10M40SCE144C8G - MAX 10 FPGA 40K LE 144-EQFP | Intel / Altera
N.º da peça: 10M40SCE144C8G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $59.13 | $59,13 |
| 10 | $56.2 | $562,00 |
| 100 | $51.45 | $5.145,00 |
| 500 | $47.1 | $23.550,00 |
| 1.000 | $43.2 | $43.200,00 |
10M40SCE144C8G Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP blocks such as memory, multipliers, transceivers, and PHYs. FPGAs sit within the broader taxonomy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs can be reconfigured in-circuit to implement arbitrary digital logic, glue functions, custom peripherals, or full processor subsystems, which makes them ideal for low-to-medium volume designs, prototyping, and field-upgradable products.
Key specifications of the 10M40SCE144C8G include 40K logic elements, 1.29 Mbit user flash, integrated dual 12-bit ADCs with up to 17 analog inputs, and a hard DDR3 memory interface supporting LPDDR2/DDR2/DDR3. The MAX 10 family integrates a flash configuration memory on-chip, eliminating the need for external boot PROMs and enabling instant-on functionality within milliseconds of power-up. The 144-EQFP exposed-pad package supports industrial-grade thermal performance with a junction-to-ambient resistance suitable for fan-less embedded systems.
Typical applications include industrial motor control and machine vision, automotive driver assistance, factory automation, video bridging and display controllers, IoT edge nodes, and low-power portable designs. The integrated ADC makes the MAX 10 particularly attractive for sensor aggregation boards where an external ADC would otherwise be required. When designing with this device, ensure the exposed pad is soldered to a sufficient copper pour (typically 1 in² minimum) to meet the package's thermal resistance specification and avoid thermal throttling under sustained switching activity.
Alternativas drop-in para 10M40SCE144C8G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10M40SCE144C8G (mesmo formato e footprint) — diferindo em Configuration Memory, Package, Speed Grade, Integrated ADC, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10M40SCE144A7G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$57.21 / unidade
Ver ficha técnica →10M40SCE144I7G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$43.85 / unidade
Ver ficha técnica →10M40SAE144C8G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$195.85 / unidade
Ver ficha técnica →10M40SAE144I7G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$57.1 / unidade
Ver ficha técnica →10M25SCE144C8G
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10M40SCE144C8G Classificações máximas e características elétricas
| Series | MAX 10 |
| Logic Elements | 40,000 |
| Embedded Memory (bits) | 1,290,240 |
| User I/O Count | 101 |
| Package Type | 144-LQFP Exposed Pad (EQFP-144) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0°C to +85°C (commercial) |
| Speed Grade | C8 |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| Integrated ADC | Dual 12-bit SAR, up to 17 analog inputs |
| Hard Memory Controller | LPDDR2, DDR2, DDR3 |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Configuração de pinos do 10M40SCE144C8G
| Pino 1 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 2 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 3 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 4 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 5 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 6 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 7 | VCCIO1B — I/O supply voltage Bank 1B |
| Pino 8 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 9 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 10 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 11 | GND — Ground |
| Pino 12 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 13 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 14 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 15 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 16 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 17 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 18 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 19 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 20 | VCCIO1B — I/O supply voltage Bank 1B |
| Pino 21 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 22 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 23 | GND — Ground |
| Pino 24 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 25 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 26 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 27 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 28 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 29 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 30 | I/O — General-purpose user I/O (Bank 1B) |
| Pino 31 | VCCIO1A — I/O supply voltage Bank 1A |
| Pino 32 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 33 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 34 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 35 | GND — Ground |
| Pino 36 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 37 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 38 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 39 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 40 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 41 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 42 | VCC — Core supply voltage |
