EP4CE6E22A7N vs EP4CE6E22C7 Comparação
Comparação detalhada lado a lado de EP4CE6E22A7N por Intel e EP4CE6E22C7 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP4CE6E22A7N | EP4CE6E22C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $17,40 | $11,20 |
| Series | Cyclone IV E | Cyclone IV E |
| Logic Elements | 6,272 | — |
| Embedded Memory (bits) | 276,480 | — |
| Embedded Multipliers (18x18) | 15 | — |
| User I/O Pins | 91 | — |
| Number of I/O Banks | 4 | — |
| Number of PLLs | 2 | 4 |
| Global Clock Networks | 10 | — |
| Process Node | 60 nm low power | — |
| Core Voltage | 1.2 V | — |
| Operating Temperature Grade | Automotive A7 (-40C to +125C junction) | — |
| Package Type | 144-pin EQFP (E22) with exposed pad | — |
| Configuration Modes | JTAG, AS, PS, FPP | JTAG, Active Serial (AS), Passive Serial (PS) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Family | — | Cyclone IV |
| Core Architecture | — | Logic Elements (LE) |
| Number of Logic Elements (LEs) | — | 6,272 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count] |
| Number of Configurable Logic Blocks (CLBs) | — | 392 |
| Total Embedded Memory Bits | — | 276,480 |
| Total RAM (Kbits) | — | 270 |
| Number of Embedded 18x18 Multipliers | — | 15 |
| User I/O Count | — | 91 |
| I/O Standards Supported | — | LVDS, LVCMOS, LVTTL, SSTL, HSTL, PCI |
| Operating Supply Voltage (Core) | — | 1.0 V to 1.2 V (typ. 1.2 V) |
| Operating Supply Voltage (I/O) | — | 1.2 V to 3.3 V |
| Logic Speed Grade | — | C7 |
| Operating Temperature Range (Commercial) | — | 0°C to +85°C (junction) |
| Encapsulamento | — | 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch |
| Process Technology | — | 60 nm low-power CMOS |