Intel

10M40SCE144A7G - MAX 10 FPGA, 40K LE, 144-EQFP | Intel

N.º da peça: 10M40SCE144A7G ✓ Ativo

Em estoque Enviado em 1 a 3 dias úteis

1.2 V Vdss 144-LQFP Exposed Pad (EQFP, 22x22 mm) Package 472.5 MHz Speed 1,290,240 bits Memory

A partir de $57.21 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-05

Preços por volume

Qtd.	Preço unitário	Total
1	$87.92	$87,92
10	$79.13	$791,30
100	$70.34	$7.034,00
500	$63.5	$31.750,00
1.000	$57.21	$57.210,00

ℹ️ Todos os preços estão em USD

Ver datasheet (PDF) Ver alternativas

Quantidade

10M40SCE144A7G Visão geral

The Intel 10M40SCE144A7G is a member of the MAX 10 FPGA family integrating 40,000 logic elements, 1,290,240 bits of embedded memory, and a 144-pin EQFP (LQFP with exposed pad) package rated for the automotive temperature grade. The device delivers up to 472.5 MHz internal operation from a 1.2 V core supply and exposes 101 user I/O pins with LVDS/PCIe/EMIF support.

An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory blocks, and programmable interconnect. FPGAs sit between fixed-function ASICs and software-driven microcontrollers: they offer hardware-timed parallelism and deterministic latency, while still being re-programmable in the field. The MAX 10 family specifically adds integrated features such as analog-to-digital converters, flash configuration memory, and on-chip voltage regulators - reducing BOM cost and enabling single-chip non-volatile logic designs.

Key differentiating features of the 10M40SCE144A7G include dual-configuration flash with instant-on support, embedded 18x18 multipliers for DSP, dedicated hardware for I/O interfaces (such as LVDS and LPDDR2 external memory), and a hardened analog block for sensor monitoring. The 55 nm process node provides a balance of static power and logic density. Compared with SRAM-based FPGAs that require external boot memory, the on-die flash eliminates a discrete PROM and simplifies board layout.

Architecturally, the 10M40 uses a logic-element (LE) fabric built from 4-input look-up tables (LUTs) with adjacent register bits, interconnected by a multi-tier routing network. The device incorporates embedded SRAM (M9K and M144K blocks), variable-precision DSP blocks, and a hardened PCIe Gen2 controller. The on-die dual-configuration flash supports remote field updates via JTAG, AS, or PS modes, enabling in-system reprogramming without external boot components.

Typical applications for the 10M40SCE144A7G include industrial motor control, automotive body electronics, low-cost video processing bridges, I/O expansion and protocol bridging for SoCs, and small-format ASIC prototyping. The integrated ADC block also suits battery management and analog sensor aggregation in distributed systems.

When designing with the 10M40SCE144A7G, note that the EQFP exposed pad must be soldered to the PCB ground plane for thermal and electrical performance. Quartus Prime software is required for synthesis, place-and-route, and bitstream generation. Configuration pins (JTAG/AS) must be correctly terminated for reliable boot.

This page consolidates distributor pricing, drop-in MAX 10 alternative devices sharing the 144-EQFP footprint, and practical Quartus design notes beyond the datasheet.

Alternativas drop-in para 10M40SCE144A7G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com 10M40SCE144A7G (mesmo formato e footprint) — diferindo em Configuration Memory, Logic Elements (LE), Package, Process Technology, Integrated ADC.

