10AX115U3F45I2SG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
MPN: 10AX115U3F45I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9540.66 | $9,540.66 |
| 10 | $9050 | $90,500.00 |
| 50 | $8520 | $426,000.00 |
| 100 | $8090 | $809,000.00 |
| 500 | $7450 | $3,725,000.00 |
Drop-in alternatives for 10AX115U3F45I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115U3F45I2LG
✅ Drop-In✓ In Stock
$6600 / Unit
View Datasheet →10AX115U3F45E2SG
✅ Drop-In✓ In Stock
$5800 / Unit
View Datasheet →10AX115U2F45I2SG
✅ Drop-In✓ In Stock
$8902.49 / Unit
View Datasheet →10AX115U2F45I2LG
✅ Drop-In✓ In Stock
$9589.87 / Unit
View Datasheet →10AX115U2F45I1SG
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →10AX115U2F45E2SG
✅ Drop-In✓ In Stock
$6920.66 / Unit
View Datasheet →10AX115U3F45I2SG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory (M20K) | 68,857,856 bits (67.5 Mbit) |
| Embedded Memory Blocks | 1,518 |
| DSP Blocks (18x19 Multipliers) | 1,518 |
| User I/O Pins | 480 |
| Transceivers | 24 channels |
| Max Transceiver Data Rate | 14.4 Gbps |
| Hard Memory Controller | Yes (DDR4 / DDR3 / QDRII+) |
| Process Technology | TSMC 20 nm |
| Package | 1932-ball FCBGA (F45) |
| Operating Temperature Grade | Industrial (-40C to +100C junction) |
| Speed Grade | I2 |
| Configuration Scheme | AES-256 encrypted, partial reconfiguration |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10AX115U3F45I2SG 1932-ball fcbga (f45) Pin Configuration Guide
Complete pinout information for 10AX115U3F45I2SG (1932-ball fcbga (f45) package) with 480 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115U3F45I2SG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 480 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115U3F45I2SG is suitable for 7 applications: 4K/8K Broadcast Video Processing, Wireless Baseband Digital Up/Down Conversion, 100G Ethernet Datapath Bridging, Military Radar Pre-Processing, Medical Imaging Front-End (Ultrasound / CT), High-Performance Computing (HPC) Protocol Offload, Industrial Automation and Machine Vision.
4K/8K Broadcast Video Processing
The 10AX115U3F45I2SG fits 4K/8K broadcast video pipelines because of its 24 transceivers supporting 6G/12G SDI and SMPTE 2022/2059 at up to 14.4 Gbps per lane, and its 1,150,000 logic elements which can ingest multi-channel 4K streams in parallel. Embedded 18x19 multipliers accelerate deinterlacing, scaling, and color-space conversion kernels without consuming external DSP chips. The 67.5 Mbit of M20K memory holds multiple line buffers for motion-adaptive processing at 60 fps. Placed on a video I/O card between SDI deserializers and an SoC host, it serves as the bridge between the SDI parallel bus and 10GbE/25GbE IP networks. The I2 industrial speed grade and -40C to +100C junction rating permit deployment in OB vans and outdoor broadcast enclosures. The 1932-ball FCBGA requires a high-density 12-layer PCB with microvia thermal arrays to dissipate the 18-22 W typical video-processing load.
Recommended
Wireless Baseband Digital Up/Down Conversion
The 10AX115U3F45I2SG's combination of 1,518 18x19 multipliers and 24 transceivers at 14.4 Gbps makes it well-suited for wireless baseband digital up-conversion (DUC) and down-conversion (DDC) in 4G LTE and 5G NR small-cell applications. Each transceiver lane can carry CPRI up to 9.8 Gbps, so 24 lanes support a fully populated CPRI ring back to a baseband unit. The hard floating-point DSP blocks execute CFR, DPD, and crest-factor reduction kernels in fewer clock cycles than the previous-generation Arria V. Embedded 67.5 Mbit memory holds pre-distortion lookup tables and digital predistortion sample buffers without external SRAM. The 14.4 Gbps transceiver rate provides margin for higher-order QAM and carrier aggregation. Industrial temperature grade (I2) supports outdoor small-cell enclosures. Power consumption of approximately 20-25 W at full DSP+transceiver utilization requires a forced-air heatsink.
