5CGXBC7D7F27C8N - Cyclone V GX FPGA, 149.5K LE, 672-BGA | Intel
MPN: 5CGXBC7D7F27C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $269.5 | $2,695.00 |
| 100 | $254 | $25,400.00 |
| 250 | $241.75 | $60,437.50 |
| 500 | $228.5 | $114,250.00 |
Drop-in alternatives for 5CGXBC7D7F27C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CGXBC7D7F31C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$198 / Unit
View Datasheet →5CGXBC7D6F27C8N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
5CGXBC7C7U19C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$76.8 / Unit
View Datasheet →5CGXBC7C7F23C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$29.7 / Unit
View Datasheet →5CGTFD9A5U19A7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$241.5 / Unit
View Datasheet →5CEFA9F27C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$295 / Unit
View Datasheet →5CGXBC7D7F27C8N Maximum Ratings & Electrical Characteristics
| Series | Cyclone V GX |
| Family | Cyclone V (5CGXBC7) |
| Logic Elements (LE) | 149,500 |
| Embedded Memory Bits | 7,880,704 |
| Block RAM (M10K) | 446 blocks / 12.5 Mb |
| 18x18 Multipliers | 364 |
| User I/O Pins (maximum) | 364 |
| Transceivers | 9 channels @ up to 3.125 Gbps |
| PCIe Hard IP Block | Yes (Gen2 x1/x2/x4) |
| Process Node | TSMC 28 nm low-power |
| Package | 672-ball FBGA (27 x 27 mm, 1.0 mm pitch) |
| Speed Grade | C8 (8 ns, commercial) |
| Operating Junction Temperature | 0 C to 85 C (commercial) |
| Supply Voltage (core) | 1.1 V typical |
| Lead-Free / RoHS | Yes (N suffix = Pb-free) |
| Configuration Method | Active serial (AS x4) / Passive serial / JTAG |
| Memory Controllers | Hard DDR3/DDR2/LPDDR2 controller |
5CGXBC7D7F27C8N 672-ball fbga (27 x 27 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for 5CGXBC7D7F27C8N (672-ball fbga (27 x 27 mm, 1.0 mm pitch) package) with 364 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CGXBC7D7F27C8N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 364 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CGXBC7D7F27C8N is suitable for 6 applications: PCI Express Gen2 Endpoint Card, Industrial Machine Vision (GigE Vision / CoaXPress), Motor Control and Encoder Interface, Broadcast Video Bridging and SDI, Software-Defined Radio Front-End, Industrial IoT Gateway with Multi-Protocol Backhaul.
PCI Express Gen2 Endpoint Card
The 5CGXBC7D7F27C8N's hard PCIe Gen2 IP block and 9 integrated 3.125 Gbps transceivers make it ideal for low-cost PCIe x1/x2/x4 endpoint cards such as frame grabbers, data-acquisition boards, and software-radio front-ends. With 149,500 LE, the device can implement the PCIe hard IP plus a custom DMA engine and protocol logic without external PHYs, reducing BOM cost by roughly 30% versus an FPGA-plus-discrete-PHY solution. Reference designs in the Intel Cyclone V PCIe Development Kit show typical Gen2 x4 throughput of around 1.6 GB/s with 256-byte payloads.
Recommended
Industrial Machine Vision (GigE Vision / CoaXPress)
For machine-vision cameras and frame grabbers, the 5CGXBC7D7F27C8N's 9 transceivers are sufficient to drive one GigE Vision link plus two CoaXPress downlinks (each at up to 3.125 Gbps) or a single 4-lane CoaXPress uplink at 6.25 Gbps. The 364 user I/O and 446 M10K blocks (12.5 Mb) provide generous headroom for image-line buffers and Bayer-to-RGB conversion pipelines. Industrial temperature variants exist (I suffix) but the C8N part handles 0-85 C commercial enclosures well.
Recommended
Motor Control and Encoder Interface
The 5CGXBC7D7F27C8N's 364 hardware 18x18 multipliers (effective 364 27x27 DSP blocks) and 12.5 Mb block RAM make it well-suited to multi-axis servo control loops running field-oriented control (FOC) at 32 kHz per axis. Its 364 user I/O can directly interface quadrature encoders, Hall sensors, and resolver-to-digital converter outputs. The hard DDR3 controller streams position logs to host memory at multi-MB/s rates for predictive maintenance analytics.
Recommended
Broadcast Video Bridging and SDI
Cyclone V GX devices are commonly used to bridge between SDI, HDMI, DisplayPort, and Ethernet in broadcast equipment. The 5CGXBC7D7F27C8N can implement multi-rate SDI receivers/transmitters (SD/HD/3G) in soft IP, and its 9 transceivers support 3G-SDI links directly. The 149.5K LE fits color-space conversion, scaling, and genlock logic alongside the serial protocol stack.
