MPC8555VTAPF vs MPC8543VTANGD 对比
详细并排对比 MPC8555VTAPF 出自 NXP Semiconductors 和 MPC8543VTANGD 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC8555VTAPF | MPC8543VTANGD |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 停产 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $152.00 | $152.00 |
| Core Processor | PowerPC e500 | PowerPC e500 |
| Number of Cores | 1 Core, 32-Bit | 1 |
| Maximum Core Frequency | 833 MHz | — |
| Co-Processor / DSP | Communications; CPM (Communications Processor Module) | — |
| Memory Controllers | DDR, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | Yes (per datasheet) | — |
| Ethernet | Dual 10/100/1000 MAC with TCP/IP acceleration | — |
| PCI / PCI-X Interfaces | Dual PCI/PCI-X | — |
| Security Engine | IPSec / SSL / TLS / 3DES / AES acceleration | — |
| Local Bus Controller | Yes | — |
| L1 Cache | 32 KB Instruction + 32 KB Data | — |
| 工作温度 | -40C to +105C (Industrial / Extended) | 0 °C to +105 °C |
| 封装 | 783-FCPBGA, 29x29 mm | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| Part Status | Not For New Designs | — |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Manufacturer | — | NXP Semiconductors (Freescale) |
| Series | — | PowerQUICC III |
| Core Architecture | — | Power Architecture, 7-stage pipeline, dual-issue superscalar |
| Core Speed | — | 800 MHz |
| Bus Width | — | 32-bit |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| L2 Cache | — | 256 KB |
| Memory Controller | — | DDR2 SDRAM with ECC, up to 533 MHz data rate |
| Ethernet MACs | — | 4x Gigabit (SGMII/RGMII) |
| PCI Express | — | 2x PCIe interfaces |
| Serial RapidIO | — | 2x SRIO endpoints |
| PCI/PCI-X | — | 1x 32-bit PCI/PCI-X interface |
| Core Voltage | — | 1.0 V (typical) |
| I/O Voltages | — | 1.8 V / 2.5 V / 3.3 V |
| Process Technology | — | 90 nm CMOS |
| Package Type | — | FCBGA-783 (29x29 mm) |