrete logic. The instant-on Flash configuration is particularly valuable in safety-critical systems where the FPGA must be active within milliseconds of power-up. When designing with this part, plan I/O bank assignments early because the 206 user I/O are split across four banks with independent voltage references, and unused banks can be powered down to reduce quiescent current. Use Lattice Diamond 3.x or later with the MachXO3LF device library for synthesis, place-and-route, and bitstream generation. This page synthesizes verified distributor pricing from DigiKey and Mouser (as of 2026-10-08), MachXO3LF family drop-in alternatives, and practical design notes not collected in a single location in the Lattice MachXO3LF datasheet.
LFCPNX-100-9LFG672C - 100K LC CertusPro-NX FPGA, 672-BGA | Lattice
The Lattice Semiconductor LFCPNX-100-9LFG672C is a CertusPro-NX family Field Programmable Gate Array (FPGA) built on a 28 nm FD-SOI process, integrating 100,000 logic cells, 3,833,856 bits of embedded memory, and 96000 LUTs in a 672-ball LFG (FCBGA) package. It delivers high-density general-purpose logic fabric with low static and dynamic power consumption characteristic of Lattice's Nexus platform, along with integrated 10G SerDes support for high-bandwidth serial interfaces. An FPGA (Field Programmable Gate Array) is a programmable logic device that allows hardware designers to implement custom digital circuits after PCB fabrication. The CertusPro-NX family sits within the broader taxonomy of programmable logic devices: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs differ from CPLDs and ASICs in that they offer far higher logic density, embedded memory blocks, DSP slices, and high-speed transceivers, while remaining reconfigurable in the field. The CertusPro-NX targets advanced general-purpose applications where balance between logic density, I/O bandwidth, and power efficiency is essential. Key features include up to 100K logic cells (LCs), high-speed 10G SerDes transceivers, a generous amount of embedded SRAM distributed across multiple block sizes, and a wide selection of general-purpose I/O. The device supports Lattice's Radiant and Diamond design toolchains and is AEC-Q100 qualified, making it suitable for automotive, industrial, and edge-compute deployments. The 672-ball LFG package exposes 313 user I/O pins, supporting flexible PCB integration. Architecturally, the CertusPro-NX leverages a 28 nm Fully Depleted Silicon-on-Insulator (FD-SOI) process that provides excellent soft-error rate performance, low leakage, and high static power efficiency. Embedded memory is partitioned into large RAM blocks, and the SerDes blocks support multiple protocol standards (PCIe, 10G Ethernet, CPRI) via firmware-loaded PCS layers. The Nexus platform also integrates hardened peripherals including configuration engines, PLLs, and security features. Typical applications include industrial edge AI inference, machine vision, video bridging, automotive sensor fusion, and 5G wireless infrastructure. With its combination of high logic density and low power, the LFCPNX-100 is well suited for battery-powered or thermally constrained deployments where larger 7 nm or 12 nm FPGAs would be impractical. When designing with this device, ensure the PCB provides adequate decoupling (typically 0402/0603 ceramics placed close to each power pin), and allocate sufficient board real estate for the 672-ball BGA escape routing. Developers should use the Lattice Radiant tool suite for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing across five vendors, drops-in alternatives within the LFCPNX family, and practical design notes not consolidated in the manufacturer datasheet.
LFCPNX-100-9LFG672I - 100K LC CertusPro-NX FPGA, 672-BGA | Lattice
The Lattice Semiconductor LFCPNX-100-9LFG672I is a CertusPro-NX general-purpose field-programmable gate array (FPGA) delivering 96,000 logic cells with 3,833,856 bits of embedded memory in a 672-ball caBGA package (LFG672). Built on Lattice's 28 nm FD-SOI Nexus platform, it targets low-power edge applications that need small form factors, high reliability, and high-speed serial connectivity. An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that lets engineers implement custom digital logic, memory blocks, DSP blocks, and high-speed transceivers after PCB fabrication. FPGAs sit at the heart of embedded systems in a hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. CertusPro-NX is Lattice's advanced general-purpose FPGA family, positioned between low-density ECP5 and high-density Avant devices, optimized for bridging, sensor aggregation, and edge AI inference. Key features include 96K logic cells, 7.4 Mb embedded SRAM, 156 18x18 multipliers, dedicated DDR3/LPDDR4 memory controller hard IP, up to 10 Gbps SERDES lanes for PCIe Gen 3 and 10 GbE, and a wide variety of programmable I/O supporting LVCMOS, LVDS, and MIPI standards. The LFG672 caBGA package with 27x27 mm body footprint is part of the surface-mount BGA family and integrates a high-I/O-count silicon variant of the CertusPro-NX family. From an architectural perspective, CertusPro-NX uses Lattice's Nexus small-form-factor platform combined with hardened system IP such as SERDES and DDR PHY. The 28 nm FD-SOI process delivers improved soft-error rate (SER) and lower soft-error sensitivity compared to bulk CMOS, making the family suitable for industrial and aerospace applications where radiation-induced upsets are a concern. Typical applications include industrial sensor aggregation and machine vision, edge AI inference for low-power vision, motor control and robotics, PCIe bridging for host expansion, and 5G small-cell fronthaul. The 100K LC variant sits in the mid-density sweet spot between the LFCPNX-50 (smaller logic capacity) and LFCPNX-200 (highest density) devices, all sharing the same LFG672 package for migration headroom. When designing with this device, use Lattice Radiant software for synthesis, place-and-route, and bitstream generation. Provide stable power rails for VCC_CORE (0.85 V typical) and VCC_IO bank supplies; bulk decoupling close to each rail pin and a clean SERDES reference clock are critical for 10 Gbps link reliability. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers select and qualify the LFCPNX-100-9LFG672I faster.
