10AX115U2F45I2SG - Arria 10 GX FPGA, 1.15M LEs, 17.4G Transceivers | Altera
MPN: 10AX115U2F45I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11114.36 | $11,114.36 |
| 10 | $10558.64 | $105,586.40 |
| 50 | $9992.92 | $499,646.00 |
| 100 | $9447.21 | $944,721.00 |
| 250 | $8902.49 | $2,225,622.50 |
Drop-in alternatives for 10AX115U2F45I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115U2F45I2LG
✅ Drop-In✓ In Stock
$9589.87 / Unit
View Datasheet →10AX115U2F45I1SG
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →10AX115U2F45E2SG
✅ Drop-In✓ In Stock
$6920.66 / Unit
View Datasheet →10AX115U2F45E2LG
✅ Drop-In✓ In Stock
$7380 / Unit
View Datasheet →10AX115U2F45E1SG
✅ Drop-In✓ In Stock
$13900 / Unit
View Datasheet →10AX115U1F45I1SG
✅ Drop-In✓ In Stock
$3720 / Unit
View Datasheet →10AX115U2F45I2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Adaptive Logic Modules (ALMs) | 427,200 |
| Embedded Memory (Bits) | 68,857,856 |
| User I/O Pins | 480 |
| Number of LABs/CLBs | 427,200 |
| Transceiver Data Rate (Chip-to-Chip) | up to 17.4 Gbps |
| Transceiver Data Rate (Backplane) | up to 12.5 Gbps |
| Core Voltage | 0.87 V to 0.98 V |
| Process Technology | 20 nm |
| Package | 1932-BBGA, FCBGA (45 x 45 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (TJ) |
| Temperature Grade | Industrial |
| Supplier Device Package | 1932-FCBGA |
10AX115U2F45I2SG 1932-fcbga Pin Configuration Guide
Complete pinout information for 10AX115U2F45I2SG (1932-fcbga package) with 480 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115U2F45I2SG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 480 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115U2F45I2SG is suitable for 7 applications: 100G/400G Optical Transport Line Cards, 4K UHD Broadcast Video Processing, Military Radar and Electronic Warfare Signal Chains, Medical Imaging Reconstruction Pipelines, 5G Wireless Fronthaul/Backhaul Aggregation, ASIC Prototyping and Emulation Platforms, High-Frequency Trading Acceleration.
100G/400G Optical Transport Line Cards
The 10AX115U2F45I2SG fits 100G/400G optical transport line cards because its 17.4 Gbps chip-to-chip transceivers enable four lanes of 25 Gbps to form a 100G interface via gearbox logic in fabric. Combined with hard PCI Express Gen3 IP blocks, hard DDR4 controllers up to 1,200 MHz, and 1.15M logic elements, the device can implement MAC, PCS, and framer functions alongside the SERDES, eliminating external PHY chips. The 480 user I/Os accommodate 100G Ethernet MAC plus OTU4 framer data paths, while the 68 Mbit embedded RAM buffers packet bursts. Compared with ASIC solutions, this part cuts NRE and time-to-market for low-volume OTN and packet-optical transport platforms. Designers should target 25-35 W thermal envelopes with 1500 LFM airflow.
Recommended
4K UHD Broadcast Video Processing
In 4K UHD broadcast video processing pipelines, the 10AX115U2F45I2SG delivers the parallel datapath density required for real-time 12G-SDI, HDMI 2.0, and DisplayPort 1.4 aggregation. Its 1.15M logic elements sustain color-space conversion, scaling, frame-rate conversion, and HDR tone-mapping at 60 fps. The hard DSP blocks accelerate motion-adaptive deinterlacing and noise reduction, offloading fabric resources. The 480 user I/Os accept multiple 12G-SDI streams plus PTP reference timing, while the 12.5 Gbps backplane transceivers handle inter-card linking in modular broadcast routers. The industrial -40C to +100C temperature grade supports outdoor broadcast head-end installations and OB truck environments.
Recommended
Military Radar and Electronic Warfare Signal Chains
Radar and electronic-warfare systems leverage the 10AX115U2F45I2SG's 17.4 Gbps transceivers for direct ADC/DAC interface plus its 1.15M logic elements for FFT, beamforming, and pulse-Doppler processing. The hardened floating-point DSP block architecture implements 4096-point FFTs in fewer cycles than soft cores, freeing fabric for adaptive null-steering and jam-detection algorithms. The industrial -40C to +100C temperature grade supports ground-mobile and naval installations, while 12.5 Gbps backplane transceivers connect to downstream signal recorders. Mission-critical designs benefit from the deterministic latency of hard memory controllers for chirp-table replay and matched-filter correlation.
Recommended
Medical Imaging Reconstruction Pipelines
The 10AX115U2F45I2SG accelerates CT, MRI, and PET reconstruction pipelines where iterative algorithms demand high floating-point throughput. Its hardened DSP blocks execute back-projection and SIRT kernels at deterministic latency, while the 1.15M logic elements implement parallel sensor-fusion paths for hybrid PET-MRI scanners. The 68 Mbit embedded RAM holds projection slices and intermediate sinograms without external memory pressure. Hard DDR4 controllers sustain 2,400 MTPS bandwidth for raw k-space data ingestion from 16-channel MRI receivers. The industrial -40C to +100C temperature range and surface-mount FCBGA package support hospital equipment deployment and mobile CT installations.
