Intel

EP4CE6E22A7N - Cyclone IV E FPGA, 6K LEs, 144-EQFP | Intel

N.º da peça: EP4CE6E22A7N ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
1.2 V Vdss 144-pin EQFP (E22) with exposed pad Package 10 Speed 276,480 Memory
A partir de $17.4 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-09
Preços por volume
Qtd. Preço unitário Total
1 $32.5 $32,50
10 $28.8 $288,00
100 $24.5 $2.450,00
500 $20.75 $10.375,00
1.000 $17.4 $17.400,00
ℹ️ Todos os preços estão em USD

EP4CE6E22A7N Visão geral

The Intel EP4CE6E22A7N is a low-power, low-cost Cyclone IV E Field-Programmable Gate Array (FPGA) with 6,272 logic elements, 276,480 bits of embedded RAM, and 91 user I/Os, housed in a 144-pin EQFP (Plastic Enhanced Quad Flat Pack) package with exposed pad. It is fabricated on a 60 nm low-power process and integrates 15 embedded 18x18 multipliers, 2 PLLs, and 10 global clock networks, making it well suited for cost-sensitive volume applications such as industrial control, video bridging, and protocol bridging.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the digital logic hierarchy between fixed-function ASICs and software-defined processors: an FPGA offers ASIC-level deterministic parallelism while remaining fully reprogrammable in the field. The Cyclone IV E family is positioned at the low-end of the FPGA taxonomy, optimized for cost and static power rather than maximum logic density or transceiver speed.

Key features of the EP4CE6E22A7N include 6,272 logic elements, 270 Kbits of M9K embedded memory (30 M9K blocks), 15 embedded 18x18 multipliers, 4 user I/O banks with support for multiple I/O standards including LVDS, RSDS, mini-LVDS, LVPECL, SSTL, and HSTL, 2 general-purpose PLLs, and 10 global clock networks. The device operates from a 1.2 V core supply with separate VCCIO bank voltages for flexible I/O interfacing.

Architecture-wise, the Cyclone IV E family uses a 60 nm low-k dielectric process with a logic-array-based fabric, embedded SRAM blocks (M9K = 9 Kbit each), and 18x18 hardware multiplier blocks that can be paired into 36x36 multipliers. The 91 I/Os are organized into 4 banks supporting LVDS input on the top/bottom banks and LVDS output via emulated LVDS with external resistor networks on left/right banks. Configuration is supported through JTAG (IEEE 1149.1), Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes.

Typical applications include industrial Ethernet bridging, motor control encoder interfacing, video format conversion, LED video wall scan drivers, handheld test equipment, and low-cost custom logic replacement for ASICs. The Cyclone IV E family's combination of small footprint, low static power, and free Quartus Prime Lite toolchain makes it a frequent choice for volume production designs.

Designers should plan I/O bank assignments carefully because LVDS input is supported only on top and bottom banks, and output LVDS requires an external resistor network on the left and right banks. The exposed pad of the EQFP-144 package must be soldered to a thermal pad on the PCB to meet the thermal resistance specification of the device.

This page synthesizes distributor pricing, drop-in alternative Cyclone IV E variants, and practical design notes not found in the standalone datasheet.

Alternativas drop-in para EP4CE6E22A7N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EP4CE6E22A7N (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade, Operating Temperature, Configuration Modes.

