M1AFS1500-1FGG256 vs M1AFS1500-1FG256I Vergleich
Detaillierter Direktvergleich von M1AFS1500-1FGG256 von Microchip Technology und M1AFS1500-1FG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip
M1AFS1500-1FGG256 ✓ AktivMicrochip Technology
M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip
M1AFS1500-1FG256I ✓ AktivSpezifikationsvergleich
| Parameter | M1AFS1500-1FGG256 | M1AFS1500-1FG256I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $172,23 | $205,00 |
| Series | Fusion (M1AFS1500) | — |
| System Gates | 1,500,000 | — |
| Logic Cells | 38,400 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Maximale Taktfrequenz | 350 MHz | — |
| Number of I/Os | 119 | — |
| Versorgungsspannung | 1.5 V | — |
| Technology | CMOS, 130 nm | — |
| Configuration Memory | Flash-based (non-volatile) | — |
| Gehäuse / Bauform | 256-LBGA (FBGA, S-PBGA-B256) | — |
| Ball Pitch | 1.00 mm | — |
| Montagestil | SMD/SMT | — |
| Minimum Operating Temperature | 0 C | — |
| Maximum Operating Temperature | +70 C | — |
| Packaging | Tray | — |
| Speed Grade | -1 | -1 (standard) |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | Non-Compliant (contains lead, per distributor data) |
| Integrated Analog Blocks | Yes (configurable analog conditioning and conversion) | — |
| Integrated Flash Memory Blocks | Yes | — |
| Clock Management | Integrated clock generation and management circuitry | Integrated clock generation and management circuitry |
| Logic Capacity | — | 1,500,000 system gates |
| User I/O | — | 119 |
| Processor Core | — | ARM Cortex-M1 (M1 variant) |
| Memory Resource | — | 276480 bits |
| Configuration Technology | — | Flash-based, nonvolatile |
| Process Technology | — | 130 nm CMOS, 7-layer metal |
| Core Supply Voltage | — | 1.5 V |
| System Performance | — | up to 350 MHz |
| Gehäuse | — | 256-LBGA (FG256) |
| Montageart | — | Surface Mount |
| Betriebstemperatur | — | -40C to +85C (industrial grade, suffix I) |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Analog Functionality | — | Fusion configurable analog blocks |
| Lead-Free Status | — | Contains Lead |