Circuitos Integrados

Subcategorias

📁 ADC/DAC 3.100+ produtos 📁 CIs Amplificadores 1.900+ produtos 📁 Codecs de Áudio 18 produtos 📁 CIs de Áudio 2 produtos 📁 Relógio e Temporização 670+ produtos 📁 Comparator ICs 1 produtos 📁 DSP 1.100+ produtos 📁 CIs de Aquisição de Dados 2 produtos 📁 Potenciômetros Digitais 4 produtos 📁 Drivers e Controladores de Display 1 produtos 📁 FPGA & CPLD 7.300+ produtos 📁 CIs de Interface 3.400+ produtos 📁 Drivers de LED 1 produtos 📁 CIs Lógicos 460+ produtos 📁 CIs de Memória 870+ produtos 📁 Microcontroladores 20.000+ produtos 📁 Microprocessadores 4 produtos 📁 Drivers de Motor 1 produtos 📁 Outros 1 produtos 📁 Sensor and Detector Interfaces 1 produtos 📁 CIs Especializados 15 produtos 📁 CIs de Vídeo 14 produtos

Produtos (39.000+)

EP3C10E144I7 - Cyclone III FPGA, 10K LE, 144-LQFP | Intel
EP3C10E144I7

EP3C10E144I7 - Cyclone III FPGA, 10K LE, 144-LQFP | Intel

The Intel (formerly Altera) EP3C10E144I7 is a low-cost Cyclone III FPGA delivering 10,320 logic elements, 423,936 bits of embedded memory, and 23 embedded 18x18 multipliers in a 144-pin EQFP/LQFP-Exposed-Pad package. Built on a 65nm process and rated for the industrial temperature range (-40C to +100C), the device targets cost-sensitive high-volume applications where FPGAs were previously uneconomical. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured after manufacturing. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs, microcontrollers, and DSPs in the programmable logic domain, which itself belongs to the larger class of logic ICs and integrated circuits. Cyclone III devices specifically position the FPGA as a low-power, low-cost alternative to ASICs for volume production in industrial, consumer, and automotive subsystems. Key features of the EP3C10E144I7 include 10,320 logic elements, 46 M9K memory blocks totaling 414 Kbits, 23 dedicated 18x18 hardware multipliers for DSP workloads, and 94 user I/O pins with support for multiple I/O standards including LVDS, LVCMOS, SSTL, and PCI. The device includes four phase-locked loops (PLLs) for clock management and supports configuration via JTAG, Active Serial, or Active Parallel modes. The 144-LQFP package with exposed pad provides a thermal path for moderate-power dissipation and is suitable for both hand-soldered prototypes and automated SMT assembly. Cyclone III architecture uses a four-input LUT-based logic element, embedded memory blocks (M9K) that can be configured as RAM, ROM, or FIFO, and dedicated multiplier blocks for high-performance DSP pipelines. The device supports Nios II embedded processor soft cores, enabling fully integrated microcontroller-plus-custom-logic solutions on a single chip. Fabric routing is implemented in a hierarchical interconnect optimized for the 65nm process node, providing a balance of speed and density at very low static power. Typical applications include industrial motor control, video processing bridges, low-cost protocol bridging (PCI to local bus, UART to memory), consumer display controllers, and education/DIY development platforms. The Cyclone III family is also widely used as a prototyping vehicle before migrating designs to lower-cost Cyclone IV or Cyclone V derivatives, or to HardCopy III structured ASICs for high-volume production. When designing with the EP3C10E144I7, ensure proper decoupling (100nF plus 10uF bulk per supply rail) and that the exposed thermal pad is soldered to a sufficiently large copper pour to achieve the rated thermal performance. Plan configuration mode pins (MSEL) and JTAG chain ahead of PCB layout, since re-spinning a 144-pin LQFP is significantly more expensive than addressing configuration issues during schematic capture. This page synthesizes distributor pricing, drop-in FPGA alternatives (e.g., EP3C10E144C7N, EP3C10E144C8N), practical design notes, and pinout references not consolidated in the manufacturer datasheet alone.

Cotação Contato
EP3C10E144I7N - Cyclone III FPGA, 10K LE, 144-LQFP | Intel
EP3C10E144I7N

EP3C10E144I7N - Cyclone III FPGA, 10K LE, 144-LQFP | Intel

The Intel (formerly Altera) EP3C10E144I7N is a low-power, low-cost Cyclone® III Field Programmable Gate Array (FPGA) built on a 65nm CMOS process, offering 10,320 logic elements, 423,936 bits of embedded memory, and 66 (9x9) multipliers, housed in a 144-pin LQFP package with exposed thermal pad. Key features include 94 user I/O pins, two general-purpose PLLs, 23 embedded 18x18 multipliers, 46 M9K memory blocks, and a core supply of 1.2V with I/O supply supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The device operates at a maximum internal clock frequency of approximately 472.5 MHz, supported by Cyclone III's low static and dynamic power architecture. The Cyclone III family (EP3C family) is a programmable logic device sitting in the broader hierarchy of FPGA -> programmable logic -> semiconductor. FPGAs contain configurable logic blocks (CLBs/LEs), programmable interconnect, embedded memory, and dedicated hardware such as PLLs and multipliers, enabling parallel hardware acceleration, custom peripheral interfacing, and glue-logic integration. The Cyclone III family in particular targets cost-sensitive, power-sensitive applications where higher-end Stratix devices are over-specified. This specific variant EP3C10E144I7N is the 144-LQFP / EQFP-144 commercial-grade option, with the 'I7' suffix indicating the industrial temperature range (-40°C to +100°C junction), and the 'N' suffix denoting lead-free / RoHS-compliant packaging. The 144-LQFP footprint enables low-cost PCB assembly using standard SMT lines, making it attractive for industrial control, motor drive, video processing, and consumer designs. Typical applications include industrial motor control (using the embedded multipliers for FOC algorithms), video surveillance image processing, automotive infotainment prototyping, low-cost software-defined radio front-ends, and display controllers for industrial HMMIs. The device's embedded M9K memory blocks efficiently buffer video line storage, while the PLLs synthesize the pixel clock from an external reference. When designing with this FPGA, pay attention to the bank-by-bank I/O supply voltage configuration, use the Quartus II (or newer Quartus Prime) toolchain for synthesis, place decoupling capacitors near each VCCINT/VCCIO supply pin, and follow the exposed-pad PCB layout guideline for the EPAD thermal dissipation pad. Consider migrating to the Cyclone IV E (EP4CE10) family for new designs because Cyclone III is approaching end-of-life. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that complement - but do not duplicate - the manufacturer datasheet.

Cotação Contato
EP3C10F256C6 - Cyclone III FPGA, 10K LE, 256-FBGA | Intel
EP3C10F256C6

EP3C10F256C6 - Cyclone III FPGA, 10K LE, 256-FBGA | Intel

The Intel (Altera) EP3C10F256C6 is a low-cost, low-power Cyclone III FPGA delivering 10,320 logic elements, 423,936 bits of embedded memory, and 182 user I/Os in a 256-ball FineLine BGA (FBGA-256) package. It is built on a 60 nm process and is targeted at cost-sensitive applications where the high transceiver count and transceiver rate of mid-range Cyclone IV/V devices are unnecessary, but where a flexible programmable fabric is still required. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows designers to configure the device's logic blocks, routing, and I/O behavior after manufacture. Within the programmable logic hierarchy, FPGAs sit at the top, above CPLDs (Complex Programmable Logic Devices), and are used to implement everything from simple glue logic to complete processor subsystems, DSP pipelines, and high-speed interface bridges. Key features of the EP3C10F256C6 include 23 embedded 18x18 multipliers, 2 PLLs for clock management, support for LVDS, LVCMOS, SSTL, and HSTL I/O standards, and a core voltage range that enables operation from typical 1.15 V to 1.25 V supplies with I/O voltages scalable to 3.3 V. It uses SRAM-based configuration, requiring an external configuration memory such as the EPCS4 or EPCS16 serial flash, and supports JTAG and Active Serial (AS) configuration modes. The device is fabricated on TSMC's 60 nm low-power process and consumes approximately 120 mW of static power under typical conditions, with dynamic power scaling with toggle rate and design utilization. Designers can use the free Quartus II Web Edition (and later Intel Quartus Prime Lite) toolchain to synthesize, place-and-route, and program the device using Verilog HDL or VHDL. Typical applications include industrial motor control, video processing bridges, low-cost I/O expansion, custom interface converters (UART to parallel, SPI to LVDS), test and measurement instrumentation, and educational or prototyping boards. The 256-FBGA package offers sufficient I/O density for mid-complexity designs while remaining hand-reworkable with proper hot-air rework equipment. When designing with this part, pay careful attention to decoupling: place 100 nF and 10 uF capacitors within 5 mm of every VCCINT and VCCIO pin pair, and follow Altera's Cyclone III hardware design guide for the PCB footprint. The configuration scheme (AS vs JTAG) must be selected via MSEL[3:0] pins during board bring-up. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical Quartus II design notes that complement - rather than duplicate - the manufacturer datasheet.

