5CGXBC7D7F31C8N - Cyclone V GX FPGA, 149.5K LE, 896-FBGA | Intel
MPN: 5CGXBC7D7F31C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $280 | $280.00 |
| 10 | $265 | $2,650.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198 | $198,000.00 |
Drop-in alternatives for 5CGXBC7D7F31C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CGXBC7D7F31C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V GX |
| Logic Elements (LE) | 149,500 |
| Embedded Memory (bits) | 7,880,704 |
| User I/O Pins | 480 |
| DSP Blocks (18x18) | 312 |
| Transceivers | 9 (up to 3.125 Gbps) |
| PCIe Hard IP | 2 × Gen2 endpoints |
| PLLs | 8 |
| Package | 896-ball FBGA, F31 (31 × 31 mm, 1.0 mm pitch) |
| Process Node | TSMC 28 nm low-power |
| Core Voltage (VCC) | 1.1 V |
| Speed Grade | 8 (commercial) |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Configuration Mode | Passive Serial, Fast Passive Parallel, JTAG, AES-256 encrypted |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
5CGXBC7D7F31C8N 896-ball fbga, f31 (31 × 31 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for 5CGXBC7D7F31C8N (896-ball fbga, f31 (31 × 31 mm, 1.0 mm pitch) package) with 480 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CGXBC7D7F31C8N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 480 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CGXBC7D7F31C8N is suitable for 6 applications: Industrial Ethernet Switch and Gateway, PCIe Endpoint Card for Industrial PCs, Motor Drive and Servo Control, Video Broadcast and Surveillance Processing, Wireless Baseband Preprocessing, Test and Measurement Instrumentation.
Industrial Ethernet Switch and Gateway
The Intel 5CGXBC7D7F31C8N is well suited for industrial Ethernet switches, Profinet IRT gateways, and EtherCAT slave controllers because it integrates 9 full-duplex transceivers operating up to 3.125 Gbps and 312 DSP blocks of 18×18 multipliers. The device supports SGMII, GbE, and 1000BASE-X PHYs through its hardened PCS and PMA, allowing direct connection to standard industrial PHY chips without external serializer/deserializer devices. Its 1.1 V core voltage and low static power simplify thermal design in DIN-rail enclosures, while the dual PCIe Gen2 endpoints enable host-side integration in modular PLC backplanes. A typical design uses the FPGA as a cut-through switch with hardware-accelerated priority queueing and time-sensitive networking (TSN) scheduling.
Recommended
PCIe Endpoint Card for Industrial PCs
With two hard PCIe Gen2 endpoints and 9 transceivers, the 5CGXBC7D7F31C8N is widely used as a PCIe endpoint card on industrial PCs for vision, motion, and data-acquisition interfaces. The hardened PCIe Gen2 IP saves roughly 30,000 LEs compared with a soft IP-core approach, freeing fabric for application logic such as Camera Link acquisition, encoder counters, or high-speed ADC interfacing. Throughput of 5 Gbps per PCIe Gen2 lane allows aggregation of multiple data streams into host memory with minimal DMA overhead, and the FPGA's hot-socketing capability supports in-field card replacement without system shutdown. Quartus Prime generates the PCIe reference design as part of the IP Catalog under 'PCIe HIP.'
Recommended
Motor Drive and Servo Control
The 5CGXBC7D7F31C8N implements high-performance field-oriented control (FOC) loops for industrial motor drives using its 312 dedicated DSP blocks. A typical 3-axis servo design runs FOC, SVPWM, and encoder interfaces at 32 kHz loop rates with deterministic latency below 4 µs thanks to the parallel fabric. Hardened PCIe Gen2 endpoints connect to a motion controller over a backplane, while transceivers support serial encoder protocols such as EnDat 2.2, BiSS, and Tamagawa. The 1.1 V core and sub-1 W static power suit the device to sealed inverter enclosures with conduction-cooled heatsinks.
Recommended
Video Broadcast and Surveillance Processing
Broadcast studios and IP-surveillance NVRs use the 5CGXBC7D7F31C8N for SDI-to-IP bridging, multi-stream video scaling, and H.264/H.265 proxy encoding. Its 7,880,704 bits of embedded memory buffer full-HD frames at line rate, while 312 DSP blocks run 3D-DCT and motion-estimation pre-processing. The 9 transceivers carry 3G-SDI or SMPTE 2022-6 uncompressed video over 10 GbE, and the PCI Express Gen2 endpoint connects to host CPU storage for recording. The commercial -8 speed grade closes timing for 1080p60 processing without throttling, and AES-256 encrypted bitstreams protect proprietary video-processing IP.
