5CGTFD9A5U19A7N - Cyclone V GT FPGA 301K LE UFBGA-484 | Intel
MPN: 5CGTFD9A5U19A7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $337.3 | $337.30 |
| 10 | $314.5 | $3,145.00 |
| 100 | $289.2 | $28,920.00 |
| 500 | $262 | $131,000.00 |
| 1,000 | $241.5 | $241,500.00 |
Drop-in alternatives for 5CGTFD9A5U19A7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
5CGTFD9C5U19A7N
β Drop-Inπ Reference alternative (not in catalog)
5CGTFD7D5F27I7N
β Drop-Inβ In Stock
$218.4 / Unit
View Datasheet β5CGTFD9D5F27C7N
β Drop-Inπ Reference alternative (not in catalog)
5CGTFD9A5U19A7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V GT |
| Logic Elements | 301,000 |
| Embedded Memory | 14,251,008 bits |
| User I/Os | 240 |
| Process Technology | 28 nm TSMC |
| Core Voltage | 1.1 V |
| Package | UFBGA-484 (19 mm) |
| Mounting Type | Surface Mount |
| Transceivers | Up to 9 channels, up to 3.125 Gbps |
| PCIe Hard IP | Gen2 x1/x2/x4 |
| PLLs | 4 |
| 18x18 Multipliers | 156 |
| Memory Controllers | 2 (hard) |
| Operating Temperature | -40C to +125C (Automotive / Industrial Tj) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| MSL Level | 3 (per JEDEC J-STD-020) |
5CGTFD9A5U19A7N ufbga-484 (19 mm) Pin Configuration Guide
Complete pinout information for 5CGTFD9A5U19A7N (ufbga-484 (19 mm) package) with 48 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CGTFD9A5U19A7N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 48 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CGTFD9A5U19A7N is suitable for 6 applications: Industrial Machine Vision, Motor Control and Industrial Drives, Software-Defined Radio Baseband, Video Bridge and Capture Cards, Low-Cost Wireline Backplane Aggregation, Automotive Telematics and Driver Assistance.
Industrial Machine Vision
The 5CGTFD9A5U19A7N is well suited to industrial machine vision systems because it combines 301K logic elements with 14.25 Mbits of embedded memory and hard PCIe Gen2 IP. The fabric can host real-time image-processing pipelines (Sobel filtering, blob detection, color conversion) while the hard PCIe controller streams results to a host CPU at up to 4 Gbps. With -40C to +125C junction operation, the device tolerates factory-floor thermal stress, and the 240 user I/Os accept parallel image-sensor inputs plus GPIO for trigger and strobe signals, eliminating the need for an external bridge ASIC.
Recommended
Motor Control and Industrial Drives
The 5CGTFD9A5U19A7N suits multi-axis motor control where deterministic loop rates and high-resolution PWM matter. The 156 dedicated 18x18 multipliers accelerate field-oriented control (FOC) math, while 4 PLLs generate precise switch-mode timing for IGBT and SiC gate drivers. Hard PCIe Gen2 IP simplifies the connection to a host motion controller, and the 9 transceiver channels carry EtherCAT or SERCOS III through external PHYs. The UFBGA-484 package dissipates thermal energy efficiently in sealed industrial enclosures.
Recommended
Software-Defined Radio Baseband
The 5CGTFD9A5U19A7N is a strong fit for software-defined radio (SDR) baseband processing where moderate logic density meets multi-gigabit sample links. The 9 transceiver channels accept analog-to-digital converter data streams up to 3.125 Gbps (JESD204B-style links via external PHY or LVDS), and 301K logic elements run DDC, channelization, and demodulation blocks. The 14 Mbits of block RAM serve as sample-rate conversion buffers, while hard PCIe Gen2 IP delivers baseband I/Q to a host CPU for upper-layer MAC and protocol processing.
Recommended
Video Bridge and Capture Cards
The 5CGTFD9A5U19A7N supports video bridge and capture card designs that convert Camera Link, CoaXPress, or HDMI streams into PCIe or 10 GbE packets. The 3.125 Gbps transceivers handle the high-speed serialized video channels, while the hard PCIe Gen2 IP endpoint presents the video data to the host CPU with minimal latency. With 14 Mbits of embedded memory, the FPGA can buffer line-scan data and frame drops without external SDRAM, reducing BOM cost for embedded vision appliances.