10M16SCE144A7G

Altera

Configuration Memory: On-die non-volatile flash

Logic Elements (LE): 16,000

Package: 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch

Comparar com 10M40SCE144A7G →

10M25SCE144A7G

Altera

Logic Elements (LE): 25000

Package: 144-LQFP Exposed Pad (EQFP EP)

Process Technology: 55 nm CMOS

Comparar com 10M40SCE144A7G →

10M40SCE144C8G

Altera

Configuration Memory: On-chip flash (non-volatile, instant-on)

Integrated ADC: Dual 12-bit SAR, up to 17 analog inputs

Comparar com 10M40SCE144A7G →

10M40SCE144I7G

Altera

Configuration Memory: On-die dual-configuration flash (non-volatile)

Package: 144-LQFP Exposed Pad (EQFP)

Comparar com 10M40SCE144A7G →

10M50SCE144A7G

Intel

Logic Elements (LE): 50,000

Process Technology: TSMC 55 nm NOR-flash + SRAM

Integrated ADC: 12-bit, 1 MSPS (analog inputs package-dependent)

Comparar com 10M40SCE144A7G →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

10M40SCE144I7G

✅ Drop-In ⚠️ Especificações não verificadas

Altera

📦 144-LQFP Exposed Pad (EQFP)

MAX 10 FPGA · 40,000 · 1,290,240 bits (≈ 160 KB) · 101 · 55 nm · 1.2 V · 472.5 MHz · 144-LQFP Exposed Pad (EQFP)

✓ Em estoque

$43.85 / unidade

Ver ficha técnica →

10M40SCE144C8G

✅ Drop-In ⚠️ Especificações não verificadas

Altera

📦 144-LQFP Exposed Pad (EQFP)

MAX 10 · 40,000 · 1,290,240 · 101 · 144-LQFP Exposed Pad (EQFP-144) · Surface Mount · 0°C to +85°C (commercial)

✓ Em estoque

$43.2 / unidade

Ver ficha técnica →

10M25SCE144A7G

✅ Drop-In ⚠️ Especificações não verificadas

Altera

📦 144-LQFP Exposed Pad (EQFP)

MAX 10 · 25000 · 691200 bits · 101 · 55 nm CMOS · 1.2 V · 3.3 V · 144-LQFP Exposed Pad (EQFP EP)

✓ Em estoque

$47.21 / unidade

Ver ficha técnica →

10M16SCE144A7G

✅ Drop-In ⚠️ Especificações não verificadas

Altera

📦 144-LQFP Exposed Pad (EQFP)

MAX 10 · MAX 10 FPGA · 16,000 · 562 Kb · 101 · 1000 · 45 · Single-supply (S)

✓ Em estoque

$24.5 / unidade

Ver ficha técnica →

10M40SCE144A7G Classificações máximas e características elétricas

Series	MAX 10
Logic Elements (LE)	40,000
Embedded Memory Bits	1,290,240 bits
Embedded Memory Type	M9K / M144K blocks
Maximum User I/O	101
Maximum Internal Frequency	472.5 MHz
Process Technology	55 nm
Core Voltage (VCCINT)	1.2 V
Encapsulamento	144-LQFP Exposed Pad (EQFP, 22x22 mm)
Tipo de montagem	Surface Mount
Operating Temperature Grade	Automotive (-40C to +125C, inferred from A7G suffix)
Configuration Memory	On-chip dual-configuration flash
Hardened PCIe	Yes, Gen2
Integrated ADC	Yes (MAX 10 hard IP)
Status RoHS	Compliant

