5CGXBC7D7F31C8N - Cyclone V GX FPGA, 149.5K LE, 896-FBGA | Intel
N.º da peça: 5CGXBC7D7F31C8N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $280 | $280,00 |
| 10 | $265 | $2.650,00 |
| 100 | $245 | $24.500,00 |
| 500 | $220 | $110.000,00 |
| 1.000 | $198 | $198.000,00 |
5CGXBC7D7F31C8N Visão geral
A field-programmable gate array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), distinct from fixed-function ASICs by their post-fabrication flexibility and from microcontroller units (MCUs) by their parallel, hardware-timed execution model. Within Intel's portfolio, the Cyclone V family is positioned as the low-power, cost-optimized series for high-volume applications such as industrial motor control, video bridging, and machine-to-machine connectivity.
Key features include 149,500 logic elements (LEs), 7,880,704 embedded memory bits (approximately 963 Kbits of M10K plus 1.46 Mbits of MLAB), 312 DSP blocks of 18x18 multipliers, nine full-duplex 3.125 Gbps transceivers, two hard PCI Express Gen2 x1/x2/x4 endpoints, and eight PLLs. The 5CGXBC7D7F31C8N speed grade 8 (commercial, -8C) variant supports core VCC of 1.1 V with hot-socketing capability and configuration via passive serial, fast passive parallel, JTAG, or encrypted bitstream using AES-256.
The Cyclone V GX architecture combines a fabric of adaptive logic modules (ALMs), dedicated block RAM, DSP slices, and hard IP for PCIe, memory controllers, and high-speed serial I/O. This heterogeneous structure lets designers implement protocol bridging, signal processing, and control logic in a single device without consuming fabric resources for functions that are hardened in silicon.
Typical applications include industrial Ethernet switching and fieldbus gateways, video broadcast and surveillance processing, PCIe endpoint cards, motor drive control loops, and low-cost wireless baseband preprocessing. The transceiver-rich 5CGXC7 die (F31 package, 31 mm × 31 mm body, 1.0 mm pitch) targets designs that previously required a more expensive Arria or Stratix device.
When designing with this part, plan power-rail sequencing for 1.1 V core, 2.5 V/3.3 V auxiliary, and 1.5 V transceiver supplies, and respect the 896-ball BGA layout with 4 or 6 PCB layers and microvia stackups. Quartus II / Quartus Prime software with device support file 5CGXFC7D6 is required for synthesis, place-and-route, and bitstream generation.
This page combines drop-in same-family alternatives, parameter-by-parameter comparison, and practical PCB design notes that complement, rather than duplicate, the device datasheet and ordering information.
Alternativas drop-in para 5CGXBC7D7F31C8N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5CGXBC7D7F31C8N (mesmo formato e footprint) — diferindo em Package, Transceivers, Family, PLLs, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5CGXBC7D6F31C7N
✅ Drop-In✓ Em estoque
$312 / unidade
Ver ficha técnica →5CGXBC7D7F27C8N
✅ Drop-In✓ Em estoque
$228.5 / unidade
Ver ficha técnica →5CGXBC7D6F27C7N
✅ Drop-In✓ Em estoque
$261.55 / unidade
Ver ficha técnica →5CGXBC7C7U19C8N
✅ Drop-In✓ Em estoque
$76.8 / unidade
Ver ficha técnica →5CGXBC7C7F23C8N
✅ Drop-In✓ Em estoque
$29.7 / unidade
Ver ficha técnica →5CGTFD9A5U19A7N
✅ Drop-In✓ Em estoque
$241.5 / unidade
Ver ficha técnica →5CGXBC7D7F31C8N Classificações máximas e características elétricas
| Family | Cyclone V GX |
| Logic Elements (LE) | 149,500 |
| Embedded Memory (bits) | 7,880,704 |
| User I/O Pins | 480 |
| DSP Blocks (18x18) | 312 |
| Transceivers | 9 (up to 3.125 Gbps) |
| PCIe Hard IP | 2 × Gen2 endpoints |
| PLLs | 8 |
| Encapsulamento | 896-ball FBGA, F31 (31 × 31 mm, 1.0 mm pitch) |
| Process Node | TSMC 28 nm low-power |
| Core Voltage (VCC) | 1.1 V |
| Speed Grade | 8 (commercial) |
| Temperatura de operação | 0 °C to +85 °C (commercial) |
| Configuration Mode | Passive Serial, Fast Passive Parallel, JTAG, AES-256 encrypted |
| Status RoHS | Compliant |
| Tipo de montagem | Surface Mount (BGA) |
Guia de Configuração de Pinos do 5CGXBC7D7F31C8N 896-ball fbga, f31 (31 × 31 mm, 1.0 mm pitch)
Configuração de pinos para 5CGXBC7D7F31C8N (pacote 896-ball fbga, f31 (31 × 31 mm, 1.0 mm pitch)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 5CGXBC7D7F31C8N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
5CGXBC7D7F31C8N é adequado para 6 aplicaçãos: Industrial Ethernet Switch and Gateway, PCIe Endpoint Card for Industrial PCs, Motor Drive and Servo Control, Video Broadcast and Surveillance Processing, Wireless Baseband Preprocessing, Test and Measurement Instrumentation.
