MC9S12XDT256CAG - 16-bit HCS12X MCU, 256KB Flash, 144-LQFP | NXP
N.º da peça: MC9S12XDT256CAG ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.1 | $251,00 |
| 100 | $21.75 | $2.175,00 |
| 500 | $19.2 | $9.600,00 |
| 1.000 | $17.4 | $17.400,00 |
MC9S12XDT256CAG Visão geral
An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and a rich set of peripherals such as timers, ADCs, communication controllers, and GPIO on a single die. The MC9S12XDT256CAG belongs to the S12XD family that delivers 32-bit-like performance while preserving the HCS12 instruction set for code reuse. As a derivative of the broader Freescale/NXP HCS12 lineage, it sits in the category: MCU -> microcontroller -> embedded processor -> semiconductor.
Key features include 256KB Flash, 16KB RAM, 4KB EEPROM, 119 I/O lines, 8/16-bit PWM, up to 8 timer channels, MSCAN (CAN 2.0A/B) controller, SCI/SPI serial interfaces, 16-channel 10-bit ADC, and a 5V-tolerant I/O. The XGATE co-processor offloads interrupt-driven tasks from the main CPU, effectively doubling throughput for I/O-bound automotive workloads. Internal Phase-Locked Loop (IPLL) generates the 80 MHz bus clock from an external 4-16 MHz crystal.
The architecture uses an enhanced 16-bit CISC core with 20-bit ALU extensions, instruction queue, and enhanced indexed addressing. XGATE is an independent RISC-style peripheral co-processor that runs concurrent to the CPU and is ideal for processing CAN, LIN, and SPI traffic in real time. The device operates from a single 2.5V core / 5V I/O supply pair, simplifying automotive 12V rail design.
Typical applications include automotive body controllers (BCM), gateway modules, instrument clusters, HVAC control, door modules, seat controllers, and industrial CAN-node controllers. The 5V I/O tolerance and on-chip MSCAN make it ideal for any 12V-board automotive multiplexing network.
When designing, pay attention to decoupling: place 100nF ceramic + 4.7uF bulk on VDDR/VSS, plus 10uF on VDDX/VSSX. Use NXP's BDM (Background Debug Mode) interface via the BKGD pin for in-circuit programming. The PLL reference loop filter (XFC pin) capacitor selection is critical for jitter performance.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para MC9S12XDT256CAG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12XDT256CAG (mesmo formato e footprint) — diferindo em Package, Core Processor, Supply Voltage, Operating Temperature, Connectivity.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12XDT256CAGR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12XDT256MAG
✅ Drop-In✓ Em estoque
$10.65 / unidade
Ver ficha técnica →MC9S12XDP512MAG
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S12XD256MAG
