M1AFS1500-1FGG256 vs M1AFS1500-1FG256I Comparação
Comparação detalhada lado a lado de M1AFS1500-1FGG256 por Microchip Technology e M1AFS1500-1FG256I por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip
M1AFS1500-1FGG256 ✓ AtivoMicrochip Technology
M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip
M1AFS1500-1FG256I ✓ AtivoComparação de especificações
| Parâmetro | M1AFS1500-1FGG256 | M1AFS1500-1FG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $172,23 | $205,00 |
| Series | Fusion (M1AFS1500) | — |
| System Gates | 1,500,000 | — |
| Logic Cells | 38,400 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Frequência máxima de clock | 350 MHz | — |
| Number of I/Os | 119 | — |
| Tensão de alimentação | 1.5 V | — |
| Technology | CMOS, 130 nm | — |
| Configuration Memory | Flash-based (non-volatile) | — |
| Encapsulamento / Caixa | 256-LBGA (FBGA, S-PBGA-B256) | — |
| Ball Pitch | 1.00 mm | — |
| Estilo de montagem | SMD/SMT | — |
| Minimum Operating Temperature | 0 C | — |
| Maximum Operating Temperature | +70 C | — |
| Packaging | Tray | — |
| Speed Grade | -1 | -1 (standard) |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Non-Compliant (contains lead, per distributor data) |
| Integrated Analog Blocks | Yes (configurable analog conditioning and conversion) | — |
| Integrated Flash Memory Blocks | Yes | — |
| Clock Management | Integrated clock generation and management circuitry | Integrated clock generation and management circuitry |
| Logic Capacity | — | 1,500,000 system gates |
| User I/O | — | 119 |
| Processor Core | — | ARM Cortex-M1 (M1 variant) |
| Memory Resource | — | 276480 bits |
| Configuration Technology | — | Flash-based, nonvolatile |
| Process Technology | — | 130 nm CMOS, 7-layer metal |
| Core Supply Voltage | — | 1.5 V |
| System Performance | — | up to 350 MHz |
| Encapsulamento | — | 256-LBGA (FG256) |
| Tipo de montagem | — | Surface Mount |
| Temperatura de operação | — | -40C to +85C (industrial grade, suffix I) |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Analog Functionality | — | Fusion configurable analog blocks |
| Lead-Free Status | — | Contains Lead |