Recommended
100G Ethernet Datapath Bridging
The 10AX115U3F45I2SG supports 100GbE aggregation by combining 24 transceivers at 14.4 Gbps into multiple 10G/25G/40G Ethernet channels, with soft IP implementing MAC, PCS, and RS-FEC layers. The 1.15M logic elements accommodate full 100G MAC-to-MAC bridge functions plus traffic shaping and QoS scheduling in a single device. The hard memory controller running DDR4 at 2666 Mbps provides line-rate buffering for 100G line cards without external packet-buffer SRAM. Industrial temp grade enables deployment in non-controlled-temperature telco edge cabinets. Estimated: total power at full 100G line rate is 28-32 W, requiring a finned heatsink with at least 200 LFM airflow. The 1932-ball FCBGA footprint aligns with standard 100G line-card PCB stack-ups.
Recommended
Military Radar Pre-Processing
The 10AX115U3F45I2SG handles radar pre-processing because its 1,518 18x19 multipliers run windowing, pulse compression, and MTI filters at multi-hundred-MHz sample rates without external DSP chips. The 67.5 Mbit of embedded M20K memory stores range-Doppler map data, and the 24 transceivers digitize antenna arrays at up to 14.4 Gbps per lane. The I2 industrial temperature grade (-40C to +100C) supports deployment in ground-vehicle and shipboard radar enclosures. AES-256 encrypted bitstream and partial reconfiguration features protect firmware IP. Estimated: at full DSP and transceiver utilization, the device dissipates 30-35 W, demanding a cold-plate or conduction-cooled heatsink in MIL-STD-810 sealed enclosures. Quartus Prime Standard Edition supports DO-254 certifiable design flows for avionics adjacent applications.
Recommended
Medical Imaging Front-End (Ultrasound / CT)
The 10AX115U3F45I2SG integrates beamforming and front-end filtering for ultrasound and CT imaging systems because its 1,518 DSP blocks execute FIR, I/Q demodulation, and envelope detection across 64-128 channels in parallel. The 67.5 Mbit M20K memory holds pre-computed beamforming coefficients and temporary scan-line buffers without external SRAM. The 24 transceivers aggregate probe-element data at up to 14.4 Gbps per lane, eliminating off-board analog front-end cards. The I2 industrial temp grade and low-jitter transceiver PLLs suit the EMI-sensitive medical environment. Estimated: power consumption of 22-28 W requires a low-profile fan-cooled heatsink in cart-mounted ultrasound systems. The AES-256 bitstream encryption protects patient-data processing IP.
Recommended
High-Performance Computing (HPC) Protocol Offload
The 10AX115U3F45I2SG fits HPC protocol-offload accelerator cards because it implements low-latency MPI, OpenSHMEM, and custom RDMA transports via its 14.4 Gbps transceivers and 1.15M logic elements. The hard memory controller with DDR4 at 2666 Mbps reduces host-CPU memory contention by buffering scatter-gather lists in FPGA-side M20K blocks. The 480 user I/Os expose PCIe Gen3 x16 and multiple 10GbE/40GbE lanes directly to the host CPU through soft IP. Industrial temp grade allows deployment in standard server chassis. Estimated: a fully loaded protocol-offload card draws 25-32 W and needs a passive heatsink with 150 LFM chassis airflow. The AES-256 encrypted bitstream protects proprietary HPC protocol IP from reverse engineering.
