MPC8555VTAPF vs MPC8543VTANGD 비교

다음의 상세 나란히 비교: MPC8555VTAPF 제조: NXP Semiconductors 및 MPC8543VTANGD 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MPC8555VTAPF MPC8555VTAPF - 833MHz PowerQUICC III MPU | NXP | 783-FCPBGA

MPC8555VTAPF - 833MHz PowerQUICC III MPU | NXP | 783-FCPBGA

MPC8555VTAPF ✗ 단종
NXP Semiconductors
MPC8543VTANGD MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD ✓ 활성

사양 비교

파라미터 MPC8555VTAPF MPC8543VTANGD
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 수명 종료 활성
재고 상태 In Stock In Stock
단가 (USD) $152.00 $152.00
Core Processor PowerPC e500 PowerPC e500
Number of Cores 1 Core, 32-Bit 1
Maximum Core Frequency 833 MHz —
Co-Processor / DSP Communications; CPM (Communications Processor Module) —
Memory Controllers DDR, SDRAM —
Graphics Acceleration No —
Display & Interface Controllers Yes (per datasheet) —
Ethernet Dual 10/100/1000 MAC with TCP/IP acceleration —
PCI / PCI-X Interfaces Dual PCI/PCI-X —
Security Engine IPSec / SSL / TLS / 3DES / AES acceleration —
Local Bus Controller Yes —
L1 Cache 32 KB Instruction + 32 KB Data —
동작 온도 -40C to +105C (Industrial / Extended) 0 °C to +105 °C
패키지 783-FCPBGA, 29x29 mm —
실장 유형 Surface Mount (BGA) Surface Mount (BGA)
Part Status Not For New Designs —
RoHS 상태 [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Manufacturer — NXP Semiconductors (Freescale)
Series — PowerQUICC III
Core Architecture — Power Architecture, 7-stage pipeline, dual-issue superscalar
Core Speed — 800 MHz
Bus Width — 32-bit
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
L2 Cache — 256 KB
Memory Controller — DDR2 SDRAM with ECC, up to 533 MHz data rate
Ethernet MACs — 4x Gigabit (SGMII/RGMII)
PCI Express — 2x PCIe interfaces
Serial RapidIO — 2x SRIO endpoints
PCI/PCI-X — 1x 32-bit PCI/PCI-X interface
Core Voltage — 1.0 V (typical)
I/O Voltages — 1.8 V / 2.5 V / 3.3 V
Process Technology — 90 nm CMOS
Package Type — FCBGA-783 (29x29 mm)

데이터시트 & 자료

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