Intel

10M25SAE144I7G - MAX 10 FPGA 25K LE 144-LQFP | Intel / Altera

MPN: 10M25SAE144I7G ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss LVDS, LVCMOS, SSTL Rds(on) 144-LQFP Exposed Pad (E144), 22x22 mm Package 1,728 Kbits (691,200 bits) Memory
From $50.75 USD / Unit
MOQ: 1 |
Price updated: 2026-10-05
Volume Pricing
Qty Unit Price Extended
1 $70.12 $70.12
10 $65.5 $655.00
100 $58 $5,800.00
250 $54.5 $13,625.00
500 $50.75 $25,375.00
ℹ️ All prices are in USD

10M25SAE144I7G Overview

The Intel (formerly Altera) MAX 10 10M25SAE144I7G is a non-volatile Field Programmable Gate Array from the MAX 10 family, integrating 25,000 logic elements, 691,200 bits of embedded memory (1,728 Kbits), and 144 EQFP pins in a 144-LQFP exposed-pad package. The device supports up to 101 user I/O pins and is fabricated on a 55 nm process node, targeting low-power, instant-on, single-chip FPGA applications with 3.0 V/3.3 V rail support.

A MAX 10 FPGA is a non-volatile, flash-based programmable logic device that combines look-up tables, embedded memory blocks, digital signal processing blocks, phase-locked loops, and on-chip analog-to-digital converters in a single die. Within the broader programmable logic taxonomy, MAX 10 sits below Cyclone 10 LP in cost and power, above CPLDs such as MAX V in density and DSP capability, and is the lowest-cost Intel FPGA family with integrated ADC and instant-on flash configuration.

Key features include 25,000 logic elements, 45 embedded 18x18 multipliers, four 12-bit 1 MSPS analog-to-digital converters, 1.2 V core voltage, and support for LVDS, LVCMOS, SSTL, and other single-ended I/O standards. The device also integrates user flash memory for non-volatile data storage, dual configuration flash for instant-on operation, and an on-chip temperature-sensing diode. The 144-LQFP exposed-pad package (E144) provides up to 101 general-purpose user I/O with a 22x22 mm body footprint suitable for industrial reflow assembly.

The MAX 10 architecture uses a logic-element fabric with adaptive logic modules, embedded SRAM blocks, and DSP blocks optimized for fixed- and floating-point operations. The integrated 12-bit ADC supports up to 17 analog input channels via the dedicated analog package pins, while the flash-based configuration memory eliminates external boot PROMs and enables sub-10 ms instant-on behavior in safety-critical industrial systems.

Typical applications include industrial control and motor drive, machine vision pre-processing, factory automation I/O expansion, video bridging and display controllers, low-cost ASIC/ASSP replacement, and distributed I/O aggregation at the edge of industrial Ethernet networks. The combination of non-volatile flash configuration, integrated 12-bit ADC, and industrial temperature grade makes it well suited for glue-logic designs with analog sensing and instant-on behavior.

When designing with this part, ensure the exposed pad is soldered to a sufficiently large copper pour for thermal dissipation and ground integrity, since high-utilization designs in the E144 package can dissipate 1-2 W. Use Intel Quartus Prime Lite for synthesis, place-and-route, and timing closure at no additional cost. Vertical migration between MAX 10 density grades within the same E144 footprint enables seamless design scaling.

This page synthesizes distributor pricing across DigiKey, Mouser, and Arrow, cross-references drop-in same-package MAX 10 alternatives, and consolidates practical design guidance not found in the manufacturer datasheet.

Drop-in alternatives for 10M25SAE144I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with 10M25SAE144I7G (same form factor and footprint) — differing in Package, Core Voltage, Logic Elements (LE), Operating Temperature, User Flash Memory.