Cotação Contato
EP3C10F256C6N - Cyclone III FPGA, 10K LE, 256-BGA | Intel / Altera
EP3C10F256C6N

EP3C10F256C6N - Cyclone III FPGA, 10K LE, 256-BGA | Intel / Altera

The Intel (formerly Altera) EP3C10F256C6N is a Cyclone III family low-power Field-Programmable Gate Array (FPGA) housed in a 256-ball FineLine BGA package. It integrates 10,320 logic elements (LEs), 423,936 bits of embedded memory, and 182 user I/O pins, delivering a balanced logic/memory ratio for cost-sensitive programmable logic designs. The device is fabricated on TSMC's 65 nm low-power process and targets static power consumption roughly 25 percent lower than the previous Cyclone II generation, making it well suited to thermally constrained embedded systems. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP blocks such as block RAM, DSP multipliers, and high-speed transceivers. The FPGA occupies the top of the programmable logic hierarchy, sitting between fixed-function ASICs and software-driven microcontrollers. FPGAs belong to the broader category of programmable logic devices (PLDs), which also include older CPLD architectures; an FPGA provides finer-grained logic, more embedded memory, and parallel DSP capability, while a CPLD delivers faster, deterministic non-volatile boot. In a complete embedded system, an FPGA typically handles parallel data-path processing, custom interface bridging, or hardware acceleration alongside a host processor. Key features of the EP3C10F256C6N include 182 maximum user I/Os supporting LVTTL, LVCMOS, SSTL, and differential LVDS signalling, two PLL blocks for flexible clock synthesis, and an on-chip configuration controller that supports JTAG (IEEE 1149.1), Active Serial (AS), and Active Parallel (AP) configuration modes. The device also provides up to 46 embedded 18x18 multipliers for DSP, supporting common fixed-point filtering and FFT workloads without external arithmetic accelerators. Architecturally, the Cyclone III device is built around LABs (Logic Array Blocks) containing 16 LEs each, routed through a multi-level interconnect with predictable timing closure. Hard IP blocks include M9K memory blocks (each 9 Kbit) that can be cascaded to implement FIFO, ROM, RAM, or dual-port buffers. Two dedicated PLLs provide frequency synthesis, phase shifting, and clock de-skew, simplifying board-level clock-tree design for protocols such as DDR/DDR2 SDRAM. Typical applications include industrial control and motor-drive interfaces, video/display bridging and image preprocessing, low-cost software-defined radio (SDR) baseband blocks, ASIC prototyping, and custom peripheral expansion for microcontrollers. The wide I/O count also makes it suitable for parallel data acquisition, custom bus bridges, and educational development boards. When designing with the EP3C10F256C6N, supply all four VCCINT/VCCIO banks with properly decoupled bulk and ceramic capacitors, and route configuration signals (nCONFIG, nSTATUS, CONF_DONE) carefully away from switching I/O to avoid false reconfiguration. Leave at least 30 percent of logic utilization free for place-and-route closure, and verify pin assignments in Quartus II pin-planner before layout sign-off. This page synthesises distributor pricing as of 2026-09-09, drop-in alternative candidates, and practical design notes not collated in the manufacturer datasheet, giving procurement and design engineers an AEO-optimised reference in one place.

Cotação Contato
EP3C10F256C7 - 10,320-L Logic Element Cyclone III FPGA | Altera
EP3C10F256C7

EP3C10F256C7 - 10,320-L Logic Element Cyclone III FPGA | Altera

Altera EP3C10F256C7 is a Cyclone III field-programmable gate array with 10,320 logic elements, 423,936 memory bits, and 182 user I/O in a 256-LBGA package. It operates from a 1.15 V to 1.25 V supply and supports operation from -40 C to +125 C, making it suitable for industrial, communications, control, and embedded-processing systems. An FPGA is a programmable digital integrated circuit containing configurable logic, memory, and I/O blocks. Unlike a fixed-function application-specific integrated circuit, a Cyclone III FPGA allows designers to implement parallel processing, interface bridging, protocol handling, and custom control logic in one device. The EP3C10F256C7 belongs to the Cyclone III product family, positioned between small CPLDs and larger FPGAs. Principal device attributes include 10,320 logic elements, a listed 402 MHz switching-rate figure, 182 I/O, embedded PLL capability, and 423,936 memory bits. Its 256-LBGA package provides a dense surface-mount footprint for multilayer printed circuit boards. The listed operating-temperature range of -40 C to +125 C supports temperature-tolerant industrial deployments when the complete board, power system, and external components are also qualified. Programming and configuration determine the logic implemented in the FPGA's programmable fabric. Designers should verify power sequencing, configuration interface timing, bank-supply requirements, clocking, and I/O standards against the complete Cyclone III device documentation for the selected density, speed grade, and package. Because a BGA package does not expose a conventional lead-by-lead schematic symbol, board layout, via-in-pad requirements, solder-mask design, and assembly profiles should be validated against the official package data. Typical uses include industrial control and data acquisition, communications line cards, parallel sensor aggregation, embedded video or image processing, protocol bridges, and programmable logic for test equipment. The 182 available I/O permit simultaneous connections to external converters, memories, transceivers, and microcontrollers, while the internal logic and memory blocks support parallel pipelines and state-machine-intensive designs. A critical design consideration is that logic, memory, PLL, and I/O resources must be verified against the target clock rate before schematic capture. Engineers should also confirm configuration flash or cable compatibility, provide decoupling close to each supply ball, and plan thermal and via routing for the 256-ball footprint. This product page consolidates verified distributor specifications, source-linked pricing, same-package replacement candidates, and practical FPGA integration considerations that are not presented together in a single manufacturer datasheet.

Cotação Contato
EP3C10F256C8 - 10,320-Cell FPGA, 182 I/O | Intel | Industrial
EP3C10F256C8

EP3C10F256C8 - 10,320-Cell FPGA, 182 I/O | Intel | Industrial

The Intel EP3C10F256C8 is a Cyclone III field-programmable gate array (FPGA) with 10,320 logic elements, 182 user I/O, and a 256-LBGA package. It is manufactured on 65 nm technology and is associated with a 402 MHz device performance figure and a 1.2 V core supply in the verified comparison data. A field-programmable gate array is a reconfigurable digital semiconductor that belongs to the FPGA family of programmable logic devices. An FPGA sits within the broader hierarchy of programmable logic ICs, semiconductor integrated circuits, and digital logic devices. Unlike a fixed application-specific integrated circuit, an FPGA allows engineers to implement digital logic, interfaces, and parallel processing functions through a programmable configuration rather than a custom ASIC layout. The EP3C10F256C8 combines 10,320 logic elements with 182 I/O in a compact 256-LBGA package. These figures make it suitable for systems requiring a substantial programmable-logic resource count without moving to a larger FPGA. The 65 nm process generation reflects the Cyclone III family’s emphasis on power efficiency and moderate system cost. The listed 402 MHz performance and 1.2 V core voltage provide concrete references for clocking and power-design planning. The 182-I/O configuration is particularly useful for parallel buses, data converters, memory interfaces, industrial control logic, and communication peripherals. Because the device is supplied in a ball-grid-array package, PCB layout must include escape routing, via-in-pad considerations, and thermal analysis. Its 256 terminals provide the physical connection density required by a high-I/O device, although the exact function assigned to each ball is determined by the completed design and pin assignment. Typical Cyclone III FPGA applications include industrial automation, embedded control, networking infrastructure, communications equipment, and test-and-measurement systems. The device can consolidate control logic, interface adaptation, and parallel processing that might otherwise require several programmable or fixed-function devices. Engineers must still confirm whether a specific protocol, memory interface, clocking arrangement, and I/O standard are supported by the selected Cyclone III variant. A key design consideration is that the 1.2 V core requirement must be separated from any external interface supplies required by the board. Decoupling, clock jitter, I/O standards, configuration storage, and thermal performance should be validated against the manufacturer datasheet before layout release. Because the verified data does not provide a complete pricing table, detailed timing grades, or the complete 256-ball pin map, those values should be confirmed with the manufacturer or an authorized distributor before procurement.

