LCMXO3LF-1300E-5UWG36ITR - 1280 LUT MachXO3 FPGA, 36-WLCSP | Lattice
N.º da peça: LCMXO3LF-1300E-5UWG36ITR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.92 | $89,20 |
| 100 | $7.45 | $745,00 |
| 500 | $6.1 | $3.050,00 |
| 1.000 | $5.25 | $5.250,00 |
| 3.000 | $4.4 | $13.200,00 |
LCMXO3LF-1300E-5UWG36ITR Visão geral
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that contains an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs occupy a tier above generic CPLDs because they integrate embedded memory blocks, hardware multipliers, PLLs, and high-speed I/O serializers. Within the programmable logic hierarchy, the MachXO3LF belongs to the "control PLD" category - bridging the gap between simple glue-logic CPLDs and high-density FPGAs such as Lattice ECP5 or Xilinx Artix-7. The L (low-power) and F (flash-based) attributes distinguish it from SRAM-based FPGAs because it is instant-on (configuration time <1 ms), single-chip, and supports live update without external boot memory.
Key features include ultra-low static power (~1 mW typical), embedded Block RAM of 64 kbits, embedded User Flash Memory (UFM) of 65 kbits, two on-chip PLLs, support for LVCMOS 1.2/1.5/1.8/2.5/3.3 V I/O standards with mixed-voltage banks, and per-pin programmability. The device integrates a hardened I2C, SPI, and JTAG controller, plus a TransFR (Transparent Field Reconfiguration) engine that allows in-system bitstream updates without halting user logic. The 5UWG36ITR ordering code decodes to speed grade -5 (mid-performance), the WLCSP-36 package, Industrial/automotive temperature grade I, and Tape-and-Reel TR packaging.
Architecturally, the MachXO3LF-1300E arranges 1280 LUT4-based logic elements in a fabric of Programmable Function Units (PFUs), supplemented by distributed SRAM and dual 18x18 hardware multipliers. Two sysCLOCK PLLs (each with four outputs) provide frequency synthesis, and an embedded hard IP block implements I2C, SPI, and timer/Counter functions - reducing the need for soft IP cores and saving logic resources. The non-volatile configuration cell uses floating-gate technology, eliminating external boot flash and supporting 10,000+ in-system reprogramming cycles.
Typical applications of the LCMXO3LF-1300E-5UWG36ITR include I/O expansion and bridging in industrial control boards, automotive infotainment and ADAS glue logic, consumer electronics power sequencing, video interface bridging (MIPI, LVDS), robotics and motor-control timing blocks, and secure boot / system health monitoring. Designers also deploy the MachXO3LF as a companion PLD next to an applications processor or SoM to provide flexible I/O mapping and fail-safe logic.
When designing with this part, pay attention to the WLCSP-36 (UWG36) land pattern requirements: WLCSP packages demand NSMD pads with 0.4 mm pitch and precise solder-mask openings (consult the Lattice MachXO3 Hardware Checklist, TN1088). Use the free Lattice Diamond or Radiant toolchain for synthesis, place-and-route, and bitstream generation. Always program a known-good golden image in the primary configuration page and a fallback image in the secondary page for field-update safety.
This page synthesizes distributor pricing, package-level drop-in alternatives, and practical WLCSP-handling design notes that are not collected in a single datasheet, providing a practical reference for hardware engineers evaluating the LCMXO3LF-1300E-5UWG36ITR for low-density control PLD applications.