LFD2NX-40-8BG256I - Certus-NX 39K LC 192 I/O FPGA | Lattice
The Lattice Semiconductor LFD2NX-40-8BG256I is a Certus-NX low-power general-purpose FPGA IC with 39,000 logic cells, 1,548,288 system gates, and 192 user I/O, housed in a 256-ball LFBGA (CABGA-256) surface-mount package. It is built on the Lattice Nexus platform using a 28nm FD-SOI process and operates from a 1V supply, with an industrial temperature grade. A Field Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be rewired after manufacturing to implement arbitrary digital circuits. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) alongside CPLDs, and they are widely used for glue logic, interface conversion, signal conditioning, and parallel processing tasks. Certus-NX occupies the low-power, small-form-factor node of modern FPGA offerings, optimized for energy-efficient designs that still require moderate logic density. Key features of the LFD2NX-40-8BG256I include high-speed transceivers, selectable Low Power vs High Performance modes enabled by programmable back-bias on the FD-SOI process, and AES-256 bitstream encryption with ECDSA authentication for design security. The 256-ball LFBGA package at 0.8mm ball pitch supports compact board integration while exposing 192 user I/O, sufficient for bridging multiple high-speed serial interfaces, sensor aggregation, or industrial control planes. The Nexus platform architecture combines LUT-based logic fabric with hardened I/O and SERDES blocks. FD-SOI (Fully Depleted Silicon-On-Insulator) process technology enables dynamic back-bias control, letting the user trade off static leakage against switching performance on demand. Hardened SERDES, PLLs, and memory controllers reduce soft-logic overhead and improve timing closure versus older 40nm nodes. Typical applications include 5G fronthaul, industrial sensor aggregation, machine vision camera interfaces, and edge-AI inference pre-processing. Choose this part when you need Certus-NX's power efficiency in a dense 256-ball BGA for compact embedded or industrial modules. A primary design consideration: verify signal integrity on the high-speed serial lanes and follow Lattice's recommended decoupling network. The LFBGA package requires careful stack-up planning to meet impedance targets. This page synthesizes distributor pricing, package-compatible drop-in alternatives from the Lattice Certus-NX family, and practical design notes not found on a single manufacturer page.
LFE2-20E-5F484C - 21K LUT FPGA, 331 I/O | Lattice
The Lattice Semiconductor LFE2-20E-5F484C is an ECP2 field-programmable gate array with 21K LUTs, 331 I/O, and DSP capability in a 484-BBGA package. It operates from a 1.2 V core supply and is identified as a -5 speed-grade device. The device is intended for programmable digital logic, embedded control, signal processing, and communications designs requiring a large I/O count. An FPGA is a programmable semiconductor whose lookup tables, registers, interconnect, and dedicated blocks can be configured after manufacture. The LFE2-20E-5F484C belongs to the ECP2 FPGA family and provides a hardware platform for parallel logic, state machines, interfaces, control logic, and DSP pipelines. Its 331 I/O make the package especially useful when the design requires substantial external connectivity. The supplied distributor information identifies the device as an ECP2 FPGA with 21K LUTs, 331 I/O, DSP support, 1.2 V operation, and a -5 speed designation. The package is identified as 484-BBGA. Detailed timing, memory, configuration, electrical, and temperature data are not present in the supplied source excerpts, so those values are not asserted here. The design should be checked against the manufacturer datasheet before layout, power budgeting, or production qualification. A -5 FPGA speed designation indicates the manufacturer’s speed-grade family, but the operating-temperature grade and timing margins are not stated in the verified excerpts. The 1.2 V core supply is the confirmed supply value, while external I/O supply requirements, configuration voltage, and power consumption require the full manufacturer documentation. The 484-BBGA package requires a PCB footprint and thermal design appropriate for a large fine-pitch BGA. Typical design uses include industrial automation, communications equipment, video and image processing, embedded control, and general-purpose programmable logic. The large I/O count can support external memory, parallel buses, sensor interfaces, transceiver connections, and control peripherals. DSP capability can reduce external processing hardware when the design uses fixed-point or parallel signal-processing functions implemented within the FPGA. For a new PCB, preserve the exact Lattice package pinout and ball assignment, define clean power and ground planes, and validate high-speed routing with the complete timing and pinout documentation. Do not treat distributor snippets as a substitute for the manufacturer datasheet. This page consolidates the verified distributor identity, package, density, I/O, voltage, and sourcing information while explicitly separating unknown technical details. The practical advantage of this part is its combination of moderate FPGA logic density, extensive I/O, DSP support, and a 1.2 V core architecture. It is more suitable than a small logic device when a design needs substantial parallel connectivity, while the -5 grade should be selected only after confirming timing requirements against the complete Lattice documentation.