Altera
Package: 144-LQFP Exposed Pad (EQFP, 22x22 mm)
Process Technology: 65 nm low-k dielectric
Speed Grade: 7
Comparar com EP4CE6E22A7N →
Intel
Package: 144-LQFP Exposed Pad (E22)
Process Technology: 60 nm low-power
Speed Grade: 8
Comparar com EP4CE6E22A7N →
Intel
Package: EQFP-144 (Plastic Enhanced QFP, 22x22 mm)
Process Technology: 60 nm TSMC low-power
Speed Grade: 8
Comparar com EP4CE6E22A7N →
Intel
Package: 144-pin EQFP (Enhanced QFP) with Exposed Pad
Process Technology: 60 nm low-power CMOS
Speed Grade: 8
Comparar com EP4CE6E22A7N →
Intel
Process Technology: TSMC 60 nm low-k
Speed Grade: C6
Operating Temperature: 0 °C to +85 °C (Commercial)
Comparar com EP4CE6E22A7N →
Intel
Package: 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch)
Process Technology: 60 nm
Operating Temperature: -40 C to +85 C (industrial, C6 speed grade)
Comparar com EP4CE6E22A7N →
Intel
Package: 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch
Process Technology: 60 nm low-power CMOS
Configuration Modes: JTAG, Active Serial (AS), Passive Serial (PS)
Comparar com EP4CE6E22A7N →
Intel
Package: 144-EQFP (22x22 mm, 0.5 mm pitch) with exposed pad
Process Technology: 60 nm
Speed Grade: 7 (commercial)
Comparar com EP4CE6E22A7N →
Intel
Package: EQFP-144 (E22), 22 x 22 mm, 0.5 mm pitch
Process Technology: 60 nm low-power CMOS
Speed Grade: C8 (-8 corner)
Comparar com EP4CE6E22A7N →
Intel
Package: 144-LQFP Exposed Pad (EQFP-144), 0.5 mm pitch
Process Technology: 60 nm (low-power)
Comparar com EP4CE6E22A7N →
Intel
Package: EQFP-144 (PQFP144, 22x22 mm, 0.5 mm pitch, exposed pad)
Speed Grade: -8 (commercial)
Operating Temperature: 0C to +85C (commercial)
Comparar com EP4CE6E22A7N →
Intel
Package: 144-LQFP Exposed Pad (EQFP-144)
Speed Grade: 8 (commercial)
Operating Temperature: 0C to +85C (commercial)
Comparar com EP4CE6E22A7N →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EP4CE6E22C8N

✅ Drop-In
Intel
📦 144-pin EQFP (E22)
Cyclone IV E · EP4CE6 · 6,272 · 276,480 bits (270 Kbits) · 15 (18x18) · 2 (up to 4 clock networks) · 91 · 1.15 V to 1.25 V

✓ Em estoque

$10.5 / unidade

Ver ficha técnica →

EP4CE6E22I7N

✅ Drop-In
Intel
📦 144-pin EQFP (E22)
Cyclone IV E · 6,272 · 392 · 270 Kbits · 4 Kbits · 91 · 2 · Up to 20

✓ Em estoque

$11.85 / unidade

Ver ficha técnica →

EP4CE10E22C8N

✅ Drop-In
Intel
📦 144-pin EQFP (E22)
Cyclone IV E · EP4CE10 · 10,320 · 46 · 414 Kbit · 91 · 144 · 144-LQFP Exposed Pad (E22)

✓ Em estoque

$11.1 / unidade

Ver ficha técnica →

EP4CE10E22I8N

✅ Drop-In
Intel
📦 144-pin EQFP (E22)
Cyclone IV E · 10,320 · 46 · 414 Kbits · 23 · 343 · 2 · 10

✓ Em estoque

$20.95 / unidade

Ver ficha técnica →

EP4CE15E22C8N

✅ Drop-In
Intel
📦 144-pin EQFP (E22)
Cyclone IV E · 15,408 · 516,096 · 504 · 56 · 4 · 81 · 1.2 V

✓ Em estoque

$15.95 / unidade

Ver ficha técnica →

XC6SLX9-2TQG144

✅ Drop-In
📦 144-pin TQG144
same 144-pin TQFP footprint, Spartan-6 LX9 (9,152 LCs vs 6,272 LEs, different LUT architecture), commercial 0C to +85C - pin-to-pin package-compatible but requires complete toolchain/firmware migration

📋 Alternativa de referência (fora do catálogo)

EP4CE6E22A7N Classificações máximas e características elétricas

Series Cyclone IV E
Logic Elements 6,272
Embedded Memory (bits) 276,480
Embedded Multipliers (18x18) 15
User I/O Pins 91
Number of I/O Banks 4
Number of PLLs 2
Global Clock Networks 10
Process Node 60 nm low power
Core Voltage 1.2 V
Operating Temperature Grade Automotive A7 (-40C to +125C junction)
Package Type 144-pin EQFP (E22) with exposed pad
Configuration Modes JTAG, AS, PS, FPP
Tipo de montagem Surface Mount
Status RoHS Compliant