Alternativas drop-in para LCMXO3LF-1300E-5UWG36ITR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com LCMXO3LF-1300E-5UWG36ITR (mesmo formato e footprint) — diferindo em Operating Temperature, Mounting Type, Speed Grade, Configuration Memory, Core Supply Voltage.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LCMXO3LF-1300E-5UWG36CTR
✅ Drop-In✓ Em estoque
$2.84 / unidade
Ver ficha técnica →LCMXO3LF-1300E-5UWG36ITR50
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO3LF-1300E-5UWG36ITR1K
✅ Drop-In✓ Em estoque
$5.55 / unidade
Ver ficha técnica →LCMXO3LF-2100E-5UWG36ITR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LCMXO3LF-2100E-5UWG36CTR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LCMXO3L-1300E-5UWG36ITR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LCMXO3LF-1300E-5UWG36ITR Classificações máximas e características elétricas
| Family | MachXO3LF |
| Logic Elements / LUTs | 1280 LUTs |
| Embedded Block RAM | 64 kbits |
| Distributed Memory | 28 kbits (nominal) |
| User Flash Memory (UFM) | 65 kbits (nominal) |
| Number of PLLs | 2 |
| Hardware Multipliers | 2 (18x18) |
| Core Voltage | 1.2 V (nominal) |
| I/O Voltage Support | LVCMOS 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 40 nm CMOS, non-volatile (floating gate) |
| Encapsulamento | 36-ball WLCSP (UWG36) |
| Speed Grade | -5 (mid) |
| Temperatura de operação | -40C to +100C (Industrial / AEC-Q100) |
| Configuration Memory | Internal flash, instant-on (<1 ms) |
| Embedded Hard IP | I2C, SPI, JTAG, TransFR engine |
| Tipo de montagem | Surface Mount (WLCSP) |
| Lead Free / RoHS | Lead Free, RoHS compliant (per distributor listings) |
Configuração de pinos do LCMXO3LF-1300E-5UWG36ITR
| Pino A1 | GND — Ground |
| Pino A2 | IO_B0 — Bank 0 general-purpose I/O |
| Pino A3 | IO_B1 — Bank 0 general-purpose I/O |
| Pino A4 | IO_B2 — Bank 0 general-purpose I/O |
| Pino A5 | VCCIO0 — Bank 0 I/O supply |
| Pino A6 | VCC — Core 1.2 V supply |
| Pino B1 | IO_B3 — Bank 0 general-purpose I/O |
| Pino B2 | IO_B4 — Bank 0 general-purpose I/O |
| Pino B3 | IO_B5 — Bank 0 general-purpose I/O |
| Pino B4 | IO_B6 — Bank 0 general-purpose I/O |
| Pino B5 | IO_B7 — Bank 0 general-purpose I/O |
| Pino B6 | VCCIO1 — Bank 1 I/O supply |
| Pino C1 | GND — Ground |
| Pino C2 | TCK — JTAG test clock |
| Pino C3 | TDI — JTAG test data in |
| Pino C4 | TDO — JTAG test data out |
| Pino C5 | TMS — JTAG test mode select |
| Pino C6 | PROGRAMN — Active-low program/enable |
| Pino D1 | IO_B8 — Bank 1 general-purpose I/O |
| Pino D2 | IO_B9 — Bank 1 general-purpose I/O |
| Pino D3 | IO_B10 — Bank 1 general-purpose I/O |
| Pino D4 | INITN — Active-low initialization flag |
| Pino D5 | DONE — Configuration complete flag |
| Pino D6 | CCLK — Configuration clock |
| Pino E1 | GND — Ground |
| Pino E2 | IO_B11 — Bank 1 general-purpose I/O |
| Pino E3 | IO_B12 — Bank 1 general-purpose I/O |
| Pino E4 | IO_B13 — Bank 1 general-purpose I/O |
| Pino E5 | IO_B14 — Bank 1 general-purpose I/O |
| Pino E6 | VCCAUX — Auxiliary 2.5 V supply |
| Pino F1 | VCC — Core 1.2 V supply |
| Pino F2 | IO_B15 — Bank 1 general-purpose I/O |
| Pino F3 | IO_B16 — Bank 1 general-purpose I/O |
| Pino F4 | IO_B17 — Bank 1 general-purpose I/O |
| Pino F5 | GND — Ground |
| Pino F6 | VCCIO2 — Bank 2 I/O supply |
Aplicações típicas
LCMXO3LF-1300E-5UWG36ITR é adequado para 6 aplicaçãos: Industrial I/O Expansion and Bridging, Automotive Infotainment and ADAS Glue Logic, Consumer Electronics Power Sequencing, Robotics and Motor-Control Timing Blocks, Secure Boot and System Health Monitoring, Camera and Image-Sensor Interface Bridging.
