M7AFS600-FGG256I vs AFS600-FGG256 Comparação
Comparação detalhada lado a lado de M7AFS600-FGG256I por Microchip Technology e AFS600-FGG256 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ Ativo
Comparação de especificações
| Parâmetro | M7AFS600-FGG256I | AFS600-FGG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Unknown |
| Family | Fusion Mixed-Signal FPGA | — |
| System Gates | 600K | 600,000 gates |
| User I/O | 119 | — |
| Encapsulamento | 256-LBGA (FBGA), 1 mm ball pitch | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm |
| Maximum System Frequency | 1098.9 MHz (per distributor parametric listing) | — |
| Embedded Processor | ARM CoreMP7 | — |
| Fabric Type | Flash-based, non-volatile, instant-on | — |
| Analog Subsystem | Integrated configurable analog (per Microchip Fusion family page) | — |
| On-chip Flash Memory | Yes (large flash memory blocks, per Microchip Fusion family page) | — |
| Clock Management | Integrated clock generation and management circuitry (PLLs) | — |
| Temperature Grade | Industrial (I suffix) | — |
| Faixa de temperatura de operação | -40C to +85C (industrial grade standard range) | — |
| Tipo de montagem | Surface Mount | Surface mount |
| Packaging | Tray | — |
| Nível MSL | [DATA_NEEDED: MSL Level] | — |
| Thermal Resistance (theta_JA) | [DATA_NEEDED: Thermal Resistance] | — |
| Device Type | — | Fusion mixed-signal FPGA |
| Configurable Logic Cells | — | 13,824 cells |
| I/O Count | — | 119 I/Os |
| Tensão de alimentação | — | 1.5 V |
| Logic Family | — | CMOS |
| Metal Layers | — | 7 layers |
| Configuration Memory | — | Flash-based nonvolatile memory |
| Configuration Feature | — | Live at Power-Up (LAPU) |
| Frequência máxima de clock | — | 1098.9 MHz |
| Temperatura de operação | — | 0°C to 70°C |
| Package Type | — | 256-pin FBGA |
| Package Pitch | — | 1.0 mm |
| Packing Media | — | Tray |
| RoHS | — | Compliant |