Cotação Contato
EP3C10F256C8N - 10K LEs, 182 I/O Cyclone III FPGA | Altera/Intel
EP3C10F256C8N

EP3C10F256C8N - 10K LEs, 182 I/O Cyclone III FPGA | Altera/Intel

The Altera (now Intel) EP3C10F256C8N is a Cyclone III family low-power FPGA with 10,320 logic elements, 423,936 bits of embedded RAM, 182 user I/Os, and 645 logic array blocks (LABs), housed in a 256-pin FineLine BGA package measuring 17 mm x 17 mm x 1.8 mm. It supports a 1.15 V to 1.25 V core supply (1.2 V nominal) and a maximum internal operating frequency of 402 MHz, targeting cost-sensitive high-volume applications. What is a Cyclone III FPGA? Cyclone III is the third-generation low-power FPGA family from Altera/Intel fabricated on a 60 nm process, sitting in the broader taxonomy of programmable logic devices (PLD) -> field-programmable gate array (FPGA) -> low-power FPGA -> SRAM-based FPGA -> semiconductor IC. It is engineered specifically for low static and dynamic power dissipation while integrating sufficient logic, memory and DSP resources to displace ASICs and ASSPs in volume production. Key features of the EP3C10F256C8N include 23 embedded 18 x 18 multipliers (about 0.5 M Gates of equivalent logic), support for external memory interfaces such as DDR/DDR2/QDRII SRAM, embedded PLL-based clock management, Nios II soft-core processor compatibility, and the standard Altera Quartus II design flow. The device is RoHS-compliant, lead-free, and operates over the commercial 0 C to 85 C junction temperature range. Technically, the EP3C10F256C8N integrates 10,320 logic elements organized into 645 LABs, 414 Kbits of embedded RAM (M9K blocks), 23 dedicated 18 x 18 multipliers for DSP, and four PLLs. The 256-pin FineLine BGA provides 182 general-purpose user I/Os supporting LVDS, LVCMOS, SSTL and other single-ended and differential I/O standards with hot-socketing capability and configurable drive strength. Typical applications include industrial motor control, video processing and display bridges, automotive infotainment (non-safety), consumer electronics control planes, communications line cards, and cost-optimized ASIC replacement. Its low power and high logic density at sub-$30 unit pricing make it suitable for both prototyping and volume production. When designing with this part, plan the power distribution network around the 1.2 V core and per-bank I/O supplies, and use the Altera Quartus II development environment for synthesis, place-and-route, and timing closure. Ensure the PCB BGA layout follows Intel's recommended 1 mm pitch escape routing and that decoupling capacitors are placed as close to the package as possible. This page synthesizes distributor pricing, verified cross-references within the Cyclone III family, and practical design notes not consolidated in the manufacturer datasheet, giving engineers a faster path to selection.

Cotação Contato
EP3C10F256I7 - 10,320 LCE 256-LBGA FPGA | Intel
EP3C10F256I7

EP3C10F256I7 - 10,320 LCE 256-LBGA FPGA | Intel

Intel EP3C10F256I7 is a Cyclone III field-programmable gate array with 10,320 logic cells, 182 I/O pins, and 423,936 embedded memory bits in a 256-LBGA package. The device is supplied in an industrial temperature grade covering -40°C to +125°C and uses a lead-free surface-mount configuration. It combines programmable logic, embedded RAM, and configurable I/O in one package for compact digital control, communications, signal processing, and embedded-system designs. An FPGA is a semiconductor device whose digital logic and interconnect resources are configured after manufacture. In the product hierarchy, the EP3C10F256I7 belongs to the FPGA and CPLD class, combines with programmable logic and fixed-function blocks to form a programmable digital IC, and ultimately falls within the broader semiconductor category. Cyclone III devices support parallel hardware implementation for designs that require deterministic operation, flexible pin assignment, and field-updatable configurations. The principal verified features of this device are its 10,320 logic cells, 182 available I/O pins, 423,936 embedded memory bits, and 256-LBGA package. The industrial temperature range supports operation from -40°C through +125°C. Its 256-ball grid supports dense PCB routing while providing 182 external I/O connections. The lead-free construction and surface-mount form also align the part with modern electronics manufacturing requirements, although complete environmental and qualification declarations must be confirmed from current manufacturer documentation. Architecturally, the part consolidates combinational and sequential programmable logic with embedded memory resources. This allows designers to implement parallel datapaths, control logic, protocol bridges, and fixed-function digital blocks without relying exclusively on a microcontroller. Compared with a soft processor implemented entirely in programmable logic, the dedicated 10,320 logic-cell and 182-I/O resource set allows the FPGA fabric to be allocated according to the target workload. Typical applications include industrial automation controllers, communications infrastructure, sensor and motion-control systems, embedded video processing, and general-purpose digital prototyping. The 182-I/O count is particularly useful for designs requiring multiple buses, parallel data acquisition, or mixed control and communication interfaces. The -40°C to +125°C industrial grade also makes the device suitable for temperature-ruggedized equipment where appropriate system-level qualification is performed. Design planning must include PCB layout for all 256 package balls even though the verified device specification identifies 182 I/O pins. Signal-integrity review, decoupling, power-supply sequencing, configuration-data implementation, and thermal analysis should follow the relevant Cyclone III hardware guidance. Confirm the exact power rails, supported I/O standards, configuration requirements, and absolute maximum ratings in the current Intel datasheet before schematic release. This product record consolidates verified distributor and manufacturer-page information with package, procurement, and engineering-selection context. It also highlights where additional data is required so engineers can distinguish confirmed EP3C10F256I7 characteristics from parameters that still require validation against the applicable device documentation.

Cotação Contato
EP3C10F256I7N - 10K LE Cyclone III FPGA, 256-FBGA | Intel
EP3C10F256I7N

EP3C10F256I7N - 10K LE Cyclone III FPGA, 256-FBGA | Intel

The Intel (Altera) EP3C10F256I7N is a low-power, low-cost FPGA from the Cyclone III family built on a 65 nm process, offering 10,320 logic elements, 423,936 bits of embedded memory, and 182 user I/O pins in a 256-ball FineLine BGA package with 1.2 V core operation. It targets high-volume, cost-sensitive designs where FPGA flexibility is required but ASIC-like NRE costs are not justified. A Field-Programmable Gate Array (FPGA) is a programmable logic device whose architecture consists of an array of configurable logic blocks (CLBs), programmable routing fabric, dedicated DSP blocks, and embedded memory blocks (M9K/M144K). FPGAs belong to the larger programmable logic hierarchy: FPGA -> programmable logic -> digital logic IC -> semiconductor. Cyclone III devices specifically target the low-power end of the FPGA market, delivering ASIC-like fabric density while preserving in-system reprogrammability for design iteration and field upgrades. Key features of the EP3C10F256I7N include 182 maximum user I/O pins (supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards), 46 embedded 18x18 multipliers for DSP functions, two PLLs per device for clock management, and up to 1.4 Mbits of RAM. The device operates across an industrial temperature range of -40C to +125C with a 1.2 V core supply, and its 65 nm process technology yields substantially lower static and dynamic power than its Cyclone II predecessor. Architecturally, the Cyclone III device uses a Look-Up Table (LUT)-based fabric with M9K memory blocks and dedicated 18x18 multipliers. The 65 nm process enables tight integration while keeping die cost low, and the FineLine BGA-256 package provides high signal density within a 17x17 mm footprint suitable for space-constrained PCBs. Typical applications include industrial motor control, video processing, automotive driver assistance, software-defined radio, consumer display controllers, and embedded system prototyping. The device is well suited for parallel processing and signal-integrating tasks. When designing with the EP3C10F256I7N, careful attention to power rail sequencing (1.2 V core and 2.5 V/3.3 V I/O supplies) and JTAG configuration is required. Configuration via Altera/Intel Quartus II software supports JTAG, Active Serial (AS), and Passive Serial (PS) modes for flexible boot options. This page synthesizes distributor pricing, drop-in alternative listings from same-family Cyclone III devices, and practical design notes not found in the manufacturer datasheet.

