10M25SAE144I7G - MAX 10 FPGA 25K LE 144-LQFP | Intel / Altera
N.º da peça: 10M25SAE144I7G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $70.12 | $70,12 |
| 10 | $65.5 | $655,00 |
| 100 | $58 | $5.800,00 |
| 250 | $54.5 | $13.625,00 |
| 500 | $50.75 | $25.375,00 |
10M25SAE144I7G Visão geral
A MAX 10 FPGA is a non-volatile, flash-based programmable logic device that combines look-up tables, embedded memory blocks, digital signal processing blocks, phase-locked loops, and on-chip analog-to-digital converters in a single die. Within the broader programmable logic taxonomy, MAX 10 sits below Cyclone 10 LP in cost and power, above CPLDs such as MAX V in density and DSP capability, and is the lowest-cost Intel FPGA family with integrated ADC and instant-on flash configuration.
Key features include 25,000 logic elements, 45 embedded 18x18 multipliers, four 12-bit 1 MSPS analog-to-digital converters, 1.2 V core voltage, and support for LVDS, LVCMOS, SSTL, and other single-ended I/O standards. The device also integrates user flash memory for non-volatile data storage, dual configuration flash for instant-on operation, and an on-chip temperature-sensing diode. The 144-LQFP exposed-pad package (E144) provides up to 101 general-purpose user I/O with a 22x22 mm body footprint suitable for industrial reflow assembly.
The MAX 10 architecture uses a logic-element fabric with adaptive logic modules, embedded SRAM blocks, and DSP blocks optimized for fixed- and floating-point operations. The integrated 12-bit ADC supports up to 17 analog input channels via the dedicated analog package pins, while the flash-based configuration memory eliminates external boot PROMs and enables sub-10 ms instant-on behavior in safety-critical industrial systems.
Typical applications include industrial control and motor drive, machine vision pre-processing, factory automation I/O expansion, video bridging and display controllers, low-cost ASIC/ASSP replacement, and distributed I/O aggregation at the edge of industrial Ethernet networks. The combination of non-volatile flash configuration, integrated 12-bit ADC, and industrial temperature grade makes it well suited for glue-logic designs with analog sensing and instant-on behavior.
When designing with this part, ensure the exposed pad is soldered to a sufficiently large copper pour for thermal dissipation and ground integrity, since high-utilization designs in the E144 package can dissipate 1-2 W. Use Intel Quartus Prime Lite for synthesis, place-and-route, and timing closure at no additional cost. Vertical migration between MAX 10 density grades within the same E144 footprint enables seamless design scaling.
This page synthesizes distributor pricing across DigiKey, Mouser, and Arrow, cross-references drop-in same-package MAX 10 alternatives, and consolidates practical design guidance not found in the manufacturer datasheet.
Alternativas drop-in para 10M25SAE144I7G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10M25SAE144I7G (mesmo formato e footprint) — diferindo em Package, Core Voltage, Logic Elements (LE), Operating Temperature, User Flash Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10M16SAE144I7G
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10M40SAE144I7G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$57.1 / unidade
Ver ficha técnica →10M50SAE144I7G
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10M25SAE144A7G
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10M25SCE144A7G
✅ Drop-In✓ Em estoque
$47.21 / unidade
Ver ficha técnica →10M08SAE144I7G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.8 / unidade
Ver ficha técnica →10M25SAE144I7G Classificações máximas e características elétricas
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 25,000 |
| Embedded Memory | 1,728 Kbits (691,200 bits) |
| Embedded Multipliers (18x18) | 45 |
| User I/O Pins | 101 |
| ADC Channels | 4 (12-bit, 1 MSPS) |
| User Flash Memory | Up to 1.6 Mbits |
| Process Node | 55 nm |
| Core Voltage | 1.2 V |
| Supply Voltage (Rails) | 3.0 V / 3.3 V |
| Temperatura de operação | -40C to +100C (industrial, I7G grade) |