LFE2-6E-5F256C - 6K Lattice ECP2 FPGA, 190 I/O | Lattice
The Lattice Semiconductor LFE2-6E-5F256C is a 6,000-cell ECP2 field-programmable gate array with 190 user I/O, 56,320 RAM bits, and a 256-pin FBGA package, optimized for 1.2 V operation. It combines programmable logic, block RAM, and DSP resources in a reconfigurable semiconductor for embedded control, communications, and signal-processing systems. The device operates from 1.14 V to 1.26 V and is specified for a 0°C to 85°C operating junction-temperature range. An FPGA is a programmable digital integrated circuit that can be configured after manufacture to implement logic, state machines, interfaces, and parallel processing functions. The LFE2 family belongs to the broader field-programmable logic and semiconductor hierarchy. Compared with a fixed-function application-specific integrated circuit, an FPGA allows design changes to be implemented through configuration rather than a new silicon layout, making it useful for prototypes, industrial equipment, communications infrastructure, and embedded systems. The LFE2-6E-5F256C provides 6,000 logic elements organized into 750 logic array blocks and includes 56,320 total RAM bits. The verified distributor data identifies 190 user I/O, a 1.2 V supply class, and a 256-FPBGA package measuring 17 x 17 mm. These resources make the device suitable for designs requiring parallel control logic, moderate memory buffering, protocol bridging, and programmable digital signal processing. Lattice ECP2 devices are also positioned for designs that need flexible logic density without the scale of a larger FPGA. The 90 nm ECP2 implementation combines programmable logic with advanced DSP blocks; high-speed SERDES capability is associated with the ECP2M family rather than being assumed for every ECP2 member. For the LFE2-6E-5F256C specifically, design engineers should use the manufacturer datasheet and package documentation to confirm configuration, I/O standards, clocking, power, and exposed-ball assignments before layout. Typical applications include industrial control systems, communications and protocol interfaces, embedded instrumentation, audio and general digital signal processing, data acquisition front ends, and compact embedded processors. Its 190 I/O and 56,320 RAM bits allow the FPGA to connect external memory or peripherals while offloading time-critical logic from a host processor. The 256-pin FBGA footprint also requires careful PCB routing and thermal design because the dense package can make escape routing and power delivery more demanding than a leaded package. When selecting this device, match the FPGA logic, RAM, DSP, clock, I/O, speed-grade, temperature, and power requirements to the exact system specification. A different FPGA with a similar cell count may require different tools, configuration handling, package balls, or I/O standards. This page combines verified distributor specifications, package information, and application guidance; exact pricing and stock status must be confirmed for the current purchase date. This product-data summary is intended to make the LFE2-6E-5F256C searchable for FPGA selection, package matching, and replacement evaluation without implying that every similarly packaged FPGA is pin-to-pin compatible.