Intel
Package: 144-LQFP Exposed Pad (EQFP-144)
Core Voltage: 3.3 V (single supply)
Logic Elements (LE): 8000
Compare with 10M25SAE144I7G →
Intel
Package: 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch
Operating Temperature: -40C to +85C (industrial)
Compare with 10M25SAE144I7G →
Altera
Package: 144-LQFP Exposed Pad (EQFP EP)
Logic Elements (LE): 25000
User Flash Memory: 691200 bits
Compare with 10M25SAE144I7G →
Intel
Package: 144-LQFP Exposed Pad (EQFP-144)
Core Voltage: 1.2 V (internal regulation)
Compare with 10M25SAE144I7G →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

10M16SAE144I7G

✅ Drop-In ⚠️ Specs Unverified
📦 144-LQFP Exposed Pad (E144)
same E144 footprint, 16K LE vs 25K LE (-36% density), pin-to-pin compatible

📋 Reference alternative (not in catalog)

10M40SAE144I7G

✅ Drop-In ⚠️ Specs Unverified
Intel
📦 144-LQFP Exposed Pad (E144)
MAX 10 · 40,000 · 101 · 1,290,240 · 5,140 · 168 · 55 nm

✓ In Stock

$57.1 / Unit

View Datasheet →

10M50SAE144I7G

✅ Drop-In ⚠️ Specs Unverified
📦 144-LQFP Exposed Pad (E144)
same E144 footprint, 50K LE vs 25K LE (+100% density), pin-to-pin compatible

📋 Reference alternative (not in catalog)

10M25SAE144A7G

✅ Drop-In
📦 144-LQFP Exposed Pad (E144)
same E144 footprint, commercial temp 0C to +85C vs industrial -40C to +100C

📋 Reference alternative (not in catalog)

10M25SCE144A7G

✅ Drop-In
Altera
📦 144-LQFP Exposed Pad (E144)
MAX 10 · 25000 · 691200 bits · 101 · 55 nm CMOS · 1.2 V · 3.3 V · 144-LQFP Exposed Pad (EQFP EP)

✓ In Stock

$47.21 / Unit

View Datasheet →

10M08SAE144I7G

✅ Drop-In ⚠️ Specs Unverified
Intel
📦 144-LQFP Exposed Pad (E144)
MAX 10 · 8000 · 387072 (378 Kb) · 1540 Kb (dual-configuration) · 101 · 2.85 V to 3.465 V · 3.3 V (single supply) · -40°C to +100°C (TJ)

✓ In Stock

$6.8 / Unit

View Datasheet →

10M25SAE144I7G Maximum Ratings & Electrical Characteristics

Series MAX 10
Family MAX 10 FPGA
Logic Elements (LE) 25,000
Embedded Memory 1,728 Kbits (691,200 bits)
Embedded Multipliers (18x18) 45
User I/O Pins 101
ADC Channels 4 (12-bit, 1 MSPS)
User Flash Memory Up to 1.6 Mbits
Process Node 55 nm
Core Voltage 1.2 V
Supply Voltage (Rails) 3.0 V / 3.3 V
Operating Temperature -40C to +100C (industrial, I7G grade)
Package 144-LQFP Exposed Pad (E144), 22x22 mm
Mounting Type Surface Mount
Configuration Memory Internal flash (non-volatile, instant-on)
RoHS Status Compliant
I/O Standards Supported LVDS, LVCMOS, SSTL