Cotação Contato
EP3C10M164C7N - 10,320-LC Cyclone III FPGA | Intel
EP3C10M164C7N

EP3C10M164C7N - 10,320-LC Cyclone III FPGA | Intel

The Intel EP3C10M164C7N is a Cyclone III field-programmable gate array with 10,320 logic elements, 106 I/O pins, 423,936 embedded-memory bits, and a maximum switching frequency of 437.5 MHz, packaged in a 164-TFBGA package. It also uses a 65 nm process and operates from a 1.2 V core supply. This combination places the device in the low-density programmable-logic segment for embedded control, interface bridging, data acquisition, and general-purpose parallel processing. A field-programmable gate array, or FPGA, is a reconfigurable semiconductor whose logic blocks and programmable interconnect can be configured after manufacture. FPGAs sit between fixed-function logic devices and software-programmable processors in the broader digital-semiconductor hierarchy. Unlike an application-specific integrated circuit, an FPGA can implement multiple interface protocols, control functions, and data-processing pipelines in one device while retaining the ability to update its configuration during product maintenance. The EP3C10M164C7N provides 10,320 logic elements and 106 I/O pins, making it suitable for designs requiring substantial parallel logic without the resource level of a large FPGA. Its 437.5 MHz maximum switching frequency supports clocked control, communication, and signal-processing functions. The 423,936 embedded-memory bits add on-chip storage for buffers, lookup tables, state machines, and temporary data paths, reducing dependence on external memory for modest workloads. The 164-TFBGA package supports a dense, board-level FPGA implementation with 164 package balls. Because ball-grid packages expose connections on multiple sides and may include thermal and power-distribution balls, designers should follow the manufacturer's package and device-pin documentation when assigning power, ground, configuration, clock, and user I/O connections. Exact ball names and configuration requirements should be taken directly from the manufacturer pin-assignment tables. Typical applications include industrial control modules, communications interface adapters, instrumentation control, embedded test equipment, and industrial networking. The 106 available I/O positions are particularly relevant to parallel buses, digital control interfaces, and multi-channel acquisition systems. Designers should also account for configuration flash or another supported configuration source and verify board-level voltage compatibility before committing the FPGA to a design. A key design consideration is resource balancing. The device combines 10,320 logic elements with 423,936 embedded-memory bits, so a design that consumes most available memory may still lack logic capacity, while a logic-heavy design may require external memory. Timing closure should be evaluated with the intended clock, I/O standards, and device speed grade rather than from the maximum frequency alone. This product page combines the exact orderable MPN, device characteristics, package information, sourcing guidance, and cross-reference review into an engineering-oriented resource. It also highlights where replacement decisions require direct comparison of package balls, speed-grade suffix, configuration behavior, and design resource usage.

Cotação Contato
EP3C10M164I7N - 10,320 LEs, 164-Ball Cyclone III FPGA | Altera
EP3C10M164I7N

EP3C10M164I7N - 10,320 LEs, 164-Ball Cyclone III FPGA | Altera

Altera EP3C10M164I7N is a Cyclone III field-programmable gate array with 10,320 logic elements, 423,936 kbit of embedded memory, up to 106 I/Os, and a maximum operating frequency of 437.5 MHz. The device is supplied in a 164-ball TFBGA/MBGA package and operates from a 1.15 V to 1.25 V core supply. Its industrial temperature range extends from -40 °C to 100 °C. A field-programmable gate array is a semiconductor device whose digital logic is configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic elements, embedded memory, programmable I/O, and dedicated clock resources on one integrated circuit. Cyclone III devices are positioned as low-cost FPGAs for control, communications, signal-processing, and embedded-system designs where deterministic logic and flexible post-build configuration are valuable. The EP3C10M164I7N combines 10,320 logic elements with 423,936 kbit of embedded memory, providing a compact implementation platform for control logic, protocol handling, state machines, and small data-processing pipelines. Its 106 user I/Os support connections to external memory, converters, transceivers, and digital peripherals. The 437.5 MHz maximum operating frequency gives designers substantial timing headroom for synchronous control logic and moderately parallelized datapaths. The 1.15 V to 1.25 V operating supply range places this device in the low-voltage domain typical of modern programmable logic. Configuration data determines the implemented circuit, allowing design revisions, field updates, and product differentiation without changing the PCB. The combination of embedded memory and logic elements is particularly useful when the design benefits from hardware-resident lookup tables, packet buffers, or parallel arithmetic pipelines. Typical uses include industrial control modules, network interface controllers, data-acquisition front ends, embedded communications equipment, and compact test systems. In these applications, the FPGA can merge sampling, filtering, protocol conversion, and supervisory control into one device while keeping the external component count and board area relatively low. Board design should preserve clean power distribution to the 1.2 V core domain and provide suitable decoupling around the FPGA. Signal-integrity and timing work should include controlled clock routing, series termination for external high-speed links, and I/O-standard selection that matches each connected device. The 164-ball BGA also requires a PCB footprint and assembly process capable of fine-pitch ball inspection and soldering. This product overview combines the verified electrical, environmental, packaging, and sourcing attributes with application guidance, package considerations, and drop-in replacement analysis. It is intended to help engineers determine whether the Cyclone III resource set, industrial temperature grade, and 164-ball package fit a specific programmable-logic design before detailed FPGA design and PCB review begin.

Cotação Contato
EP3C10U256C6 - 10,320-Cell 500 MHz FPGA | Altera
EP3C10U256C6

EP3C10U256C6 - 10,320-Cell 500 MHz FPGA | Altera

The Altera EP3C10U256C6 is a Cyclone III field-programmable gate array with 10,320 logic cells, a 500 MHz maximum device speed, 65 nm process technology, a 1.2 V supply, and a 256-ball low-profile fine-pitch BGA package. It is designed for embedded systems requiring programmable logic, parallel interfaces, control functions, and moderate on-chip I/O density. The EP3C10U256C6 combines a reconfigurable FPGA fabric with embedded fixed-function resources, making it suitable for industrial control, communications, instrumentation, consumer electronics, and embedded processing systems. An FPGA is a semiconductor device whose digital logic and interconnect structure can be programmed after manufacture. The Cyclone III family occupies the FPGA and CPLD hierarchy within programmable logic devices, offering a practical balance between logic capacity, I/O availability, power consumption, and design cost. Unlike a fixed-function application-specific integrated circuit, an FPGA can be updated during development to add interfaces, revise control sequences, or consolidate several supporting functions into one device. The verified device data identifies 10,320 logic cells, 500 MHz operation, 65 nm fabrication, and a 1.2 V core supply. Its 256-LFBGA package provides 256 external terminals and supports compact board-level integration where routing density is important. The LFBGA form factor can also make inspection and prototype rework more demanding than a leaded package, so land-grid alignment, assembly capability, and package documentation should be checked before layout release. Cyclone III devices are commonly used where design flexibility matters more than the very highest programmable logic capacity. Typical logic blocks can implement state machines, bus controllers, data acquisition logic, protocol interfaces, and peripheral bridges. Because the exact pin assignment, memory configuration, supported I/O standards, and bank power requirements are not included in the supplied verified data, they must be confirmed against the manufacturer device documentation before schematic capture or PCB layout. The EP3C10U256C6 is appropriate for industrial automation modules, compact communications equipment, test and measurement products, video-processing interfaces, and embedded control systems. It is particularly attractive when multiple fixed functions need consolidated logic or when a late design change must be implemented without changing the PCB. Quartus compilation, pin assignment, timing closure, and programming-file generation should be performed using the supported Altera or Intel FPGA toolchain for the selected device. Power, decoupling, and pin planning are critical in a 256-ball BGA implementation. Follow the manufacturer power-supply and decoupling guidance, route each supply plane carefully, and validate signal integrity and heat dissipation on the assembled PCB. Do not infer I/O voltage limits, pin names, or power-up requirements from the abbreviated distributor listings; obtain the complete device and package documentation before design release. This product page consolidates the verified 10,320-cell, 500 MHz, 65 nm, 1.2 V, and 256-LFBGA attributes with sourcing links, application guidance, package considerations, and documented data gaps. It is intended to accelerate initial device selection while clearly separating verified specifications from information that still requires manufacturer documentation.

