MHT1008NT1 vs MHT1008NT1515 Comparação

Comparação detalhada lado a lado de MHT1008NT1 por NXP Semiconductors e MHT1008NT1515 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MHT1008NT1 MHT1008NT1 - 12.5W RF LDMOS 2450MHz | NXP Semiconductors

MHT1008NT1 - 12.5W RF LDMOS 2450MHz | NXP Semiconductors

MHT1008NT1 ✓ Ativo
NXP Semiconductors
MHT1008NT1515 MHT1008NT1515 - 12.5W RF LDMOS 2450MHz ISM N-Channel | NXP

MHT1008NT1515 - 12.5W RF LDMOS 2450MHz ISM N-Channel | NXP

MHT1008NT1515 ✓ Ativo

Comparação de especificações

Parâmetro MHT1008NT1 MHT1008NT1515
Marca NXP Semiconductors NXP Semiconductors
Categoria MOSFETs MOSFETs
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $9,55 $0,94
Manufacturer NXP Semiconductors NXP Semiconductors (formerly Freescale)
Part Number MHT1008NT1 MHT1008NT1515
Tipo de transistor LDMOS, N-Channel Enhancement-Mode —
Application RF Power Transistor, ISM Band —
Operating Frequency 2400 MHz to 2500 MHz (2450 MHz typ) 2450 MHz (ISM band)
Test Frequency 2450 MHz —
Drain Supply Voltage (Vdd) 28 V (typical) —
Output Power (CW) 12.5 W 12.5 W
Power Gain (typical) 18.6 dB at 2450 MHz —
Drain Current 110 mA —
Power Gain (DigiKey reported) 20.9 dB (max value reported by distributor) —
Encapsulamento / Caixa PLD-1.5W (SOT1811), ceramic flanged —
Tipo de montagem Chassis / flange mount with bolt-down heatsink Surface Mount / Flange Mount with heat spreader
Status RoHS [DATA_NEEDED: rohs_status] Compliant
Lead-Free [DATA_NEEDED: lead_free] —
MSL (Moisture Sensitivity Level) [DATA_NEEDED: msl_level] —
Device Type — RF Power LDMOS Transistor, N-Channel Enhancement-Mode
Drain-Source Voltage V(BR)DSS — 65 V (minimum)
Gate Threshold Voltage VGS(th) — 1.6 V
Typical Gain — 20.9 dB at 2.45 GHz
Drain Bias (typical) — 28 V
Total Power Dissipation — 48.1 W
Temperatura de junção de operação — -40 °C to +150 °C
Encapsulamento — PLD-1.5W (PLD-1) ceramic flange
Technology — LDMOS (Laterally Diffused MOSFET)

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