10M25SAE144I7G Pin Configuration

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Pin 1 I/O — General-purpose user I/O (bank 1)
Pin 2 I/O — General-purpose user I/O (bank 1)
Pin 3 I/O — General-purpose user I/O (bank 1)
Pin 4 I/O — General-purpose user I/O (bank 1)
Pin 5 I/O — General-purpose user I/O (bank 1)
Pin 6 I/O — General-purpose user I/O (bank 1)
Pin 7 I/O — General-purpose user I/O (bank 1)
Pin 8 I/O — General-purpose user I/O (bank 1)
Pin 9 I/O — General-purpose user I/O (bank 1)
Pin 10 I/O — General-purpose user I/O (bank 1)
Pin 11 I/O — General-purpose user I/O (bank 1)
Pin 12 I/O — General-purpose user I/O (bank 1)
Pin 13 VCCIO1 — I/O bank 1 supply voltage
Pin 14 I/O — General-purpose user I/O (bank 1)
Pin 15 I/O — General-purpose user I/O (bank 1)
Pin 16 I/O — General-purpose user I/O (bank 1)
Pin 17 I/O — General-purpose user I/O (bank 1)
Pin 18 I/O — General-purpose user I/O (bank 1)
Pin 19 I/O — General-purpose user I/O (bank 1)
Pin 20 I/O — General-purpose user I/O (bank 1)
Pin 21 I/O — General-purpose user I/O (bank 1)
Pin 22 I/O — General-purpose user I/O (bank 1)
Pin 23 I/O — General-purpose user I/O (bank 1)
Pin 24 I/O — General-purpose user I/O (bank 1)
Pin 25 GND — Ground
Pin 26 I/O — General-purpose user I/O (bank 2)
Pin 27 I/O — General-purpose user I/O (bank 2)
Pin 28 I/O — General-purpose user I/O (bank 2)
Pin 29 I/O — General-purpose user I/O (bank 2)
Pin 30 I/O — General-purpose user I/O (bank 2)
Pin 31 I/O — General-purpose user I/O (bank 2)
Pin 32 I/O — General-purpose user I/O (bank 2)
Pin 33 I/O — General-purpose user I/O (bank 2)
Pin 34 I/O — General-purpose user I/O (bank 2)
Pin 35 I/O — General-purpose user I/O (bank 2)
Pin 36 I/O — General-purpose user I/O (bank 2)
Pin 37 VCCIO2 — I/O bank 2 supply voltage
Pin 38 I/O — General-purpose user I/O (bank 2)
Pin 39 I/O — General-purpose user I/O (bank 2)
Pin 40 I/O — General-purpose user I/O (bank 2)
Pin 41 I/O — General-purpose user I/O (bank 2)
Pin 42 I/O — General-purpose user I/O (bank 2)
Pin 43 I/O — General-purpose user I/O (bank 2)
Pin 44 I/O — General-purpose user I/O (bank 2)
Pin 45 I/O — General-purpose user I/O (bank 2)
Pin 46 I/O — General-purpose user I/O (bank 2)
Pin 47 I/O — General-purpose user I/O (bank 2)
Pin 48 I/O — General-purpose user I/O (bank 2)
Pin 49 I/O — General-purpose user I/O (bank 2)
Pin 50 GND — Ground
Pin 51 I/O — General-purpose user I/O (bank 3)
Pin 52 I/O — General-purpose user I/O (bank 3)
Pin 53 I/O — General-purpose user I/O (bank 3)
Pin 54 I/O — General-purpose user I/O (bank 3)
Pin 55 I/O — General-purpose user I/O (bank 3)
Pin 56 I/O — General-purpose user I/O (bank 3)
Pin 57 I/O — General-purpose user I/O (bank 3)
Pin 58 I/O — General-purpose user I/O (bank 3)
Pin 59 I/O — General-purpose user I/O (bank 3)
Pin 60 I/O — General-purpose user I/O (bank 3)
Pin 61 VCCIO3 — I/O bank 3 supply voltage
Pin 62 I/O — General-purpose user I/O (bank 3)
Pin 63 I/O — General-purpose user I/O (bank 3)
Pin 64 I/O — General-purpose user I/O (bank 3)
Pin 65 I/O — General-purpose user I/O (bank 3)
Pin 66 I/O — General-purpose user I/O (bank 3)
Pin 67 I/O — General-purpose user I/O (bank 3)
Pin 68 I/O — General-purpose user I/O (bank 3)
Pin 69 I/O — General-purpose user I/O (bank 3)
Pin 70 I/O — General-purpose user I/O (bank 3)
Pin 71 I/O — General-purpose user I/O (bank 3)
Pin 72 I/O — General-purpose user I/O (bank 3)
