5CSEBA5U19I7SN - 85K LE Cyclone V SE SoC FPGA | Intel / Altera
N.º da peça: 5CSEBA5U19I7SN ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $154.48 | $154,48 |
| 10 | $145.5 | $1.455,00 |
| 100 | $132.2 | $13.220,00 |
| 250 | $125.8 | $31.450,00 |
| 500 | $118.4 | $59.200,00 |
5CSEBA5U19I7SN Visão geral
A Cyclone V SE SoC FPGA is a heterogeneous computing device that pairs an ARM Cortex-A9 hard processor system with programmable logic on a single die, enabling tight coupling between software execution and hardware-accelerated functions. This device belongs to the broader Cyclone V family (Cyclone V E, GX, GT, SE, SX, ST) — a low-power mid-density FPGA family positioned between MAX series CPLDs and high-end Stratix devices, optimized for cost- and power-sensitive embedded applications.
Key features include 85K logic elements (LEs), 4,450 Kbits of embedded memory (M10K + M9K blocks), 87 variable-precision DSP blocks, 4 phase-locked loops (PLLs), and integrated transceivers on SE-class devices (per Cyclone V SE device overview). The HPS section includes single-core ARM Cortex-A9 MPCore up to 800 MHz with NEON media engine, single-precision/half-precision floating-point unit, CoreSight debug and trace, L1 cache (32 KB I-cache + 32 KB D-cache), 512 KB shared L2 cache, and a rich set of peripherals (USB 2.0, Gigabit Ethernet, DDR3 controller, NAND/NOR flash controllers, I2C, SPI, UART).
Architecture leverages TSMC's 28 nm low-power process technology with hard IP blocks for memory controllers, PCIe Gen2 (x1/x2 lanes on supported variants), and high-speed serial interfaces, eliminating soft implementation overhead. The 5CSEBA5U19I7SN is the 'A5' speed/lut grade option (mid-tier speed) in the U19 package and operates across the industrial -40C to +100C junction temperature range per device datasheet.
Typical applications include industrial motor control, factory automation with HMI touchscreens, video surveillance with hardware-accelerated analytics, smart energy / grid edge monitoring, automotive ADAS prototyping, medical imaging pre-processing, machine vision, and low-cost software-defined radio front-ends. The integrated ARM core simplifies Linux/RTOS deployment while the FPGA fabric handles real-time DSP, custom interfaces, or protocol bridging.
When designing with this device, plan the HPS pin mux early using the Quartus II / Quartus Prime Qsys / Platform Designer toolchain — the HPS pin multiplexes over 60 peripherals across a limited external pin set. Use the Cyclone V SoC development kit or Arrow SoCKit evaluation board as a hardware reference, and verify DDR3 interface signal integrity with the device IBIS models before PCB fabrication.
This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone V SE family, and practical design considerations not found in the manufacturer datasheet alone.
Alternativas drop-in para 5CSEBA5U19I7SN — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5CSEBA5U19I7SN (mesmo formato e footprint) — diferindo em Package, Logic Elements, Operating Temperature, DSP Blocks, Transceivers.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5CSEBA5U19I7N
✅ Drop-In✓ Em estoque
$119.85 / unidade
Ver ficha técnica →5CSEBA5U19C7SN
✅ Drop-In✓ Em estoque
$305 / unidade
Ver ficha técnica →5CSEBA5U19C8SN
✅ Drop-In✓ Em estoque
$162 / unidade
Ver ficha técnica →5CSEBA6U19C7SN
✅ Drop-In✓ Em estoque
$149.85 / unidade
Ver ficha técnica →5CSEBA4U19I7SN
✅ Drop-In✓ Em estoque
$145 / unidade
Ver ficha técnica →5CSEBA5U19I7LN
✅ Drop-In✓ Em estoque
$142.8 / unidade
Ver ficha técnica →5CSEBA5U19I7SN Classificações máximas e características elétricas
| Family | Cyclone V SE SoC FPGA |
| Device Variant | 5CSEA5 |
| Logic Elements | 85K |
| Hard Processor System | Single-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Clock | 800 MHz |
| Encapsulamento | 484-pin UBG (Ultra FineLine BGA, 19x19 mm) |
| Package Designator | U19 |
| Speed/Logic Grade | A5 (mid-tier speed grade) |
| User I/O Count | 66 (per distributor listing); up to 288 in Cyclone V SE family typical |
| Temperatura de junção de operação | -40C to +100C (industrial) |
| Process Technology | TSMC 28 nm low-power |
| Configuration | SRAM-based, volatile |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do 5CSEBA5U19I7SN u19
Configuração de pinos para 5CSEBA5U19I7SN (pacote u19). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 5CSEBA5U19I7SN.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
5CSEBA5U19I7SN é adequado para 7 aplicaçãos: Industrial Motor Control and Drives, Machine Vision and Smart Cameras, Video Surveillance with Analytics, Smart Energy and Grid Edge Monitoring, Software-Defined Radio Front-End, Automotive ADAS Prototyping, Medical Imaging Pre-Processing.
