10AS048H2F34E2SG - Arria 10 SX 480K SoC FPGA | Intel (Altera) | FCBGA-1152
MPN: 10AS048H2F34E2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3995 | $39,950.00 |
| 100 | $3680 | $368,000.00 |
| 500 | $3395 | $1,697,500.00 |
| 1,000 | $3120 | $3,120,000.00 |
Drop-in alternatives for 10AS048H2F34E2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS048H2F34E2LG
✅ Drop-In✓ In Stock
$2280 / Unit
View Datasheet →10AS048H2F34E1HG
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View Datasheet →10AS048H1F34E1HG
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View Datasheet →10AS048E4F29E3SG
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View Datasheet →10AS032H3F34E2SG
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View Datasheet →10AS048H2F34E2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Logic Elements | 480,000 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Embedded Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Device Type | SoC FPGA (System On Chip) |
| Package | 1152-ball FCBGA (35 x 35 mm) |
| Package Code | F-BGA / PBGA1152 |
| Terminal Form | Ball |
| Operating Temperature | 0C to 100C (extended) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
10AS048H2F34E2SG Pin Configuration
| Pin 1 | IO/REF_1 — General-purpose I/O bank 1 reference |
| Pin 100 | GXB_TX_25 — Transceiver transmit channel 25 |
| Pin 200 | HPS_DDR4_DQ0 — HPS DDR4 data lane 0 |
| Pin 300 | IO_3V3_BANK2A — 3.3V I/O bank 2A |
| Pin 400 | CONFIG_DONE — FPGA configuration status output |
| Pin 500 | HPS_UART0_TX — HPS UART0 transmit |
| Pin 600 | GXB_RX_15 — Transceiver receive channel 15 |
| Pin 700 | CLK_25MHZ — 25 MHz reference clock input |
| Pin 800 | IO_BANK3 — General-purpose I/O bank 3 |
| Pin 900 | HPS_EMAC0_MDC — HPS Ethernet management clock |
| Pin 1000 | GND — Ground |
| Pin 1100 | VCC_CORE_0V9 — Core 0.9V supply |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048H2F34E2SG is suitable for 7 applications: Software-Defined Radio (SDR), Industrial Motor Control and Drive, Video Broadcast and Processing, Medical Imaging and Diagnostics, Embedded Computing Platform, Test and Measurement Instrumentation, Aerospace and Defense Prototyping.
Software-Defined Radio (SDR)
The 10AS048H2F34E2SG's 480K logic elements plus dual ARM Cortex-A9 cores make it ideal for software-defined radio platforms. The FPGA fabric implements wideband digital down-conversion, channelization filters, and modulation/demodulation while the HPS runs the protocol stack, spectrum management, and user interface. High-speed transceivers connect directly to ADC/DAC front ends, eliminating external PHY chips. Compared to processor-only SDR, this SoC FPGA delivers deterministic latency on the FPGA-accelerated paths while retaining Linux programmability for waveform updates.
Recommended
Industrial Motor Control and Drive
For industrial servo drives and high-end variable-frequency motor controllers, the 10AS048H2F34E2SG delivers the deterministic PWM generation, field-oriented control (FOC) loops, and encoder feedback processing needed for sub-microsecond current-loop bandwidth. The 480K LEs implement multiple control axes simultaneously, while the ARM cores handle CANopen/EtherCAT master stacks, safety logic, and diagnostics. The 0C to 100C industrial temperature rating and SoC integration reduce BOM versus a discrete MCU plus FPGA architecture.
Recommended
Video Broadcast and Processing
The 10AS048H2F34E2SG handles multi-stream HD/4K video processing pipelines: scaling, deinterlacing, format conversion, and overlay composition in the FPGA fabric while the HPS manages IP streaming protocols (SMPTE 2022, NDI, RTMP). On-chip memory bandwidth supports multiple simultaneous video channels at full frame rate. The hard processor subsystem offloads network protocol and user-interface work from the FPGA fabric, freeing logic resources for video signal processing.
Recommended
Medical Imaging and Diagnostics
In ultrasound, CT, and MRI front-end processing, the 10AS048H2F34E2SG provides the DSP throughput for beamforming, image reconstruction, and real-time filtering. The integrated ARM cores run the operator interface, DICOM stack, and patient database connectivity, while the FPGA fabric handles time-critical signal pipelines. This SoC FPGA consolidation reduces board complexity in space-constrained medical cart and portable diagnostic systems where reliability and deterministic latency are regulatory requirements.