Pin 73 I/O — General-purpose user I/O (bank 3)
Pin 74 GND — Ground
Pin 75 I/O — General-purpose user I/O (bank 4)
Pin 76 I/O — General-purpose user I/O (bank 4)
Pin 77 I/O — General-purpose user I/O (bank 4)
Pin 78 I/O — General-purpose user I/O (bank 4)
Pin 79 I/O — General-purpose user I/O (bank 4)
Pin 80 I/O — General-purpose user I/O (bank 4)
Pin 81 I/O — General-purpose user I/O (bank 4)
Pin 82 I/O — General-purpose user I/O (bank 4)
Pin 83 I/O — General-purpose user I/O (bank 4)
Pin 84 I/O — General-purpose user I/O (bank 4)
Pin 85 VCCIO4 — I/O bank 4 supply voltage
Pin 86 I/O — General-purpose user I/O (bank 4)
Pin 87 I/O — General-purpose user I/O (bank 4)
Pin 88 I/O — General-purpose user I/O (bank 4)
Pin 89 I/O — General-purpose user I/O (bank 4)
Pin 90 I/O — General-purpose user I/O (bank 4)
Pin 91 I/O — General-purpose user I/O (bank 4)
Pin 92 I/O — General-purpose user I/O (bank 4)
Pin 93 I/O — General-purpose user I/O (bank 4)
Pin 94 I/O — General-purpose user I/O (bank 4)
Pin 95 I/O — General-purpose user I/O (bank 4)
Pin 96 I/O — General-purpose user I/O (bank 4)
Pin 97 I/O — General-purpose user I/O (bank 4)
Pin 98 GND — Ground
Pin 99 I/O — General-purpose user I/O (bank 5)
Pin 100 I/O — General-purpose user I/O (bank 5)
Pin 101 I/O — General-purpose user I/O (bank 5)
Pin 102 I/O — General-purpose user I/O (bank 5)
Pin 103 I/O — General-purpose user I/O (bank 5)
Pin 104 I/O — General-purpose user I/O (bank 5)
Pin 105 I/O — General-purpose user I/O (bank 5)
Pin 106 I/O — General-purpose user I/O (bank 5)
Pin 107 I/O — General-purpose user I/O (bank 5)
Pin 108 I/O — General-purpose user I/O (bank 5)
Pin 109 VCCIO5 — I/O bank 5 supply voltage
Pin 110 I/O — General-purpose user I/O (bank 5)
Pin 111 I/O — General-purpose user I/O (bank 5)
Pin 112 I/O — General-purpose user I/O (bank 5)
Pin 113 I/O — General-purpose user I/O (bank 5)
Pin 114 I/O — General-purpose user I/O (bank 5)
Pin 115 I/O — General-purpose user I/O (bank 5)
Pin 116 I/O — General-purpose user I/O (bank 5)
Pin 117 I/O — General-purpose user I/O (bank 5)
Pin 118 I/O — General-purpose user I/O (bank 5)
Pin 119 I/O — General-purpose user I/O (bank 5)
Pin 120 I/O — General-purpose user I/O (bank 5)
Pin 121 I/O — General-purpose user I/O (bank 5)
Pin 122 GND — Ground
Pin 123 I/O — General-purpose user I/O (bank 6)
Pin 124 I/O — General-purpose user I/O (bank 6)
Pin 125 I/O — General-purpose user I/O (bank 6)
Pin 126 I/O — General-purpose user I/O (bank 6)
Pin 127 I/O — General-purpose user I/O (bank 6)
Pin 128 I/O — General-purpose user I/O (bank 6)
Pin 129 I/O — General-purpose user I/O (bank 6)
Pin 130 I/O — General-purpose user I/O (bank 6)
Pin 131 I/O — General-purpose user I/O (bank 6)
Pin 132 I/O — General-purpose user I/O (bank 6)
Pin 133 VCCIO6 — I/O bank 6 supply voltage
Pin 134 I/O — General-purpose user I/O (bank 6)
Pin 135 I/O — General-purpose user I/O (bank 6)
Pin 136 I/O — General-purpose user I/O (bank 6)
Pin 137 I/O — General-purpose user I/O (bank 6)
Pin 138 I/O — General-purpose user I/O (bank 6)
Pin 139 I/O — General-purpose user I/O (bank 6)
Pin 140 I/O — General-purpose user I/O (bank 6)
Pin 141 I/O — General-purpose user I/O (bank 6)
Pin 142 I/O — General-purpose user I/O (bank 6)
Pin 143 I/O — General-purpose user I/O (bank 6)
Pin 144 I/O — General-purpose user I/O (bank 6)
Pin EPAD GND/thermal — Exposed thermal pad - must be soldered to ground plane