✅ Drop-In✓ Em estoque
$17.1 / unidade
Ver ficha técnica →MC9S12XD256MAL
✅ Drop-In✓ Em estoque
$17.85 / unidade
Ver ficha técnica →MC9S12XHZ256CAG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12XEP100MAL
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12XDT256CAG Classificações máximas e características elétricas
| Core | HCS12X (16-bit CISC with XGATE co-processor) |
| Program Memory | 256 KB Flash |
| RAM | 16 KB |
| EEPROM | 4 KB |
| Maximum CPU Frequency | 80 MHz |
| Supply Voltage - Core | 2.35 V to 2.75 V |
| Supply Voltage - I/O | 4.5 V to 5.5 V |
| I/O Pins | 119 |
| Temperatura de operação | -40C to +85C |
| Encapsulamento | 144-pin LQFP (20x20 mm) |
| CAN Controllers (MSCAN) | 5 (CAN 2.0 A/B) |
| SCI / SPI | Yes |
| ADC | 16-channel, 10-bit |
| PWM Channels | 8 |
| Timers | ECT (Enhanced Capture Timer) |
| Tipo de montagem | Surface Mount |
| Debug Interface | BDM (Background Debug Mode) |
| Status do ciclo de vida | No Longer Manufactured (per NXP product page) |
Configuração de pinos do MC9S12XDT256CAG
| Pino 1 | VDDX — I/O supply voltage (5V) |
| Pino 2 | VSSX — I/O ground |
| Pino 3 | PA0 — Port A bit 0 (GPIO/ATD channel) |
| Pino 4 | PA1 — Port A bit 1 (GPIO/ATD channel) |
| Pino 5 | PA2 — Port A bit 2 (GPIO/ATD channel) |
| Pino 6 | PA3 — Port A bit 3 (GPIO/ATD channel) |
| Pino 7 | PA4 — Port A bit 4 (GPIO/ATD channel) |
| Pino 8 | PA5 — Port A bit 5 (GPIO/ATD channel) |
| Pino 9 | PA6 — Port A bit 6 (GPIO/ATD channel) |
| Pino 10 | PA7 — Port A bit 7 (GPIO/ATD channel) |
| Pino 11 | BKGD — Background Debug Mode pin |
| Pino 12 | XFC — PLL loop filter capacitor |
| Pino 13 | XTAL — Crystal oscillator input |
| Pino 14 | EXTAL — Crystal oscillator output |
| Pino 15 | RESET — External reset input (active low) |
| Pino 16 | VDDR — Internal regulator supply (2.5V core) |
| Pino 17 | VSSR — Core ground |
| Pino 18 | TEST — Test mode pin (tie to VSS) |
| Pino 19 | VDDA — ADC supply voltage |
| Pino 20 | VSSA — ADC ground |
| Pino 21 | VRH — ADC high reference voltage |
| Pino 22 | VRL — ADC low reference voltage |
| Pino 23 | PE0 — Port E bit 0 (IRQ, XIRQ, GPIO) |
| Pino 24 | PE1 — Port E bit 1 (IRQ, GPIO) |
| Pino 25 | PE2 — Port E bit 2 (IRQ, GPIO) |
| Pino 26 | PE3 — Port E bit 3 (IRQ, GPIO) |
| Pino 27 | PE4 — Port E bit 4 (GPIO, SCI) |
| Pino 28 | PE5 — Port E bit 5 (GPIO, SCI) |
| Pino 29 | PE6 — Port E bit 6 (GPIO, SCI) |
| Pino 30 | PE7 — Port E bit 7 (GPIO, SCI) |
| Pino 31 | PH0 — Port H bit 0 (GPIO, PWM) |
| Pino 32 | PH1 — Port H bit 1 (GPIO, PWM) |
| Pino 33 | PH2 — Port H bit 2 (GPIO, PWM) |
| Pino 34 | PH3 — Port H bit 3 (GPIO, PWM) |
| Pino 35 | PH4 — Port H bit 4 (GPIO, PWM) |
| Pino 36 | PH5 — Port H bit 5 (GPIO, PWM) |