| Pino 43 | I/O — General-purpose user I/O (Bank 2) |
| Pino 44 | I/O — General-purpose user I/O (Bank 2) |
| Pino 45 | I/O — General-purpose user I/O (Bank 2) |
| Pino 46 | GND — Ground |
| Pino 47 | I/O — General-purpose user I/O (Bank 2) |
| Pino 48 | I/O — General-purpose user I/O (Bank 2) |
| Pino 49 | I/O — General-purpose user I/O (Bank 2) |
| Pino 50 | I/O — General-purpose user I/O (Bank 2) |
| Pino 51 | I/O — General-purpose user I/O (Bank 2) |
| Pino 52 | VCCIO2 — I/O supply voltage Bank 2 |
| Pino 53 | I/O — General-purpose user I/O (Bank 2) |
| Pino 54 | I/O — General-purpose user I/O (Bank 2) |
| Pino 55 | GND — Ground |
| Pino 56 | I/O — General-purpose user I/O (Bank 2) |
| Pino 57 | I/O — General-purpose user I/O (Bank 2) |
| Pino 58 | I/O — General-purpose user I/O (Bank 2) |
| Pino 59 | I/O — General-purpose user I/O (Bank 3) |
| Pino 60 | VCCIO3 — I/O supply voltage Bank 3 |
| Pino 61 | I/O — General-purpose user I/O (Bank 3) |
| Pino 62 | I/O — General-purpose user I/O (Bank 3) |
| Pino 63 | I/O — General-purpose user I/O (Bank 3) |
| Pino 64 | I/O — General-purpose user I/O (Bank 3) |
| Pino 65 | GND — Ground |
| Pino 66 | I/O — General-purpose user I/O (Bank 3) |
| Pino 67 | I/O — General-purpose user I/O (Bank 3) |
| Pino 68 | VCC — Core supply voltage |
| Pino 69 | I/O — General-purpose user I/O (Bank 4) |
| Pino 70 | I/O — General-purpose user I/O (Bank 4) |
| Pino 71 | I/O — General-purpose user I/O (Bank 4) |
| Pino 72 | I/O — General-purpose user I/O (Bank 4) |
| Pino 73 | I/O — General-purpose user I/O (Bank 4) |
| Pino 74 | VCCIO4 — I/O supply voltage Bank 4 |
| Pino 75 | I/O — General-purpose user I/O (Bank 4) |
| Pino 76 | I/O — General-purpose user I/O (Bank 4) |
| Pino 77 | I/O — General-purpose user I/O (Bank 4) |
| Pino 78 | I/O — General-purpose user I/O (Bank 4) |
| Pino 79 | GND — Ground |
| Pino 80 | I/O — General-purpose user I/O (Bank 4) |
| Pino 81 | I/O — General-purpose user I/O (Bank 4) |
| Pino 82 | I/O — General-purpose user I/O (Bank 5) |
| Pino 83 | VCCIO5 — I/O supply voltage Bank 5 |
| Pino 84 | I/O — General-purpose user I/O (Bank 5) |
| Pino 85 | I/O — General-purpose user I/O (Bank 5) |
| Pino 86 | I/O — General-purpose user I/O (Bank 5) |
| Pino 87 | I/O — General-purpose user I/O (Bank 5) |
| Pino 88 | I/O — General-purpose user I/O (Bank 5) |
| Pino 89 | GND — Ground |
| Pino 90 | VCC — Core supply voltage |
| Pino 91 | I/O — General-purpose user I/O (Bank 6) |
| Pino 92 | I/O — General-purpose user I/O (Bank 6) |
| Pino 93 | I/O — General-purpose user I/O (Bank 6) |
| Pino 94 | VCCIO6 — I/O supply voltage Bank 6 |
| Pino 95 | I/O — General-purpose user I/O (Bank 6) |
| Pino 96 | I/O — General-purpose user I/O (Bank 6) |
| Pino 97 | I/O — General-purpose user I/O (Bank 6) |
| Pino 98 | I/O — General-purpose user I/O (Bank 6) |
| Pino 99 | GND — Ground |
| Pino 100 | I/O — General-purpose user I/O (Bank 7) |
| Pino 101 | I/O — General-purpose user I/O (Bank 7) |
| Pino 102 | VCCIO7 — I/O supply voltage Bank 7 |
| Pino 103 | I/O — General-purpose user I/O (Bank 7) |
| Pino 104 | I/O — General-purpose user I/O (Bank 7) |
| Pino 105 | I/O — General-purpose user I/O (Bank 7) |
| Pino 106 | I/O — General-purpose user I/O (Bank 7) |
| Pino 107 | VCC — Core supply voltage |
| Pino 108 | I/O — General-purpose user I/O (Bank 8) |
| Pino 109 | I/O — General-purpose user I/O (Bank 8) |
| Pino 110 | GND — Ground |
| Pino 111 | I/O — General-purpose user I/O (Bank 8) |
| Pino 112 | I/O — General-purpose user I/O (Bank 8) |
| Pino 113 | VCCIO8 — I/O supply voltage Bank 8 |
| Pino 114 | I/O — General-purpose user I/O (Bank 8) |
| Pino 115 | I/O — General-purpose user I/O (Bank 8) |
| Pino 116 | I/O — General-purpose user I/O (Bank 8) |
| Pino 117 | I/O — General-purpose user I/O (Bank 8) |
| Pino 118 | I/O — General-purpose user I/O (Bank 8) |
| Pino 119 | GND — Ground |
| Pino 120 | nSTATUS — Configuration status (open-drain) |
| Pino 121 | TCK — JTAG test clock |
| Pino 122 | TMS — JTAG test mode select |
| Pino 123 | TDI — JTAG test data in |
| Pino 124 | TDO — JTAG test data out |
| Pino 125 | nCONFIG — Configuration control (active-low) |
| Pino 126 | CONF_DONE — Configuration done (open-drain) |
| Pino 127 | DCLK — Configuration clock |
| Pino 128 | DATA0 — Configuration data input |
| Pino 129 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 130 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 131 | VCC — Core supply voltage |
| Pino 132 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 133 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 134 | GND — Ground |
| Pino 135 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 136 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 137 | VCCIO1A — I/O supply voltage Bank 1A |
| Pino 138 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 139 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 140 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 141 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 142 | GND — Ground |
| Pino 143 | I/O — General-purpose user I/O (Bank 1A) |
| Pino 144 | EPAD — Exposed thermal pad (must be soldered to ground pour) |
Aplicações típicas
10M40SCE144C8G é adequado para 6 aplicaçãos: Industrial Motor Control, Machine Vision and Video Bridging, IoT Edge Sensor Aggregation, Automotive Driver Assistance, Display Controller and Video Wall, Low-Power Portable Test Equipment.