Industrial Ethernet Switch and Gateway
The Intel 5CGXBC7D7F31C8N is well suited for industrial Ethernet switches, Profinet IRT gateways, and EtherCAT slave controllers because it integrates 9 full-duplex transceivers operating up to 3.125 Gbps and 312 DSP blocks of 18×18 multipliers. The device supports SGMII, GbE, and 1000BASE-X PHYs through its hardened PCS and PMA, allowing direct connection to standard industrial PHY chips without external serializer/deserializer devices. Its 1.1 V core voltage and low static power simplify thermal design in DIN-rail enclosures, while the dual PCIe Gen2 endpoints enable host-side integration in modular PLC backplanes. A typical design uses the FPGA as a cut-through switch with hardware-accelerated priority queueing and time-sensitive networking (TSN) scheduling.
Recomendado
PCIe Endpoint Card for Industrial PCs
With two hard PCIe Gen2 endpoints and 9 transceivers, the 5CGXBC7D7F31C8N is widely used as a PCIe endpoint card on industrial PCs for vision, motion, and data-acquisition interfaces. The hardened PCIe Gen2 IP saves roughly 30,000 LEs compared with a soft IP-core approach, freeing fabric for application logic such as Camera Link acquisition, encoder counters, or high-speed ADC interfacing. Throughput of 5 Gbps per PCIe Gen2 lane allows aggregation of multiple data streams into host memory with minimal DMA overhead, and the FPGA's hot-socketing capability supports in-field card replacement without system shutdown. Quartus Prime generates the PCIe reference design as part of the IP Catalog under 'PCIe HIP.'
Recomendado
Motor Drive and Servo Control
The 5CGXBC7D7F31C8N implements high-performance field-oriented control (FOC) loops for industrial motor drives using its 312 dedicated DSP blocks. A typical 3-axis servo design runs FOC, SVPWM, and encoder interfaces at 32 kHz loop rates with deterministic latency below 4 µs thanks to the parallel fabric. Hardened PCIe Gen2 endpoints connect to a motion controller over a backplane, while transceivers support serial encoder protocols such as EnDat 2.2, BiSS, and Tamagawa. The 1.1 V core and sub-1 W static power suit the device to sealed inverter enclosures with conduction-cooled heatsinks.
Recomendado
Video Broadcast and Surveillance Processing
Broadcast studios and IP-surveillance NVRs use the 5CGXBC7D7F31C8N for SDI-to-IP bridging, multi-stream video scaling, and H.264/H.265 proxy encoding. Its 7,880,704 bits of embedded memory buffer full-HD frames at line rate, while 312 DSP blocks run 3D-DCT and motion-estimation pre-processing. The 9 transceivers carry 3G-SDI or SMPTE 2022-6 uncompressed video over 10 GbE, and the PCI Express Gen2 endpoint connects to host CPU storage for recording. The commercial -8 speed grade closes timing for 1080p60 processing without throttling, and AES-256 encrypted bitstreams protect proprietary video-processing IP.
Recomendado
Wireless Baseband Preprocessing
Small-cell and distributed-RAN architectures leverage the 5CGXBC7D7F31C8N for CPRI signal aggregation, digital pre-distortion (DPD), and crest-factor reduction (CFR) before the RF power amplifier. The 9 transceivers accept up to 9 CPRI links at 3.072 Gbps for multi-band aggregation. With 312 18×18 multipliers, the device can implement DPD look-up tables and polynomial correction for PA linearization, while the dedicated PCIe Gen2 endpoints link to a baseband SoC over the backplane. The 1.1 V core and TSMC 28 nm process yield static power below 1 W, simplifying the thermal envelope in outdoor small-cell enclosures.