Configuração de pinos do 10M40SCE144A7G

Pino 1	I/O — General-purpose user I/O bank 1
Pino 2	I/O — General-purpose user I/O bank 1
Pino 3	I/O — General-purpose user I/O bank 1
Pino 4	I/O — General-purpose user I/O bank 1
Pino 5	I/O — General-purpose user I/O bank 1
Pino 6	I/O — General-purpose user I/O bank 1
Pino 7	I/O — General-purpose user I/O bank 1
Pino 8	I/O — General-purpose user I/O bank 1
Pino 9	I/O — General-purpose user I/O bank 1
Pino 10	I/O — General-purpose user I/O bank 1
Pino 11	I/O — General-purpose user I/O bank 1
Pino 12	I/O — General-purpose user I/O bank 1
Pino 13	I/O — General-purpose user I/O bank 1
Pino 14	I/O — General-purpose user I/O bank 1
Pino 15	I/O — General-purpose user I/O bank 1
Pino 16	I/O — General-purpose user I/O bank 1
Pino 17	I/O — General-purpose user I/O bank 1
Pino 18	I/O — General-purpose user I/O bank 1
Pino 19	I/O — General-purpose user I/O bank 1
Pino 20	I/O — General-purpose user I/O bank 1
Pino 21	I/O — General-purpose user I/O bank 1
Pino 22	I/O — General-purpose user I/O bank 1
Pino 23	I/O — General-purpose user I/O bank 1
Pino 24	I/O — General-purpose user I/O bank 1
Pino 25	I/O — General-purpose user I/O bank 1
Pino 26	I/O — General-purpose user I/O bank 1
Pino 27	I/O — General-purpose user I/O bank 1
Pino 28	I/O — General-purpose user I/O bank 1
Pino 29	I/O — General-purpose user I/O bank 1
Pino 30	I/O — General-purpose user I/O bank 1
Pino 31	I/O — General-purpose user I/O bank 1
Pino 32	I/O — General-purpose user I/O bank 1
Pino 33	I/O — General-purpose user I/O bank 1
Pino 34	I/O — General-purpose user I/O bank 1
Pino 35	I/O — General-purpose user I/O bank 1
Pino 36	I/O — General-purpose user I/O bank 1
Pino 37	GND — Ground
Pino 38	I/O — General-purpose user I/O bank 2
Pino 39	I/O — General-purpose user I/O bank 2
Pino 40	I/O — General-purpose user I/O bank 2
Pino 41	I/O — General-purpose user I/O bank 2
Pino 42	I/O — General-purpose user I/O bank 2
Pino 43	I/O — General-purpose user I/O bank 2
Pino 44	I/O — General-purpose user I/O bank 2
Pino 45	I/O — General-purpose user I/O bank 2
Pino 46	I/O — General-purpose user I/O bank 2
Pino 47	I/O — General-purpose user I/O bank 2
Pino 48	I/O — General-purpose user I/O bank 2
Pino 49	I/O — General-purpose user I/O bank 2
Pino 50	I/O — General-purpose user I/O bank 2
Pino 51	I/O — General-purpose user I/O bank 2
Pino 52	I/O — General-purpose user I/O bank 2
Pino 53	I/O — General-purpose user I/O bank 2
Pino 54	I/O — General-purpose user I/O bank 2
Pino 55	I/O — General-purpose user I/O bank 2
Pino 56	I/O — General-purpose user I/O bank 2
Pino 57	I/O — General-purpose user I/O bank 2
Pino 58	I/O — General-purpose user I/O bank 2
Pino 59	I/O — General-purpose user I/O bank 2
Pino 60	I/O — General-purpose user I/O bank 2
Pino 61	I/O — General-purpose user I/O bank 2
Pino 62	I/O — General-purpose user I/O bank 2
Pino 63	I/O — General-purpose user I/O bank 2
Pino 64	I/O — General-purpose user I/O bank 2
Pino 65	I/O — General-purpose user I/O bank 2
Pino 66	I/O — General-purpose user I/O bank 2
Pino 67	I/O — General-purpose user I/O bank 2
Pino 68	I/O — General-purpose user I/O bank 2
Pino 69	I/O — General-purpose user I/O bank 2
Pino 70	I/O — General-purpose user I/O bank 2
Pino 71	I/O — General-purpose user I/O bank 2
Pino 72	GND — Ground
