MPXV2053GP vs MPX2053GP Comparação
Comparação detalhada lado a lado de MPXV2053GP por NXP Semiconductors e MPX2053GP por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MPXV2053GP | MPX2053GP |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Pressure Sensors | Pressure Sensors |
| Status do ciclo de vida | Obsolete | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $10,50 | $9,75 |
| Pressure Type | Vented Gauge | Vented Gauge |
| Operating Pressure Range | 0 kPa to 50 kPa (0 PSI to 7.25 PSI) | 0 kPa to 50 kPa (0 PSI to 7.25 PSI) |
| Maximum Overpressure | [DATA_NEEDED: max overpressure rating] | — |
| Tipo de saída | Analog, Wheatstone bridge (mV differential) | Wheatstone Bridge (analog voltage, ratiometric) |
| Output Span | 0 mV to 40 mV (typ) at 10 V supply | — |
| Tensão de alimentação | 10 V typical (ratiometric output) | 10 V typical (16 V maximum) |
| Port Style | Top-side, male tube 0.13" (3.17 mm) | — |
| Encapsulamento / Caixa | 8-SMD, Gull Wing, Side Port | — |
| Tipo de montagem | Surface Mount | Through-Hole |
| Temperatura de operação | [DATA_NEEDED: full operating temperature range, spec from datasheet 0C to +85C typical] | 0°C to +85°C |
| Temperature Compensation | On-chip, calibrated | On-chip, calibrated |
| Technology | Silicon piezoresistive (MEMS strain gauge) | Silicon piezoresistive (MEMS) |
| Linearity | [DATA_NEEDED: linearity %FS] | [DATA_NEEDED: linearity %FS] |
| Hysteresis | [DATA_NEEDED: hysteresis %FS] | — |
| Media Compatibility | Dry non-corrosive gases | — |
| Status RoHS | [DATA_NEEDED: confirm RoHS status from datasheet] | Compliant |
| Sensitivity | — | 0.8 mV/kPa typical |
| Full-Scale Output | — | 0 mV to 40 mV (at 10 V supply) |
| Port Configuration | — | Single radial barbed port, 0.19" (4.93 mm) tube |
| Encapsulamento | — | 4-SIP Module (Unibody-4) |
| Termination Style | — | PC Pin (through-hole) |