| Encapsulamento | 144-LQFP Exposed Pad (E144), 22x22 mm |
| Tipo de montagem | Surface Mount |
| Configuration Memory | Internal flash (non-volatile, instant-on) |
| Status RoHS | Compliant |
| I/O Standards Supported | LVDS, LVCMOS, SSTL |
Configuração de pinos do 10M25SAE144I7G
| Pino 1 | I/O — General-purpose user I/O (bank 1) |
| Pino 2 | I/O — General-purpose user I/O (bank 1) |
| Pino 3 | I/O — General-purpose user I/O (bank 1) |
| Pino 4 | I/O — General-purpose user I/O (bank 1) |
| Pino 5 | I/O — General-purpose user I/O (bank 1) |
| Pino 6 | I/O — General-purpose user I/O (bank 1) |
| Pino 7 | I/O — General-purpose user I/O (bank 1) |
| Pino 8 | I/O — General-purpose user I/O (bank 1) |
| Pino 9 | I/O — General-purpose user I/O (bank 1) |
| Pino 10 | I/O — General-purpose user I/O (bank 1) |
| Pino 11 | I/O — General-purpose user I/O (bank 1) |
| Pino 12 | I/O — General-purpose user I/O (bank 1) |
| Pino 13 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 14 | I/O — General-purpose user I/O (bank 1) |
| Pino 15 | I/O — General-purpose user I/O (bank 1) |
| Pino 16 | I/O — General-purpose user I/O (bank 1) |
| Pino 17 | I/O — General-purpose user I/O (bank 1) |
| Pino 18 | I/O — General-purpose user I/O (bank 1) |
| Pino 19 | I/O — General-purpose user I/O (bank 1) |
| Pino 20 | I/O — General-purpose user I/O (bank 1) |
| Pino 21 | I/O — General-purpose user I/O (bank 1) |
| Pino 22 | I/O — General-purpose user I/O (bank 1) |
| Pino 23 | I/O — General-purpose user I/O (bank 1) |
| Pino 24 | I/O — General-purpose user I/O (bank 1) |
| Pino 25 | GND — Ground |
| Pino 26 | I/O — General-purpose user I/O (bank 2) |
| Pino 27 | I/O — General-purpose user I/O (bank 2) |
| Pino 28 | I/O — General-purpose user I/O (bank 2) |
| Pino 29 | I/O — General-purpose user I/O (bank 2) |
| Pino 30 | I/O — General-purpose user I/O (bank 2) |
| Pino 31 | I/O — General-purpose user I/O (bank 2) |
| Pino 32 | I/O — General-purpose user I/O (bank 2) |
| Pino 33 | I/O — General-purpose user I/O (bank 2) |
| Pino 34 | I/O — General-purpose user I/O (bank 2) |
| Pino 35 | I/O — General-purpose user I/O (bank 2) |
| Pino 36 | I/O — General-purpose user I/O (bank 2) |
| Pino 37 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 38 | I/O — General-purpose user I/O (bank 2) |
| Pino 39 | I/O — General-purpose user I/O (bank 2) |
| Pino 40 | I/O — General-purpose user I/O (bank 2) |
| Pino 41 | I/O — General-purpose user I/O (bank 2) |
| Pino 42 | I/O — General-purpose user I/O (bank 2) |
| Pino 43 | I/O — General-purpose user I/O (bank 2) |
| Pino 44 | I/O — General-purpose user I/O (bank 2) |
| Pino 45 | I/O — General-purpose user I/O (bank 2) |
| Pino 46 | I/O — General-purpose user I/O (bank 2) |
| Pino 47 | I/O — General-purpose user I/O (bank 2) |
| Pino 48 | I/O — General-purpose user I/O (bank 2) |
| Pino 49 | I/O — General-purpose user I/O (bank 2) |
| Pino 50 | GND — Ground |
| Pino 51 | I/O — General-purpose user I/O (bank 3) |
| Pino 52 | I/O — General-purpose user I/O (bank 3) |
| Pino 53 | I/O — General-purpose user I/O (bank 3) |
| Pino 54 | I/O — General-purpose user I/O (bank 3) |
| Pino 55 | I/O — General-purpose user I/O (bank 3) |
| Pino 56 | I/O — General-purpose user I/O (bank 3) |
| Pino 57 | I/O — General-purpose user I/O (bank 3) |
| Pino 58 | I/O — General-purpose user I/O (bank 3) |
| Pino 59 | I/O — General-purpose user I/O (bank 3) |
| Pino 60 | I/O — General-purpose user I/O (bank 3) |
| Pino 61 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 62 | I/O — General-purpose user I/O (bank 3) |
| Pino 63 | I/O — General-purpose user I/O (bank 3) |
| Pino 64 | I/O — General-purpose user I/O (bank 3) |
| Pino 65 | I/O — General-purpose user I/O (bank 3) |
| Pino 66 | I/O — General-purpose user I/O (bank 3) |
| Pino 67 | I/O — General-purpose user I/O (bank 3) |
| Pino 68 | I/O — General-purpose user I/O (bank 3) |
| Pino 69 | I/O — General-purpose user I/O (bank 3) |
| Pino 70 | I/O — General-purpose user I/O (bank 3) |
| Pino 71 | I/O — General-purpose user I/O (bank 3) |
| Pino 72 | I/O — General-purpose user I/O (bank 3) |
| Pino 73 | I/O — General-purpose user I/O (bank 3) |