Typical Applications

10M25SAE144I7G is suitable for 6 applications: Industrial Motor Drive Controller, Machine Vision Pre-Processing Bridge, Factory Automation I/O Expansion, Video Bridging and Display Controller, Low-Cost ASIC/ASSP Replacement, Distributed Industrial Ethernet I/O Aggregation.

🏭

Industrial Motor Drive Controller

The 10M25SAE144I7G is well suited to industrial motor-drive controllers because its 25K logic elements can host encoder interfaces, PWM generation, and field-oriented control state machines while the integrated 12-bit ADC samples motor current and back-EMF without an external ADC IC. The non-volatile flash configuration delivers sub-10 ms instant-on, eliminating the boot delay typical of SRAM-based FPGAs in safety-critical drives. The industrial temperature grade (-40C to +100C for I7G) handles cabinet-side ambient swings near inverters. With 101 user I/O, designers can parallel several SPI encoder channels plus isolated UART/CAN links to a host PLC within the same device.

🎥

Machine Vision Pre-Processing Bridge

In machine vision pre-processing, the 10M25SAE144I7G bridges parallel image sensors to host SoCs while performing thresholding, ROI cropping, and line-buffer management. The 45 embedded 18x18 multipliers accelerate small convolutional kernels for edge detection at line rate, and the 1,728 Kbits of embedded memory hold line buffers without external SRAM. LVDS support enables direct connection to high-speed image sensors, while the 144-LQFP exposed-pad package fits in compact 22x22 mm camera modules. Quartus Prime Lite provides a free toolchain for designers prototyping vision pipelines.

⚡

Factory Automation I/O Expansion

Factory automation I/O expansion modules use the 10M25SAE144I7G to aggregate discrete sensors, opto-isolated inputs, and relay outputs onto a single fieldbus link. The 101 user I/O accommodate dozens of 24V-tolerant channels when paired with external level shifters, while the 12-bit ADC monitors supply rails and analog sensor outputs. Non-volatile instant-on behavior ensures deterministic startup when cabinets are power-cycled, which simplifies IEC 61131 PLC integration. The device pairs naturally with industrial Ethernet PHYs to form distributed I/O slices at sub-station granularity.

📺

Video Bridging and Display Controller

Video bridging applications such as LVDS-to-RGB or MIPI-to-LVDS conversion leverage the 10M25SAE144I7G's LVDS support, 25K logic elements for protocol conversion, and 1,728 Kbits of embedded memory for line buffering. The exposed-pad 144-LQFP package mounts on cost-sensitive display controller boards where BGA packages would inflate assembly cost. Designers can prototype format converters, scalers, and timing generators in Quartus Prime Lite, then migrate the same firmware to higher-density MAX 10 or Cyclone devices without changing the PCB footprint.

🔧

Low-Cost ASIC/ASSP Replacement

The 10M25SAE144I7G is frequently used as a low-cost ASIC/ASSP replacement for low-to-mid volume products where a custom mask set is uneconomical. Its 25K logic elements, 45 multipliers, four ADCs, and non-volatile configuration let designers consolidate what would otherwise require a microcontroller, external ADC, configuration EEPROM, and discrete glue logic into a single 22x22 mm package. Quartus Prime Lite is free, eliminating per-seat toolchain licensing fees. Vertical migration to 10M40 or 10M50 within the same footprint lets the same PCB scale from prototype to feature-rich derivative.

🌐

Distributed Industrial Ethernet I/O Aggregation

At the edge of industrial Ethernet networks, the 10M25SAE144I7G aggregates sensor data from multiple field-side nodes and forwards it over EtherCAT, PROFINET, or Modbus TCP links. The 12-bit ADC integrates analog sensor sampling into the same device that runs the industrial protocol stack in soft logic. Non-volatile flash configuration eliminates boot delay concerns when the node is power-cycled by the upstream switch. With 101 user I/O and an industrial temperature grade, the device fits compact IP67 field-mount enclosures typical of modern smart-factory deployments.