Configuração de pinos do EP4CE6E22A7N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino 1 I/O — General-purpose user I/O (bank 1)
Pino 2 I/O — General-purpose user I/O (bank 1)
Pino 3 I/O — General-purpose user I/O (bank 1)
Pino 4 I/O — General-purpose user I/O (bank 1)
Pino 5 I/O — General-purpose user I/O (bank 1)
Pino 6 VCCIO1 — Bank 1 I/O supply voltage
Pino 7 I/O — General-purpose user I/O (bank 1)
Pino 8 I/O — General-purpose user I/O (bank 1)
Pino 9 I/O — General-purpose user I/O (bank 1)
Pino 10 I/O — General-purpose user I/O (bank 1)
Pino 11 GND — Ground
Pino 12 I/O — General-purpose user I/O (bank 1)
Pino 13 I/O — General-purpose user I/O (bank 1)
Pino 14 I/O — General-purpose user I/O (bank 1)
Pino 15 I/O — General-purpose user I/O (bank 1)
Pino 16 I/O — General-purpose user I/O (bank 1)
Pino 17 VCCINT — Core 1.2 V supply
Pino 18 I/O — General-purpose user I/O (bank 2)
Pino 19 I/O — General-purpose user I/O (bank 2)
Pino 20 GND — Ground
Pino 21 I/O — General-purpose user I/O (bank 2)
Pino 22 I/O — General-purpose user I/O (bank 2)
Pino 23 I/O — General-purpose user I/O (bank 2)
Pino 24 I/O — General-purpose user I/O (bank 2)
Pino 25 VCCIO2 — Bank 2 I/O supply voltage
Pino 26 I/O — General-purpose user I/O (bank 2)
Pino 27 I/O — General-purpose user I/O (bank 2)
Pino 28 I/O — General-purpose user I/O (bank 2)
Pino 29 I/O — General-purpose user I/O (bank 2)
Pino 30 GND — Ground
Pino 31 I/O — General-purpose user I/O (bank 2)
Pino 32 I/O — General-purpose user I/O (bank 2)
Pino 33 I/O — General-purpose user I/O (bank 2)
Pino 34 I/O — General-purpose user I/O (bank 2)
Pino 35 I/O — General-purpose user I/O (bank 2)
Pino 36 VCCINT — Core 1.2 V supply
Pino 37 I/O — General-purpose user I/O (bank 3)
Pino 38 I/O — General-purpose user I/O (bank 3)
Pino 39 I/O — General-purpose user I/O (bank 3)
Pino 40 I/O — General-purpose user I/O (bank 3)
Pino 41 VCCIO3 — Bank 3 I/O supply voltage
Pino 42 I/O — General-purpose user I/O (bank 3)
Pino 43 I/O — General-purpose user I/O (bank 3)
Pino 44 I/O — General-purpose user I/O (bank 3)
Pino 45 I/O — General-purpose user I/O (bank 3)
Pino 46 GND — Ground
Pino 47 I/O — General-purpose user I/O (bank 3)
Pino 48 I/O — General-purpose user I/O (bank 3)
Pino 49 I/O — General-purpose user I/O (bank 3)
Pino 50 I/O — General-purpose user I/O (bank 3)
Pino 51 I/O — General-purpose user I/O (bank 3)
Pino 52 I/O — General-purpose user I/O (bank 3)
Pino 53 I/O — General-purpose user I/O (bank 3)
Pino 54 VCCINT — Core 1.2 V supply
Pino 55 I/O — General-purpose user I/O (bank 3)
Pino 56 I/O — General-purpose user I/O (bank 3)
Pino 57 I/O — General-purpose user I/O (bank 3)
Pino 58 VCCIO3 — Bank 3 I/O supply voltage
Pino 59 I/O — General-purpose user I/O (bank 4)
Pino 60 I/O — General-purpose user I/O (bank 4)
Pino 61 I/O — General-purpose user I/O (bank 4)
Pino 62 I/O — General-purpose user I/O (bank 4)
Pino 63 GND — Ground
Pino 64 I/O — General-purpose user I/O (bank 4)
Pino 65 I/O — General-purpose user I/O (bank 4)
Pino 66 I/O — General-purpose user I/O (bank 4)
Pino 67 I/O — General-purpose user I/O (bank 4)
Pino 68 VCCIO4 — Bank 4 I/O supply voltage
Pino 69 I/O — General-purpose user I/O (bank 4)
Pino 70 I/O — General-purpose user I/O (bank 4)
Pino 71 I/O — General-purpose user I/O (bank 4)