| Pino 74 | GND — Ground |
| Pino 75 | I/O — General-purpose user I/O (bank 4) |
| Pino 76 | I/O — General-purpose user I/O (bank 4) |
| Pino 77 | I/O — General-purpose user I/O (bank 4) |
| Pino 78 | I/O — General-purpose user I/O (bank 4) |
| Pino 79 | I/O — General-purpose user I/O (bank 4) |
| Pino 80 | I/O — General-purpose user I/O (bank 4) |
| Pino 81 | I/O — General-purpose user I/O (bank 4) |
| Pino 82 | I/O — General-purpose user I/O (bank 4) |
| Pino 83 | I/O — General-purpose user I/O (bank 4) |
| Pino 84 | I/O — General-purpose user I/O (bank 4) |
| Pino 85 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 86 | I/O — General-purpose user I/O (bank 4) |
| Pino 87 | I/O — General-purpose user I/O (bank 4) |
| Pino 88 | I/O — General-purpose user I/O (bank 4) |
| Pino 89 | I/O — General-purpose user I/O (bank 4) |
| Pino 90 | I/O — General-purpose user I/O (bank 4) |
| Pino 91 | I/O — General-purpose user I/O (bank 4) |
| Pino 92 | I/O — General-purpose user I/O (bank 4) |
| Pino 93 | I/O — General-purpose user I/O (bank 4) |
| Pino 94 | I/O — General-purpose user I/O (bank 4) |
| Pino 95 | I/O — General-purpose user I/O (bank 4) |
| Pino 96 | I/O — General-purpose user I/O (bank 4) |
| Pino 97 | I/O — General-purpose user I/O (bank 4) |
| Pino 98 | GND — Ground |
| Pino 99 | I/O — General-purpose user I/O (bank 5) |
| Pino 100 | I/O — General-purpose user I/O (bank 5) |
| Pino 101 | I/O — General-purpose user I/O (bank 5) |
| Pino 102 | I/O — General-purpose user I/O (bank 5) |
| Pino 103 | I/O — General-purpose user I/O (bank 5) |
| Pino 104 | I/O — General-purpose user I/O (bank 5) |
| Pino 105 | I/O — General-purpose user I/O (bank 5) |
| Pino 106 | I/O — General-purpose user I/O (bank 5) |
| Pino 107 | I/O — General-purpose user I/O (bank 5) |
| Pino 108 | I/O — General-purpose user I/O (bank 5) |
| Pino 109 | VCCIO5 — I/O bank 5 supply voltage |
| Pino 110 | I/O — General-purpose user I/O (bank 5) |
| Pino 111 | I/O — General-purpose user I/O (bank 5) |
| Pino 112 | I/O — General-purpose user I/O (bank 5) |
| Pino 113 | I/O — General-purpose user I/O (bank 5) |
| Pino 114 | I/O — General-purpose user I/O (bank 5) |
| Pino 115 | I/O — General-purpose user I/O (bank 5) |
| Pino 116 | I/O — General-purpose user I/O (bank 5) |
| Pino 117 | I/O — General-purpose user I/O (bank 5) |
| Pino 118 | I/O — General-purpose user I/O (bank 5) |
| Pino 119 | I/O — General-purpose user I/O (bank 5) |
| Pino 120 | I/O — General-purpose user I/O (bank 5) |
| Pino 121 | I/O — General-purpose user I/O (bank 5) |
| Pino 122 | GND — Ground |
| Pino 123 | I/O — General-purpose user I/O (bank 6) |
| Pino 124 | I/O — General-purpose user I/O (bank 6) |
| Pino 125 | I/O — General-purpose user I/O (bank 6) |
| Pino 126 | I/O — General-purpose user I/O (bank 6) |
| Pino 127 | I/O — General-purpose user I/O (bank 6) |
| Pino 128 | I/O — General-purpose user I/O (bank 6) |
| Pino 129 | I/O — General-purpose user I/O (bank 6) |
| Pino 130 | I/O — General-purpose user I/O (bank 6) |
| Pino 131 | I/O — General-purpose user I/O (bank 6) |
| Pino 132 | I/O — General-purpose user I/O (bank 6) |
| Pino 133 | VCCIO6 — I/O bank 6 supply voltage |
| Pino 134 | I/O — General-purpose user I/O (bank 6) |
| Pino 135 | I/O — General-purpose user I/O (bank 6) |
| Pino 136 | I/O — General-purpose user I/O (bank 6) |
| Pino 137 | I/O — General-purpose user I/O (bank 6) |
| Pino 138 | I/O — General-purpose user I/O (bank 6) |
| Pino 139 | I/O — General-purpose user I/O (bank 6) |
| Pino 140 | I/O — General-purpose user I/O (bank 6) |
| Pino 141 | I/O — General-purpose user I/O (bank 6) |
| Pino 142 | I/O — General-purpose user I/O (bank 6) |
| Pino 143 | I/O — General-purpose user I/O (bank 6) |
| Pino 144 | I/O — General-purpose user I/O (bank 6) |
| Pino EPAD | GND/thermal — Exposed thermal pad - must be soldered to ground plane |
Aplicações típicas
10M25SAE144I7G é adequado para 6 aplicaçãos: Industrial Motor Drive Controller, Machine Vision Pre-Processing Bridge, Factory Automation I/O Expansion, Video Bridging and Display Controller, Low-Cost ASIC/ASSP Replacement, Distributed Industrial Ethernet I/O Aggregation.