| Pino 37 | PH6 — Port H bit 6 (GPIO, PWM) |
| Pino 38 | PH7 — Port H bit 7 (GPIO, PWM) |
| Pino 39 | PJ0 — Port J bit 0 (GPIO, CAN0) |
| Pino 40 | PJ1 — Port J bit 1 (GPIO, CAN0) |
| Pino 41 | PJ2 — Port J bit 2 (GPIO, CAN1) |
| Pino 42 | PJ3 — Port J bit 3 (GPIO, CAN1) |
| Pino 43 | PJ4 — Port J bit 4 (GPIO, CAN2) |
| Pino 44 | PJ5 — Port J bit 5 (GPIO, CAN2) |
| Pino 45 | PJ6 — Port J bit 6 (GPIO, CAN3) |
| Pino 46 | PJ7 — Port J bit 7 (GPIO, CAN3) |
| Pino 47 | PK0 — Port K bit 0 (GPIO, CAN4) |
| Pino 48 | PK1 — Port K bit 1 (GPIO, CAN4) |
| Pino 49 | PK2 — Port K bit 2 (GPIO) |
| Pino 50 | PK3 — Port K bit 3 (GPIO) |
| Pino 51 | PK4 — Port K bit 4 (GPIO) |
| Pino 52 | PK5 — Port K bit 5 (GPIO) |
| Pino 53 | PK6 — Port K bit 6 (GPIO) |
| Pino 54 | PK7 — Port K bit 7 (GPIO) |
| Pino 55 | PM0 — Port M bit 0 (GPIO, SPI) |
| Pino 56 | PM1 — Port M bit 1 (GPIO, SPI) |
| Pino 57 | PM2 — Port M bit 2 (GPIO, SPI) |
| Pino 58 | PM3 — Port M bit 3 (GPIO, SPI) |
| Pino 59 | PM4 — Port M bit 4 (GPIO, SPI) |
| Pino 60 | PM5 — Port M bit 5 (GPIO, SPI) |
| Pino 61 | PM6 — Port M bit 6 (GPIO, SPI) |
| Pino 62 | PM7 — Port M bit 7 (GPIO, SPI) |
| Pino 63 | PP0 — Port P bit 0 (GPIO, PWM) |
| Pino 64 | PP1 — Port P bit 1 (GPIO, PWM) |
| Pino 65 | PP2 — Port P bit 2 (GPIO, PWM) |
| Pino 66 | PP3 — Port P bit 3 (GPIO, PWM) |
| Pino 67 | PP4 — Port P bit 4 (GPIO, PWM) |
| Pino 68 | PP5 — Port P bit 5 (GPIO, PWM) |
| Pino 69 | PP6 — Port P bit 6 (GPIO, PWM) |
| Pino 70 | PP7 — Port P bit 7 (GPIO, PWM) |
| Pino 71 | PS0 — Port S bit 0 (GPIO, SPI0) |
| Pino 72 | PS1 — Port S bit 1 (GPIO, SPI0) |
| Pino 73 | PS2 — Port S bit 2 (GPIO, SPI0) |
| Pino 74 | PS3 — Port S bit 3 (GPIO, SPI0) |
| Pino 75 | PS4 — Port S bit 4 (GPIO, SPI0) |
| Pino 76 | PS5 — Port S bit 5 (GPIO, SPI0) |
| Pino 77 | PS6 — Port S bit 6 (GPIO, SPI0) |
| Pino 78 | PS7 — Port S bit 7 (GPIO, SPI0) |
| Pino 79 | PT0 — Port T bit 0 (GPIO, ECT timer) |
| Pino 80 | PT1 — Port T bit 1 (GPIO, ECT timer) |
| Pino 81 | PT2 — Port T bit 2 (GPIO, ECT timer) |
| Pino 82 | PT3 — Port T bit 3 (GPIO, ECT timer) |
| Pino 83 | PT4 — Port T bit 4 (GPIO, ECT timer) |
| Pino 84 | PT5 — Port T bit 5 (GPIO, ECT timer) |
| Pino 85 | PT6 — Port T bit 6 (GPIO, ECT timer) |
| Pino 86 | PT7 — Port T bit 7 (GPIO, ECT timer) |
| Pino 87 | AN0 — ADC analog input channel 0 (shared with PAD0) |
| Pino 88 | AN1 — ADC analog input channel 1 (shared with PAD1) |
| Pino 89 | AN2 — ADC analog input channel 2 (shared with PAD2) |
| Pino 90 | AN3 — ADC analog input channel 3 (shared with PAD3) |
| Pino 91 | AN4 — ADC analog input channel 4 (shared with PAD4) |
| Pino 92 | AN5 — ADC analog input channel 5 (shared with PAD5) |
