MSC8157ETVT1000A vs MSC8144ETVT800A Comparação

Comparação detalhada lado a lado de MSC8157ETVT1000A por NXP Semiconductors e MSC8144ETVT800A por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MSC8157ETVT1000A MSC8157ETVT1000A - 1GHz Six-Core StarCore DSP, 783-FCBGA | NXP

MSC8157ETVT1000A - 1GHz Six-Core StarCore DSP, 783-FCBGA | NXP

MSC8157ETVT1000A Obsolete
NXP Semiconductors
MSC8144ETVT800A MSC8144ETVT800A - SC3400 Core DSP, 800MHz, 783-FCBGA | NXP

MSC8144ETVT800A - SC3400 Core DSP, 800MHz, 783-FCBGA | NXP

MSC8144ETVT800A Obsolete

Comparação de especificações

Parâmetro MSC8157ETVT1000A MSC8144ETVT800A
Marca NXP Semiconductors NXP Semiconductors
Categoria DSP DSP
Status do ciclo de vida Obsolete Obsolete
Status do estoque In Stock In Stock
Preço unitário (USD) $190,89 $195,50
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Series StarCore —
Type SC3850 Six-Core Digital Signal Processor (DSP) —
Architecture StarCore SC3850, six independent cores —
Core Count 6 —
Clock Rate 1 GHz (1000 MHz) —
Largura do barramento de dados 64-bit —
On-Chip RAM 6.375 MB 10.5 MB
On-Chip ROM 96 kB —
L1 Instruction Cache (per core) 32 KB —
L1 Data Cache (per core) 32 KB —
Voltage - Core 1.0 V —
Voltage - I/O 1.0 V / 1.5 V / 2.5 V (selectable) —
Interfaces Ethernet, I²C, SPI, UART/USART, PCI, RGMII, SGMII, Serial RapidIO Ethernet (UTOPIA), I2C, SPI, TDM, UART
Temperatura de operação -40°C to +105°C (Extended) -40C to +105C
Encapsulamento 783-FCBGA (Flip-Chip BGA), 29 mm × 29 mm 783-FCBGA (29x29 mm)
Contagem de pinos 783 —
Tipo de montagem Surface Mount (FCBGA) Surface Mount
Lead Status Lead Free —
Process Technology CMOS —
Core Architecture — SC3400 StarCore (4-core)
Number of Cores — 4
Core Clock Rate — 800 MHz
Non-Volatile Memory — External (NOR/NAND boot ROM)
Core Voltage — 1.00 V
I/O Voltage — 3.30 V
Operating Temperature Grade — Extended Industrial
Terminal Form — Ball
Number of Terminals — 783
Package Code — BGA / FCBGA
Package Shape — Square
Technology — High-performance multi-core DSP, SIMD
Status RoHS — [DATA_NEEDED: RoHS status not in web data]

Fichas técnicas e recursos

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