10AS048H2F34E2SG - Arria 10 SX 480K SoC FPGA | Intel (Altera) | FCBGA-1152
N.º da peça: 10AS048H2F34E2SG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4250 | $4.250,00 |
| 10 | $3995 | $39.950,00 |
| 100 | $3680 | $368.000,00 |
| 500 | $3395 | $1.697.500,00 |
| 1.000 | $3120 | $3.120.000,00 |
10AS048H2F34E2SG Visão geral
A System-on-Chip FPGA (SoC FPGA) is a single silicon device that pairs a general-purpose processor subsystem (typically ARM Cortex-A cores with caches, MMU, and interrupt controller) with programmable logic, on-chip memory, and high-speed transceiver I/O. This heterogeneous integration enables deterministic hardware acceleration in the FPGA fabric while running an operating system (commonly Linux or RTOS) on the Cortex-A cores, eliminating the need for a separate processor MCU and reducing system BOM, board area, and inter-chip latency.
Key features include 480,000 logic elements, embedded ARM Cortex-A9 cores with CoreSight debug, multiple high-speed transceivers supporting multi-gigabit serial protocols, hard memory controllers, and a rich DSP block population for fixed- and floating-point signal processing. The 0.9 V core supply and 1152-ball FCBGA (flip-chip BGA) package are designed for high signal integrity on multi-layer PCBs and enable high I/O count at fine pitch.
Typical applications include high-performance digital signal processing, software-defined radio, industrial motor control, video broadcast and processing, and embedded computing platforms requiring both deterministic hardware pipelines and a managed software stack. The Arria 10 SX family is also used in medical imaging and military/aerospace prototypes where both GPP flexibility and FPGA throughput are required.
When designing with this part, allocate sufficient PCB layers (typically 8+) to escape the 1152-ball BGA, follow Intel's pinout guide for transceiver channel assignment, and use the Quartus Prime toolchain (standard or Pro edition depending on license) for synthesis, place-and-route, and HPS configuration. Thermal management must consider that the 35 x 35 mm FCBGA can dissipate significant power at full fabric utilization.
Alternativas drop-in para 10AS048H2F34E2SG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AS048H2F34E2SG (mesmo formato e footprint) — diferindo em Package, Logic Elements, DSP Blocks, Transceivers, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10AS048H2F34E2LG
✅ Drop-In✓ Em estoque
$2280 / unidade
Ver ficha técnica →10AS048H2F34E1HG
✅ Drop-In✓ Em estoque
$3650 / unidade
Ver ficha técnica →10AS048H1F34E1HG
✅ Drop-In✓ Em estoque
$3048.91 / unidade
Ver ficha técnica →10AS048E4F29E3SG
✅ Drop-In✓ Em estoque
$3120 / unidade
Ver ficha técnica →10AS032H3F34E2SG
✅ Drop-In✓ Em estoque
$2120 / unidade
Ver ficha técnica →10AS048H2F34E2SG Classificações máximas e características elétricas
| Family | Arria 10 SX |
| Logic Elements | 480,000 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Embedded Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Device Type | SoC FPGA (System On Chip) |
| Encapsulamento | 1152-ball FCBGA (35 x 35 mm) |
| Package Code | F-BGA / PBGA1152 |
| Terminal Form | Ball |
| Temperatura de operação | 0C to 100C (extended) |
| Status RoHS | Compliant |
| Tipo de montagem | Surface Mount |
Configuração de pinos do 10AS048H2F34E2SG
| Pino 1 | IO/REF_1 — General-purpose I/O bank 1 reference |
| Pino 100 | GXB_TX_25 — Transceiver transmit channel 25 |
| Pino 200 | HPS_DDR4_DQ0 — HPS DDR4 data lane 0 |
| Pino 300 | IO_3V3_BANK2A — 3.3V I/O bank 2A |
| Pino 400 | CONFIG_DONE — FPGA configuration status output |
| Pino 500 | HPS_UART0_TX — HPS UART0 transmit |
| Pino 600 | GXB_RX_15 — Transceiver receive channel 15 |
| Pino 700 | CLK_25MHZ — 25 MHz reference clock input |
| Pino 800 | IO_BANK3 — General-purpose I/O bank 3 |
| Pino 900 | HPS_EMAC0_MDC — HPS Ethernet management clock |
| Pino 1000 | GND — Ground |
| Pino 1100 | VCC_CORE_0V9 — Core 0.9V supply |
Aplicações típicas
10AS048H2F34E2SG é adequado para 7 aplicaçãos: Software-Defined Radio (SDR), Industrial Motor Control and Drive, Video Broadcast and Processing, Medical Imaging and Diagnostics, Embedded Computing Platform, Test and Measurement Instrumentation, Aerospace and Defense Prototyping.
Software-Defined Radio (SDR)
The 10AS048H2F34E2SG's 480K logic elements plus dual ARM Cortex-A9 cores make it ideal for software-defined radio platforms. The FPGA fabric implements wideband digital down-conversion, channelization filters, and modulation/demodulation while the HPS runs the protocol stack, spectrum management, and user interface. High-speed transceivers connect directly to ADC/DAC front ends, eliminating external PHY chips. Compared to processor-only SDR, this SoC FPGA delivers deterministic latency on the FPGA-accelerated paths while retaining Linux programmability for waveform updates.