Recommended Products Summary

MAX 10 10M25 Same family up-migration target Used in: Industrial Motor Drive Controller, Distributed Industrial Ethernet I/O Aggregation Cyclone 10 LP 10CL025 Higher-density migration path Used in: Industrial Motor Drive Controller, Distributed Industrial Ethernet I/O Aggregation MAX 10 10M40 Up-migration for higher resolution Used in: Machine Vision Pre-Processing Bridge, Low-Cost ASIC/ASSP Replacement Cyclone IV E EP4CE10 Higher-density alternative Used in: Machine Vision Pre-Processing Bridge MAX V 5M570Z Lower-density glue logic option Used in: Factory Automation I/O Expansion MAX 10 10M16 Down-migration for simpler I/O maps Used in: Factory Automation I/O Expansion MAX 10 10M50 Up-migration for multi-channel video Used in: Video Bridging and Display Controller, Low-Cost ASIC/ASSP Replacement Cyclone 10 LP 10CL055 Higher-density migration path Used in: Video Bridging and Display Controller
What is the logic element count of the 10M25SAE144I7G?
The 10M25SAE144I7G contains 25,000 logic elements (LEs) in the MAX 10 family. According to the Intel MAX 10 datasheet family, this density is suitable for mid-complexity glue logic, state-machine heavy designs, and small DSP pipelines that need more capacity than a CPLD but not the full feature set of a Cyclone device.
Does the 10M25SAE144I7G require an external configuration PROM?
No, the 10M25SAE144I7G uses internal flash-based configuration memory, eliminating the need for an external boot PROM. This instant-on, non-volatile behavior is a defining characteristic of the MAX 10 family, enabling sub-10 ms startup times required in safety-critical industrial applications.
What integrated ADC features does the 10M25SAE144I7G provide?
The 10M25SAE144I7G integrates four 12-bit analog-to-digital converters operating at up to 1 MSPS. These ADCs support up to 17 analog input channels through dedicated analog package pins, allowing direct sensor interfacing without external ADC ICs and reducing BOM cost for motor control and industrial monitoring applications.
How many user I/O pins does the 10M25SAE144I7G have?
The 10M25SAE144I7G provides up to 101 general-purpose user I/O pins in its 144-LQFP exposed-pad package. This pin count accommodates typical industrial interfaces such as SPI, I2C, UART, parallel LVDS, and PWM motor-control outputs while leaving room for configuration and analog pins.
Where can I buy the 10M25SAE144I7G and what is the lead time?
The 10M25SAE144I7G is in stock at authorized distributors including DigiKey and Mouser, with Arrow also offering tray packaging. As of 2026-10-06, unit pricing starts at approximately $70.12 for qty 1, with volume discounts available at qty 100 and above, and typical lead times of 2-6 weeks for production quantities.
What is the price of 10M25SAE144I7G in volume?
As of 2026-10-06, the 10M25SAE144I7G is priced at approximately $70.12 per unit at qty 1, with volume breaks dropping the unit price to roughly $58.00 at qty 100 and $50.75 at qty 500. Pricing varies by distributor and current Intel allocation; XAIPART provides consolidated quotes across authorized channels on request.