Recommended
Software-Defined Radio Front-End
For SDR systems where the FPGA pre-processes samples before forwarding to a host CPU or DSP, the 5CGXBC7D7F27C8N's transceivers interface directly to ADC/DAC evaluation boards (e.g. AD9680BCPZ-500/1250) via JESD204B subclass 1, and the 364 DSP blocks perform channelization, decimation, and FFT pipelines. The 12.5 Mb block RAM holds windowing coefficients and overlap-save buffers. The commercial 0-85 C grade is appropriate for indoor rack-mounted radio units.
Recommended
Industrial IoT Gateway with Multi-Protocol Backhaul
The 5CGXBC7D7F27C8N's transceiver count supports concurrent EtherCAT, PROFINET, or EtherNet/IP master connections alongside legacy RS-485/Modbus RTU channels via soft IP. The 7.88 Mb embedded memory accommodates protocol-stack buffers and TLS handshake scratch space. Combined with the hard DDR3 controller, this device can run an embedded Linux soft-core (Nios V) alongside the real-time protocol stack.
Recommended
Recommended Products Summary
Engineering reference data for 5CGXBC7D7F27C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CGXBC7D7F31C8N | 5CGXBC7D6F27C8N | 5CGTFD9A5U19A7N | 5CEFA9F27C7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FBGA (F27) | 672-ball FBGA (F31) | 672-ball FBGA (F27) - same | 672-ball FBGA (U19) | 484-ball FBGA (F27) |
| Logic Elements | 149,500 | 149,500 | 149,500 | 301,000 | 113,560 |
| Embedded Memory | 7,880,704 bits | 7,880,704 bits | 7,880,704 bits | 13,917,440 bits | 5,846,400 bits |
| 18x18 Multipliers | 364 | 364 | 256 | 684 | 224 |
| Transceivers | 9 @ 3.125 Gbps | 9 @ 3.125 Gbps | 6 @ 3.125 Gbps | 12 @ 5 Gbps | 0 (E family, no transceivers) |
| Hard PCIe Gen2 | Yes | Yes | Yes | Yes (Gen2) | No |
| Speed Grade | C8 (commercial) | C8 | C8 | A7 | C7 |
| Approx. Unit Price (qty 1) | USD 285 | USD 295 | USD 260 | USD 360 | USD 195 |
Key Differentiators
- Hard PCIe Gen2 IP block eliminates external PHY (vs 5CEFA9F27C7N (Cyclone V E))
- 9 integrated 3.125 Gbps transceivers (vs 5CGXBC7D6F27C8N)
- C8 speed grade gives 15% higher Fmax (vs 5CGXBC7D6F27C7N)
- Mid-density sweet spot in Cyclone V GX family (vs 5CGTFD9A5U19A7N (Cyclone V GT))
Design Notes
Estimated: at 1.1 V core and ~3 A typical dynamic current, core power is roughly 3.3 W when the device is fully utilized. Add 0.5-1.5 W for transceivers running 3.125 Gbps PRBS-31 patterns. The 672-ball FBGA exposes sufficient ground balls for low-inductance return paths - allocate at least 30% of PCB top and inner layers under the BGA to power/ground planes. Use at least 8 decoupling capacitors (4.7 uF bulk + 0.1 uF high-frequency) within 5 mm of the BGA.
The 672-ball FBGA uses 1.0 mm ball pitch and requires laser-drilled microvias (HDI PCB) with stacked via-in-pad or staggered microvia fan-out. Recommended stack-up: 8-layer 1+N+1 with 0.5 oz copper on outer layers. Match all differential transceiver pairs to 100 ohm +/-10% impedance and length-match intra-pair to within 150 um. Length-match inter-pair within 2.5 mm for PCIe Gen2 x4.
Estimated: at 3.3 W core + 1 W transceiver, total dissipation is around 4.3 W. With the 27x27 mm FBGA package, theta_JA is approximately 12 C/W still-air, giving a 52 C temperature rise - within the 85 C commercial junction limit but with no margin. Add 100 LFM airflow or a small heatsink for industrial-grade reliability. The F27 package has no integrated heat spreader, so the BGA balls are the only thermal path.
Do NOT confuse C8 (speed grade 8 ns, commercial 0-85 C) with C8N or I8N variants. The N suffix only indicates Pb-free, not industrial. For -40 to 100 C operation you must select an I-suffix part such as 5CGXBC7D7F27I7N. Also note that Cyclone V GX F27 (27x27 mm) and F31 (31x31 mm) packages share the same silicon but differ in ball count - migrating between them requires pin reassignment but no logic rework.
Compliance Information
RoHS and REACH compliant per Intel Cyclone V product family declaration. Pb-free per N suffix. AEC-Q100 is not applicable (FPGAs are not automotive-qualified ICs in the strict sense, though automotive-temp variants exist with I suffix).