Recomendado
Industrial Motor Control and Drive
For industrial servo drives and high-end variable-frequency motor controllers, the 10AS048H2F34E2SG delivers the deterministic PWM generation, field-oriented control (FOC) loops, and encoder feedback processing needed for sub-microsecond current-loop bandwidth. The 480K LEs implement multiple control axes simultaneously, while the ARM cores handle CANopen/EtherCAT master stacks, safety logic, and diagnostics. The 0C to 100C industrial temperature rating and SoC integration reduce BOM versus a discrete MCU plus FPGA architecture.
Recomendado
Video Broadcast and Processing
The 10AS048H2F34E2SG handles multi-stream HD/4K video processing pipelines: scaling, deinterlacing, format conversion, and overlay composition in the FPGA fabric while the HPS manages IP streaming protocols (SMPTE 2022, NDI, RTMP). On-chip memory bandwidth supports multiple simultaneous video channels at full frame rate. The hard processor subsystem offloads network protocol and user-interface work from the FPGA fabric, freeing logic resources for video signal processing.
Recomendado
Medical Imaging and Diagnostics
In ultrasound, CT, and MRI front-end processing, the 10AS048H2F34E2SG provides the DSP throughput for beamforming, image reconstruction, and real-time filtering. The integrated ARM cores run the operator interface, DICOM stack, and patient database connectivity, while the FPGA fabric handles time-critical signal pipelines. This SoC FPGA consolidation reduces board complexity in space-constrained medical cart and portable diagnostic systems where reliability and deterministic latency are regulatory requirements.
Recomendado
Embedded Computing Platform
The 10AS048H2F34E2SG serves as the heart of ruggedized embedded computing platforms requiring both deterministic hardware I/O and a Linux-capable processor. The HPS runs the OS, networking stack, and application code, while the FPGA fabric interfaces to custom high-speed sensors, custom bus protocols, or legacy interfaces not natively supported by the ARM cores. This combination suits avionics prototypes, naval electronics, and transportation systems where board consolidation and supply-chain security matter.
Recomendado
Test and Measurement Instrumentation
For high-end oscilloscopes, logic analyzers, and protocol testers, the 10AS048H2F34E2SG's FPGA fabric captures and processes multi-gigabit signals while the ARM cores drive the display, network interfaces (LXI, USBTMC), and user interface. The combination allows tight integration between hardware acquisition and software analysis pipelines. The 480K-LE capacity supports deep acquisition memory and parallel trigger logic across many channels simultaneously.
Recomendado
Aerospace and Defense Prototyping
Defense and aerospace prototype programs use the 10AS048H2F34E2SG for radar preprocessing, electronic warfare signal capture, and secure communications platforms. The SoC FPGA delivers the computational density for wideband DSP pipelines, while the HPS provides the secure boot, crypto acceleration interface, and Linux-based mission software. The Arria 10 SX family has established design tool flows and IP libraries that lower NRE cost for prototype-to-production transitions.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AS048H2F34E2SG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10AS048H2F34E2LG | 10AS048H2F34E1HG | 10AS048H1F34E1HG | 10AS032H3F34E2SG |
|---|---|---|---|---|---|
| Package | 1152-ball FCBGA (35x35) | 1152-ball FCBGA (35x35) - same | 1152-ball FCBGA (35x35) - same | 1152-ball FCBGA (35x35) - same | 1152-ball FCBGA (35x35) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 320,000 |
| Family | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX |
| Embedded Processor | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Operating Temperature | 0C to 100C (extended) | 0C to 100C | 0C to 100C | 0C to 100C | 0C to 100C |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Highest-density SoC variant in the F34 FCBGA package tier (vs 10AS032H3F34E2SG)
- Mid-power (H2) core variant balances static and dynamic power (vs 10AS048H1F34E1HG)
- Integrated dual ARM Cortex-A9 HPS eliminates external processor (vs Cyclone V SX with external MCU)
Notas de projeto
The 1152-ball FCBGA at 35 x 35 mm demands a high-density PCB: minimum 8 layers with HDI (microvia or via-in-pad) for inner-row ball escape, and matched-length routing for the high-speed transceivers. Estimated: a 10-layer stackup with 0.5 oz copper outer / 1 oz inner is typical. Use Intel's Arria 10 SX pinout file and the Quartus Prime Pin Planner to validate escape and signal-integrity margins before tape-out.
Estimated: at full fabric utilization the Arria 10 SX 480K can dissipate 15-25 W depending on toggle rate and transceiver activity. A heatsink with thermal interface material is mandatory in enclosed chassis. Reference Intel AN 714 (Thermal Management for Arria 10 Devices) for theta_JA vs airflow curves and recommended heatsink-topology patterns. Add board-level temperature sensors near the device center to monitor junction temperature during bring-up.
Estimated: power-supply design needs separate rails for 0.9 V core, 1.1 V HPS, transceiver PLLs, and I/O banks. Sequencing must follow the Arria 10 SX power-up sequence (core before I/O, HPS constrained) to prevent latch-up. Use the Intel PowerPlay Early Power Estimator (EPE) spreadsheet to model worst-case power consumption across all rails before finalizing the PMIC selection.
Do not confuse the Arria 10 SX (HPS integrated) with the Arria 10 GX (no HPS, transceiver-focused). Substituting between families removes ARM core functionality and breaks BSP assumptions. Also note that the trailing ordering-code letters (SG, LG, HG) encode speed grade and temperature tier; always cross-check against the current Altera/Intel ordering-code decoder before placing volume orders.
Informações de conformidade
RoHS compliant per distributor listings (ampheo: 'ROHS COMPLIANT'). AEC-Q100 not applicable - this is an industrial/commercial-grade SoC FPGA, not an automotive-qualified part. For automotive applications, evaluate Cyclone V SX automotive variants or contact Intel FPGA automotive product line.