What is the difference between 10M25SAE144I7G and 10M25SAE144A7G?
The 10M25SAE144I7G is the I7G speed-grade and industrial-temperature variant, while the 10M25SAE144A7G is the A7G commercial-temperature speed grade. Both share the same 144-LQFP exposed-pad package and 25K LE density, making them drop-in compatible except for the operating temperature window (-40C to +100C for I7G versus 0C to +85C for A7G).
Is 10M25SAE144I7G pin-compatible with 10M50SAE144I7G?
Yes, the 10M25SAE144I7G is pin-compatible with the 10M50SAE144I7G because both share the same 144-LQFP exposed-pad (E144) package and MAX 10 vertical-migration architecture. Designers can scale up to 50K logic elements on the same PCB by recompiling the Quartus Prime project with the larger device selected.
When should I choose 10M25SAE144I7G over a Cyclone 10 LP device?
Choose the 10M25SAE144I7G when your design needs non-volatile instant-on configuration, integrated 12-bit ADC channels, or simpler single-chip BOM without an external boot PROM. Choose a Cyclone 10 LP device instead when you need higher LE density, more DSP bandwidth, or transceiver-based interfaces that MAX 10 does not offer.
What is the best drop-in replacement for the 10M25SAE144I7G?
The best drop-in replacements for the 10M25SAE144I7G are same-package MAX 10 density variants such as the 10M16SAE144I7G (down-migration) and the 10M40SAE144I7G or 10M50SAE144I7G (up-migration), all sharing the 144-LQFP exposed-pad footprint. For commercial-temperature designs, the 10M25SAE144A7G is a direct substitute.
Where can I download the 10M25SAE144I7G datasheet PDF?
The 10M25SAE144I7G datasheet is available on the official Intel product page at https://www.altera.com/products/fpga/max/10/10m25-e144/10M25SAE144I7G. The MAX 10 device family datasheet covering all density grades is published on the Intel FPGA documentation hub and can be searched by ordering part number.
Where is the 10M25SAE144I7G pinout diagram located?
The 10M25SAE144I7G pinout is published in the MAX 10 device family datasheet on the Intel FPGA documentation portal. The 144-LQFP exposed-pad (E144) package diagram shows all 101 user I/O, four ADC analog inputs, configuration pins, JTAG, power, and ground pins arranged across the 22x22 mm body.
Is the 10M25SAE144I7G the same as the Altera 10M25SAE144I7G?
Yes, the 10M25SAE144I7G is the same silicon die originally branded Altera and now sold under Intel following the 2015 Altera acquisition. The MAX 10 ordering part number scheme, package pinout, and Quartus Prime support files are identical regardless of whether the distributor labels the manufacturer as Altera or Intel.
What is the best Lattice Semiconductor equivalent for the 10M25SAE144I7G?
The Lattice ECP5 LFE5U-25F-7BG256C is the closest Lattice cross-brand equivalent in terms of 25K LUT density, but it ships in a 256-ball cABGA package, not the 144-LQFP footprint. For pin-compatible Lattice alternatives in the 144-LQFP footprint, the Lattice MachXO3-4300 in the 144-pin TQFP package is a functional alternative but lacks the integrated 12-bit ADC and non-volatile flash configuration of the MAX 10.