Industrial Motor Control and Drives
The 5CSEBA5U19I7SN is well-suited for industrial motor control applications where its 800 MHz ARM Cortex-A9 hard processor system runs the control loop firmware while the 85K-logic-element FPGA fabric executes field-oriented control (FOC) PWM generation with sub-microsecond latency. With variable-precision DSP blocks available in the Cyclone V SE family, the device handles Park/Clarke transforms and current/voltage PI controllers without consuming all fabric resources. The integrated HPS peripheral set (EtherCAT slave, USB, UART) connects directly to industrial network stacks.
Recomendado
Machine Vision and Smart Cameras
The 5CSEBA5U19I7SN's combination of an ARM Cortex-A9 processor for image pipeline processing and FPGA fabric for hardware-accelerated pixel-level operations (Sobel edge detection, color space conversion, defect classification) makes it an ideal single-chip platform for smart cameras and machine vision systems. The 484-pin UBG package exposes high-speed LVDS pairs suitable for direct connection to MIPI CSI-2 image sensors via soft IP bridges. The industrial -40C to +100C operating range ensures reliable operation in factory floor enclosures.
Recomendado
Video Surveillance with Analytics
For IP video surveillance NVRs and edge analytics cameras, the 5CSEBA5U19I7SN's HPS runs Linux with ONVIF/TLS stack while the FPGA fabric handles H.264/H.265 decode of incoming streams or pre-processing (motion detection, person/vehicle classification) before forwarding. The 484-pin UBG package provides sufficient user I/O for multiple gigabit Ethernet PHYs and DDR3 memory interfaces. Per Intel's reference designs, the Cyclone V SE SoC delivers 1080p30 analytics at <2 W total power.
Recomendado
Smart Energy and Grid Edge Monitoring
In smart energy meters, grid edge monitoring PMUs, and renewable inverter controllers, the 5CSEBA5U19I7SN's hard ARM core runs IEC 61850 or DNP3 protocol stacks while the FPGA fabric implements real-time FFT-based harmonic analysis and anti-aliasing filtering on AC line measurements. The industrial temperature grade ensures reliable operation across outdoor substation ambient ranges. The integrated DDR3 controller and Gigabit Ethernet peripheral simplify BOM by eliminating external memory and PHY ICs.
Recomendado
Software-Defined Radio Front-End
The 5CSEBA5U19I7SN supports software-defined radio applications where the FPGA fabric implements digital down-conversion, channelization, and digital predistortion, while the ARM Cortex-A9 HPS runs the MAC layer and network protocol stacks. With transceiver support on the Cyclone V SE device tier, the device interfaces directly to high-speed ADCs like the AD9680 family. The 800 MHz HPS clock and FPGA fabric resources are sufficient for narrowband LTE, LoRa base stations, and private radio waveforms.
Recomendado
Automotive ADAS Prototyping
The 5CSEBA5U19I7SN is well-matched to automotive ADAS pre-production prototyping for sensor fusion platforms combining front camera, radar, and LiDAR processing. The FPGA fabric performs real-time object detection on camera streams while the HPS runs sensor fusion algorithms and CAN/Ethernet vehicle network stacks. Per Intel documentation, the Cyclone V SE SoC platform is used as a hardware reference in automotive Tier 1 evaluation kits, and the industrial temperature grade is suitable for cabin-mounted ECUs.
