MPC5554MVR132 vs MPC5554MZP132 Comparação

Comparação detalhada lado a lado de MPC5554MVR132 por NXP Semiconductors e MPC5554MZP132 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC5554MVR132 MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 Nrnd
NXP Semiconductors
MPC5554MZP132 MPC5554MZP132 - 132MHz 2MB Flash Automotive MCU | NXP

MPC5554MZP132 - 132MHz 2MB Flash Automotive MCU | NXP

MPC5554MZP132 Nrnd

Comparação de especificações

Parâmetro MPC5554MVR132 MPC5554MZP132
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida NRND NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $27,25 $92,38
Core Architecture Power Architecture e200z6 —
CPU Core 32-bit, single-core —
Maximum Operating Frequency 132 MHz —
Flash Memory Size 2 MB (2M x 8) —
SRAM Size 64 KB —
Instruction Cache / Data Cache 64 KB unified —
Encapsulamento 416-ball TE-PBGA (27 x 27 mm, 1 mm pitch) 416-pin plastic PBGA
Tipo de montagem Surface Mount Surface mount
Supply Voltage (Core) [DATA_NEEDED: core voltage range] —
Supply Voltage (I/O) 3.3 V (typical) —
Faixa de temperatura de operação -40 C to +125 C (junction) —
CAN Controllers 2 x FlexCAN 2.0B, 64 message buffers each —
ADC Channels Up to 40 channels, 12-bit SAR —
eTPU Channels 64 channels (Enhanced Time Processing Unit) —
DSPI Modules 3 x DSPI (Deserial/Serial Peripheral Interface) —
External Bus Interface 16-bit / 32-bit bus, supports SDRAM, SRAM, Flash up to 16 MB —
MMU / FPU MMU present; FPU (single-precision) per e200z6 core —
Status RoHS Compliant —
Nível MSL 3 (per JEDEC J-STD-020) —
Product Type — 32-bit automotive microcontroller
Processor Core — e200z6 Power Architecture core
Operating Frequency — 132 MHz
Flash Memory — 2 MB (2M x 8)
Architecture — Book E-compliant Power Architecture
Package Dimensions — 27 x 27 mm
Package Pitch — 1 mm
Package Material — Lead-free plastic
Package Outline — MS-034AAL-1
Temperatura de operação — -40 °C to +125 °C
Automotive Grade — Automotive grade
Primary Application — Engine management and powertrain control
Instruction Set — 32-bit
Flash Organization — 2M x 8 bits
Status do ciclo de vida — NRND

Fichas técnicas e recursos

Ver todos os produtos Criar BOM Solicitar cotação