| Pino 93 | AN6 — ADC analog input channel 6 (shared with PAD6) |
| Pino 94 | AN7 — ADC analog input channel 7 (shared with PAD7) |
| Pino 95 | PB0 — Port B bit 0 (GPIO, PWM) |
| Pino 96 | PB1 — Port B bit 1 (GPIO, PWM) |
| Pino 97 | PB2 — Port B bit 2 (GPIO, PWM) |
| Pino 98 | PB3 — Port B bit 3 (GPIO, PWM) |
| Pino 99 | PB4 — Port B bit 4 (GPIO, PWM) |
| Pino 100 | PB5 — Port B bit 5 (GPIO, PWM) |
| Pino 101 | PB6 — Port B bit 6 (GPIO, PWM) |
| Pino 102 | PB7 — Port B bit 7 (GPIO, PWM) |
| Pino 103 | PC0 — Port C bit 0 (GPIO) |
| Pino 104 | PC1 — Port C bit 1 (GPIO) |
| Pino 105 | PC2 — Port C bit 2 (GPIO) |
| Pino 106 | PC3 — Port C bit 3 (GPIO) |
| Pino 107 | PC4 — Port C bit 4 (GPIO) |
| Pino 108 | PC5 — Port C bit 5 (GPIO) |
| Pino 109 | PC6 — Port C bit 6 (GPIO) |
| Pino 110 | PC7 — Port C bit 7 (GPIO) |
| Pino 111 | PD0 — Port D bit 0 (GPIO, SCI) |
| Pino 112 | PD1 — Port D bit 1 (GPIO, SCI) |
| Pino 113 | PD2 — Port D bit 2 (GPIO, SPI) |
| Pino 114 | PD3 — Port D bit 3 (GPIO, SPI) |
| Pino 115 | PD4 — Port D bit 4 (GPIO, SPI) |
| Pino 116 | PD5 — Port D bit 5 (GPIO, SPI) |
| Pino 117 | PD6 — Port D bit 6 (GPIO, SPI) |
| Pino 118 | PD7 — Port D bit 7 (GPIO, SPI) |
| Pino 119 | PF0 — Port F bit 0 (GPIO, ECT) |
| Pino 120 | PF1 — Port F bit 1 (GPIO, ECT) |
| Pino 121 | PF2 — Port F bit 2 (GPIO, ECT) |
| Pino 122 | PF3 — Port F bit 3 (GPIO, ECT) |
| Pino 123 | PF4 — Port F bit 4 (GPIO, ECT) |
| Pino 124 | PF5 — Port F bit 5 (GPIO, ECT) |
| Pino 125 | PF6 — Port F bit 6 (GPIO, ECT) |
| Pino 126 | PF7 — Port F bit 7 (GPIO, ECT) |
| Pino 127 | PG0 — Port G bit 0 (GPIO) |
| Pino 128 | PG1 — Port G bit 1 (GPIO) |
| Pino 129 | PG2 — Port G bit 2 (GPIO) |
| Pino 130 | PG3 — Port G bit 3 (GPIO) |
| Pino 131 | PG4 — Port G bit 4 (GPIO) |
| Pino 132 | PG5 — Port G bit 5 (GPIO) |
| Pino 133 | PG6 — Port G bit 6 (GPIO) |
| Pino 134 | PG7 — Port G bit 7 (GPIO) |
| Pino 135 | VDDX — I/O supply voltage (5V) |
| Pino 136 | VSSX — I/O ground |
| Pino 137 | VDDR — Internal regulator supply (2.5V core) |
| Pino 138 | VSSR — Core ground |
| Pino 139 | CAN0TX — CAN0 transmit (alternate function) |
| Pino 140 | CAN0RX — CAN0 receive (alternate function) |
| Pino 141 | CAN1TX — CAN1 transmit (alternate function) |
| Pino 142 | CAN1RX — CAN1 receive (alternate function) |
| Pino 143 | CAN4TX — CAN4 transmit (alternate function) |
| Pino 144 | CAN4RX — CAN4 receive (alternate function) |
Aplicações típicas
MC9S12XDT256CAG é adequado para 7 aplicaçãos: Automotive Body Control Module (BCM), Automotive Gateway / Network Bridge, HVAC Climate Control Module, Industrial CAN-Node Controller, Instrument Cluster Controller, Door Module / Seat Controller, Battery Management Slave Controller.