LFE2-6E-5F256I - 6K LUT, 190 I/O ECP2 FPGA | Lattice
The Lattice Semiconductor LFE2-6E-5F256I is an ECP2 field-programmable gate array with 6,000 logic cells, 190 user I/O, a -5 speed grade, and a 1.2 V core supply in a 256-ball Fine Pitch Ball Grid Array package. It is designed for compact, parallel digital logic, control, interface, and signal-processing designs requiring programmable nonvolatile configuration and deterministic FPGA performance. A field-programmable gate array is a programmable semiconductor containing configurable logic blocks and programmable interconnect. An FPGA sits above basic fixed-function logic in the hardware hierarchy: programmable logic blocks can be connected by engineers after manufacture, allowing parallel datapaths, state machines, interfaces, and embedded control functions to be consolidated into one device. ECP2 devices combine this reconfigurable architecture with an industrial-temperature option and a high-I/O package. The verified distributor data identifies the device as an ECP2 FPGA with 6K logic cells, 190 I/O, a -5 speed designation, and a 1.2 V operating rail. DigiKey additionally lists 56,320 configuration bits and identifies the physical device as a 256-BGA package. The supplied Microchip USA result describes the package as 17 mm by 17 mm and notes 190 user I/O pins. Its snippet inconsistently states 750 lookup tables, so that value is not used as an authoritative specification. Lattice describes the ECP2/M family as optimized for advanced DSP blocks and, for ECP2M devices, high-speed SERDES. The exact DSP-block count, system frequency ranges, memory quantities, I/O standards, configuration interfaces, and power characteristics are not present in the supplied source text and therefore require confirmation from the complete manufacturer datasheet before design release. The 190-I/O count is especially useful for dense board-level integration, but users must assign pins according to the official package data and bank constraints. Typical uses include industrial control, data acquisition, communications gateways, embedded instrumentation, and parallel processing. The 256-ball package supports fine-pitch assembly but demands careful PCB layout, ball assignment, power-plane distribution, and signal-integrity control. The -5 suffix denotes the supplier-classified speed grade, while the final I suffix is reported by Partstack as an industrial temperature grade. For PCB design, use the manufacturer pinout and package drawing rather than generic BGA assumptions. Validate every power, ground, configuration, clock, and user-I/O ball against the current Lattice documentation. Confirm supported I/O standards and voltage domains before connecting external devices. This page synthesizes the supplied distributor records, package details, and replacement cross-references into an engineering-oriented procurement and selection summary.
LFE2-6E-5T144C - 6K LUT FPGA, 90 I/O | Lattice Semiconductor
The Lattice Semiconductor LFE2-6E-5T144C is an ECP2 field-programmable gate array (FPGA) with 6,000 LUTs, 90 I/O, and a 144-LQFP package. The supplied distributor data identifies the device as a 1.2 V, -5 speed-grade ECP2 FPGA with a 20 x 20 mm lead-free package. It is positioned for programmable logic, control, interface, and embedded digital systems where a compact, high-pin-count FPGA is required. An FPGA is a programmable digital integrated circuit whose logic and interconnect resources can be configured after manufacture. In the broader hierarchy, an FPGA belongs to programmable logic devices and sits above basic logic gates but below application-specific processors and systems. The LatticeECP2 family provides configurable logic blocks, programmable routing, dedicated resources, and I/O structures for parallel and serial digital designs. The LFE2-6E-5T144C combines 6,000 LUTs with 90 I/O in a 144-lead LQFP package. The -5 designation is associated with a -5 speed grade in the distributor listings, while the package code and gull-wing terminal description identify a 144-terminal surface-mount FPGA. The exact core voltage, operating-temperature range, embedded-memory configuration, block-resource quantities, and pin functions were not included in the supplied verified data and are therefore not inferred here. Typical design uses include industrial control logic, data-acquisition front ends, communications-interface bridges, instrumentation, embedded test equipment, and general-purpose digital prototyping. The 90-I/O count can be valuable when a design requires multiple parallel buses, control signals, or high-speed external interfaces. Designers should still confirm pin availability, voltage standards, and timing constraints against the official Lattice ECP2 documentation before schematic capture. A key design consideration is power planning. The distributor result identifies a 1.2 V FPGA, but the supplied data does not state core current, I/O current, power consumption, junction temperature, or thermal resistance. Those values must be taken from the manufacturer datasheet and the actual switching activity of the implemented design. Decoupling, ground-plane continuity, and pin-compatible replacement verification remain essential during PCB implementation. This page consolidates the verified distributor identity, package information, device resource summary, availability links, and engineering-oriented application context. It distinguishes documented facts from parameters that require confirmation from the Lattice Semiconductor datasheet rather than estimating values.