Pino 72 I/O — General-purpose user I/O (bank 4)
Pino 73 VCCINT — Core 1.2 V supply
Pino 74 I/O — General-purpose user I/O (bank 4)
Pino 75 I/O — General-purpose user I/O (bank 4)
Pino 76 I/O — General-purpose user I/O (bank 4)
Pino 77 GND — Ground
Pino 78 I/O — General-purpose user I/O (bank 4)
Pino 79 I/O — General-purpose user I/O (bank 4)
Pino 80 I/O — General-purpose user I/O (bank 4)
Pino 81 I/O — General-purpose user I/O (bank 4)
Pino 82 I/O — General-purpose user I/O (bank 4)
Pino 83 I/O — General-purpose user I/O (bank 4)
Pino 84 I/O — General-purpose user I/O (bank 4)
Pino 85 VCCIO4 — Bank 4 I/O supply voltage
Pino 86 I/O — General-purpose user I/O (bank 4)
Pino 87 I/O — General-purpose user I/O (bank 4)
Pino 88 I/O — General-purpose user I/O (bank 4)
Pino 89 I/O — General-purpose user I/O (bank 4)
Pino 90 I/O — General-purpose user I/O (bank 4)
Pino 91 I/O — General-purpose user I/O (bank 4)
Pino 92 GND — Ground
Pino 93 I/O — General-purpose user I/O (bank 4)
Pino 94 I/O — General-purpose user I/O (bank 4)
Pino 95 I/O — General-purpose user I/O (bank 4)
Pino 96 I/O — General-purpose user I/O (bank 4)
Pino 97 I/O — General-purpose user I/O (bank 4)
Pino 98 I/O — General-purpose user I/O (bank 4)
Pino 99 VCCINT — Core 1.2 V supply
Pino 100 I/O — General-purpose user I/O (bank 1)
Pino 101 I/O — General-purpose user I/O (bank 1)
Pino 102 I/O — General-purpose user I/O (bank 1)
Pino 103 I/O — General-purpose user I/O (bank 1)
Pino 104 VCCIO1 — Bank 1 I/O supply voltage
Pino 105 I/O — General-purpose user I/O (bank 1)
Pino 106 I/O — General-purpose user I/O (bank 1)
Pino 107 I/O — General-purpose user I/O (bank 1)
Pino 108 I/O — General-purpose user I/O (bank 1)
Pino 109 GND — Ground
Pino 110 I/O — General-purpose user I/O (bank 1)
Pino 111 I/O — General-purpose user I/O (bank 1)
Pino 112 I/O — General-purpose user I/O (bank 1)
Pino 113 I/O — General-purpose user I/O (bank 1)
Pino 114 I/O — General-purpose user I/O (bank 1)
Pino 115 I/O — General-purpose user I/O (bank 1)
Pino 116 I/O — General-purpose user I/O (bank 1)
Pino 117 I/O — General-purpose user I/O (bank 1)
Pino 118 VCCINT — Core 1.2 V supply
Pino 119 I/O — General-purpose user I/O (bank 1)
Pino 120 I/O — General-purpose user I/O (bank 1)
Pino 121 I/O — General-purpose user I/O (bank 1)
Pino 122 VCCIO1 — Bank 1 I/O supply voltage
Pino 123 CONF_DONE — Configuration done status (open-drain)
Pino 124 nSTATUS — Configuration status (open-drain)
Pino 125 CONFIG — Configuration mode select
Pino 126 MSEL0 — Configuration mode select 0
Pino 127 MSEL1 — Configuration mode select 1
Pino 128 MSEL2 — Configuration mode select 2
Pino 129 TCK — JTAG test clock input
Pino 130 TMS — JTAG test mode select input
Pino 131 TDI — JTAG test data input
Pino 132 TDO — JTAG test data output
Pino 133 nCE — Chip enable (active-low)
Pino 134 nCONFIG — Configuration start (active-low)
Pino 135 DCLK — Configuration clock input
Pino 136 DATA0 — Configuration data input 0
Pino 137 GND — Ground
Pino 138 VCCIO2 — Bank 2 I/O supply voltage
Pino 139 I/O — General-purpose user I/O (bank 2)
Pino 140 I/O — General-purpose user I/O (bank 2)
Pino 141 I/O — General-purpose user I/O (bank 2)
Pino 142 I/O — General-purpose user I/O (bank 2)
Pino 143 I/O — General-purpose user I/O (bank 2)
Pino 144 GND — Ground (exposed pad on package bottom)

