10AS032H4F35I3SG - Arria 10 SX 320K SoC FPGA, 1152-FBGA | Intel
N.º da peça: 10AS032H4F35I3SG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1394.91 | $1.394,91 |
| 10 | $1320.5 | $13.205,00 |
| 100 | $1180 | $118.000,00 |
| 250 | $1120 | $280.000,00 |
| 500 | $1080 | $540.000,00 |
10AS032H4F35I3SG Visão geral
A SoC FPGA is a single silicon device that merges a general-purpose processor subsystem with a programmable logic fabric, allowing deterministic hardware acceleration alongside OS-driven software workloads. Arria 10 SX sits in Intel's mid-to-high density tier between Cyclone/MAX and Stratix families, balancing DSP, transceiver bandwidth, and power efficiency for mid-range 5G, industrial, and defense applications. The 'H4' designator denotes a high-memory-bandwidth variant with hardened floating-point DSP and 17.4 Gbps transceivers.
Key specifications include 320K logic elements, 21.6 Mbits embedded RAM, 1,568 DSP blocks (variable-precision with hard IEEE 754 single-precision floating point), 24 transceivers up to 17.4 Gbps, and an industrial-grade junction temperature range. The HPS includes dual 1.5 GHz ARM Cortex-A9 cores with CoreSight debug, 32 KB I-cache + 32 KB D-cache per core, 512 KB shared L2, NEON media engine, and a 125 MHz Cortex-M3 for system management. The 1152-FCBGA uses Intel's flip-chip ball-grid array technology, providing low-inductance power delivery and high-speed signal escape.
Typical applications include 5G radio baseband processing, radar and electronic-warfare front-ends, industrial machine-vision and motion controllers, military secure communications, and medical imaging accelerators. The combination of 17.4 Gbps transceivers, hard PCIe Gen3 x8, and ARM Linux support suits any design needing hardware-realtime signal chains plus Linux-class application processing on a single device.
When designing, ensure proper power-decoupling close to the package's split power domains (VCC, VCCP, VCCPT, VCC_HPS), respect the 35x35 mm PCB land pattern with controlled-impedance lanes for transceivers, and plan for the 1.5 GHz HPS boot sequence including the required boot ROM configuration. Thermal management must consider the industrial -40C to +100C junction range when designing conduction-cooled enclosures.
Alternativas drop-in para 10AS032H4F35I3SG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AS032H4F35I3SG (mesmo formato e footprint) — diferindo em Package, Logic Elements, Mounting Type, DSP Blocks, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10AS032H4F35I3LG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1320.75 / unidade
Ver ficha técnica →10AS032H4F35E3SG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3750 / unidade
Ver ficha técnica →10AS032H4F34I3SG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3150 / unidade
Ver ficha técnica →10AS032H4F35E3LG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1195 / unidade
Ver ficha técnica →10AS032H4F34I3LG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1428.73 / unidade
Ver ficha técnica →10AS032H4F35I3SG Classificações máximas e características elétricas
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 |
| Adaptive Logic Modules (ALM) | 118,730 |
| Embedded Memory (Mbits) | 21.6 |
| DSP Blocks | 1,568 |
| DSP Format | Variable-precision with hard IEEE 754 single-precision FP |
| Transceivers | 24 (up to 17.4 Gbps) |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Speed | 1.5 GHz |
| Hard Memory Controller | Yes (DDR3/DDR4, LPDDR2/3) |
| PCIe Hard IP | PCIe Gen3 x8 |
| Process Node | 20 nm |
| Encapsulamento | 1152-ball Flip-Chip BGA (35x35 mm) |
| Temperatura de operação | -40C to +100C (Industrial) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do 10AS032H4F35I3SG 1152-ball flip-chip bga (35x35 mm)
Configuração de pinos para 10AS032H4F35I3SG (pacote 1152-ball flip-chip bga (35x35 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10AS032H4F35I3SG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10AS032H4F35I3SG é adequado para 6 aplicaçãos: 5G Radio Baseband Processing, Radar and Electronic Warfare, Industrial Machine Vision, Military Secure Communications, Medical Imaging Accelerator, Video Broadcast Infrastructure.
5G Radio Baseband Processing
The 10AS032H4F35I3SG's 24 transceivers up to 17.4 Gbps and 1,568 DSP blocks with hard IEEE 754 single-precision floating point make it well-suited for 5G radio unit (RU) baseband processing. The device handles 4T4R or 8T8R CPRI/eCPRI fronthaul aggregation with sub-millisecond latency, while the dual 1.5 GHz ARM Cortex-A9 HPS runs MAC-layer scheduling and OAM software. Industrial -40C to +100C operation supports outdoor tower-mount and edge deployments.
Recomendado
Radar and Electronic Warfare
The 10AS032H4F35I3SG excels in radar and electronic-warfare (EW) signal processing, with 24 transceivers supporting phased-array digitisation and 1,568 DSP blocks delivering 1.5 TFLOPs of single-precision throughput for pulse compression, MTI, and beamforming. The industrial temperature grade supports airborne and shipboard platforms, while the ARM HPS handles track-management software. PCIe Gen3 x8 enables tight coupling to FPGA co-processors.
Recomendado
Industrial Machine Vision
The 10AS032H4F35I3SG powers multi-camera machine-vision systems, where its 1,568 DSP blocks run convolutional neural networks at 50-100 frames per second on 1080p streams. The dual ARM Cortex-A9 HPS runs Linux for camera-link protocol stacks, while the FPGA fabric interfaces with MIPI CSI-2, GigE Vision, and CoaXPress sensors. The 35x35 mm FCBGA supports fan-less industrial chassis with -40C to +100C operation for factory floor deployment.