LFE2-6E-5T144I - 6K LUT, 90 I/O FPGA | Lattice
The Lattice Semiconductor LFE2-6E-5T144I is a 6K-LUT ECP2 field-programmable gate array with 90 user-programmable I/O pins, 56,320 RAM bits, and a 1.2 V supply class, packaged in a 144-pin TQFP. The I suffix identifies the industrial-temperature offering, while the -5 speed grade and 144-pin package support designs requiring deterministic programmable logic in industrial embedded systems. A field-programmable gate array, or FPGA, is a programmable semiconductor used to implement control logic, interfaces, protocol handling, datapaths, and DSP functions after board fabrication. Within the broader semiconductor hierarchy, an FPGA combines configurable logic blocks, programmable interconnect, block RAM, and I/O resources. This makes it useful when a design requires rapid revisions, parallel channels, mixed logic functions, or a compact controller that would otherwise require several fixed-function devices. The verified product data identifies 6K LUTs, 90 I/O, 56,320 RAM bits, and a 1.2 V operating class. A 144-TQFP package provides 144 physical leads and a surface-mount form factor suitable for automated PCB assembly. The available listing data also reports 90 I/O and a 144-TQFP package, while detailed pin assignments, block counts, pin standards, and configuration interface details require the manufacturer datasheet before layout or replacement approval. Typical ECP2 applications include industrial control, instrumentation, embedded communication, motion-control logic, and general-purpose programmable signal conditioning. The programmable architecture lets designers consolidate parallel control functions into one FPGA, while the 90 I/O count supports external memory, converters, communications transceivers, status indicators, and actuator or sensor interfaces. Designers should verify voltage tolerances and pin multiplexing against the device-specific pinout rather than relying only on the package name. For robust implementation, begin with the manufacturer pinout and power specifications, then define bank voltage constraints before assigning external interfaces. Place decoupling capacitors close to every supply pin, preserve the package footprint and exposed thermal requirements specified by the manufacturer, and program the device using the supported Lattice toolchain. A hardware replacement is valid only after checking pinout, I/O standards, supply rails, timing, configuration interface, and temperature grade. This product page consolidates verified distributor and cross-reference information, practical selection guidance, and design cautions for engineers evaluating the LFE2-6E-5T144I. Exact price, lead time, stock status, pin-level electrical limits, and full timing/resource parameters are not supplied consistently in the provided source data and should therefore be confirmed before procurement or PCB release.
LFE2-6E-6F256C - 6K LUT 190 I/O FPGA | Lattice Semiconductor
The Lattice Semiconductor LFE2-6E-6F256C is a 6,000-cell ECP2 field-programmable gate array with 6,000 LUTs, 190 I/O, 55 Kb block RAM, and a 1.2 V supply in a 256-pin FBGA package. Its -6 speed grade and DSP support suit compact control, interface, signal-processing, and embedded-logic designs requiring a high pin count and deterministic programmable logic. An FPGA is a semiconductor device whose digital behavior is defined by loading a configuration bitstream after manufacture. The ECP2 family belongs to the broader programmable-logic hierarchy and combines LUT-based combinational logic, embedded block RAM, programmable I/O, and dedicated DSP resources. This combination allows designers to implement parallel data paths, protocol handling, state machines, and control functions on one device. The verified listing identifies the LFE2-6E-6F256C as a 6K-LUT device with 190 I/O and DSP support at 1.2 V. Independent indexing also identifies the device as a 256-pin FBGA using 90 nm technology. These figures make the part relevant to industrial control, communications, test equipment, consumer electronics, and embedded systems that need more routing resources and I/O than a small programmable logic device can provide. The LFE2-6E-6F256C belongs to the LatticeECP2 family. Its large I/O count can simplify board-level connections when the design uses multiple buses, parallel data interfaces, or multiple external peripherals. The 55 Kb block RAM figure applies explicitly to the verified LFE2-6E-6FN256C family member; the supplied search data does not state that figure for LFE2-6E-6F256C, so that value is not used as a target specification here. For a new board, engineers should verify power rails, configuration interface support, I/O standards, pin constraints, and the exact package drawing before layout. Because the available evidence confirms 256 FBGA and 190 I/O but does not provide a complete manufacturer pin table, detailed ball assignments and electrical limits should be taken from the official Lattice documentation rather than inferred from distributor summaries. This page consolidates distributor availability, family-level technical context, procurement questions, and design cautions. It distinguishes verified facts from unavailable details and avoids treating generic FPGA advice as device-specific performance data. Check current distributor inventory and quote terms directly before committing a production BOM.