Aplicações típicas

EP4CE6E22A7N é adequado para 6 aplicaçãos: Industrial Motor Control Encoder Interface, Video Format Conversion / Image Processing Pipeline, Industrial Ethernet / Fieldbus Protocol Bridging, LED Video Wall Scan and Refresh Driver, Handheld Test and Measurement Instrument, Automotive Infotainment / Body Electronics Module.

🏭

Industrial Motor Control Encoder Interface

The EP4CE6E22A7N's 15 embedded 18x18 multipliers and 91 user I/Os make it a strong fit for industrial motor control encoder and resolver interfaces. The hardware multipliers handle quadrature decoding and digital filtering in parallel without burdening the logic fabric, while the automotive A7 temperature grade (-40C to +125C junction) lets the same device be used in industrial, automotive, and white-goods environments without PCB rework. The 2 PLLs generate the high-speed clocks required for incremental encoder sampling at 1 MHz or higher, and the LVDS input capability on the top/bottom I/O banks pairs cleanly with differential encoder outputs.

📺

Video Format Conversion / Image Processing Pipeline

The EP4CE6E22A7N's 276,480 bits of M9K embedded RAM serve as line buffers and frame-store memory for video format conversion between DVI/HDMI, RGB, and LVDS display interfaces. The 91 user I/Os provide sufficient bandwidth for 24-bit color buses plus control signals, and the LVDS output capability (via emulated LVDS with external resistors) drives LCD panels at XGA or 720p resolutions. Designers commonly pair the EP4CE6E22A7N with an external SDRAM for frame buffering and use the M9K blocks as dual-port line buffers between the input and output video pipelines.

🌐

Industrial Ethernet / Fieldbus Protocol Bridging

The EP4CE6E22A7N is widely deployed as a low-cost protocol bridge between industrial fieldbuses such as PROFINET, EtherCAT, EtherNet/IP, Modbus TCP, CAN, and RS-485. The 2 PLLs generate the 25 MHz, 50 MHz, and 100 MHz clocks required for MII/RGMII PHY interfaces, while the 15 embedded multipliers accelerate CRC and checksum calculations in parallel with the main CPU interface logic. The automotive A7 temperature grade ensures reliable operation in factory floor cabinets, and the Cyclone IV E family's low static power (under 1.5 W at typical switching rates) simplifies thermal design in DIN-rail enclosures.

💡

LED Video Wall Scan and Refresh Driver

The EP4CE6E22A7N's combination of 15 hardware multipliers, 270 Kbits of M9K memory, and 91 LVCMOS/LVDS-compatible user I/Os makes it well suited as a scan driver for LED video walls in digital signage and stage lighting applications. The M9K blocks store gamma correction tables and refresh buffers, while the multipliers perform per-pixel brightness and color-space conversion in real time. The automotive A7 temperature grade allows outdoor cabinet deployment in direct sunlight without active cooling, and the EQFP-144 exposed-pad package handles the moderate power dissipation of a fully-loaded Cyclone IV E cleanly through a copper thermal pour.

🔧

Handheld Test and Measurement Instrument

The EP4CE6E22A7N's low static power (60 nm low-k process) and small 144-pin EQFP package are ideal for handheld portable test instruments such as oscilloscope front-ends, logic analyzers, and protocol sniffers. The 2 PLLs generate the precise multi-rate clocks required for time-interleaved ADC sampling, while the 91 user I/Os interface to LCD displays, keypads, touch controllers, and USB transceivers. The automotive A7 temperature grade lets the same instrument platform be qualified for both benchtop laboratory use and field service environments. Quartus Prime Lite (free) supports the EP4CE6E22A7N for low-NRE firmware development.

🚗

Automotive Infotainment / Body Electronics Module

The EP4CE6E22A7N's automotive A7 temperature grade (-40C to +125C junction) and AEC-Q-style qualification makes it directly deployable in automotive infotainment head units, instrument clusters, body control modules, and CAN/LIN gateway nodes. The 15 hardware multipliers accelerate audio decoding (MP3, AAC, SBC) and graphic overlay rendering, while the 4 I/O banks interface to LVDS display panels, CAN transceivers, MOST network PHYs, and audio codecs. The exposed thermal pad on the EQFP-144 package handles under-hood thermal cycling without active cooling, and the Cyclone IV E family's 10-year longevity commitment supports long-life automotive production programs.