Industrial Motor Drive Controller
The 10M25SAE144I7G is well suited to industrial motor-drive controllers because its 25K logic elements can host encoder interfaces, PWM generation, and field-oriented control state machines while the integrated 12-bit ADC samples motor current and back-EMF without an external ADC IC. The non-volatile flash configuration delivers sub-10 ms instant-on, eliminating the boot delay typical of SRAM-based FPGAs in safety-critical drives. The industrial temperature grade (-40C to +100C for I7G) handles cabinet-side ambient swings near inverters. With 101 user I/O, designers can parallel several SPI encoder channels plus isolated UART/CAN links to a host PLC within the same device.
Recomendado
Machine Vision Pre-Processing Bridge
In machine vision pre-processing, the 10M25SAE144I7G bridges parallel image sensors to host SoCs while performing thresholding, ROI cropping, and line-buffer management. The 45 embedded 18x18 multipliers accelerate small convolutional kernels for edge detection at line rate, and the 1,728 Kbits of embedded memory hold line buffers without external SRAM. LVDS support enables direct connection to high-speed image sensors, while the 144-LQFP exposed-pad package fits in compact 22x22 mm camera modules. Quartus Prime Lite provides a free toolchain for designers prototyping vision pipelines.
Recomendado
Factory Automation I/O Expansion
Factory automation I/O expansion modules use the 10M25SAE144I7G to aggregate discrete sensors, opto-isolated inputs, and relay outputs onto a single fieldbus link. The 101 user I/O accommodate dozens of 24V-tolerant channels when paired with external level shifters, while the 12-bit ADC monitors supply rails and analog sensor outputs. Non-volatile instant-on behavior ensures deterministic startup when cabinets are power-cycled, which simplifies IEC 61131 PLC integration. The device pairs naturally with industrial Ethernet PHYs to form distributed I/O slices at sub-station granularity.
Recomendado
Video Bridging and Display Controller
Video bridging applications such as LVDS-to-RGB or MIPI-to-LVDS conversion leverage the 10M25SAE144I7G's LVDS support, 25K logic elements for protocol conversion, and 1,728 Kbits of embedded memory for line buffering. The exposed-pad 144-LQFP package mounts on cost-sensitive display controller boards where BGA packages would inflate assembly cost. Designers can prototype format converters, scalers, and timing generators in Quartus Prime Lite, then migrate the same firmware to higher-density MAX 10 or Cyclone devices without changing the PCB footprint.
Recomendado
Low-Cost ASIC/ASSP Replacement
The 10M25SAE144I7G is frequently used as a low-cost ASIC/ASSP replacement for low-to-mid volume products where a custom mask set is uneconomical. Its 25K logic elements, 45 multipliers, four ADCs, and non-volatile configuration let designers consolidate what would otherwise require a microcontroller, external ADC, configuration EEPROM, and discrete glue logic into a single 22x22 mm package. Quartus Prime Lite is free, eliminating per-seat toolchain licensing fees. Vertical migration to 10M40 or 10M50 within the same footprint lets the same PCB scale from prototype to feature-rich derivative.