LFE2-6E-6F256I - 6K LUT FPGA, 190 I/O, 256-BGA | Lattice
The Lattice Semiconductor LFE2-6E-6F256I is an ECP2 field-programmable gate array with 6,000 logic elements, 56,320 total RAM bits, and 190 general-purpose user I/Os, housed in a 256-pin fine-pitch ball grid array package. It is designed for embedded programmable-logic applications requiring moderate logic density, parallel I/O, and configurable DSP resources. An FPGA is a programmable semiconductor whose logic, interconnect, and memory resources can be configured after fabrication. The LFE2-6E-6F256I belongs to the ECP2 family and provides a compact implementation platform for control logic, data acquisition, protocol bridging, and embedded signal-processing functions. Its 6K LUT class can consolidate multiple fixed-function blocks into one device while retaining field-updatable firmware. Key verified features include 6,000 logic elements, 750 equivalent logic blocks, 190 user I/Os, 56,320 RAM bits, and a 1.2 V supply designation. Distributor listings identify the device as an ECP2 FPGA with a -6 speed grade and industrial temperature designation. The package is identified as a 256-BGA package. The ECP2 architecture is useful when a design needs programmable routing and logic rather than a fixed application-specific integrated circuit. The 190 I/O count provides substantial parallel connectivity for buses, counters, control signals, and external memory interfaces, while the available logic and RAM resources support moderate state machines and buffering. Exact timing, voltage tolerances, configuration details, and pin functions should be confirmed in the manufacturer data sheet before layout or production release. Typical applications include industrial control and factory automation, communication-interface bridging, instrumentation and test equipment, embedded data acquisition, and compact control systems. The FPGA can consolidate interface logic and control functions, reducing component count when firmware flexibility is important. When designing a board, preserve the manufacturer's recommended power, decoupling, configuration, clocking, and ball-grid-array layout requirements. Validate signal integrity and thermal performance across the complete operating temperature range and programmed logic configuration. This page consolidates verified distributor and product data, application guidance, package information, and selection considerations for engineers evaluating the LFE2-6E-6F256I.
LFE2-6E-6T144C - 6K LUT, 90 I/O FPGA | Lattice Semiconductor
The Lattice Semiconductor LFE2-6E-6T144C is an ECP2 field-programmable gate array with 6K LUTs, 90 I/O, 6,320 logic cells, and a 144-pin TQFP package. Its 1.2 V core and -6 speed grade make it a compact programmable-logic device for embedded control, interface bridging, signal conditioning, and industrial automation. The verified distributor listing identifies the device as a LatticeECP2 FPGA manufactured using 90 nm technology and supplied in a tray package. A field-programmable gate array is a semiconductor whose configurable logic and interconnect resources implement digital functions after fabrication. An FPGA occupies the programmable-logic portion of the wider semiconductor hierarchy, above fixed-function logic ICs and below application-specific programmable systems. The ECP2 family combines programmable logic blocks, memory resources, digital signal processing capability, and general-purpose I/O in one reconfigurable device. This makes the LFE2-6E-6T144C useful when design rules change faster than a custom ASIC can be produced. Key features include 6K LUTs, 6,320 cells, 90 I/O, a 1.2 V supply, and a -6 speed designation. The 144-pin TQFP package provides 144 external terminals in a surface-mount gull-wing format. Verified web results describe the part as an ECP2 FPGA with DSP capability, but detailed block counts, I/O standards, memory parameters, and timing values were not supplied in the retrieved evidence. Those values should therefore be confirmed against the manufacturer datasheet before a design is released. The part’s architecture is appropriate for glue-logic implementations, protocol conversion, control-plane logic, parallel data acquisition, and compact embedded systems. Its 90 I/O count can reduce the need for external programmable peripherals when the board-level pin budget is constrained. The -6 designation identifies the manufacturer’s speed grade, while the commercial C suffix appears in the ordering code; the retrieved evidence does not provide the exact commercial-temperature limits. Typical uses include industrial controllers, sensor aggregation modules, test equipment, embedded communications bridges, and compact control systems. A 1.2 V FPGA core simplifies power partitioning when the surrounding board already includes a 1.2 V rail, but external interface voltage levels must be selected independently and checked against the actual I/O specifications. The 144-pin package is larger than common QFN options, so PCB area and routing resources must be included in the mechanical design. For a new board, place the FPGA close to its clocks, decoupling network, configuration interface, and high-speed I/O routes. Keep power and ground connections short, follow the manufacturer’s recommended land pattern, and validate signal integrity for any external interface. This page consolidates verified distributor specifications, procurement information, replacement analysis, and engineering guidance rather than repeating only the part-number description.