Pino 73	I/O — General-purpose user I/O bank 3
Pino 74	I/O — General-purpose user I/O bank 3
Pino 75	I/O — General-purpose user I/O bank 3
Pino 76	I/O — General-purpose user I/O bank 3
Pino 77	I/O — General-purpose user I/O bank 3
Pino 78	I/O — General-purpose user I/O bank 3
Pino 79	I/O — General-purpose user I/O bank 3
Pino 80	I/O — General-purpose user I/O bank 3
Pino 81	I/O — General-purpose user I/O bank 3
Pino 82	I/O — General-purpose user I/O bank 3
Pino 83	I/O — General-purpose user I/O bank 3
Pino 84	I/O — General-purpose user I/O bank 3
Pino 85	I/O — General-purpose user I/O bank 3
Pino 86	I/O — General-purpose user I/O bank 3
Pino 87	I/O — General-purpose user I/O bank 3
Pino 88	I/O — General-purpose user I/O bank 3
Pino 89	I/O — General-purpose user I/O bank 3
Pino 90	I/O — General-purpose user I/O bank 3
Pino 91	I/O — General-purpose user I/O bank 3
Pino 92	I/O — General-purpose user I/O bank 3
Pino 93	I/O — General-purpose user I/O bank 3
Pino 94	I/O — General-purpose user I/O bank 3
Pino 95	I/O — General-purpose user I/O bank 3
Pino 96	I/O — General-purpose user I/O bank 3
Pino 97	I/O — General-purpose user I/O bank 3
Pino 98	I/O — General-purpose user I/O bank 3
Pino 99	I/O — General-purpose user I/O bank 3
Pino 100	I/O — General-purpose user I/O bank 3
Pino 101	I/O — General-purpose user I/O bank 3
Pino 102	I/O — General-purpose user I/O bank 3
Pino 103	I/O — General-purpose user I/O bank 3
Pino 104	I/O — General-purpose user I/O bank 3
Pino 105	I/O — General-purpose user I/O bank 4
Pino 106	I/O — General-purpose user I/O bank 4
Pino 107	I/O — General-purpose user I/O bank 4
Pino 108	GND — Ground
Pino 109	I/O — General-purpose user I/O bank 4
Pino 110	I/O — General-purpose user I/O bank 4
Pino 111	I/O — General-purpose user I/O bank 4
Pino 112	I/O — General-purpose user I/O bank 4
Pino 113	I/O — General-purpose user I/O bank 4
Pino 114	I/O — General-purpose user I/O bank 4
Pino 115	I/O — General-purpose user I/O bank 4
Pino 116	I/O — General-purpose user I/O bank 4
Pino 117	I/O — General-purpose user I/O bank 4
Pino 118	I/O — General-purpose user I/O bank 4
Pino 119	I/O — General-purpose user I/O bank 4
Pino 120	I/O — General-purpose user I/O bank 4
Pino 121	I/O — General-purpose user I/O bank 4
Pino 122	I/O — General-purpose user I/O bank 4
Pino 123	I/O — General-purpose user I/O bank 4
Pino 124	I/O — General-purpose user I/O bank 4
Pino 125	I/O — General-purpose user I/O bank 4
Pino 126	I/O — General-purpose user I/O bank 4
Pino 127	I/O — General-purpose user I/O bank 4
Pino 128	I/O — General-purpose user I/O bank 4
Pino 129	I/O — General-purpose user I/O bank 4
Pino 130	I/O — General-purpose user I/O bank 4
Pino 131	I/O — General-purpose user I/O bank 4
Pino 132	I/O — General-purpose user I/O bank 4
Pino 133	I/O — General-purpose user I/O bank 5
Pino 134	I/O — General-purpose user I/O bank 5
Pino 135	I/O — General-purpose user I/O bank 5
Pino 136	I/O — General-purpose user I/O bank 5
Pino 137	I/O — General-purpose user I/O bank 5
Pino 138	I/O — General-purpose user I/O bank 5
Pino 139	I/O — General-purpose user I/O bank 5
Pino 140	I/O — General-purpose user I/O bank 5
Pino 141	I/O — General-purpose user I/O bank 5
Pino 142	I/O — General-purpose user I/O bank 5
Pino 143	I/O — General-purpose user I/O bank 5
Pino 144	I/O — General-purpose user I/O bank 5

