MPC8555VTAPF vs MPC8543VTANGD Comparison

Detailed side-by-side comparison of MPC8555VTAPF by NXP Semiconductors and MPC8543VTANGD by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC8555VTAPF MPC8555VTAPF - 833MHz PowerQUICC III MPU | NXP | 783-FCPBGA

MPC8555VTAPF - 833MHz PowerQUICC III MPU | NXP | 783-FCPBGA

MPC8555VTAPF ✗ End of Life
NXP Semiconductors
MPC8543VTANGD MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD ✓ Active

Specification Comparison

Parameter MPC8555VTAPF MPC8543VTANGD
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status End of Life Active
Stock Status In Stock In Stock
Unit Price (USD) $152.00 $152.00
Core Processor PowerPC e500 PowerPC e500
Number of Cores 1 Core, 32-Bit 1
Maximum Core Frequency 833 MHz —
Co-Processor / DSP Communications; CPM (Communications Processor Module) —
Memory Controllers DDR, SDRAM —
Graphics Acceleration No —
Display & Interface Controllers Yes (per datasheet) —
Ethernet Dual 10/100/1000 MAC with TCP/IP acceleration —
PCI / PCI-X Interfaces Dual PCI/PCI-X —
Security Engine IPSec / SSL / TLS / 3DES / AES acceleration —
Local Bus Controller Yes —
L1 Cache 32 KB Instruction + 32 KB Data —
Operating Temperature -40C to +105C (Industrial / Extended) 0 °C to +105 °C
Package 783-FCPBGA, 29x29 mm —
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Part Status Not For New Designs —
RoHS Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Manufacturer — NXP Semiconductors (Freescale)
Series — PowerQUICC III
Core Architecture — Power Architecture, 7-stage pipeline, dual-issue superscalar
Core Speed — 800 MHz
Bus Width — 32-bit
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
L2 Cache — 256 KB
Memory Controller — DDR2 SDRAM with ECC, up to 533 MHz data rate
Ethernet MACs — 4x Gigabit (SGMII/RGMII)
PCI Express — 2x PCIe interfaces
Serial RapidIO — 2x SRIO endpoints
PCI/PCI-X — 1x 32-bit PCI/PCI-X interface
Core Voltage — 1.0 V (typical)
I/O Voltages — 1.8 V / 2.5 V / 3.3 V
Process Technology — 90 nm CMOS
Package Type — FCBGA-783 (29x29 mm)

Datasheets & Resources

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