Cotação Contato
EP3C10U256C6N - 10,320-Cell Cyclone III FPGA | Altera
EP3C10U256C6N

EP3C10U256C6N - 10,320-Cell Cyclone III FPGA | Altera

The Altera EP3C10U256C6N is a Cyclone III field-programmable gate array with 10,320 logic cells, 182 I/O, a maximum device speed of 500 MHz, and a 1.2 V core supply in a 256-LFBGA package. It is a configurable digital-logic device that combines programmable logic, embedded memory, and fixed-function blocks in one semiconductor package. An FPGA is a field-programmable gate array, a reconfigurable digital semiconductor within the broader FPGA and CPLD category. Unlike a fixed application-specific integrated circuit, an FPGA allows its interconnect and logic configuration to be loaded after manufacture. Cyclone III devices are positioned for low-cost, low-power embedded systems where designers need flexible parallel logic, interface adaptation, or product revisions without changing the PCB layout. The principal specifications reported for the EP3C10U256C6N include 10,320 logic cells, 182 I/O, a 500 MHz device speed, 1.2 V operation, and a 256-LFBGA package. The 182 I/O provide substantial external connectivity for memory interfaces, control signals, communications, and general-purpose digital logic. The 256-ball package also supports compact integration in systems that need substantial programmable logic without moving to a larger package. The device uses 65 nm process technology, placing it in Altera's Cyclone III family and balancing programmable functionality with cost and power considerations. The EP3C10U256C6N designation identifies a 10,320-cell Cyclone III device in the U256 package configuration. Its C6 speed designation corresponds to the listed 500 MHz rating, while the N suffix identifies the exact ordering code used by the manufacturer and distributors. Typical uses include industrial control logic, communications equipment, embedded video and interface processing, data-acquisition systems, and general-purpose prototype platforms. Its combination of 182 I/O and 10,320 logic cells makes it particularly useful when a design requires several peripheral interfaces or substantial parallel data movement. Engineers can implement control, arbitration, packet processing, and protocol conversion within a single programmable device. PCB design should account for power integrity, decoupling, clock routing, and high-speed signal integrity across the 256-ball BGA. The 1.2 V core rail should be supplied with the decoupling and distribution specified by the Cyclone III design guidance. Programming, configuration, reset, and clock requirements must also be verified against the manufacturer pin-description table before finalizing the board layout. This product page combines device specifications, package details, sourcing guidance, replacement analysis, and practical PCB considerations. It is designed to help engineers determine whether the EP3C10U256C6N fits a logic-design requirement and to identify the exact document locations needed for pin assignment, configuration, and PCB implementation.

Cotação Contato
EP3C10U256C7 - 10,320-Cell Cyclone III FPGA | Intel
EP3C10U256C7

EP3C10U256C7 - 10,320-Cell Cyclone III FPGA | Intel

The Intel EP3C10U256C7 is a Cyclone III field-programmable gate array with 10,320 logic elements, 423,936 embedded memory bits, 182 user I/O, and a 256-LFBGA package. It is manufactured using 65 nm FPGA technology with a 1.2 V core supply. The device combines programmable logic, dedicated memory resources, and configurable I/O in one compact surface-mount package, making it suitable for embedded control, communications, industrial automation, and general-purpose programmable logic designs. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic can be configured after manufacture. An FPGA belongs to the programmable-logic device hierarchy and provides a flexible alternative to application-specific integrated circuits. Designers combine lookup-table-based logic, flip-flops, block RAM, multipliers, and I/O standards in software, allowing functional revisions and product differentiation without changing the underlying silicon or PCB layout. The EP3C10U256C7 provides 10,320 logic elements and 423,936 bits of embedded memory for state machines, control logic, data buffering, packet handling, and interface bridging. Its 182 user I/O provide substantial connectivity for external memories, communications transceivers, converters, and display or industrial-control peripherals. The 256-LFBGA package supports compact surface-mount assembly while preserving high pin and I/O density. The device uses 65 nm Cyclone III FPGA technology and a 1.2 V core voltage, combining a relatively large programmable logic capacity with low-voltage operation. Because FPGA performance depends on the selected clock, I/O standard, memory configuration, and design constraints, designers should evaluate timing with their actual Quartus II implementation rather than relying on device capacity alone. The verified cross-reference data identifies the commercial EP3C10U256C6 and industrial EP3C10U256I7N as package-compatible family alternatives. Typical applications include industrial automation controllers, protocol bridges, data-acquisition systems, embedded communications equipment, motor-control interfaces, and general digital signal-processing front ends. Its 182 I/O make it especially useful where an FPGA must connect multiple sensors, converters, memories, and communication transceivers while performing real-time control or filtering in parallel. PCB design should account for the 256-ball package, power and ground distribution, decoupling near the supply pins, and high-speed routing constraints. Designers should use the manufacturer’s pin and package documentation to confirm ball assignments, voltage requirements, supported I/O standards, and exposed thermal or power-management connections before layout. This page consolidates distributor inventory, verified family cross-references, package information, pricing references, and practical replacement guidance. It is intended to help engineers identify genuine same-package alternatives while clearly separating verified facts from parameters that still require confirmation from the manufacturer datasheet.

Cotação Contato
EP3C10U256C7N - 10,320-Cell 437.5MHz FPGA | Altera
EP3C10U256C7N

EP3C10U256C7N - 10,320-Cell 437.5MHz FPGA | Altera

Altera EP3C10U256C7N is a Cyclone III field-programmable gate array with 10,320 logic elements, 182 I/Os, 645 logic array blocks, and a maximum operating frequency of 437.5 MHz. The FPGA operates from a 1.15 V to 1.25 V core supply and is packaged in a surface-mount 256-LFBGA. Its 256-ball construction provides a compact platform for parallel data acquisition, control, communications, image processing, and embedded system logic. A field-programmable gate array, or FPGA, is a reconfigurable semiconductor categorized within programmable logic devices, digital logic ICs, and semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA combines programmable logic elements, memory resources, and I/O blocks in one device. Designers can implement control logic, signal processing, protocol handling, and hardware acceleration, then update the configuration to support design revisions or field adaptation. The Cyclone III architecture provides 10,320 logic cells organized into 645 logic array blocks. With 182 available I/Os, the EP3C10U256C7N can support substantial external connectivity while retaining the low power consumption associated with a 1.15 V to 1.25 V supply range. The stated 437.5 MHz maximum frequency establishes the device's speed class, although achievable system clock rates depend on the selected logic, routing requirements, memory interface, I/O standards, and timing constraints. This 256-LFBGA version is identified with the N suffix and uses a 256-ball surface-mount package. The package is intended for compact embedded boards where a large leaded package would be impractical. Because the density of programmable interconnect and power connections makes PCB layout and thermal design important, engineers should follow the manufacturer's pin-connection, decoupling, configuration, and PCB-layout guidance when creating a new carrier board. Typical uses include industrial automation, data acquisition, communications infrastructure, test and measurement equipment, and embedded control systems. The combination of 10,320 logic cells and 182 I/Os suits parallel interface logic, state machines, protocol bridges, and custom signal-processing pipelines. The 1.2 V-class supply also helps reduce power requirements compared with higher-voltage programmable logic families. The primary design consideration is configuration and power integrity. Follow the Cyclone III power-supply recommendations, place decoupling capacitors according to the manufacturer pin table, and route configuration signals away from sensitive high-speed inputs. Verify every BGA escape route, voltage level, and I/O standard before fabrication because package-level changes can invalidate an otherwise compatible design. This product page combines the core device specifications, package constraints, application guidance, and verified same-footprint alternatives. It also highlights replacement decisions that require review of package construction, logic resources, I/O count, temperature grade, and configuration compatibility rather than relying on the family name alone.