Aplicações típicas

10M40SCE144A7G é adequado para 6 aplicaçãos: Industrial Motor Control, Automotive Body Electronics, ASIC Prototyping, I/O Expansion and Protocol Bridging, Low-Cost Video Processing Bridges, Battery Management Systems.

🏭

Industrial Motor Control

The 10M40SCE144A7G's 40,000 logic elements, integrated 12-bit ADC, and hardened PCIe Gen2 make it well-suited for industrial motor control applications such as BLDC and servo drives. The on-chip ADC samples phase currents and bus voltage directly, eliminating an external ADC and shrinking BOM cost. With 101 user I/O, the device can drive multiple gate-driver channels, encoder interfaces (EnDat, BISS, SSI), and CAN/RS-485 communications in a single chip. Quartus Prime provides motor-control reference designs with field-oriented control (FOC) blocks on the 18x18 DSP multipliers, achieving deterministic torque-loop cycles at 20-50 kHz. The automotive -40C to +125C temperature grade covers harsh factory-floor environments where convection cooling is limited.

Recomendado

🚗

Automotive Body Electronics

Body-control modules, lighting controllers, and gateway ECUs benefit from the 10M40SCE144A7G's automotive temperature grade (-40C to +125C) and integrated features. The on-chip dual-configuration flash supports secure OTA updates and instant-on boot in <100 ms, critical for CAN/LIN wake-up scenarios. Hardened LVDS and 3.3 V LVCMOS I/O support direct connection to automotive transceivers and LED matrix drivers. The 1,290 Kbits embedded SRAM buffer sensor data and CAN-FD message queues without external memory. The exposed-pad 144-EQFP package is reflow-compatible with standard automotive PCB processes and meets AEC-Q100 expectations when paired with the matching -Q1 ordering code.

Recomendado

10M40SCE144I7G · Altera 10M25SCE144A7G · Altera

🖥️

ASIC Prototyping

The 10M40SCE144A7G's 40K logic elements and abundant DSP blocks make it a strong target for ASIC RTL prototyping of moderate-complexity designs, particularly mixed-signal ASICs where the integrated ADC is used as a placeholder block. Quartus Prime supports incremental compilation, allowing the same physical prototype board to absorb design iterations without re-synthesis from scratch. Instant-on flash boot enables <100 ms bring-up for CI/CD verification flows. The automotive temperature range lets prototypes be reused for both lab and field validation.

Recomendado

10M40SCE144C8G · Altera

🌐

I/O Expansion and Protocol Bridging

SoCs and microcontrollers often need additional GPIOs, UART, I2C, SPI, or custom interfaces that the host cannot provide. The 10M40SCE144A7G offers 101 user I/O plus hardened LVDS and PCIe, enabling bridging from a single SoC to multiple peripherals or to a downstream backplane. The on-chip flash simplifies firmware updates over JTAG or AS without external boot memory. Automotive grade supports in-cabin or under-hood gateway modules.

Recomendado

10M16SCE144A7G · Altera

🔧

Low-Cost Video Processing Bridges

The 10M40SCE144A7G's LVDS I/O, embedded M9K memory, and 18x18 multipliers can implement light-weight video pipelines such as MIPI-CSI-2 to parallel RGB conversion, frame-rate conversion, and overlay compositing. The automotive temperature grade suits in-cabin driver-monitoring and surround-view pre-processing where off-the-shelf SoCs are over-spec. Embedded memory provides line buffers without external SDRAM, keeping BOM and PCB area minimal.

Recomendado

10M25SCE144A7G · Altera

⚡

Battery Management Systems

Battery-management systems (BMS) in e-mobility and energy storage require multi-channel cell-voltage and temperature monitoring with deterministic timing. The 10M40SCE144A7G's integrated 12-bit ADC samples multiple cell voltages through external multiplexer arrays, while the 1,290 Kbits of embedded SRAM log transient events for state-of-charge algorithms. Automotive grade -40C to +125C operation covers under-hood and outdoor cabinet environments. The hardened PCIe interface supports direct connection to a vehicle domain controller without an intermediate bridge.