LFE2-6E-6T144I - 6K LUT FPGA, 90 I/O, 1.2 V | Lattice
The Lattice Semiconductor LFE2-6E-6T144I is an ECP2 series field-programmable gate array with 6,000 logic cells, 90 I/O, and 56,320 RAM bits in a 144-LQFP surface-mount package. The verified product data identifies a 1.2 V device with a -6 speed designation and an industrial temperature option encoded by the part number. Its architecture combines programmable logic resources, block RAM, and dedicated DSP capability in a compact programmable-logic device suited to embedded control, signal processing, communications, and industrial equipment. An FPGA is a reconfigurable digital semiconductor that contains configurable logic blocks and programmable interconnect. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can be programmed after manufacture to implement control logic, data paths, interfaces, and algorithms. The ECP2 family belongs to the broader FPGA and programmable-logic hierarchy, combining flexible parallel hardware with configuration-based design updates. The LFE2-6E-6T144I provides 6K logic elements, 90 I/O, and 56,320 RAM bits according to DigiKey and Mouser results. One supplier result also identifies 750 logic array blocks or configurable logic blocks, while the available data reports a 1.14 V to 1.26 V supply range and an operating junction temperature beginning at -40 °C. The -6 speed grade identifies the device speed option, but the supplied data does not establish the complete timing table, configuration interface details, or absolute maximum ratings. Typical uses include industrial control logic, sensor and acquisition systems, communications interface aggregation, low-power signal processing, and embedded instrumentation. The 90-I/O count provides substantial board-level connectivity for buses, status signals, control outputs, and external interfaces. The 56,320 RAM bits can support buffering, packet storage, counters, and small data tables, while the FPGA architecture allows parallel operations without relying on sequential processor execution. When designing around this device, verify the exact pinout, configuration memory interface, clock requirements, supported I/O standards, and bank voltage constraints in the LatticeECP2/M family data sheet. Do not infer pin compatibility solely from a matching package. The supplied search data supports the core resource and package claims, but not a complete manufacturer-qualified replacement list. This page combines verified distributor specifications, application guidance, and design cautions for engineers evaluating the LFE2-6E-6T144I. It distinguishes documented facts from unavailable parameters so procurement and hardware decisions can be made without inventing electrical or timing data.
LFE2-6E-6TN144C - 6K LUT ECP2 FPGA, 144-LQFP | Lattice
The Lattice Semiconductor LFE2-6E-6TN144C is a member of the LatticeECP2 (ECP2) family of Field Programmable Gate Arrays (FPGAs) fabricated on a 90 nm CMOS process, integrating 6,000 Look-Up Tables (LUTs), 56,320 flip-flops (or system gates), and 90 user I/O in a 144-pin TQFP/LQFP (TQ = Thin Quad Flat Pack) surface-mount package. The device features a -6 speed grade, operates from a 1.2 V core supply, and supports embedded DSP blocks for low-cost signal processing. The "E" suffix denotes the ECP2 family (low-cost, high-volume) while "C" denotes the commercial temperature grade. An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic functionality is defined after manufacturing by the user via a configuration bitstream loaded into on-chip SRAM. FPGAs sit hierarchically under programmable logic -> logic devices -> digital integrated circuits -> semiconductors. Unlike ASICs, FPGAs offer rapid prototyping, in-field re-programmability, and parallel hardware execution, making them ideal glue logic, interface bridging, and pre-silicon validation platforms. Key features of the LFE2-6E-6TN144C include 6,000 LUTs, 56,320 flip-flops equivalent in system gates, 90 user I/O pins, embedded sysDSP blocks for multiply-accumulate operations, dedicated DDR memory interface support, and on-chip PLLs for clock management. The device supports multiple I/O standards including LVCMOS, LVTTL, PCI, LVDS, SSTL, and HSTL. The 144-pin TQFP package is 22 mm × 22 mm with 0.5 mm pitch. The ECP2 architecture combines high-performance FPGA fabric with low-cost positioning, providing 311 MHz internal operation and pre-engineered IP cores through Lattice's ispLeverage / Lattice Diamond design tool chain. Embedded DSP blocks (typically 18×18 multipliers) accelerate signal-processing functions at lower power than soft multipliers implemented in LUT fabric. Hardened memory interface controllers simplify DDR1/DDR2 PHY integration. Typical applications include industrial control and factory automation glue logic, telecom interface bridging (SPI, I2C, UART, parallel buses), video processing front-ends, low-volume prototyping replacement for aging CPLDs, motor control and encoder interfaces, and medical/portable instrumentation requiring low-power programmable logic. The 6K LUT density suits medium-complexity state machines, bus conversion, and DSP pre-processing. When designing with this part, ensure all I/O banks receive proper VCCIO rail voltages matching the chosen I/O standard (1.2 V–3.3 V) and that the JTAG chain is properly terminated for in-system programming. Always validate timing closure at the chosen fMAX using Lattice Diamond timing analysis, as the 311 MHz figure is best-case for internal register-to-register paths only. This page synthesizes distributor pricing, drop-in alternatives within the ECP2 family, and practical design notes not consolidated in the manufacturer datasheet, helping engineers select the right speed grade, temperature grade, and package variant for production.