Recommended
5G Wireless Fronthaul/Backhaul Aggregation
In 5G fronthaul and backhaul aggregation equipment, the 10AX115U2F45I2SG's 17.4 Gbps transceivers drive 25G eCPRI and CPRI-10 optical links to remote radio heads. The 1.15M logic elements implement MACsec, packet segmentation, and QoS scheduling for thousands of radio flows simultaneously. Hard PCI Express Gen3 IP blocks connect to host CPUs and network processors, while hard DDR4 controllers buffer aggregate traffic at line rate. The 480 user I/Os accept multiple 10G/25G Ethernet SFPs plus timing synchronization inputs (PTP, SyncE). The industrial temperature grade is essential for outdoor cell-site gateway installations.
Recommended
ASIC Prototyping and Emulation Platforms
ASIC prototyping and emulation platforms use the 10AX115U2F45I2SG because its 1.15M logic elements, 68 Mbit embedded RAM, and 480 user I/Os provide dense capacity for partitioning large ASIC RTL into multiple FPGAs. The 17.4 Gbps transceivers deliver multi-Gbps chip-to-chip bridges between FPGAs on the prototyping board, supporting designs up to 100M ASIC gates when partitioned across four to six devices. Hard DDR4 controllers enable pre-silicon software validation at near-real memory latency. The deterministic timing closure of the 20 nm process simplifies timing-driven partitioning compared to smaller-node FPGAs where variability dominates.
Recommended
High-Frequency Trading Acceleration
In high-frequency trading (HFT) acceleration cards, the 10AX115U2F45I2SG implements feed handlers, market-data parsers, and order-book state machines with deterministic sub-microsecond latency. The 17.4 Gbps transceivers deliver raw market-data feeds from co-located exchange gateways with minimal protocol overhead. Hard DDR4 controllers provide predictable read-write cycles for order-book caches, while the 1.15M logic elements run parallel TCP/UDP reassembly and FIX/ITCH decoding pipelines. The industrial temperature grade supports co-location data-center environments with high ambient temperatures. Latency-tuning guidance from the Arria 10 GX Transceiver PHY User Guide supports per-pipeline timing closure for nanosecond-level optimization.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115U2F45I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115U2F45I2LG | 10AX115U2F45I1SG | 10AX115U2F45E2SG | 10AX115U2F45E2LG | 10AX115U2F45E1SG | 10AX115U1F45I1SG |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1932-BBGA, FCBGA (45x45 mm) | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | U2 | U2 | U1 | U2 | U2 | U1 | U1 |
| Temperature Grade | Industrial (-40C to +100C TJ) | Industrial | Industrial | Commercial (0C to +100C) | Commercial | Commercial | Industrial |
| User I/O Pins | 480 | 480 | 480 | 480 | 480 | 480 | 480 |
| Transceiver Rate (Chip-to-Chip) | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
| Embedded RAM (Bits) | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Approximate Unit Price (USD, as of 2026-09-05) | 11,114.36 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest speed grade U2 plus industrial temperature grade in the same 1932-FCBGA package (vs 10AX115U2F45I1SG)
- Industrial temperature operation versus commercial-only alternative (vs 10AX115U2F45E2SG)
- Direct drop-in alternative with identical silicon and package footprint (vs 10AX115U2F45I2LG)
Design Notes
Estimated: a 100G line-card design using the 10AX115U2F45I2SG at 80 percent logic utilization and full transceiver activity will dissipate 25-35 W. The 1932-FCBGA junction-to-ambient thermal resistance with 1500 LFM airflow is approximately 1.5 C/W, yielding a 38-53 C junction rise above 25 C ambient. Industrial -40C to +100C TJ operation requires sustained airflow and a heatsink; without airflow, the part will thermally throttle within seconds under typical 25 W load.
The 1932-ball FC-FBGA package demands a high-density PCB stack-up with microvias, laser-drilled blind/buried vias, and 12 or more layers. Use a 1.0 mm pitch BGA fanout with via-in-pad for transceiver channels, length-match the differential pairs to within 5 mil for 17.4 Gbps operation, and provide a continuous ground plane under the transceiver region. Reference the Altera Arria 10 GX Transceiver PHY User Guide pinout table for ball assignments and the Pin Connection Guidelines for unused-pin termination rules.
Provide a multi-rail power-delivery network for the 10AX115U2F45I2SG: core (0.87-0.98 V), auxiliary, PLL, transceiver, and I/O supplies. Decoupling capacitors must cover at least 12 frequency decades from 100 kHz bulk electrolytics to 10 nF 0402 ceramics placed within 100 mil of the supply balls. The transceiver PLLs require a quiet 0.95 V analog supply; isolate from digital switching noise with a ferrite bead or pi-filter. Use the PowerPlay Early Power Estimator before schematic freeze to size the regulators correctly.
Common pitfalls with the 10AX115U2F45I2SG include: (1) ignoring configuration mode selection - MSEL pins must match the chosen AS/PS/JTAG mode at first power-up; (2) underestimating configuration time - large bitstreams take several hundred milliseconds, so design reset sequencing with this delay; (3) mixing I/O standards without per-bank VREF - the device supports mixed-voltage I/O banks, but each bank has a single VCCIO and VREF; (4) omitting pull-downs on unused transceiver RX pins - floating inputs oscillate and increase power.
For 17.4 Gbps transceiver operation, follow these signal-integrity rules: use a reference clock with sub-200 fs RMS jitter, route transceiver traces on the top/bottom layers over a continuous ground plane, and apply 100 ohm differential impedance with controlled skew. Pre-emphasis and equalization settings from the Arria 10 GX Transceiver PHY User Guide must be tuned per channel length; default settings work to 100 mm FR4 but require adjustment for backplanes.
Compliance Information
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status were not present in the verified web data; flagged as unknown pending manufacturer confirmation. AEC-Q100 is not applicable for FPGAs - the relevant automotive qualification is AEC-Q100 for ICs in safety-critical automotive electronics, which Arria 10 GX variants may optionally carry under the I2SG/automotive-grade suffix scheme.