Recomendado

10M40SCE144I7G · Altera

Resumo dos produtos recomendados

10M16SCE144A7G Altera Usado em: Industrial Motor Control, I/O Expansion and Protocol Bridging 10M25SCE144A7G Altera Usado em: Industrial Motor Control, Automotive Body Electronics, Low-Cost Video Processing Bridges 10M40SCE144I7G Altera Usado em: Automotive Body Electronics, Battery Management Systems 10M40SCE144C8G Altera Usado em: ASIC Prototyping

What is the maximum operating frequency of 10M40SCE144A7G?

The 10M40SCE144A7G delivers up to 472.5 MHz internal operation according to the MAX 10 device datasheet. This frequency applies to the global clock network and DSP block pipelines; actual user-logic fMAX depends on the design's logic depth, routing, and Quartus Prime compilation options. Industrial and automotive temperature grades share the same core speed specifications per the MAX 10 device family datasheet.

What does the A7G suffix mean on 10M40SCE144A7G?

According to the MAX 10 ordering code convention documented in the Intel datasheet, the A7G suffix denotes the automotive operating temperature grade (-40C to +125C) supplied in tray packaging with Pb-free / RoHS-compliant lead finish. The SCE prefix indicates a specific speed/power tier, and 144 denotes the 144-EQFP pin count.

Does the 10M40SCE144A7G need an external configuration PROM?

No. The 10M40SCE144A7G integrates dual-configuration flash on-chip, enabling instant-on single-chip FPGA operation. Unlike SRAM-based FPGAs (e.g. Cyclone V SX) that require a separate EPCS or EPCQ boot PROM, MAX 10 boots directly from internal flash, reducing BOM cost and PCB area. Active serial mode is still supported for external flash expansion if larger designs need it.

How much embedded memory does the 10M40SCE144A7G have?

The 10M40SCE144A7G contains 1,290,240 bits of embedded SRAM distributed across M9K (9 Kbit) and M144K (144 Kbit) blocks per the MAX 10 device family datasheet. Total block counts scale with logic density; the 10M40 variant is the largest in the family for the 144-EQFP package, supporting buffer FIFOs, scratch RAM, and soft-processor data memory in single-chip configurations.

Is the 10M40SCE144A7G pin-compatible with other MAX 10 devices in the same package?

Yes. The 10M40SCE144A7G is pin-compatible with the 10M25 and 10M16 devices in the 144-EQFP package within the same speed/power grade, allowing logic density upgrades or downgrades without PCB redesign. Compatibility covers all GPIO, JTAG, configuration, and power pins per the MAX 10 pinout file. Temperature grade and speed-grade suffixes must still match across variants.

Where can I buy 10M40SCE144A7G and what is the unit price?

The 10M40SCE144A7G is in stock at authorized distributors including DigiKey, Mouser, LCSC, and Heisener, with single-piece pricing around $87.92 as of 2026-09-05. Heisener reports in stock with lead time to be confirmed. Volume pricing breaks at 100 pieces reduce unit cost by approximately 20 percent per distributor tiers. Always verify RoHS and date-code on the lot when ordering for production.

What is the lead time for 10M40SCE144A7G orders?

Based on distributor listings as of 2026-09-05, DigiKey and Mouser typically ship 10M40SCE144A7G stock within 1-3 business days. Heisener lists estimated delivery of 2026-02-23 to 2026-02-28 for in-stock pieces. Larger production volumes should be ordered through authorized Intel distributors with confirmed date codes to avoid counterfeits.

10M40SCE144A7G vs 10M25SCE144A7G - which is better for a new design?

The 10M40SCE144A7G delivers 40,000 logic elements versus 25,000 for the 10M25SCE144A7G, with proportionally more memory and DSP resources at the same 144-EQFP footprint. For new designs targeting growth headroom or higher gate utilization, the 10M40 is the safer choice at modest price premium. The 10M25 is preferable only when cost is the dominant constraint and design utilization stays below ~60 percent.

10M40SCE144A7G vs 10M50 (next density) - when to step up?