Recommended
Industrial Automation and Machine Vision
The 10AX115U3F45I2SG is well-suited to industrial machine-vision controllers because its 1.15M logic elements process multiple GigE Vision / CoaXPress camera streams in parallel, while the 24 transceivers drive CoaXPress links at up to 12.5 Gbps per lane. The 1,518 DSP blocks accelerate image pre-processing kernels (Sobel, Gaussian, FFT) at line-rate without external DSP chips. The 67.5 Mbit M20K memory holds frame buffers and feature-extraction tables. The I2 industrial temperature grade supports factory-floor operation from -40C to +100C. Estimated: at full machine-vision load the FPGA draws 20-26 W and requires a fanless heatsink in IP65 enclosures. The AES-256 bitstream encryption protects proprietary vision IP.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115U3F45I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115U3F45I2LG | 10AX115U3F45E2SG | 10AX115U2F45I2SG | 10AX115U2F45I2LG | 10AX115U2F45I1SG | 10AX115U2F45E2SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | U3 (U3 = fastest) | U3 | U3 | U2 (one bin slower) | U2 (one bin slower) | U2 (one bin slower) | U2 (one bin slower) |
| Temperature Grade | Industrial (I2: -40C..+100C) | Industrial (I2) | Extended (E2: 0C..+100C) | Industrial (I2) | Industrial (I2) | Industrial (I1: slowest) | Extended (E2) |
| Transceivers | 24 @ 14.4 Gbps | 24 @ 14.4 Gbps | 24 @ 14.4 Gbps | 24 @ 14.4 Gbps | 24 @ 14.4 Gbps | 24 @ 14.4 Gbps | 24 @ 14.4 Gbps |
| User I/O | 480 | 480 | 480 | 480 | 480 | 480 | 480 |
| Embedded Memory | 67.5 Mbit (1,518 M20K blocks) | 67.5 Mbit (1,518 M20K blocks) | 67.5 Mbit (1,518 M20K blocks) | 67.5 Mbit (1,518 M20K blocks) | 67.5 Mbit (1,518 M20K blocks) | 67.5 Mbit (1,518 M20K blocks) | 67.5 Mbit (1,518 M20K blocks) |
| DSP Blocks (18x19) | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 |
| RoHS / Lead-Free | RoHS (G finish) | Lead-free (L finish) | RoHS (G finish) | RoHS (G finish) | Lead-free (L finish) | RoHS (G finish) | RoHS (G finish) |
Key Differentiators
- Highest U3 speed grade in the 1.15M-LE Arria 10 F45 family (vs 10AX115U2F45I2SG)
- Industrial -40C to +100C junction rating for harsh environments (vs 10AX115U3F45E2SG)
- 24 transceivers at 14.4 Gbps in a single F45 FCBGA device (vs 10AX090U3F45I2SG)
Design Notes
Estimated: at full DSP and transceiver utilization, the 10AX115U3F45I2SG in the 1932-ball F45 FCBGA package dissipates 25-35 W. The lid requires a thermal interface material (TIM) pad or paste and an external heatsink rated for 0.2-0.3 C/W or better. Place a microvia thermal array (25+ vias per cm^2) directly under the package BGA footprint on a 12-layer PCB. For sealed industrial enclosures use a 200 LFM fan or a conduction-cooled cold plate. Always validate with the Arria 10 Early Power Estimator before committing to a thermal solution.
Power-on sequencing must follow the Arria 10 Power Management User Guide. The 0.9 V core rail must ramp last and monotonically, with VCCIO and VCCPD ramped before the core. Failure to sequence properly can trigger latch-up of the 20 nm core transistors. Use the Arria 10 development kit power tree as a reference: a dedicated Power Management IC such as the LTM4677 or ISLUSBPOLCTRL20 is recommended. Soft-start ramp time must be between 0.1 ms and 100 ms to avoid inrush trips.
The 1932-ball F45 FCBGA uses a 1.0 mm ball pitch, requiring laser-drilled microvias and a 12-layer or thicker PCB stack-up. Reference the Arria 10 F45 PCB Design Guidelines for the exact via-in-pad and back-drill stack-up. Use the Arria 10 Symbol and Footprint files from the Quartus Prime pin planner to verify the PCB footprint against the device datasheet. High-speed transceiver channels require matched-length routing with intra-pair skew less than 5 mil and lane-to-lane skew less than 50 mil for 14.4 Gbps operation.
Transceiver channels operating at 14.4 Gbps require a continuous reference-plane stack-up with no splits under the lanes. Use a 2 oz copper core for the transceiver power planes. AC-coupling capacitors must be placed within 250 mil of the FPGA ball, with the capacitor pad-to-via length matched to within 5 mil on each side of the capacitor. The PCIe Gen3 and 10GbE reference clock jitter must be below 100 fs RMS to meet the Arria 10 jitter tolerance mask. Use IBIS-AMI simulation with the Quartus Prime SI Toolkit for channel validation before tape-out.
Do not use the -E1, -E2, or -E3 speed grade for industrial temperature applications: the E grades are specified for 0C to +100C only. Substituting E2 for I2 in outdoor equipment voids the temperature rating. Do not operate the device above the maximum transceiver line rate of 14.4 Gbps: the device may produce bit errors but still appear functional. Always cross-check the bitstream SOF section against the configured device ID before release to production, especially when migrating between U3 and U2 speed grades.
Compliance Information
RoHS and lead-free compliance per Intel Arria 10 product page. AEC-Q100 not applicable (FPGA is not an automotive-grade part; automotive designers should evaluate under Intel's automotive program separately). Conflict-minerals compliance per Intel supplier declarations.