Recomendado
Military Secure Communications
The 10AS032H4F35I3SG supports tactical-radio and secure-communications platforms with 24 transceivers fed through the FPGA fabric to DSP blocks implementing AES-256, frequency hopping, and adaptive modems. The ARM HPS runs a Linux-based crypto stack, while the FPGA fabric accelerates bulk encryption at line rate. Industrial temperature operation and BGA packaging support ruggedised MIL-spec enclosures used in dismounted and vehicular applications.
Recomendado
Medical Imaging Accelerator
The 10AS032H4F35I3SG powers CT, MRI, and ultrasound imaging systems where its 1,568 DSP blocks deliver 1.5 TFLOPs for back-projection, beamforming, and image reconstruction. The hard IEEE 754 single-precision floating point accelerates iterative reconstruction algorithms at sub-second latency. The dual ARM Cortex-A9 HPS runs the imaging GUI and DICOM stack, while the FPGA fabric interfaces with high-speed ADC channels and LVDS probe arrays.
Recomendado
Video Broadcast Infrastructure
The 10AS032H4F35I3SG handles UHD video processing in broadcast and Pro AV infrastructure, with 24 transceivers supporting 12G-SDI, SMPTE 2110 IP video, and HDMI 2.0 ingest. The 1,568 DSP blocks run real-time video codecs, color-space conversion, and overlay blending. The dual ARM Cortex-A9 HPS runs a Linux-based broadcast control plane, while the FPGA fabric delivers deterministic sub-frame latency required for live production switching.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AS032H4F35I3SG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10AS032H4F35I3LG | 10AS032H4F35E3SG | 10AS032H4F34I3SG | 10AS032H4F35E3LG | 10AS032H4F34I3LG |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-FCBGA (35x35 mm) | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (34x34 mm) | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (34x34 mm) |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Enhanced (0C to +100C) | Industrial (-40C to +100C) | Enhanced (0C to +100C) | Industrial (-40C to +100C) |
| Lead Finish | SnPb (standard) | Pb-free (matte Sn) | SnPb (standard) | SnPb (standard) | Pb-free (matte Sn) | Pb-free (matte Sn) |
| DSP Blocks | 1,568 | 1,568 | 1,568 | 1,568 | 1,568 | 1,568 |
| Transceivers | 24 (17.4 Gbps) | 24 (17.4 Gbps) | 24 (17.4 Gbps) | Reduced (smaller BGA) | 24 (17.4 Gbps) | Reduced (smaller BGA) |
| HPS Processor | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz |
Principais diferenciais
- Industrial-grade operation with full -40C to +100C junction temperature (vs 10AS032H4F35E3SG)
- Full 35x35 mm FCBGA with maximum transceiver count (vs 10AS032H4F34I3SG)
- Dual ARM Cortex-A9 at 1.5 GHz for embedded compute (vs Pure-FPGA Arria 10 GX family)
Notas de projeto
Estimated: at 100% utilisation of the 1,568 DSP blocks plus 24 transceivers at 17.4 Gbps, the 10AS032H4F35I3SG draws approximately 25-30 W from VCC, VCCP, VCCPT, and VCC_HPS rails. Designers should budget for the Intel SmartVID-controlled core voltage (typically 0.85-0.95 V) using the Arria 10 PowerPlay early-power-estimator spreadsheet before PCB layout. Use independent decoupling networks per rail with at least 10x 47 uF bulk capacitors and 0.1 uF/1 uF high-frequency ceramics placed within 5 mm of the BGA balls.
Estimated: at 25 W dissipation on a 35x35 mm 1152-ball FCBGA with typical junction-to-ambient theta_JA of 8-12 C/W (still air, JEDEC test board), the junction rises 200-300 C above ambient. Industrial-grade devices rated to +100C junction require a heatsink plus 200-400 LFM airflow or a cold-plate in a conduction-cooled chassis. Designers should always check the SmartVID thermal model in Quartus Prime and apply Arria 10 thermal-design guidelines to avoid thermal-shutdown at elevated ambient.
Route the 17.4 Gbps transceiver lanes with controlled impedance of 100 ohm differential (85 ohm for lower data rates) using 12-15 mil trace widths on Megtron-6 or equivalent low-loss dielectric stackup. Apply length-matching within 5 mils per transceiver channel and place AC-coupling capacitors within 200 mils of the device balls. For the HPS, route DDR3/DDR4 with 50 ohm single-ended trace impedance and within 25 ps of byte-level matching per Intel EMIF specification.
Ensure the HPS boot ROM is configured via the BSEL pins for the correct boot source (QSPI flash, NAND, SD/MMC, or eMMC) before POR. Failure to strap BSEL correctly results in no boot. Also verify the transceiver reference-clock jitter meets the Arria 10 SX PLL specification - a noisy reference clock causes link instability at 17.4 Gbps. Use a low-noise clock generator such as the Si5341 or equivalent.
Informações de conformidade
SnPb lead-finish standard; Pb-free variant is 10AS032H4F35I3LG. RoHS compliance depends on variant: the standard suffix is SnPb (non-RoHS), while the LG suffix is Pb-free matte Sn. AEC-Q100 not applicable as this is an FPGA, not an automotive-qualified IC.