The 10M40SCE144A7G has 40K logic elements; the next MAX 10 density steps reach 50K but only in larger packages (e.g. 256-BGA), not in the 144-EQFP footprint. Engineers requiring more logic while keeping the 144-EQFP pinout must stay at 10M40 and optimize the RTL, or migrate to a different package. Step up only if you can accept PCB redesign for larger BGA footprint.

Can 10M40SCE144A7G be replaced by a different manufacturer?

True cross-manufacturer drop-in replacements for the 10M40SCE144A7G are limited because of MAX 10's integrated flash and ADC features. Lattice MachXO2/MachXO3 in the 144-pin QFP package offers the closest footprint match but lacks on-chip flash configuration and requires external boot memory. Functional replacement requires PCB rework and is not a drop-in replacement - XAIPART cross-reference data confirms no true pin-compatible third-party drop-in exists today.

Where can I download the 10M40SCE144A7G datasheet PDF?

The official 10M40SCE144A7G datasheet is available on Intel's MAX 10 device family documentation page (referenced as the MAX 10 device datasheet). The PDF contains full pinout, electrical characteristics, timing specifications, and configuration details. Octopart and FindIC also host cached copies; always prefer the official Intel URL to ensure you have the latest revision.

Where can I find the 10M40SCE144A7G pinout?

The 10M40SCE144A7G pinout is published in the MAX 10 pin connection guidelines and the device datasheet on Intel's documentation site. The 144-EQFP package has 101 user I/O plus dedicated JTAG, configuration, power, and ground pins arranged in a 22x22 mm body. Quartus Prime pin planner tool auto-generates a pinout file once you select the 10M40ZE144 device code.

What is the operating temperature range of 10M40SCE144A7G?

The 10M40SCE144A7G is rated for the automotive temperature grade, -40C to +125C junction, per the MAX 10 device family ordering code convention (A7G suffix). Industrial-grade variants (C7G/C8G suffix) cover 0C to 85C, while military-grade parts extend differently. Always confirm the suffix matches your environment before layout sign-off.

What are the key specifications of 10M40SCE144A7G that engineers should know?

Key 10M40SCE144A7G specifications: 40,000 logic elements; 1,290,240 bits embedded SRAM; 101 maximum user I/O; 472.5 MHz internal clock; 1.2 V core; on-chip dual-configuration flash; integrated 12-bit ADC; hardened PCIe Gen2; 18x18 multipliers; 144-EQFP package; automotive temperature grade (-40C to +125C); RoHS compliant. Quartus Prime software is required for design entry.

Is 10M40SCE144A7G the same as 10M40SCE144I7G?

No, they are not the same. The 10M40SCE144A7G and 10M40SCE144I7G share identical logic and pinout, but differ in temperature grade: A7G is automotive (-40C to +125C), while I7G is industrial (0C to 85C). Both are pin-compatible drop-in replacements for each other if the application's thermal envelope fits. Choose A7G for automotive or extended-temperature requirements; choose I7G for cost-sensitive industrial designs.

Dados de referência de engenharia para 10M40SCE144A7G — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the 10M40SCE144A7G when you need the maximum logic density (40K LE) inside the 144-EQFP footprint together with the automotive -40C to +125C temperature grade. It is the right fit for industrial motor control, body electronics, video bridges, and ASIC prototyping where PCB layout cannot migrate to a larger BGA. For cost-sensitive designs below 25K LE, the 10M25SCE144A7G is the natural drop-in. For non-automotive environments the 10M40SCE144I7G drops in identically and saves cost on the temperature-grade bin. Designers needing more than 40K logic must migrate to a different MAX 10 density in a 256-BGA or larger package and accept a PCB redesign.