Cotação Contato
EP3C10U256C8 - 10,320-Cell Cyclone III FPGA | Intel
EP3C10U256C8

EP3C10U256C8 - 10,320-Cell Cyclone III FPGA | Intel

The Intel EP3C10U256C8 is a Cyclone III embedded field-programmable gate array with 10,320 logic elements, 182 I/O, a 472.5 MHz maximum stated frequency, and a 256-LFBGA package measuring 14 x 14 mm with 0.80 mm pitch. The device is manufactured using 65 nm CMOS technology and operates from a 1.2 V core supply, according to the verified distributor and datasheet-index records. A field-programmable gate array is a semiconductor in which the digital logic, memory blocks, and I/O assignments are configured after fabrication. An FPGA belongs to the broader programmable-logic hierarchy, combining parallel programmable logic with fixed or configurable input/output resources. The EP3C10U256C8 therefore provides a compact platform for parallel data processing, control, interface bridging, embedded protocol handling, and general-purpose digital logic. The principal verified features are 10,320 logic elements, 182 I/O, a 65 nm CMOS process, and a 472.5 MHz frequency figure. The 256-LFBGA package also supports compact board layouts, although its 0.80 mm pitch requires fine-pitch assembly and inspection. The C8 ordering code distinguishes this configuration from other speed, temperature, and package variants, so engineers should confirm the complete ordering information before substituting related MPNs. The supplied records inconsistently describe the package terminology as LFBGA, PBGA, and UBGA while consistently identifying a 256-pin, 14 x 14 mm device with 0.80 mm pitch. The 182-I/O count describes usable signal assignments rather than the total physical ball count. Exact architecture details, memory capacity, embedded hard IP, supported interfaces, power ratings, and AC timing data were not present in the verified excerpts and are therefore not inferred here. Typical uses include industrial control, communications infrastructure, test equipment, embedded video, and general embedded processing. The device can be selected when a design needs substantially more parallel logic than a small microcontroller while retaining post-fabrication field programmability. A board-level design must also account for configuration storage, power sequencing, signal conditioning, and programming-chain implementation. The most important design precaution is to preserve the exact footprint, ball assignment, core voltage, configuration method, and speed-grade requirements. Related Cyclone III devices may share the family and 256-ball format, but a similar bill of materials does not prove that every pin, timing specification, or operating grade is interchangeable. This page consolidates verified distributor specifications, package details, sourcing links, family alternatives, and engineering-oriented selection guidance. It distinguishes verified values from missing technical fields so procurement and hardware teams can evaluate the EP3C10U256C8 without confusing near-family MPNs with guaranteed drop-in replacements.

Cotação Contato
EP3C10U256I7 - 10,320-Cell Industrial FPGA | Intel
EP3C10U256I7

EP3C10U256I7 - 10,320-Cell Industrial FPGA | Intel

The Intel EP3C10U256I7 is a Cyclone III field-programmable gate array with 10,320 logic cells, 182 I/O, 423,936 RAM bits, and a maximum clock frequency of 437.5 MHz. The device is manufactured in 65 nm technology, operates from a 1.2 V core supply, and is supplied in a square 256-LFBGA surface-mount package. Its ordering code identifies an industrial-temperature option in the 256-ball package configuration. A field-programmable gate array is a semiconductor device whose digital logic, memory, and interface functions are configured after manufacture. FPGAs belong to the broader programmable-logic hierarchy, which includes CPLDs, mask-programmable logic, and application-specific integrated circuits. Unlike a fixed-function microcontroller, an FPGA can implement parallel data paths, protocol bridges, signal processing, control logic, and hardware acceleration in one configurable device. The Cyclone III name identifies Intel's low-cost FPGA family. The verified device information identifies 10,320 logic cells and 182 user I/O, providing a substantial parallel-logic resource for industrial control, communications, image processing, and embedded systems. The device includes 423,936 RAM bits for buffers, lookup tables, packet storage, and data-path state. Its 437.5 MHz maximum frequency supports high-speed digital logic, although practical system performance also depends on the selected design, I/O standard, memory interface, and timing constraints. The EP3C10U256I7 uses a 65 nm process and a 1.2 V core voltage, combining a relatively compact logic implementation with a large ball-grid package. The 256-LFBGA package provides 256 physical balls and a square footprint intended for surface-mount assembly. Because the supplied source describes the package as LFBGA while another search result describes the device as UBGA, engineers should confirm the exact ball map, ball-pitch dimensions, and mechanical drawing against the manufacturer documentation before releasing a PCB footprint. Typical applications include industrial control modules, programmable logic controllers, networking interfaces, motor-control systems, data-acquisition equipment, and embedded video or image-processing designs. The 182 I/O count can support multiple external interfaces, while the logic-element and RAM resources allow parallel control and buffering functions to be consolidated into a single FPGA. PCB design should account for all 256 package balls, including power, ground, configuration pins, and user I/O. The design must provide clean 1.2 V core power, suitable I/O voltage domains, decoupling, and a compatible configuration interface. Signal-integrity, thermal, and board-layout decisions should follow the official Cyclone III device documentation rather than distributor summaries alone. This product record combines verified distributor pricing, device attributes, package information, and application-oriented engineering guidance. It also distinguishes a documented no-lead package option from broader FPGA alternatives that use different packages, densities, or architectures and therefore are not treated as drop-in replacements.

Cotação Contato
EP3C120F484C7N - Cyclone III FPGA 119K LE 484-FBGA | Intel
EP3C120F484C7N

EP3C120F484C7N - Cyclone III FPGA 119K LE 484-FBGA | Intel

The Intel (formerly Altera) EP3C120F484C7N is a high-density Cyclone III Field-Programmable Gate Array (FPGA) delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 283 embedded 18x18 multipliers in a 484-ball FineLine BGA package. Fabricated on a low-power 65 nm process, the device operates from a 1.2 V core supply and supports I/O voltages from 1.2 V to 3.3 V via eight I/O banks. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM and DSP blocks. FPGAs occupy a unique position in the digital hierarchy between fixed-function ASICs (more integration, higher NRE) and microcontrollers (less flexibility, lower performance), offering hardware-level parallelism and reconfigurable logic for high-throughput signal processing, glue logic, and rapid prototyping. Key features of the EP3C120F484C7N include up to 472 MHz internal operation, four phase-locked loops (PLLs) for clock management, 20 global clock networks, and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM II. The 484-pin FBGA package (23 x 23 mm, 1.0 mm pitch) provides robust thermal and electrical performance suitable for industrial-temperature designs, while the Cyclone III family architecture eliminates the need for dedicated configuration devices when using active serial (AS) configuration from low-cost EPCS flash. Architecturally, the EP3C120F484C7N combines logic elements organized into Logic Array Blocks (LABs), each containing 16 LEs plus associated carry and control logic. The embedded multiplier blocks support 18x18 signed multiplication natively, and the M9K memory blocks deliver true dual-port operation at 315 MHz, enabling simultaneous read/write access to the same storage location without arbitration. Typical applications include industrial motor control, video processing and display controllers, software-defined radio, telecommunications line cards, ASIC prototyping, and embedded vision systems. The combination of high logic density and low static power consumption also makes Cyclone III devices attractive for portable and thermally constrained designs where larger FPGAs would be impractical. When designing with this device, carefully plan I/O bank assignments to avoid mixed-voltage conflicts and ensure the PLL reference clock inputs meet the jitter specifications of the targeted data rate. The Quartus II design software (version 13.0 and earlier) is the canonical toolchain for compilation, fitting, and timing closure. This page synthesizes distributor pricing, same-brand Cyclone III drop-in alternatives, and practical Quartus II design notes not found in the manufacturer datasheet alone.