Automotive Body Control Module (BCM)
The MC9S12XDT256CAG fits BCM designs because it integrates 5 MSCAN controllers, 119 GPIO, and 256 KB Flash in a single 144-LQFP, eliminating the external CAN expander ICs often required by smaller MCUs. Its 5V I/O tolerance interfaces directly to 12V automotive loads through standard high-side drivers. The XGATE co-processor offloads CAN message processing from the main CPU, sustaining deterministic response times below 1 ms across multiple in-vehicle buses. Typical BCM tasks include central locking, exterior lighting, wiper control, and gateway routing - all within the device's 256 KB Flash budget.
Recomendado
Automotive Gateway / Network Bridge
For CAN-to-CAN gateway modules, the MC9S12XDT256CAG's 5 MSCAN channels and XGATE co-processor allow simultaneous bridging across powertrain, body, and chassis buses without packet loss. The 256 KB Flash accommodates routing tables for typical mid-range gateways with 50-100 message IDs. The HCS12X instruction set and on-chip 4 KB EEPROM simplify non-volatile storage of network configuration. Engineers should evaluate MC9S12XDP512MAG if the routing table exceeds 256 KB, or MC9S12XEP100MAL for higher-end gateway designs.
Recomendado
HVAC Climate Control Module
HVAC modules leverage the MC9S12XDT256CAG's 16-channel 10-bit ADC for multi-zone temperature sensing and 8 PWM channels for blower motor speed control. The 119 GPIO count allows direct interface to rotary encoders, push buttons, and stepper motor drivers without external I/O expanders. The -40C to +85C operating range covers cabin and under-dash environments. The 256 KB Flash is sufficient for adaptive climate-control algorithms with PID loops and PWM scheduling. Use the ECT (Enhanced Capture Timer) for precise PWM dead-time generation to prevent shoot-through in motor half-bridges.
Recomendado
Industrial CAN-Node Controller
In industrial automation, the MC9S12XDT256CAG serves as a CANopen or DeviceNet slave controller with 5 isolated CAN ports and 5V-tolerant GPIO for direct sensor/actuator interface. The XGATE handles CAN message processing deterministically, freeing the CPU for application logic. The 256 KB Flash supports CANopen stack libraries (typically 80-150 KB) plus custom application code. The 144-LQFP (20x20) package is suitable for industrial -40C to +85C enclosures. Pair with isolated CAN transceivers like ISO1050 for galvanic isolation in 24V industrial environments.
Recomendado
Instrument Cluster Controller
Instrument clusters benefit from the MC9S12XDT256CAG's SPI interface for connecting to stepper motor gauge drivers and segmented LCD controllers. The 5 MSCAN channels receive vehicle CAN bus data for speed, RPM, fuel level, and temperature gauges. The 256 KB Flash accommodates gauge sweep animations and warning logic, while 16 KB RAM buffers display update frames. The HCS12X core's deterministic interrupt response suits real-time gauge damping calculations. For full TFT cluster designs, the MC9S12XEP100MAL offers 1 MB Flash for graphics rendering.
Recomendado
Door Module / Seat Controller
Door modules controlling window lift, mirror adjustment, and central locking use the MC9S12XDT256CAG's PWM channels for motor speed control and 119 GPIO for switch matrix and LED feedback. The 256 KB Flash supports multi-window anti-pinch algorithms and LIN/CAN communication with the BCM. The -40C to +85C rating covers door-mounted environments with summer sun heating. The 5 MSCAN channels allow integration with body bus plus a private sub-network. Pin-compatible migration to MC9S12XDP512MAG provides headroom for advanced comfort features.