What is the logic element count of the EP4CE6E22A7N?
The EP4CE6E22A7N contains 6,272 logic elements (LEs) according to the Intel Cyclone IV E device handbook. It also integrates 30 M9K memory blocks (276,480 RAM bits total), 15 embedded 18x18 hardware multipliers, 2 general-purpose PLLs, and 10 global clock networks. The 'E6' in the part number denotes the 6K-LE density tier within the Cyclone IV E family.
What package does the EP4CE6E22A7N ship in and what is the pin count?
The EP4CE6E22A7N ships in a 144-pin Plastic Enhanced Quad Flat Pack (EQFP, JEDEC designation E22) with an exposed thermal pad for improved thermal dissipation. The device exposes 91 user I/O pins distributed across 4 I/O banks. The exposed pad must be soldered to the PCB thermal pad to meet the datasheet thermal resistance specification.
Where can I buy the EP4CE6E22A7N and what is the typical price?
The EP4CE6E22A7N is in stock at authorized distributors including DigiKey and Mouser as of 2026-09-10. The qty-1 unit price is approximately 32.50 USD, dropping to roughly 17.40 USD at 1,000-piece quantities. Lead time for production quantities is generally 6-10 weeks through authorized channels. Independent distributors may quote shorter lead times but require counterfeit-vigilance inspection.
What is the lead time for the EP4CE6E22A7N?
Lead time for the EP4CE6E22A7N through authorized Intel distributors is typically 6-10 weeks for production-volume orders as of 2026-09-10. The part is currently active in Intel's product lifecycle with no EOL announcement. For urgent prototype quantities, distributors such as DigiKey often have tray stock immediately shippable. Customers are advised to maintain at least a 12-week safety stock for volume production.
Is the EP4CE6E22A7N in stock at major distributors?
Yes, the EP4CE6E22A7N is currently in stock at major authorized distributors as of 2026-09-10. DigiKey lists the part with immediate shipping availability for tray quantities, and Mouser carries inventory for engineering prototypes. Industrial customers can also source from independent distributors such as Ampheo, though authentication inspection is recommended for non-tray packaging.
What is the difference between EP4CE6E22A7N and EP4CE10E22C8N?
The EP4CE6E22A7N provides 6,272 logic elements with an automotive A7 temperature grade (-40C to +125C junction), while the EP4CE10E22C8N provides 10,320 logic elements with a commercial C8 speed/temperature grade (0C to +85C junction, 8 ns internal timing). Both share the 144-pin EQFP E22 package, so the EP4CE10E22C8N can serve as a logic-density upgrade for non-automotive designs on the same PCB footprint.
Is the EP4CE10E22C8N a drop-in replacement for the EP4CE6E22A7N?
The EP4CE10E22C8N is a partial drop-in replacement for the EP4CE6E22A7N: both share the 144-pin EQFP E22 package, the same 4-bank I/O layout, and the same 91 user I/O pinout. However, the EP4CE10E22C8N uses a commercial C8 speed/temperature grade (0C to +85C) whereas the EP4CE6E22A7N uses the automotive A7 grade (-40C to +125C junction), so it cannot be used in automotive or extended-industrial temperature environments without a redesign.
When should I choose the EP4CE6E22A7N over the EP4CE10E22C8N?
Choose the EP4CE6E22A7N when the design requires the automotive A7 temperature grade (-40C to +125C junction) or when the cost-sensitive volume production only needs the 6K-LE density. Choose the EP4CE10E22C8N when you need the additional 4K logic elements and the design operates within commercial 0C to +85C. Both share the same 144-pin EQFP E22 footprint, so PCB layout migration is trivial.
What is the best drop-in replacement for the EP4CE6E22A7N?
The closest drop-in replacements for the EP4CE6E22A7N in the same 144-pin EQFP E22 package are the EP4CE6E22C8N (commercial temperature grade C8), the EP4CE6E22I7N (industrial I7 -40C to +100C), and the EP4CE6F17C8N (lower-cost F17 256-ball FineLine BGA package, footprint-changing). For a true pin-compatible upgrade with more logic elements, the EP4CE10E22C8N (10K LEs, commercial grade) uses the same EQFP-144 footprint.
Where can I download the EP4CE6E22A7N datasheet PDF?
The official EP4CE6E22A7N datasheet and the Cyclone IV E device handbook are available as free PDF downloads from the Intel Programmable Solutions Group website (intel.com/content/www/us/en/docs/programmable/683597/current/cyclone-iv-e-device-overview.html). The handbook includes the device pinout, DC and switching characteristics, configuration user guide, and recommended operating conditions across the entire Cyclone IV E family.
Where can I find the EP4CE6E22A7N pinout for the EQFP-144 package?
The EP4CE6E22A7N 144-pin EQFP pinout is documented in Chapter 9 (Pin-Out Information) of the Intel Cyclone IV E Device Handbook. The pinout table lists each of the 144 pins by pin number, name, and bank assignment. Quartus Prime software (free Lite edition) also generates a project-specific pinout report and pin planner view for the EP4CE6E22A7N when you select the E22 package in the device settings.
What are the key specifications of the EP4CE6E22A7N that engineers should know?
Key EP4CE6E22A7N specifications: 6,272 logic elements, 276,480 bits of embedded M9K RAM, 15 embedded 18x18 multipliers, 91 user I/Os across 4 banks, 2 PLLs, 10 global clock networks, 60 nm low-power process, 1.2 V core supply, automotive A7 temperature grade (-40C to +125C junction), 144-pin EQFP E22 package with exposed thermal pad, and JTAG/AS/PS/FPP configuration. I/O standards supported include LVCMOS, LVTTL, SSTL, HSTL, PCI, and LVDS (input on top/bottom banks only).
What is the difference between EP4CE6E22A7N and EP4CE6F17C8N?
The EP4CE6E22A7N ships in the 144-pin EQFP E22 surface-mount package with automotive A7 temperature grade, while the EP4CE6F17C8N ships in the 256-ball FineLine BGA F17 package with commercial C8 grade. Both share the same Cyclone IV E 6K-LE silicon die, so logic capacity, M9K memory, and multiplier resources are identical. However, the F17 BGA is a footprint-changing package, so the EP4CE6F17C8N is NOT a drop-in replacement for the E22 EQFP.
What is the best Lattice or AMD/Xilinx equivalent for EP4CE6E22A7N?
The closest AMD/Xilinx Spartan-6 equivalent to the EP4CE6E22A7N in similar logic-density and I/O-count class is the XC6SLX9-2TQG144 (Spartan-6 LX9, 144-pin TQG144 package, 9,152 LCs, 102 user I/Os). From Lattice Semiconductor, the closest is the LFE2-6E-6TN144C (ECP2-6, 144-pin TQFP, 6,000 LUTs, 90 user I/Os). Both are footprint-compatible at the 144-pin TQFP level but use different toolchains and configuration bitstreams, so firmware migration is required.

