MPC8555VTAPF vs MPC8543VTANGD Comparação

Comparação detalhada lado a lado de MPC8555VTAPF por NXP Semiconductors e MPC8543VTANGD por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC8555VTAPF MPC8555VTAPF - 833MHz PowerQUICC III MPU | NXP | 783-FCPBGA

MPC8555VTAPF - 833MHz PowerQUICC III MPU | NXP | 783-FCPBGA

MPC8555VTAPF ✗ Fim de vida
NXP Semiconductors
MPC8543VTANGD MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD ✓ Ativo

Comparação de especificações

Parâmetro MPC8555VTAPF MPC8543VTANGD
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Fim de vida Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $152,00 $152,00
Core Processor PowerPC e500 PowerPC e500
Number of Cores 1 Core, 32-Bit 1
Maximum Core Frequency 833 MHz —
Co-Processor / DSP Communications; CPM (Communications Processor Module) —
Memory Controllers DDR, SDRAM —
Graphics Acceleration No —
Display & Interface Controllers Yes (per datasheet) —
Ethernet Dual 10/100/1000 MAC with TCP/IP acceleration —
PCI / PCI-X Interfaces Dual PCI/PCI-X —
Security Engine IPSec / SSL / TLS / 3DES / AES acceleration —
Local Bus Controller Yes —
L1 Cache 32 KB Instruction + 32 KB Data —
Temperatura de operação -40C to +105C (Industrial / Extended) 0 °C to +105 °C
Encapsulamento 783-FCPBGA, 29x29 mm —
Tipo de montagem Surface Mount (BGA) Surface Mount (BGA)
Part Status Not For New Designs —
Status RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Manufacturer — NXP Semiconductors (Freescale)
Series — PowerQUICC III
Core Architecture — Power Architecture, 7-stage pipeline, dual-issue superscalar
Core Speed — 800 MHz
Bus Width — 32-bit
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
L2 Cache — 256 KB
Memory Controller — DDR2 SDRAM with ECC, up to 533 MHz data rate
Ethernet MACs — 4x Gigabit (SGMII/RGMII)
PCI Express — 2x PCIe interfaces
Serial RapidIO — 2x SRIO endpoints
PCI/PCI-X — 1x 32-bit PCI/PCI-X interface
Core Voltage — 1.0 V (typical)
I/O Voltages — 1.8 V / 2.5 V / 3.3 V
Process Technology — 90 nm CMOS
Package Type — FCBGA-783 (29x29 mm)

Fichas técnicas e recursos

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