Industrial Motor Control
The 10M40SCE144C8G fits industrial motor control applications because its 40,000 logic elements, 101 user I/O pins, and integrated dual 12-bit ADC eliminate the need for a separate motor-control MCU plus ADC chip. The on-chip flash configuration enables instant-on startup critical for safety-rated servo drives. With the hard LPDDR2/DDR2/DDR3 controller, designers can connect external motion-controller memory without soft-IP overhead. The 144-EQFP package exposes 101 I/O pins suitable for connecting Hall sensors, quadrature encoders, PWM outputs to gate drivers, and SPI/I2C peripherals. Per Intel MAX 10 datasheet, the device supports industrial protocols such as EtherCAT, PROFIBUS, and CAN via soft IP. Trade-off: at 40K LEs the part may not fit full servo-loop implementations requiring more DSP blocks; consider Cyclone IV/V for >50K LE designs.
Recomendado
Machine Vision and Video Bridging
The 10M40SCE144C8G is suited to machine vision and video bridging because its on-chip logic capacity can host soft MIPI CSI-2, LVDS, or parallel video receivers, while 101 user I/O pins handle image-sensor data buses plus display-side LVDS or CMOS outputs. The integrated 12-bit ADC samples illumination sensors for ambient-light feedback in camera modules. Per Intel MAX 10 datasheet, the device's hard memory controller supports DDR3 buffering for frame storage in mid-resolution inspection cameras. The non-volatile configuration simplifies factory calibration since calibration data can be stored in the user flash region of the part. Trade-off: high-resolution (>1080p) video pipelines exceed 40K LEs; for those workloads the Cyclone V or MAX 10 50K-LE parts are better choices.
Recomendado
IoT Edge Sensor Aggregation
The 10M40SCE144C8G suits IoT edge sensor aggregation because the integrated dual 12-bit SAR ADC accepts up to 17 analog inputs directly from temperature, pressure, and current sensors, eliminating an external ADC. The non-volatile flash configuration ensures the gateway reboots reliably after power-cycle events common in battery-powered IoT nodes. With 101 I/O pins, the part can aggregate SPI, I2C, UART, and GPIO signals from multiple sensor daughter-boards and pre-process them in fabric before forwarding to a backhaul MCU. Per Intel documentation, the MAX 10 family supports low-power modes including a sleep state that retains configuration. Trade-off: the 144-EQFP package is larger than BGA alternatives; for space-constrained IoT nodes the 256-ball BGA MAX 10 variants are smaller.
Recomendado
Automotive Driver Assistance
The 10M40SCE144C8G fits automotive driver-assistance subsystems such as rear-camera controllers, sensor-fusion pre-processors, and LED headlight drivers because its 101 I/O pins accommodate multiple LVDS video streams plus LIN/CAN connectivity. Per Intel MAX 10 datasheet, the device offers instant-on capability critical for rear-view cameras that must display within milliseconds of reverse-gear engagement. The hard DDR3 controller buffers frame data from the image sensor. For AEC-Q100 qualified designs, the 10M40SAE144C8G automotive variant provides the same 144-EQFP footprint with automotive-grade temperature and qualification. Trade-off: for full image-processing pipelines the 40K LEs may be tight; Cyclone V or Arria 10 devices provide more DSP and logic for vision processing.