Dados de referência de engenharia para EP4CE6E22A7N — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EP4CE6E22A7N when your design requires the automotive A7 temperature grade (-40C to +125C junction) and approximately 6K logic elements with 15 hardware multipliers. It is the optimal fit for under-hood automotive modules, body electronics gateways, and industrial products deployed in uncontrolled environments. Choose the EP4CE6E22C8N for cost-optimized commercial products, or the EP4CE6E22I7N for industrial products with extended but not automotive temperature. Migrate to the EP4CE10E22C8N when the design exceeds 6K LEs but you want to keep the same 144-pin EQFP E22 PCB layout, or to the EP4CE15E22C8N when you need 15K LEs and 56 hardware multipliers. For multi-vendor sourcing, the XC6SLX9-2TQG144 from AMD/Xilinx in the same 144-pin TQFP pin count offers a footprint-compatible alternative at the cost of a complete toolchain migration.

Comparação com alternativas

Parâmetro Este produto EP4CE6E22C8N EP4CE6E22I7N EP4CE10E22C8N EP4CE10E22I8N EP4CE15E22C8N XC6SLX9-2TQG144
Package 144-pin EQFP (E22) 144-pin EQFP (E22) - same 144-pin EQFP (E22) - same 144-pin EQFP (E22) - same 144-pin EQFP (E22) - same 144-pin EQFP (E22) - same 144-pin TQG144 - same
Brand Intel Intel Intel Intel Intel Intel AMD
Logic Elements 6,272 6,272 (same die) 6,272 (same die) 10,320 (+65%) 10,320 (+65%) 15,408 (+146%) 9,152 logic cells
Temperature Grade A7 (-40C to +125C junction) C8 (0C to +85C) I7 (-40C to +100C) C8 (0C to +85C) I8 (-40C to +100C) C8 (0C to +85C) C (0C to +85C)
Speed Grade A7 (automotive timing) C8 (commercial 8 ns) I7 (industrial 7 ns) C8 (commercial 8 ns) I8 (industrial 8 ns) C8 (commercial 8 ns) -2 (Spartan-6 medium speed)
Embedded Multipliers (18x18) 15 15 (same die) 15 (same die) 23 (+53%) 23 (+53%) 56 (+273%) 16 DSP48A1 slices
Embedded Memory 276,480 bits (270 Kbits) 276,480 bits (same die) 276,480 bits (same die) 423,936 bits (+53%) 423,936 bits (+53%) 516,096 bits (+87%) 589,824 bits (Block RAM)
User I/Os 91 91 91 91 91 81 (-11%) 102 (+12%)
Toolchain Quartus Prime (free Lite) Quartus Prime (free Lite) Quartus Prime (free Lite) Quartus Prime (free Lite) Quartus Prime (free Lite) Quartus Prime (free Lite) ISE / Vivado (free WebPack)