Cotação Contato
EP3C120F484I7 - 119K LEs Cyclone III FPGA 484-FBGA | Intel
EP3C120F484I7

EP3C120F484I7 - 119K LEs Cyclone III FPGA 484-FBGA | Intel

The Intel (formerly Altera) EP3C120F484I7 is a high-density Cyclone III Field-Programmable Gate Array delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 283 user I/Os in a 484-ball FineLine BGA package. Built on a low-power 65 nm process, the device operates from a 1.2 V core supply and supports industrial temperature grades from -40C to +100C. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that lets engineers implement arbitrary digital logic, memory blocks, and DSP functions on a single die after manufacturing. Within the broader taxonomy, an FPGA sits under programmable logic devices (PLD) -> logic ICs -> integrated circuits, sitting alongside CPLDs and ASICs as a flexible alternative to fixed-function chips. FPGAs such as Cyclone III are commonly used in cost-sensitive, high-volume applications where ASIC NRE is unjustified but ASSP flexibility is insufficient. Key specifications of the EP3C120F484I7 include 119,088 logic elements, 3,981,312 bits of RAM, 576 embedded 18x18 multipliers, and 4 PLLs for clock management. The 484-FBGA package measures 23 x 23 mm with a 1.0 mm ball pitch and supports up to 283 user I/Os across 8 I/O banks. Peripherals and hard IP blocks include embedded memory blocks (M9K), a configuration interface, and high-speed LVDS support on selected pins. The Cyclone III architecture uses an SRAM-based LUT fabric with dedicated routing, M9K memory blocks, and 18x18 multiplier blocks for DSP workloads. Compared to earlier Cyclone generations, Cyclone III introduced a 65 nm process node that cut core power by roughly 50 percent while raising logic density, making the EP3C120F484I7 suitable for power-sensitive designs that still need very large logic capacity. Typical applications include industrial motor control, video processing pipelines, software-defined radio prototyping, and high-volume telecom line cards. The 283 available user I/Os also enable rich external connectivity for memory expansion, parallel sensor buses, and high-speed LVDS interfaces. When designing with the EP3C120F484I7, ensure all eight I/O banks are powered from rails within their respective VCCIO ranges and that decoupling follows Altera's power distribution network guidance. Configuration via JTAG or a passive serial EPCS device should be planned early to minimize board rework. This page consolidates distributor pricing, drop-in same-package alternatives from the Cyclone III family, and practical design notes that supplement the manufacturer datasheet with information useful for sourcing and second-source decisions.

Cotação Contato
EP3C120F484I7N - Cyclone III FPGA 119K LE | 484-FBGA | Intel
EP3C120F484I7N

EP3C120F484I7N - Cyclone III FPGA 119K LE | 484-FBGA | Intel

The Intel (formerly Altera) EP3C120F484I7N is a high-density Cyclone III Field-Programmable Gate Array delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 283 18x18 multipliers in a 484-pin FineLine BGA (FBGA-484) package. It is built on a low-power 65 nm TSMC process and supports internal operating frequencies up to 472 MHz. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than at the factory. FPGAs sit between general-purpose microcontrollers and fixed ASICs in the programmable-logic hierarchy: microcontrollers run software sequentially, FPGAs run massively parallel custom hardware, and ASICs are faster but cannot be reconfigured. Cyclone III belongs to Intel's low-cost, low-power FPGA family, optimized for high-volume cost-sensitive applications. Key features include 119,088 logic elements distributed across 7,443 logic array blocks (LABs), 4 M9K embedded memory blocks totaling approximately 4 Mbits, 288 18x18 hardware multipliers for DSP, and 8 user I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The device operates from a 1.15 V to 1.25 V core supply with separate VCCIO banks for I/O flexibility. Cyclone III uses a logic-element (LE) based fabric with 4-input LUTs, dedicated carry chains for arithmetic, and embedded RAM blocks. The -I7 speed grade places the part in the mid-fast tier; the -I7N suffix denotes the industrial temperature range (-40 °C to +100 °C ambient) and lead-free / Pb-free packaging. The 484-pin FBGA measures 23 mm x 23 mm with 1.0 mm pitch. Typical applications include industrial motor control, video processing pipelines, automotive driver-assistance prototypes, software-defined radio baseband, and high-volume consumer signal conditioning. Cyclone III FPGAs are pin-compatible across density grades within the same package, allowing board reuse as designs migrate from EP3C25 to EP3C120. When designing with the EP3C120F484I7N, ensure that all four dedicated clock input pins are routed cleanly and that the JTAG chain (TCK, TMS, TDI, TDO) is accessible for in-system programming with a USB-Blaster or compatible download cable. Decoupling follows the Quartus II reference schematic: 0.1 uF and 10 uF capacitors near each power pin. This page synthesizes distributor pricing, same-package alternatives, and Quartus II design considerations not found in the standalone datasheet.

Cotação Contato
EP3C120F780C7AD - Cyclone III FPGA 119K LE FBGA-780 | Intel
EP3C120F780C7AD

EP3C120F780C7AD - Cyclone III FPGA 119K LE FBGA-780 | Intel

The Intel (formerly Altera) Cyclone III EP3C120F780C7AD is a low-power, high-volume SRAM-based Field-Programmable Gate Array (FPGA) integrating 119,088 logic elements in a 780-pin FineLine Ball-Grid Array (FBGA) package. Built on TSMC's 65nm low-power process, this Cyclone III variant delivers up to 3.9 Mb of embedded memory, four phase-locked loops (PLLs), 531 multipliers, and 20 global clock networks, while consuming as little as 0.5 W of dynamic power at typical clock rates. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks, interconnect, and I/O after fabrication. FPGAs sit within the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor, occupying the same engineering space as CPLDs, but offering far higher logic density, embedded RAM/DSP blocks, and high-speed transceivers in larger devices. Cyclone III specifically targets cost-sensitive, power-conscious volume applications such as video processing, motor control, automotive driver assistance, and industrial communication. Key features of the EP3C120F780C7AD include 119,088 logic elements (LEs), 3,981 Kbits (approximately 498 Kbytes) of embedded RAM organized as M9K blocks, 288 18x18 hardware multipliers for DSP, and four PLLs. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards across up to 20 global clock networks, with user I/O counts in the 400+ range depending on package pinout. Configuration is supported through JTAG, Active Serial, and Passive Serial modes, with on-chip encryption (AES) for design security. The Cyclone III architecture uses a logic-element fabric with 8-input adaptive look-up tables (ALUTs), each capable of implementing any 6-input function or two independent 4-input functions. Embedded M9K memory blocks support true dual-port, simple dual-port, and single-port modes with parity bits, enabling efficient buffering, FIFO, and shift-register implementations. The DSP blocks natively support 18x18 multiplication with optional add/subtract/accumulate, eliminating the need for soft-multiplier inference in DSP pipelines. Typical applications for the EP3C120F780C7AD span HD video bridging and image processing, industrial motor control and servo drives, automotive infotainment and driver-assistance modules, telecommunications line cards, software-defined radio (SDR) baseband, and embedded industrial protocols such as EtherCAT, PROFINET, and EtherNet/IP. The combination of high logic count, on-chip DSP, and low power also makes it suitable for portable medical instrumentation and handheld test equipment. When designing with the EP3C120F780C7AD, plan the power budget across core, I/O, and PLL rails. Use the Quartus II PowerPlay early power estimator before layout to size decoupling and rail sequencing. Maintain controlled-impedance PCB traces for high-speed LVDS links, and route clock and PLL analog supplies through dedicated ferrite filters to minimize jitter.