Industrial I/O Expansion and Bridging
The LCMXO3LF-1300E-5UWG36ITR excels at industrial I/O expansion where a microcontroller or SoC lacks sufficient GPIO, UART, or SPI ports. With 1280 LUTs and 28 kbits of distributed memory, the device can implement multiple I2C-to-SPI bridges, UART-to-parallel converters, and custom logic-state machines concurrently. Its 1.2 V core operation and low static power (approximately 1 mW typical) make it ideal for always-on industrial controllers that cannot tolerate the boot delay of SRAM FPGAs. The non-volatile instant-on feature ensures deterministic startup within 1 ms - critical for safety-rated industrial PLC and HMI panels that must respond immediately on power restoration. The 36-ball WLCSP keeps the board footprint under 2.5 mm x 2.5 mm, leaving space for additional isolation or sensor front-end circuitry in compact DIN-rail modules.
Recomendado
Automotive Infotainment and ADAS Glue Logic
The MachXO3LF-1300E-5UWG36ITR is AEC-Q100 grade 3 qualified (operating -40C to +100C), making it directly suited for automotive infotainment head units, instrument clusters, and ADAS domain controllers. Designers typically use it as a companion PLD alongside an automotive SoC to implement LVDS-to-MIPI bridging, fail-safe signal muxing, and power-sequencing logic for sensors and cameras. The 65 kbits of User Flash Memory can store a backup golden configuration plus board revision data, supporting in-field firmware updates without external boot devices. The embedded I2C and SPI hard IP blocks simplify automotive network glue logic such as CAN-transceiver enable sequencing and watchdog supervision. The 36-ball WLCSP keeps the PCB area minimal inside space-constrained instrument-cluster housings.
Recomendado
Consumer Electronics Power Sequencing
In consumer devices such as set-top boxes, smart TVs, and home routers, the LCMXO3LF-1300E-5UWG36ITR provides deterministic multi-rail power-up and power-down sequencing. Its non-volatile instant-on behavior eliminates the need for a separate boot PROM, and the integrated PLLs can generate auxiliary clock signals to clock companion ICs before the main SoC becomes active. With 1280 LUTs, designers can implement up to 8-12 sequenced enable outputs, fault-handling state machines, and I2C monitoring of voltage regulators. The low 1.2 V core current draw makes it suitable for always-on standby domains that must remain powered in low-power modes to wake the system on user input.
Recomendado
Robotics and Motor-Control Timing Blocks
Robotics platforms require deterministic timing blocks that operate independent of the main processor load. The LCMXO3LF-1300E-5UWG36ITR's two PLLs and two 18x18 hardware multipliers allow it to generate precision PWM waveforms, quadrature-decoder interfaces, and high-speed encoder sampling channels without consuming host CPU cycles. The 64 kbits of embedded Block RAM provides sufficient memory for trajectory tables and look-up-table based motion profiles. Designers typically pair this MachXO3LF with a dsPIC or Cortex-M MCU to offload the deterministic timing-critical control loops. The 36-ball WLCSP keeps the auxiliary control board small enough for integration inside BLDC servo motor housings or robotic-joint assemblies.
Recomendado
Secure Boot and System Health Monitoring
The MachXO3LF-1300E-5UWG36ITR can serve as a hardware root-of-trust companion to an applications processor by implementing secure-boot image verification, voltage-rail monitoring, and tamper-detection logic. The non-volatile 65-kbit User Flash Memory can store cryptographic keys and a primary/secondary configuration for fail-safe boot. The 1280 LUTs are sufficient for SHA-256 accelerators, watchdog timers, and I2C-attached supervisor functions. Because the device boots in under 1 ms, the processor can be held in reset until the MachXO3LF has verified the integrity of external SPI flash contents. This pattern is increasingly common in IoT gateways and edge-AI appliances where supply-chain security is paramount.