Recommended
Low-Cost Wireline Backplane Aggregation
The 5CGTFD9A5U19A7N suits aggregation nodes in low-cost wireline backplanes where multiple 1 Gbps links terminate at a single fabric. Nine transceiver channels provide up to 28 Gbps of aggregated serial bandwidth, which is sufficient for edge-of-card aggregation and CPRI 3 observation paths. Hard PCIe Gen2 IP plus 240 user I/Os make it easy to bridge the aggregated traffic to a host CPU, and the UFBGA-484 package keeps the design within a 19x19 mm footprint.
Recommended
Automotive Telematics and Driver Assistance
The 5CGTFD9A5U19A7N's automotive-grade temperature profile (-40C to +125C Tj) and 3.125 Gbps transceiver channels suit automotive telematics, surround-view driver assistance, and front-camera preprocessing ECUs. The 301K logic elements run image rectification and lane-detection algorithms, while the hard PCIe Gen2 IP interfaces to the vehicle's ADAS SoC. The RoHS-compliant UFBGA-484 package is compatible with automotive PCB processes and high-vibration environments.
Recommended
Recommended Products Summary
Engineering reference data for 5CGTFD9A5U19A7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CGTFD9C5U19A7N | 5CGTFD7D5F27I7N | 5CGTFD9D5F27C7N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | UFBGA-484 (U19) | UFBGA-484 (U19) | FBGA-672 (F27) | FBGA-672 (F27) |
| Family | Cyclone V GT | Cyclone V GT | Cyclone V GT | Cyclone V GT |
| Logic Elements | 301,000 | 301,000 | 149,500 | 301,000 |
| Transceiver Channels | 9 | 9 | 9 | 9 |
| Max Transceiver Data Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
| PCIe Hard IP | Gen2 x1/x2/x4 | Gen2 x1/x2/x4 | Gen2 x1/x2/x4 | Gen2 x1/x2/x4 |
| Temperature Grade | Automotive -40C to +125C Tj | Commercial 0C to +85C Tj | Industrial -40C to +100C Tj | Commercial 0C to +85C Tj |
| User I/Os | 240 | 240 | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Mid-density Cyclone V GT with full 9-channel 3.125 Gbps transceiver support (vs 5CGTFD7D5F27I7N)
- Automotive-grade temperature profile with same die as commercial U19 (vs 5CGTFD9C5U19A7N)
- Hard PCIe Gen2 IP versus soft-IP implementations (vs Cyclone V E devices)
Design Notes
Transceiver channels on the 5CGTFD9A5U19A7N must be routed on inner stripline layers with controlled 50 ohm differential impedance and length matching within the limits stated in the Cyclone V GT Transceiver User Guide. AC-coupling capacitors are required between the FPGA and the external PHY or connector; place them as close to the receiver pins as the BGA fanout allows. Keep the transceiver analog power planes (VCCR_GXB, VCCT_GXB) isolated from digital switching planes to avoid coupling noise into the 3.125 Gbps PLLs.
Estimated: at full logic utilization with 9 active transceiver channels, the 5CGTFD9A5U19A7N can dissipate 3-5 W. The UFBGA-484 package has a theta-JA around 12-15 C/W on a JEDEC 8-layer test board (per Cyclone V thermal guidelines), producing a 36-75 C temperature rise above ambient. In sealed enclosures, provide thermal vias under the central ball array and a copper spreader or heat spreader to keep Tj below +125 C for automotive-grade operation.
Do not use the 5CGTFD9A5U19A7N 'A' (automotive) OPN in commercial-only designs without confirming the broader temperature profile is acceptable; conversely, the 'C' (commercial) variants may fail in industrial deployments with elevated ambient. Also verify that the Quartus Prime version supports the specific OPN - some legacy Quartus versions (older than 16.0) lack complete Cyclone V GT support. Always regenerate the pin connection guidelines file before board layout.
Use microvia or laser-drilled stacked-via technology for the 0.8 mm pitch BGA fanout to escape the central array. The UFBGA-484 BGA has a 19 x 19 mm body with 22 x 22 ball array; allow a minimum of 4 routing layers between the BGA and the first via. Reference Intel's Cyclone V Board Design Guidelines for recommended stackup and via dimensions.
Compliance Information
RoHS compliance per Altera/Intel product page. The 'A' temperature grade targets automotive profiles but the Cyclone V GT family is not AEC-Q100 qualified in the strict sense; consult Intel for automotive PPAP support. Lead-free and Pb-free terminal finish.