Recomendado
Distributed Industrial Ethernet I/O Aggregation
At the edge of industrial Ethernet networks, the 10M25SAE144I7G aggregates sensor data from multiple field-side nodes and forwards it over EtherCAT, PROFINET, or Modbus TCP links. The 12-bit ADC integrates analog sensor sampling into the same device that runs the industrial protocol stack in soft logic. Non-volatile flash configuration eliminates boot delay concerns when the node is power-cycled by the upstream switch. With 101 user I/O and an industrial temperature grade, the device fits compact IP67 field-mount enclosures typical of modern smart-factory deployments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10M25SAE144I7G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10M16SAE144I7G | 10M40SAE144I7G | 10M50SAE144I7G | 10M25SAE144A7G | 10M25SCE144A7G | 10M08SAE144I7G |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (E144), 22x22 mm | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 25,000 | 16,000 (-36%) | 40,000 (+60%) | 50,000 (+100%) | 25,000 (same) | 25,000 (same) | 8,000 (-68%) |
| Embedded Memory (Kbits) | 1,728 | 1,152 (-33%) | 1,260 (-27%) | 1,638 (-5%) | 1,728 (same) | 1,728 (same) | 378 (-78%) |
| 18x18 Multipliers | 45 | 32 (-29%) | 70 (+56%) | 144 (+220%) | 45 (same) | 45 (same) | 16 (-64%) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C |
| Speed Grade | I7G | I7G | I7G | I7G | A7G (commercial) | A7G (commercial) | I7G |
| Integrated ADC | 4 (12-bit, 1 MSPS) | 4 (12-bit, 1 MSPS) | 4 (12-bit, 1 MSPS) | 4 (12-bit, 1 MSPS) | 4 (12-bit, 1 MSPS) | 4 (12-bit, 1 MSPS) | 4 (12-bit, 1 MSPS) |
| Configuration Memory | Internal flash (non-volatile) | Internal flash | Internal flash | Internal flash | Internal flash | Internal flash | Internal flash |
Principais diferenciais
- Non-volatile flash configuration with integrated 12-bit ADC (vs Lattice ECP5 LFE5U-25F)
- 144-LQFP exposed-pad package with vertical migration (vs Lattice MachXO3-4300)
- Free Quartus Prime Lite toolchain (vs Xilinx Spartan-6)
Notas de projeto
Solder the exposed pad (EPAD) of the 144-LQFP package to a continuous ground copper pour of at least 1 square inch to dissipate 1-2 W typical and avoid thermal shutdown. Without a continuous ground pour the junction-to-ambient thermal resistance rises sharply and the device may throttle. Estimated: at 1.5 W dissipation, a 25x25 mm 4-layer 1 oz copper pour keeps theta_JA below 25 C/W, supporting industrial-temperature operation without active cooling.
Decouple each VCCIO bank pin with a 0.1 uF ceramic capacitor placed within 5 mm of the pin, and add a bulk 10 uF tantalum or ceramic capacitor near the VCCINT/VCCIO cluster. The MAX 10 device is sensitive to rail noise during configuration; insufficient decoupling can cause configuration failure or CRC errors on flash memory. Estimated: budget 20 decoupling capacitors total for the 144-LQFP package power pins.
Route LVDS pairs with 100 ohm differential impedance and matched trace lengths within 150 mils to avoid skew on high-speed LVDS channels. Use 4-layer stackup with continuous reference planes; the 22x22 mm LQFP body has long lead spans, so signal-via antipad clearance must be respected to maintain impedance. Refer to the Intel MAX 10 handbook pin connection guidelines for bank-by-bank VREF and VCCIO routing.
Keep analog input pins to the dedicated ANA pins separate from digital I/O traces, and guard the analog section with a ground ring to isolate ADC sampling noise. The four integrated 12-bit ADCs sample at 1 MSPS and will couple switching noise from nearby digital lines if layout is careless. Estimated: maintain at least 5 mm between analog input traces and any switching signal traces.
Do not confuse the I7G speed grade with the C7G commercial-temperature speed grade - the I7G part is industrial-temperature qualified while A7G is commercial-only. Also note that the MAX 10 E144 package uses identical pinouts across density grades (10M02, 10M04, 10M08, 10M16, 10M25, 10M40, 10M50), enabling vertical migration within the same PCB footprint if Quartus Prime recompilation is acceptable.
Informações de conformidade
RoHS and REACH compliant per Intel MAX 10 product family documentation. AEC-Q100 not applicable - this is a non-automotive-grade industrial FPGA. Lead-free assembly process supported; halogen-free status not explicitly stated in provided data.