Recomendado
Test and Measurement Instrumentation
Modular PXI and AXIe test platforms use the 5CGXBC7D7F31C8N as a flexible FPGA co-processor for high-speed protocol-aware test, including PCIe Gen2 link inspection, USB 3.0 protocol checks, and 10 GbE jitter analysis. The device's 9 transceivers operate up to 3.125 Gbps, supporting multi-protocol physical-layer testing through external bit-error-rate testers. A real-time pattern generator and oscilloscope capture block consume roughly 80,000 LEs and 200 DSP blocks, leaving room for protocol-state-machine engines. PCI Express Gen2 backplane integration allows test data to stream directly to host memory at 5 Gbps per lane.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5CGXBC7D7F31C8N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5CGXBC7D6F31C7N | 5CGXBC7D7F27C8N | 5CGXBC7C7U19C8N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 896-ball FBGA (F31, 31x31 mm) | 896-ball FBGA (F31) - same | 896-ball FBGA (F27, 27x31 mm) - same ball count | 672-ball UBGA (U19) - different ball count |
| Logic Elements | 149,500 | 149,500 | 149,500 | 149,500 |
| Speed Grade | -8C (commercial) | -7C (commercial, ~12-15% slower) | -8C (same) | -8C (same) |
| Transceivers | 9 × up to 3.125 Gbps | 9 × up to 3.125 Gbps | 9 × up to 3.125 Gbps | 9 × up to 3.125 Gbps |
| PCIe Hard IP | 2 × Gen2 endpoints | 2 × Gen2 endpoints | 2 × Gen2 endpoints | 2 × Gen2 endpoints |
| Price (1 piece, USD, as of 2026-09-05) | $280 | ~$255 (slightly lower for slower speed grade) | ~$280 (same speed, smaller package) | ~$225 (smaller BGA, lower unit cost) |
Principais diferenciais
- Same-die drop-in on F31 footprint with relaxed timing (vs 5CGXBC7D6F31C7N)
- Larger BGA with full I/O access (vs 5CGXBC7C7U19C8N)
- Lower unit cost with same die when I/O is not needed (vs 5CGXBC7C7F23C8N)
Notas de projeto
The Cyclone V device family requires a sequenced 1.1 V core, 2.5 V VCCPD, and 1.5 V/2.5 V/3.3 V VCCIO supply rail ramp per the manufacturer's power-up specification. A power-management IC such as an LM3880 sequencer or a discrete MOSFET plus supervisory arrangement must hold the FPGA in reset (nCONFIG held low) until all rails reach at least 90 percent of nominal; failure to follow the sequence can trigger in-rush currents and partial-configuration errors on cold boot.
Estimated: the 896-ball F31 package at 1.0 mm pitch requires a 4- or 6-layer PCB stackup with microvia (laser-drilled) layer pairs and a minimum 0.127 mm finished via pad. Decoupling follows the manufacturer reference schematic: at least 32 × 0.1 µF 0402 capacitors placed uniformly beneath the BGA footprint plus 4 × 10 µF bulk capacitors within 25 mm of the package. The Quartus Prime pin planner should be used to balance high-speed transceiver and DDR3 signals across the inner layers to avoid simultaneous-switching-noise (SSN) issues.
Do not substitute a Cyclone V E variant (such as 5CEBA4F23C8N) when the design requires PCIe or high-speed transceivers — these are unavailable on the E family and the design will not close. Also avoid mixing -8 speed-grade parts with -7 stock in production; timing-closure failures under cold corner (-40 °C) are common. Finally, when migrating between F31 and F27 BGA packages, regenerate the entire pinout and re-validate the PCB BGA land pattern, because the F27 layout is smaller in one dimension despite the same 896-ball count.
Informações de conformidade
RoHS compliance and lead-free BGA balls are confirmed by the Intel Cyclone V device declaration. Halogen-free status is not explicitly stated in the verified data and should be confirmed via the manufacturer's material declaration. The part is not AEC-Q100 qualified; it is targeted at commercial/industrial environments.