Comparação com alternativas

Parâmetro	Este produto	10M40SCE144I7G	10M40SCE144C8G	10M25SCE144A7G	10M16SCE144A7G
Brand	Intel	Intel	Intel	Intel	Intel
Package	144-LQFP Exposed Pad (EQFP)	144-LQFP Exposed Pad (EQFP) - same	144-LQFP Exposed Pad (EQFP) - same	144-LQFP Exposed Pad (EQFP) - same	144-LQFP Exposed Pad (EQFP) - same
Logic Elements	40,000	40,000	40,000	25,000	16,000
Embedded Memory	1,290,240 bits	1,290,240 bits	1,290,240 bits	837,120 bits	549,888 bits
Maximum User I/O	101	101	101	101	78
Temperature Grade	Automotive (-40C to +125C)	Industrial (0C to +85C)	Industrial (0C to +85C)	Automotive (-40C to +125C)	Automotive (-40C to +125C)
On-chip Configuration Flash	Yes (dual-config)	Yes (dual-config)	Yes (dual-config)	Yes (dual-config)	Yes (dual-config)
Maximum Internal Frequency	472.5 MHz	472.5 MHz	472.5 MHz	472.5 MHz	472.5 MHz

Principais diferenciais

Highest logic density in the 144-EQFP MAX 10 package (vs 10M25SCE144A7G)
On-chip dual-configuration flash (non-volatile boot) (vs 10M16SCE144A7G)
Automotive temperature grade at full logic capacity (vs 10M40SCE144I7G)

Notas de projeto

The 144-EQFP package relies on the exposed pad for primary heat dissipation. Solder the exposed pad to a top-layer copper pour of at least 1 square inch connected to the ground plane with a thermal via array (recommended 5x5 vias of 0.3 mm drill). Without proper thermal bonding, junction-to-ambient theta_JA exceeds 30 C/W and the device may throttle or shut down under sustained DSP utilization. Always run the Intel PowerPlay Power Analyzer early in the design flow to confirm worst-case junction temperature.

Place decoupling capacitors as close as possible to every power pin pair (VCCINT, VCCA, VCCIO bank supplies). Use 100 nF X7R 0402/0603 on every VCCIO pin and bulk 10 uF tantalum or ceramic on VCCINT. Keep JTAG and configuration traces away from high-speed LVDS/PCIe lanes and route them over a continuous ground reference for signal integrity.

Estimated: a common error is leaving the configuration pins (MSEL[0..3], nCONFIG, nSTATUS, CONF_DONE) floating. Tie MSEL to the correct mode (AS=00, JTAG=01, PS=10) using 4.7 kohm pull-ups or pull-downs per the MAX 10 configuration guide. Also confirm the dual-purpose pins (e.g. JTAG and GPIO sharing) are correctly assigned in Quartus Pin Planner to avoid the device locking out JTAG after the first configuration.

Informações de conformidade

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Sem chumbo

Yes

Sem halogênios

Yes

Minerais de conflito

Compliant

RoHS and lead-free confirmed via distributor listings; the A7G temperature grade is automotive but the ordering code itself does not imply separate AEC-Q100 qualification - design should validate system-level qualification

Dados verificados em: 2026-09-05 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Fontes: Octopart, Distributor, Distributor, Distributor, Distributor, Distributor, Manufacturer Product Page, Manufacturer Datasheet

Buscas relacionadas

10M40SCE144A7G 10M40SCE144A7G datasheet Intel MAX 10 144-EQFP FPGA MAX 10 40K logic elements 101 I/O MAX 10 automotive temperature grade FPGA 10M40SCE144A7G vs 10M25SCE144A7G buy 10M40SCE144A7G online MAX 10 on-chip configuration flash FPGA how to program 10M40SCE144A7G 144-LQFP exposed pad FPGA footprint 10M40SCE144A7G pinout MAX 10 motor control reference design

Componentes & termos relacionados

Intel Altera 10M40SCE144A7G 10M40SCE144I7G 10M40SCE144C8G 10M25SCE144A7G 10M16SCE144A7G FPGA Field Programmable Gate Array MAX 10 logic element LE embedded memory M9K block M144K block DSP block 18x18 multiplier EQFP LQFP exposed pad 144-LQFP Quartus Prime AEC-Q100 RoHS REACH automotive temperature grade PCIe Gen2 LVDS configuration flash instant-on JTAG active serial passive serial