Engineering reference data for 10M25SAE144I7G — comparison, design guidance, and compliance information.

Selection Guide

Choose the 10M25SAE144I7G when you need a non-volatile, instant-on FPGA with 25K logic elements and integrated 12-bit ADCs in an industrial-temperature, surface-mount 144-LQFP exposed-pad package. It is ideal for motor-drive control, industrial I/O aggregation, and cost-sensitive ASIC replacement where boot-PROM elimination and on-die analog sensing reduce BOM count. For lower-density designs (under 16K LE), down-migrate to the 10M08 or 10M16 in the same E144 footprint to reduce cost. For higher-density needs (above 50K LE) or transceiver interfaces, choose a Cyclone 10 LP or Cyclone IV/E device instead. For commercial-only deployments where industrial temperature is not required, the 10M25SAE144A7G is a direct substitute at potentially lower price. Cross-brand alternatives in the same footprint are limited - Lattice and Xilinx equivalents typically ship in BGA packages, so the MAX 10 remains the strongest option when 144-LQFP exposed-pad compatibility is required.

Comparison with Alternatives

Parameter This Product 10M16SAE144I7G 10M40SAE144I7G 10M50SAE144I7G 10M25SAE144A7G 10M25SCE144A7G 10M08SAE144I7G
Package 144-LQFP Exposed Pad (E144), 22x22 mm 144-LQFP Exposed Pad (E144) - same 144-LQFP Exposed Pad (E144) - same 144-LQFP Exposed Pad (E144) - same 144-LQFP Exposed Pad (E144) - same 144-LQFP Exposed Pad (E144) - same 144-LQFP Exposed Pad (E144) - same
Brand Intel Intel Intel Intel Intel Intel Intel
Logic Elements 25,000 16,000 (-36%) 40,000 (+60%) 50,000 (+100%) 25,000 (same) 25,000 (same) 8,000 (-68%)
Embedded Memory (Kbits) 1,728 1,152 (-33%) 1,260 (-27%) 1,638 (-5%) 1,728 (same) 1,728 (same) 378 (-78%)
18x18 Multipliers 45 32 (-29%) 70 (+56%) 144 (+220%) 45 (same) 45 (same) 16 (-64%)
Operating Temperature -40C to +100C (industrial) -40C to +100C -40C to +100C -40C to +100C 0C to +85C (commercial) 0C to +85C (commercial) -40C to +100C
Speed Grade I7G I7G I7G I7G A7G (commercial) A7G (commercial) I7G
Integrated ADC 4 (12-bit, 1 MSPS) 4 (12-bit, 1 MSPS) 4 (12-bit, 1 MSPS) 4 (12-bit, 1 MSPS) 4 (12-bit, 1 MSPS) 4 (12-bit, 1 MSPS) 4 (12-bit, 1 MSPS)
Configuration Memory Internal flash (non-volatile) Internal flash Internal flash Internal flash Internal flash Internal flash Internal flash

Key Differentiators

  • Non-volatile flash configuration with integrated 12-bit ADC (vs Lattice ECP5 LFE5U-25F)
  • 144-LQFP exposed-pad package with vertical migration (vs Lattice MachXO3-4300)
  • Free Quartus Prime Lite toolchain (vs Xilinx Spartan-6)

Design Notes

Solder the exposed pad (EPAD) of the 144-LQFP package to a continuous ground copper pour of at least 1 square inch to dissipate 1-2 W typical and avoid thermal shutdown. Without a continuous ground pour the junction-to-ambient thermal resistance rises sharply and the device may throttle. Estimated: at 1.5 W dissipation, a 25x25 mm 4-layer 1 oz copper pour keeps theta_JA below 25 C/W, supporting industrial-temperature operation without active cooling.

Decouple each VCCIO bank pin with a 0.1 uF ceramic capacitor placed within 5 mm of the pin, and add a bulk 10 uF tantalum or ceramic capacitor near the VCCINT/VCCIO cluster. The MAX 10 device is sensitive to rail noise during configuration; insufficient decoupling can cause configuration failure or CRC errors on flash memory. Estimated: budget 20 decoupling capacitors total for the 144-LQFP package power pins.

Route LVDS pairs with 100 ohm differential impedance and matched trace lengths within 150 mils to avoid skew on high-speed LVDS channels. Use 4-layer stackup with continuous reference planes; the 22x22 mm LQFP body has long lead spans, so signal-via antipad clearance must be respected to maintain impedance. Refer to the Intel MAX 10 handbook pin connection guidelines for bank-by-bank VREF and VCCIO routing.

Keep analog input pins to the dedicated ANA pins separate from digital I/O traces, and guard the analog section with a ground ring to isolate ADC sampling noise. The four integrated 12-bit ADCs sample at 1 MSPS and will couple switching noise from nearby digital lines if layout is careless. Estimated: maintain at least 5 mm between analog input traces and any switching signal traces.

Do not confuse the I7G speed grade with the C7G commercial-temperature speed grade - the I7G part is industrial-temperature qualified while A7G is commercial-only. Also note that the MAX 10 E144 package uses identical pinouts across density grades (10M02, 10M04, 10M08, 10M16, 10M25, 10M40, 10M50), enabling vertical migration within the same PCB footprint if Quartus Prime recompilation is acceptable.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and REACH compliant per Intel MAX 10 product family documentation. AEC-Q100 not applicable - this is a non-automotive-grade industrial FPGA. Lead-free assembly process supported; halogen-free status not explicitly stated in provided data.

Data verified on: 2026-10-06 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera 10M25SAE144I7G 10M25 MAX 10 FPGA Field Programmable Gate Array non-volatile FPGA flash-based FPGA instant-on FPGA 144-LQFP Exposed Pad E144 package 12-bit ADC logic element embedded memory DSP block Quartus Prime Cyclone LVDS industrial temperature grade I7G speed grade AEC-Q100
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