MSC8157ETVT1000A vs MSC8144ETVT800A Vergleich
Detaillierter Direktvergleich von MSC8157ETVT1000A von NXP Semiconductors und MSC8144ETVT800A von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MSC8157ETVT1000A - 1GHz Six-Core StarCore DSP, 783-FCBGA | NXP
MSC8157ETVT1000A ObsoleteNXP Semiconductors
MSC8144ETVT800A - SC3400 Core DSP, 800MHz, 783-FCBGA | NXP
MSC8144ETVT800A ObsoleteSpezifikationsvergleich
| Parameter | MSC8157ETVT1000A | MSC8144ETVT800A |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $190,89 | $195,50 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Series | StarCore | — |
| Type | SC3850 Six-Core Digital Signal Processor (DSP) | — |
| Architecture | StarCore SC3850, six independent cores | — |
| Core Count | 6 | — |
| Clock Rate | 1 GHz (1000 MHz) | — |
| Datenbusbreite | 64-bit | — |
| On-Chip RAM | 6.375 MB | 10.5 MB |
| On-Chip ROM | 96 kB | — |
| L1 Instruction Cache (per core) | 32 KB | — |
| L1 Data Cache (per core) | 32 KB | — |
| Voltage - Core | 1.0 V | — |
| Voltage - I/O | 1.0 V / 1.5 V / 2.5 V (selectable) | — |
| Interfaces | Ethernet, I²C, SPI, UART/USART, PCI, RGMII, SGMII, Serial RapidIO | Ethernet (UTOPIA), I2C, SPI, TDM, UART |
| Betriebstemperatur | -40°C to +105°C (Extended) | -40C to +105C |
| Gehäuse | 783-FCBGA (Flip-Chip BGA), 29 mm × 29 mm | 783-FCBGA (29x29 mm) |
| Pin-Anzahl | 783 | — |
| Montageart | Surface Mount (FCBGA) | Surface Mount |
| Lead Status | Lead Free | — |
| Process Technology | CMOS | — |
| Core Architecture | — | SC3400 StarCore (4-core) |
| Number of Cores | — | 4 |
| Core Clock Rate | — | 800 MHz |
| Non-Volatile Memory | — | External (NOR/NAND boot ROM) |
| Core Voltage | — | 1.00 V |
| I/O Voltage | — | 3.30 V |
| Operating Temperature Grade | — | Extended Industrial |
| Terminal Form | — | Ball |
| Number of Terminals | — | 783 |
| Package Code | — | BGA / FCBGA |
| Package Shape | — | Square |
| Technology | — | High-performance multi-core DSP, SIMD |
| RoHS-Status | — | [DATA_NEEDED: RoHS status not in web data] |