LFE2-6E-7F256C - 6000-LUT FPGA, 190 I/O, 256-BGA | Lattice
The Lattice Semiconductor LFE2-6E-7F256C is an ECP2 field-programmable gate array with 6000 logic cells, 190 I/O, a 420 MHz maximum operating frequency, and a 256-ball BGA package. It is designed for compact programmable-logic applications requiring substantial logic capacity, parallel interfaces, and embedded DSP resources. The -7 speed designation and 1.2 V supply place it in the performance-oriented portion of the LatticeECP2 family. An FPGA is a semiconductor whose digital logic and interconnects are configured after manufacture. In the broader hierarchy, an FPGA is a programmable logic device and therefore a type of semiconductor IC. ECP2 devices combine LUT-based logic, programmable routing, block RAM, DSP capability, and user I/O in one package. This combination allows designers to implement control logic, interface bridges, packet processing, signal conditioning, and embedded data pipelines without relying on a custom ASIC. Verified distributor data identifies this device as an ECP2 FPGA with 6000 cells, 190 I/O, and a 256-BGA package. The LFE2-6E-7F256C also appears in comparison data as a 420 MHz, 6000-cell PBGA256 device measuring 17 x 17 mm. Its 190 available I/O support substantial board-level connectivity, while the ECP2 architecture provides a practical balance between logic density, programmable functionality, and device integration. The suffix C denotes a commercial-temperature ordering code in the supplied comparison data, but the complete temperature range is not available in the provided sources. Typical applications include industrial automation, communications infrastructure, embedded control, video and image processing, data acquisition, and DSP-assisted signal processing. Its 190 I/O are useful when an interface must connect multiple buses, counters, memory devices, converters, or control peripherals. Its 6000-cell capacity is suitable for parallel datapaths and moderate protocol stacks, although design headroom should be checked against routing, timing, RAM, DSP, and pin-assignment requirements before committing to a production build. For reliable implementation, use the manufacturer pin table and package information rather than generic BGA assumptions. Decoupling, bank-supply requirements, configuration pins, clock topology, I/O standards, and unused-ball treatment must follow the LatticeECP2/M Family Data Sheet. A programmable device also depends on a valid bitstream, correct configuration clocking, and a suitable Lattice programming interface. This page consolidates the supplied distributor listings, package information, and cross-reference evidence. It separates verified values from unavailable electrical details and does not infer pricing, lifecycle, pinout, or compliance claims that were not established by the source data. Engineers should evaluate the LFE2-6E-7F256C when a 6000-cell FPGA, 190 I/O, 420 MHz-class performance, and 256-BGA integration align with the design. Confirm timing closure, memory and DSP availability, package ball assignments, and supply status in the official documentation before hardware release.
LFE2-6E-7T144C - 6K LUT ECP2 FPGA | Lattice Semiconductor
Lattice Semiconductor LFE2-6E-7T144C is an ECP2 field-programmable gate array with 6,000 logic cells, 56,320 embedded RAM bits, and 90 user I/O in a 144-pin LQFP package. The verified product data identifies a 1.2 V device with a -7 speed designation and DSP capability. It is designed for compact programmable-logic applications where moderate logic density, embedded memory, and a large pin count are useful without moving to a larger FPGA. What is an FPGA? A field-programmable gate array is a reconfigurable digital integrated circuit containing programmable logic, memory, and input/output resources. An FPGA belongs to the programmable-logic hierarchy and can be programmed after manufacture to implement control logic, interfaces, data acquisition, signal processing, or embedded systems. The LatticeECP2 family combines programmable logic blocks, DSP resources, and I/O in an integrated device. The LFE2-6E-7T144C is identified by the verified sources as an ECP2 FPGA with 6,000 logic elements, 90 user I/O, 56,320 bits of on-chip RAM, and a 144-LQFP package. The separate product references also describe 750 logic blocks and a 1.14 V to 1.26 V supply range. The -7 speed code is retained from the verified listing, while the commercial temperature grade and full timing details require confirmation from the manufacturer datasheet. Its 90 user I/O make the device suitable for systems that need multiple external interfaces, parallel buses, status signals, or mixed control and data paths. The 144-LQFP package provides a conventional surface-mount footprint and exposes substantially more pins than a small FPGA package. Designers should account for package routing, power distribution, signal integrity, and thermal performance in the final PCB design. Typical uses include industrial control, instrumentation, embedded data acquisition, communications interfaces, DSP-assisted signal processing, and compact embedded control platforms. The DSP feature cited in the verified listings can reduce external processing hardware when the design uses suitable fixed-point operations and parallel datapaths. Before finalizing a design, verify the pinout, bank voltages, supported I/O standards, configuration method, clock requirements, and power-sequencing constraints against the LatticeECP2/M Family Data Sheet. The available search data does not provide a manufacturer-controlled purchase price or complete pin-level assignment, so those details must not be inferred. This page combines verified distributor specifications, package information, application guidance, and strict replacement criteria for engineers evaluating the LFE2-6E-7T144C.