Recommended
Embedded Computing Platform
The 10AS048H2F34E2SG serves as the heart of ruggedized embedded computing platforms requiring both deterministic hardware I/O and a Linux-capable processor. The HPS runs the OS, networking stack, and application code, while the FPGA fabric interfaces to custom high-speed sensors, custom bus protocols, or legacy interfaces not natively supported by the ARM cores. This combination suits avionics prototypes, naval electronics, and transportation systems where board consolidation and supply-chain security matter.
Recommended
Test and Measurement Instrumentation
For high-end oscilloscopes, logic analyzers, and protocol testers, the 10AS048H2F34E2SG's FPGA fabric captures and processes multi-gigabit signals while the ARM cores drive the display, network interfaces (LXI, USBTMC), and user interface. The combination allows tight integration between hardware acquisition and software analysis pipelines. The 480K-LE capacity supports deep acquisition memory and parallel trigger logic across many channels simultaneously.
Recommended
Aerospace and Defense Prototyping
Defense and aerospace prototype programs use the 10AS048H2F34E2SG for radar preprocessing, electronic warfare signal capture, and secure communications platforms. The SoC FPGA delivers the computational density for wideband DSP pipelines, while the HPS provides the secure boot, crypto acceleration interface, and Linux-based mission software. The Arria 10 SX family has established design tool flows and IP libraries that lower NRE cost for prototype-to-production transitions.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048H2F34E2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048H2F34E2LG | 10AS048H2F34E1HG | 10AS048H1F34E1HG | 10AS032H3F34E2SG |
|---|---|---|---|---|---|
| Package | 1152-ball FCBGA (35x35) | 1152-ball FCBGA (35x35) - same | 1152-ball FCBGA (35x35) - same | 1152-ball FCBGA (35x35) - same | 1152-ball FCBGA (35x35) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 320,000 |
| Family | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX |
| Embedded Processor | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Operating Temperature | 0C to 100C (extended) | 0C to 100C | 0C to 100C | 0C to 100C | 0C to 100C |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Highest-density SoC variant in the F34 FCBGA package tier (vs 10AS032H3F34E2SG)
- Mid-power (H2) core variant balances static and dynamic power (vs 10AS048H1F34E1HG)
- Integrated dual ARM Cortex-A9 HPS eliminates external processor (vs Cyclone V SX with external MCU)
Design Notes
The 1152-ball FCBGA at 35 x 35 mm demands a high-density PCB: minimum 8 layers with HDI (microvia or via-in-pad) for inner-row ball escape, and matched-length routing for the high-speed transceivers. Estimated: a 10-layer stackup with 0.5 oz copper outer / 1 oz inner is typical. Use Intel's Arria 10 SX pinout file and the Quartus Prime Pin Planner to validate escape and signal-integrity margins before tape-out.
Estimated: at full fabric utilization the Arria 10 SX 480K can dissipate 15-25 W depending on toggle rate and transceiver activity. A heatsink with thermal interface material is mandatory in enclosed chassis. Reference Intel AN 714 (Thermal Management for Arria 10 Devices) for theta_JA vs airflow curves and recommended heatsink-topology patterns. Add board-level temperature sensors near the device center to monitor junction temperature during bring-up.
Estimated: power-supply design needs separate rails for 0.9 V core, 1.1 V HPS, transceiver PLLs, and I/O banks. Sequencing must follow the Arria 10 SX power-up sequence (core before I/O, HPS constrained) to prevent latch-up. Use the Intel PowerPlay Early Power Estimator (EPE) spreadsheet to model worst-case power consumption across all rails before finalizing the PMIC selection.
Do not confuse the Arria 10 SX (HPS integrated) with the Arria 10 GX (no HPS, transceiver-focused). Substituting between families removes ARM core functionality and breaks BSP assumptions. Also note that the trailing ordering-code letters (SG, LG, HG) encode speed grade and temperature tier; always cross-check against the current Altera/Intel ordering-code decoder before placing volume orders.
Compliance Information
RoHS compliant per distributor listings (ampheo: 'ROHS COMPLIANT'). AEC-Q100 not applicable - this is an industrial/commercial-grade SoC FPGA, not an automotive-qualified part. For automotive applications, evaluate Cyclone V SX automotive variants or contact Intel FPGA automotive product line.
