M1AFS1500-1FGG256 vs M1AFS1500-1FG256I Comparaison
Comparaison détaillée côte à côte de M1AFS1500-1FGG256 par Microchip Technology et M1AFS1500-1FG256I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip
M1AFS1500-1FGG256 ✓ ActifMicrochip Technology
M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip
M1AFS1500-1FG256I ✓ ActifComparaison des spécifications
| Paramètre | M1AFS1500-1FGG256 | M1AFS1500-1FG256I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $172,23 | $205,00 |
| Series | Fusion (M1AFS1500) | — |
| System Gates | 1,500,000 | — |
| Logic Cells | 38,400 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Fréquence d'horloge maximale | 350 MHz | — |
| Number of I/Os | 119 | — |
| Tension d'alimentation | 1.5 V | — |
| Technology | CMOS, 130 nm | — |
| Configuration Memory | Flash-based (non-volatile) | — |
| Boîtier / Format | 256-LBGA (FBGA, S-PBGA-B256) | — |
| Ball Pitch | 1.00 mm | — |
| Style de montage | SMD/SMT | — |
| Minimum Operating Temperature | 0 C | — |
| Maximum Operating Temperature | +70 C | — |
| Packaging | Tray | — |
| Speed Grade | -1 | -1 (standard) |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | Non-Compliant (contains lead, per distributor data) |
| Integrated Analog Blocks | Yes (configurable analog conditioning and conversion) | — |
| Integrated Flash Memory Blocks | Yes | — |
| Clock Management | Integrated clock generation and management circuitry | Integrated clock generation and management circuitry |
| Logic Capacity | — | 1,500,000 system gates |
| User I/O | — | 119 |
| Processor Core | — | ARM Cortex-M1 (M1 variant) |
| Memory Resource | — | 276480 bits |
| Configuration Technology | — | Flash-based, nonvolatile |
| Process Technology | — | 130 nm CMOS, 7-layer metal |
| Core Supply Voltage | — | 1.5 V |
| System Performance | — | up to 350 MHz |
| Boîtier | — | 256-LBGA (FG256) |
| Type de montage | — | Surface Mount |
| Température de fonctionnement | — | -40C to +85C (industrial grade, suffix I) |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Analog Functionality | — | Fusion configurable analog blocks |
| Lead-Free Status | — | Contains Lead |