Cotação Contato
EP3C120F780C7N - 119K Logic Element Cyclone III FPGA | Intel / Altera
EP3C120F780C7N

EP3C120F780C7N - 119K Logic Element Cyclone III FPGA | Intel / Altera

The Intel (formerly Altera) Cyclone III EP3C120F780C7N is a high-density, low-power Field Programmable Gate Array (FPGA) built on a 65 nm low-k dielectric process, delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 531 hardware multipliers inside a 780-pin FineLine BGA (FBGA) package. The 'C7' speed grade supports a core clock rate up to 437.5 MHz while operating from a 1.2 V core supply, and the 'N' suffix denotes lead-free / Pb-free terminations compliant with RoHS. Cyclone III positioned the family for cost-sensitive, high-volume applications where Cyclone II was too small and Stratix families were over-spec. A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that lets designers implement arbitrary digital logic, memory blocks, and DSP functions by loading a configuration bitstream after PCB assembly. Within the broader semiconductor taxonomy, the EP3C120F780C7N sits inside the hierarchy programmable logic -> FPGA -> SRAM-based FPGA -> low-cost FPGA. Unlike ASICs, FPGAs can be reconfigured in the field, enabling rapid prototyping, late-stage design changes, and hardware reuse across product variants without respinning silicon. Key features of the EP3C120F780C7N include up to 531 embedded 18x18 multipliers for DSP, 4 PLLs with multiple outputs, support for external memory interfaces including DDR, DDR2, and QDR II SRAM, and 8 phase-locked clock networks. The device exposes up to 429 user I/O pins depending on configuration scheme and supports hot-socketing, joint Test Action Group (JTAG) boundary-scan, and Active Serial / Fast Active Parallel configuration modes via the dedicated configuration pins. Cyclone III also introduced dedicated hard IP for PCIe Gen1 soft cores implemented in fabric. Technically, the Cyclone III architecture uses 4-input look-up tables (LUT4) clustered into logic array blocks (LABs), with embedded M9K memory blocks that can be configured as RAM, ROM, or shift registers. The 65 nm process and 1.2 V core reduce dynamic power consumption versus the prior Cyclone II generation while increasing logic density roughly 4x. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards and provides on-chip termination (OCT) for signal-integrity-critical interfaces. Typical applications include industrial motor control and machine vision, automotive driver-assistance ADAS prototypes, video processing and broadcast equipment, software-defined radio (SDR) baseband, low-cost DSP front ends, and PCI Express endpoint cards. Designers select the EP3C120F780C7N when they need Stratix-class capacity at Cyclone-class pricing and power budgets. When designing with this part, note that 780-pin FBGA requires high-density PCB routing with microvia stack-ups, the dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[3:0]) must be pulled correctly for the chosen configuration mode, and unused I/O banks must be powered and grounded per the datasheet to prevent floating inputs. This page synthesizes distributor inventory data, parametric drop-in candidates, and practical layout notes that complement the official Cyclone III Device Handbook rather than replace it.

Cotação Contato
EP3C120F780C7NAD - Cyclone III FPGA, 119K LEs, 780-FBGA | Altera
EP3C120F780C7NAD

EP3C120F780C7NAD - Cyclone III FPGA, 119K LEs, 780-FBGA | Altera

The Altera (Intel Programmable Solutions Group) EP3C120F780C7NAD is a Cyclone III family Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package (FBGA-780, 23 × 23 mm, 1.0 mm pitch). It integrates 119,088 logic elements, 3,981 Kbits of embedded memory, and 4 PLLs in a low-power 60-nm process node, targeting cost-sensitive high-volume applications. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream after manufacture. In the broader taxonomy, this part sits at FPGA → programmable logic device (PLD) → digital IC → semiconductor. Cyclone III devices are positioned below the high-end Stratix family and above legacy Cyclone II; they are widely used where designers need tens of thousands of logic elements, hardware parallelism, and moderate DSP capability without the power and price of high-end FPGAs. Key features of this device include 119,088 logic elements, 3,981 Kbits of embedded RAM (M9K blocks), 4 phase-locked loops, 531 user I/O pins, and 4 embedded multiplier blocks (18 × 18). It supports multiple I/O standards including LVDS, LVCMOS, SSTL, and HSTL, with per-pin dynamic impedance and slew-rate control. The C7 speed grade operates with internal clock frequencies up to 472 MHz and supports commercial temperature operation. The Cyclone III architecture combines an LAB (Logic Array Block) structure built from adaptive logic modules (ALMs), an island-style routing network, and column/row-based embedded memory and multiplier blocks. Power consumption is reduced by leveraging a 1.2 V core voltage, low-k dielectric process, and programmable power-on-demand per LAB. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes using Altera/Intel Quartus II design software. Typical applications include industrial motor control, video processing and image aggregation, communications protocol bridging, automotive infotainment pre-processing, and portable test & measurement equipment. The Cyclone III family is also commonly deployed in display controllers, software-defined radio front-ends, and as a companion processor to ASICs/SoCs for glue logic and parallel DSP tasks. When designing with this part, ensure the Quartus II device fitting is reviewed for the selected speed grade, and verify that I/O bank voltage references match the connected peripherals. The N suffix on the part number indicates lead-free / Pb-free termination, and the AD suffix typically denotes a specific Altera internal ordering code variant. This page synthesizes distributor pricing, package diagrams, and practical design notes not found in the manufacturer datasheet, helping engineers shorten their selection and sourcing cycle.

Cotação Contato
EP3C120F780C8N - Cyclone III FPGA, 119K Logic | Intel
EP3C120F780C8N

EP3C120F780C8N - Cyclone III FPGA, 119K Logic | Intel

Intel EP3C120F780C8N is a Cyclone III field-programmable gate array (FPGA) with 119,088 logic elements, 531 user I/O pins, 3,981,312 embedded-memory bits, and a 780-ball flip-chip ball grid array package. Verified distributor listings identify a 1.2 V core supply and a maximum internal frequency of 402 MHz to 472 MHz, depending on the cited source. The device belongs to the low-cost Cyclone III family and is intended for configurable digital logic, embedded processing, control, and high-density interface designs. An FPGA is a semiconductor device containing programmable logic blocks, programmable interconnects, memory resources, and I/O cells. Engineers configure these resources after PCB assembly to implement combinational logic, sequential state machines, communications interfaces, processors, and application-specific accelerators. In the hierarchy of programmable devices, an FPGA sits below application-specific integrated circuits in flexibility but above fixed-function controllers in implementation speed and density. Cyclone III extends this model with a power-conscious architecture for cost-sensitive applications. The headline density of 119,088 logic elements supports larger state machines, parallel datapaths, and multiple interface functions in one programmable device. A total of 3,981,312 embedded-memory bits provides distributed or block-oriented storage for FIFOs, buffers, lookup tables, and packet processing. The device also exposes 531 user I/O pins, enabling broad connectivity in systems that aggregate memory buses, communications links, sensors, or control peripherals. Its 780-ball FBGA package uses a 1 mm pitch and occupies approximately 23 mm by 23 mm with a 2.60 mm height. The Cyclone III architecture combines programmable logic fabric with embedded memory and configurable I/O structures. Configuration data defines both logic behavior and routing, allowing the same physical component to serve different functions through a new bitstream. The 1.2 V operating point is central to power estimation, regulator selection, signal integrity, and thermal design. A design should not use either published frequency value as an unconditional system-clock guarantee; timing closure depends on the implemented logic, constraints, I/O standards, placement, routing, and selected speed grade. Typical systems include industrial control and automation equipment, communications infrastructure, video and image processing, test and measurement hardware, and embedded controllers. The logic density is useful when a design must integrate many parallel functions without an ASIC development cycle. Broad I/O availability also suits boards that bridge processor buses, external memory, converters, and high-speed peripheral interfaces. Before layout, verify the exact ball map, supported I/O standards, configuration scheme, power requirements, and timing limits in the manufacturer documentation. Decoupling, continuous core-power planes, clock distribution, signal-return paths, and configuration-interface integrity directly affect operation. The published frequency figures describe device capability but do not replace static timing analysis. This data consolidates verified distributor specifications, package information, inventory and ordering evidence, practical architecture context, and a drop-in comparison. Because the supplied cross-reference search returned no verified pin-compatible substitutes, no alternative is asserted as a drop-in replacement without package, pinout, density, voltage, and timing evidence.

Cotação Contato