Principais diferenciais

  • Automotive A7 temperature grade in low-cost Cyclone IV E family (vs EP4CE6E22C8N)
  • Logic-density upgrade path on identical PCB footprint (vs EP4CE10E22C8N)
  • Lowest-cost cross-architecture alternative (vs XC6SLX9-2TQG144)

Notas de projeto

Estimated: At typical 1.2 V core switching activity with 50% utilization, the EP4CE6E22A7N dissipates approximately 1.0 to 1.5 W of static and dynamic power. The exposed pad on the underside of the EQFP-144 package is the primary thermal path - it must be soldered to a PCB thermal pad connected to an inner ground plane with at least 9 thermal vias (0.3 mm diameter) for the datasheet thermal resistance of approximately 18 C/W to be met. Without the exposed-pad soldering, junction temperature can exceed 125C and trigger thermal shutdown during normal automotive operation.

Decouple the EP4CE6E22A7N with a 100 nF X7R 0402 ceramic capacitor within 3 mm of each VCCINT and VCCIO pin, plus a single 10 uF bulk tantalum or ceramic capacitor near the device. The four VCCIO banks can run at different voltages (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V) and must each have their own decoupling. Keep the JTAG chain traces (TCK, TMS, TDI, TDO) under 150 mm total length and avoid running them parallel to high-speed LVDS signals.

LVDS input is supported only on the top (banks 1 and 3) and bottom (banks 2 and 4) I/O banks; LVDS output on the left/right banks requires an external resistor network for emulated LVDS. The MSEL[2:0] pins must match the desired configuration mode (AS x1, AS x4, PS, FPP) before power-up - changing MSEL after configuration begins causes configuration failure. Active Serial mode requires the MSEL pins to be set per the datasheet AS-x1 table, not the PS table.

Route all 91 user I/O signals on inner layers with 50 ohm single-ended or 100 ohm differential impedance, using the Intel-provided IBIS models for signal-integrity simulation. The two PLLs (top-left and bottom-right of the die) each require a quiet analog supply - place a ferrite bead between the PLL_AVCC pin and the main VCCINT plane, with 1 uF and 100 nF decoupling on the PLL_AVCC side. Do not route high-speed signals under the exposed pad or over the PLL region.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Sem chumbo
Yes
Sem halogênios
Yes
Minerais de conflito
Compliant

RoHS and REACH compliant per Intel product page. The A7 suffix in EP4CE6E22A7N denotes the automotive temperature grade (-40C to +125C junction); the A7 speed/temperature code is part of the Cyclone IV E ordering information. AEC-Q100 qualification documentation is available under NDA from Intel Field Application Engineering.

Dados verificados em: 2026-09-10 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

EP4CE6E22A7N EP4CE6E22A7N datasheet PDF Intel Cyclone IV E FPGA 6K logic elements EP4CE6E22A7N pinout EQFP-144 Cyclone IV E automotive grade FPGA EP4CE6E22A7N buy price stock EP4CE6E22A7N vs EP4CE10E22C8N EP4CE6E22A7N drop-in replacement 144-pin EQFP Cyclone IV E FPGA what is the logic element count of EP4CE6E22A7N Cyclone IV E automotive body electronics module Quartus Prime free Cyclone IV E

Componentes & termos relacionados

Intel Altera EP4CE6E22A7N Cyclone IV E FPGA Field-Programmable Gate Array EQFP-144 Plastic Enhanced Quad Flat Pack Logic Element M9K memory block 18x18 hardware multiplier PLL LVDS JTAG Active Serial configuration Quartus Prime AEC-Q100 RoHS REACH automotive temperature grade industrial temperature grade commercial temperature grade IEEE 1149.1 60 nm low-power process
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