Recommended
Wireless Baseband Preprocessing
Small-cell and distributed-RAN architectures leverage the 5CGXBC7D7F31C8N for CPRI signal aggregation, digital pre-distortion (DPD), and crest-factor reduction (CFR) before the RF power amplifier. The 9 transceivers accept up to 9 CPRI links at 3.072 Gbps for multi-band aggregation. With 312 18×18 multipliers, the device can implement DPD look-up tables and polynomial correction for PA linearization, while the dedicated PCIe Gen2 endpoints link to a baseband SoC over the backplane. The 1.1 V core and TSMC 28 nm process yield static power below 1 W, simplifying the thermal envelope in outdoor small-cell enclosures.
Recommended
Test and Measurement Instrumentation
Modular PXI and AXIe test platforms use the 5CGXBC7D7F31C8N as a flexible FPGA co-processor for high-speed protocol-aware test, including PCIe Gen2 link inspection, USB 3.0 protocol checks, and 10 GbE jitter analysis. The device's 9 transceivers operate up to 3.125 Gbps, supporting multi-protocol physical-layer testing through external bit-error-rate testers. A real-time pattern generator and oscilloscope capture block consume roughly 80,000 LEs and 200 DSP blocks, leaving room for protocol-state-machine engines. PCI Express Gen2 backplane integration allows test data to stream directly to host memory at 5 Gbps per lane.
Recommended
Recommended Products Summary
Engineering reference data for 5CGXBC7D7F31C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CGXBC7D6F31C7N | 5CGXBC7D7F27C8N | 5CGXBC7C7U19C8N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 896-ball FBGA (F31, 31x31 mm) | 896-ball FBGA (F31) - same | 896-ball FBGA (F27, 27x31 mm) - same ball count | 672-ball UBGA (U19) - different ball count |
| Logic Elements | 149,500 | 149,500 | 149,500 | 149,500 |
| Speed Grade | -8C (commercial) | -7C (commercial, ~12-15% slower) | -8C (same) | -8C (same) |
| Transceivers | 9 × up to 3.125 Gbps | 9 × up to 3.125 Gbps | 9 × up to 3.125 Gbps | 9 × up to 3.125 Gbps |
| PCIe Hard IP | 2 × Gen2 endpoints | 2 × Gen2 endpoints | 2 × Gen2 endpoints | 2 × Gen2 endpoints |
| User I/O | 480 | 480 | 480 | [DATA_NEEDED: U19 user I/O count for 5CGXBC7] |
| Price (1 piece, USD, as of 2026-09-05) | $280 | ~$255 (slightly lower for slower speed grade) | ~$280 (same speed, smaller package) | ~$225 (smaller BGA, lower unit cost) |
Key Differentiators
- Same-die drop-in on F31 footprint with relaxed timing (vs 5CGXBC7D6F31C7N)
- Larger BGA with full I/O access (vs 5CGXBC7C7U19C8N)
- Lower unit cost with same die when I/O is not needed (vs 5CGXBC7C7F23C8N)
Design Notes
The Cyclone V device family requires a sequenced 1.1 V core, 2.5 V VCCPD, and 1.5 V/2.5 V/3.3 V VCCIO supply rail ramp per the manufacturer's power-up specification. A power-management IC such as an LM3880 sequencer or a discrete MOSFET plus supervisory arrangement must hold the FPGA in reset (nCONFIG held low) until all rails reach at least 90 percent of nominal; failure to follow the sequence can trigger in-rush currents and partial-configuration errors on cold boot.
Estimated: the 896-ball F31 package at 1.0 mm pitch requires a 4- or 6-layer PCB stackup with microvia (laser-drilled) layer pairs and a minimum 0.127 mm finished via pad. Decoupling follows the manufacturer reference schematic: at least 32 × 0.1 µF 0402 capacitors placed uniformly beneath the BGA footprint plus 4 × 10 µF bulk capacitors within 25 mm of the package. The Quartus Prime pin planner should be used to balance high-speed transceiver and DDR3 signals across the inner layers to avoid simultaneous-switching-noise (SSN) issues.
Do not substitute a Cyclone V E variant (such as 5CEBA4F23C8N) when the design requires PCIe or high-speed transceivers — these are unavailable on the E family and the design will not close. Also avoid mixing -8 speed-grade parts with -7 stock in production; timing-closure failures under cold corner (-40 °C) are common. Finally, when migrating between F31 and F27 BGA packages, regenerate the entire pinout and re-validate the PCB BGA land pattern, because the F27 layout is smaller in one dimension despite the same 896-ball count.
Compliance Information
RoHS compliance and lead-free BGA balls are confirmed by the Intel Cyclone V device declaration. Halogen-free status is not explicitly stated in the verified data and should be confirmed via the manufacturer's material declaration. The part is not AEC-Q100 qualified; it is targeted at commercial/industrial environments.