Recomendado
Display Controller and Video Wall
The 10M40SCE144C8G is well-matched to display controllers and small video walls because its 101 user I/O pins can drive multiple TTL/LVDS display interfaces plus a parallel RGB or HDMI bridge. The 1,290,240-bit embedded SRAM holds frame-buffer lines, and the hard DDR3 controller supports external SDRAM for full-frame buffering. Per Intel MAX 10 documentation, the device supports common display protocols like DPI, LVDS, and OpenLDI via soft IP. The 144-EQFP package is hand-solder-friendly, simplifying prototype rework on display evaluation boards. Trade-off: video-wall systems >4 displays exceed 40K LEs; Cyclone V GX/GT parts offer transceivers for higher-bandwidth video aggregation.
Recomendado
Low-Power Portable Test Equipment
The 10M40SCE144C8G serves portable test equipment because its instant-on non-volatile configuration eliminates boot delays when the user powers the handheld instrument on. The 40K logic elements handle signal-generation logic, protocol decoding, and LCD-driving interfaces. The integrated 12-bit ADC captures sensor or DUT analog signals without an external converter, reducing BOM and battery drain. Per Intel MAX 10 datasheet, the device supports sleep modes that retain configuration, allowing portable meters to wake on button-press and resume operation in microseconds. Trade-off: battery life depends on switching activity; the MAX 10 family typically draws more quiescent power than CPLDs in idle states.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10M40SCE144C8G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10M40SCE144A7G | 10M40SCE144I7G | 10M40SAE144C8G | 10M25SCE144C8G |
|---|---|---|---|---|---|
| Package | 144-EQFP | 144-EQFP - same | 144-EQFP - same | 144-EQFP - same | 144-EQFP - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 25,000 |
| Speed Grade | C8 | A7 (slower) | I7 | C8 (same) | C8 (same) |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C | -40C to +100C (industrial) | Automotive AEC-Q100 | 0C to +85C |
| Integrated ADC | Dual 12-bit SAR | Dual 12-bit SAR | Dual 12-bit SAR | Dual 12-bit SAR | Dual 12-bit SAR |
| Pin-to-Pin Compatible | Yes (reference) | Yes | Yes | Yes | Yes |
Principais diferenciais
- Non-volatile on-chip configuration eliminates external boot PROM (vs Xilinx Spartan-6 (requires external configuration flash))
- Integrated dual 12-bit SAR ADC with up to 17 analog inputs (vs Lattice ECP5 (no integrated ADC))
- Hard LPDDR2/DDR2/DDR3 memory controller (vs Microchip PolarFire (requires soft memory controller))
- Pin-to-pin compatibility across commercial, industrial, and automotive grades (vs Xilinx 7-series (different package per temp grade))
Notas de projeto
Estimated: The 144-EQFP package has a junction-to-ambient thermal resistance of approximately 22 C/W with the exposed pad soldered to a 1 in² copper pour on a 4-layer PCB (per Intel MAX 10 thermal guidelines). For continuous switching activity at 40K LE utilization, the junction temperature rise at ambient 25°C is roughly 25-35°C depending on toggle rate. The exposed pad (pin 144) MUST be soldered to the PCB ground pour for proper thermal dissipation; leaving it unsoldered increases theta_JA by ~50% and risks thermal-induced timing failures.
Per Intel MAX 10 datasheet, the 10M40SCE144C8G requires multiple supply rails: VCC (core, typically 1.2V), VCCA (analog/pll, 2.5V), VCCIOx (per I/O bank, 1.2V-3.3V), and VCCD_PLL (PLL digital, 1.2V). Each VCCIO bank can be independently set to support mixed-voltage interfaces. Place 0.1µF decoupling capacitors within 3mm of every VCC/VCCIO/VCCA pin and a 10µF bulk capacitor near each supply rail. Add ferrite beads between analog VCCA and digital VCC to minimize ADC noise coupling.
The 144-EQFP has a 0.5mm pitch and exposed thermal pad. Per Intel layout guidelines, use 4-layer PCB with continuous ground plane beneath the FPGA; route all high-speed signals on inner layers with reference to ground. JTAG chain (TCK, TMS, TDI, TDO) requires 4.7kΩ pull-ups on TMS and TDI. The nSTATUS and CONF_DONE signals are open-drain and require external 10kΩ pull-ups to VCCIO. Daisy-chain JTAG when multiple devices are present on the board.
Do not leave unused I/O pins floating in the design - explicitly configure them as outputs driving low or as inputs with internal weak pull-up enabled in the Quartus pin assignment. Floating inputs can draw excess current and cause oscillations. When using the integrated ADC, ensure analog inputs are properly anti-aliased with RC filters (typically 100Ω + 1nF) before connecting to ADCIN pins. Avoid routing noisy digital signals near analog traces to preserve ADC SNR.
Informações de conformidade
RoHS compliant per Altera/Intel product page. AEC-Q100 not qualified on this part number - select the 10M40SAE144C8G for automotive. Halogen-free status not confirmed in verified data.