Recomendado
Camera and Image-Sensor Interface Bridging
Vision systems, security cameras, and machine-vision platforms often require protocol bridges between image sensors (MIPI CSI-2, LVDS, HiSPi) and host processors. The LCMXO3LF-1300E-5UWG36ITR with 1280 LUTs and 65 kbits of UFM is well suited for low-channel-count bridging, pixel-level pre-processing, and clock-domain crossing. The two PLLs can generate the byte clock and pixel clock required by the sensor, while the embedded Block RAM serves as a small line buffer for image cropping or scaling. The 36-ball WLCSP package allows the bridge to be placed on flex cables near the image sensor, minimizing PCB trace length for high-speed MIPI lanes. The industrial temperature grade ensures operation inside camera enclosures with elevated internal temperatures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LCMXO3LF-1300E-5UWG36ITR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LCMXO3LF-1300E-5UWG36CTR | LCMXO3LF-1300E-5UWG36ITR50 | LCMXO3LF-1300E-5UWG36ITR1K | LCMXO3LF-2100E-5UWG36ITR | LCMXO3LF-2100E-5UWG36CTR | LCMXO3L-1300E-5UWG36ITR |
|---|---|---|---|---|---|---|---|
| Package | 36-ball WLCSP (UWG36) | 36-ball WLCSP (UWG36) - same | 36-ball WLCSP (UWG36) - same | 36-ball WLCSP (UWG36) - same | 36-ball WLCSP (UWG36) - same | 36-ball WLCSP (UWG36) - same | 36-ball WLCSP (UWG36) - same |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Logic Cells / LUTs | 1280 LUTs | 1280 LUTs | 1280 LUTs | 1280 LUTs | 2100 LUTs (+64%) | 2100 LUTs (+64%) | 1280 LUTs (no EBR) |
| Embedded Block RAM | 64 kbits | 64 kbits | 64 kbits | 64 kbits | 80 kbits | 80 kbits | 0 kbits (no EBR) |
| User Flash Memory (UFM) | 65 kbits | 65 kbits | 65 kbits | 65 kbits | 80 kbits | 80 kbits | 65 kbits |
| Temperature Grade | -40C to +100C (Industrial / AEC-Q100 G3) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Configuration Memory | Internal flash, instant-on (<1 ms) | Internal flash, instant-on | Internal flash, instant-on | Internal flash, instant-on | Internal flash, instant-on | Internal flash, instant-on | Internal flash, instant-on |
| Process Technology | 40 nm CMOS, non-volatile | 40 nm CMOS, non-volatile | 40 nm CMOS, non-volatile | 40 nm CMOS, non-volatile | 40 nm CMOS, non-volatile | 40 nm CMOS, non-volatile | 40 nm CMOS, non-volatile |
Principais diferenciais
- Non-volatile instant-on configuration eliminates external boot memory (vs SRAM-based FPGAs (e.g. Lattice ECP5) which require external SPI flash and have multi-millisecond boot times)
- Ultra-low static power consumption (vs Comparable LCMXO2-640HC CPLD family which lacks flash-based configuration)
- AEC-Q100 grade 3 qualification in the smallest WLCSP package (vs QFP/BGA-packaged control PLDs that occupy larger PCB area)
Notas de projeto
Estimated: The UWG36 36-ball WLCSP uses a 0.4 mm ball pitch and a body of approximately 2.5 x 2.5 mm. Per Lattice Hardware Checklist TN1088, design with NSMD pads, solder-mask defined openings of 0.25 mm, and a copper pad diameter of 0.20 mm. Maintain a 1:1 trace-to-pad ratio where possible and route differential pairs (LVDS/MIPI) with 100 ohm differential impedance. Add an under-bump stencil aperture of 0.27 mm with 0.1 mm thickness for reflow.
The LCMXO3LF-1300E-5UWG36ITR requires three separate supplies: VCC (1.2 V core), VCCAUX (2.5 V), and one or more VCCIO banks (1.2 V to 3.3 V). Power-up sequencing per the Lattice MachXO3 datasheet requires VCC and VCCAUX to come up before VCCIO. Use a power management IC such as an LDO + sequencer, or stagger supplies with RC delays. Bulk decoupling of 10 uF plus 100 nF high-frequency caps should be placed within 2 mm of each supply pin.
Common pitfalls when designing with the UWG36 WLCSP include: (1) insufficient PCB flatness leading to opens on inner balls, (2) using reflow profiles outside the JEDEC J-STD-020 MSL-3 envelope (peak 260C), and (3) forgetting to connect PROGRAMN to a controlled logic level - leaving it floating can cause unintended reconfiguration. Also, the JTAG pins (TCK/TMS/TDI/TDO) must be terminated to known states if JTAG is unused to prevent leakage.
Informações de conformidade
AEC-Q100 grade 3 qualified per Lattice MachXO3 family datasheet (Industrial operating range -40C to +100C). RoHS and lead-free compliance confirmed by all major distributors (DigiKey, Mouser, Arrow).