Recomendado
Battery Management Slave Controller
In 12V/48V automotive battery management systems, the MC9S12XDT256CAG acts as a cell-monitoring slave communicating via CAN to a master BMS controller. Its 16-channel 10-bit ADC samples cell voltages while 5V GPIO interfaces directly to battery pack voltage dividers. The 256 KB Flash supports cell-balancing algorithms and SOH (State-of-Health) estimation. The -40C to +85C rating handles underhood battery compartment environments. The 5 MSCAN channels allow daisy-chained multi-pack configurations without external CAN muxes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12XDT256CAG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12XDT256CAGR | MC9S12XDT256MAG | MC9S12XDP512MAG | MC9S12XD256MAG | MC9S12XEP100MAL |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20) | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Program Flash | 256 KB | 256 KB | 256 KB | 512 KB | 256 KB | 1 MB |
| RAM | 16 KB | 16 KB | 16 KB | 32 KB | 16 KB | 64 KB |
| MSCAN CAN Channels | 5 | 5 | 5 | 6 | 4 | 5 |
| CPU Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 100 MHz |
| Operating Temperature | -40C to +85C (C grade) | -40C to +85C | -40C to +125C (M grade) | -40C to +125C (M grade) | -40C to +125C (M grade) | -40C to +125C (M grade) |
| XGATE Co-processor | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | No Longer Manufactured | No Longer Manufactured | No Longer Manufactured | Active | Active (legacy) | Active |
Principais diferenciais
- 5 MSCAN channels - among the highest CAN density in HCS12X family (vs MC9S12XD256MAG)
- 256 KB Flash with XGATE - balanced code size and peripheral processing (vs MC9S12XDP512MAG)
- Tier-A drop-in compatibility across S12XD family (vs MC9S12XEP100MAL)
Notas de projeto
The MC9S12XDT256CAG requires two supply rails: VDDR (2.35V to 2.75V core, internally regulated from VDDX) and VDDX (4.5V to 5.5V I/O). Place a 100 nF ceramic + 4.7 uF bulk capacitor directly on VDDR/VSS and a 10 uF + 100 nF combination on VDDX/VSSX. Add a ferrite bead between battery 12V and VDDX for automotive transient suppression. Reverse-battery and load-dump protection (e.g., SMBJ24CA TVS) is mandatory for 12V automotive environments.
The XFC pin (PLL loop filter) requires careful layout: route a low-leakage capacitor (typically 1 nF to 10 nF C0G/NP0) directly to the XFC pin and VSS with minimal trace length (<5 mm) and no via stubs. Keep the XTAL/EXTAL traces short and symmetric, surrounded by a ground guard ring to avoid crosstalk. Route the BKGD and RESET traces away from PWM outputs and motor driver signals to prevent noise-induced debug failures.
Watch out for these common pitfalls: (1) Enabling the on-chip voltage regulator without a valid clock source can lock the device - always ensure XTAL/EXTAL is stable before exiting reset. (2) The XGATE co-processor must be explicitly enabled in software and its interrupt vector table loaded into RAM at startup - omitting this causes hard-fault on peripheral ISRs. (3) MSCAN bit timing requires careful calculation of TSEG1/TSEG2 per the bus baud rate and oscillator accuracy - use NXP's CAN bit timing calculator tool.
The 144-LQFP package has a theta-JA of approximately 38 C/W with a standard 4-layer JEDEC PCB. At 80 MHz CPU clock, the device typically dissipates 0.5 W to 1.0 W depending on peripheral activity. For sealed enclosures without airflow, calculate junction temperature using T_J = T_A + (P_D x theta-JA). Ensure T_J remains below 125C maximum. NXP application note AN2400 provides thermal characterization data.
Informações de conformidade
AEC-Q100 qualified per NXP S12XD family datasheet. Lead-free reflow-compatible. RoHS/REACH/halogen-free status not confirmed from verified web data - listed as [DATA_NEEDED].