Recomendado
Medical Imaging Pre-Processing
In ultrasound, endoscopy, and portable X-ray imaging equipment, the 5CSEBA5U19I7SN delivers deterministic real-time DSP for beamforming and image reconstruction while the ARM core handles DICOM image transfer and user interface logic. The industrial temperature range supports continuous-duty operation in clinical environments. With 85K logic elements and dedicated DSP blocks, the device can replace discrete DSP + microcontroller architectures, reducing board space by up to 60%.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5CSEBA5U19I7SN — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5CSEBA5U19I7N | 5CSEBA5U19C7SN | 5CSEBA5U19C8SN | 5CSEBA6U19C7SN | 5CSEBA4U19I7SN |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 484-pin UBG (U19, 19x19 mm) | 484-pin UBG (U19, 19x19 mm) - same | 484-pin UBG (U19, 19x19 mm) - same | 484-pin UBG (U19, 19x19 mm) - same | 484-pin UBG (U19, 19x19 mm) - same | 484-pin UBG (U19, 19x19 mm) - same |
| Logic Elements | 85K | 85K | 85K | 85K | 110K | 40K |
| Speed Grade | A5 (mid-tier) | A5 | A5 | A5 | A6 | A4 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| HPS Processor | Single-core ARM Cortex-A9 @ 800 MHz | Single-core ARM Cortex-A9 @ 800 MHz | Single-core ARM Cortex-A9 @ 800 MHz | Single-core ARM Cortex-A9 @ 800 MHz | Single-core ARM Cortex-A9 @ 800 MHz | Single-core ARM Cortex-A9 @ 800 MHz |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
| Approximate Unit Price (qty 1) | USD 154.48 | Similar tier (USD 150-160) | Slightly lower (commercial grade) | Higher (faster speed grade) | Higher (110K LE density) | Lower (40K LE density) |
Principais diferenciais
- Industrial temperature grade in identical pin-compatible footprint (vs 5CSEBA5U19C7SN (commercial temperature variant))
- Mid-density 85K logic element tier for cost-optimized designs (vs 5CSEBA6U19C7SN (110K LE A6 variant))
- Lower LE count with same HPS reduces total power and BOM cost (vs 5CSEBA5U19C8SN (faster speed grade variant))
Notas de projeto
The 484-pin UBG (Ultra FineLine BGA) package uses a 19x19 mm body with 0.8 mm pitch. Per Intel's Cyclone V Device Datasheet, route all HPS shared I/O banks on the package perimeter using 4 mil trace width and 4 mil spacing with microvia in-pad construction for the breakout. The DDR3 controller pins require matched-length routing within +/-25 mil tolerance to maintain 800 MT/s operation. Decoupling: 1x 10uF + 4x 100nF per power pin pair, with all caps placed within 200 mil of the BGA pad.
Cyclone V SE SoC devices dissipate up to 3.5 W under typical industrial workloads (1 GHz HPS core active, 50% fabric utilization at 200 MHz). The UBG package has theta_JA of approximately 15 C/W with a 4-layer PCB and adequate thermal vias under the package. For enclosed IP65/IP67 enclosures or ambient temperatures above +70C, derate by 25% and add a thermal pad to the enclosure wall. Use Quartus Prime's PowerPlay analyzer early in the design cycle to estimate junction temperature rise and avoid over-temperature shutdown.
HPS pin multiplexer configuration is finalized early in the design — once pin assignments are locked, changes ripple through the entire board layout. Use Platform Designer (formerly Qsys) to generate the HPS pinout table, then map each peripheral function to specific HPS I/O banks before PCB layout begins. Reserve 10-15% of HPS I/O as reconfigurable pins via the HPS GPIO multiplexer for late-stage debugging. Critical: do NOT route high-speed LVDS signals (e.g., MIPI CSI-2 deserialized clock) adjacent to DDR3 byte lanes — keep at least 4x trace-spacing separation.
Common pitfalls with the Cyclone V SoC platform: (1) Attempting to boot from NAND flash with ECC disabled — enable hardware ECC in U-Boot for production-grade reliability. (2) Configuring HPS clocks faster than 800 MHz — the A5 speed grade enforces this ceiling. (3) Skipping the FPGA configuration image load before HPS boot — when using a single shared flash for both HPS preloader and FPGA bitstream, the HPS bootloader must reach the 'load bitstream' stage before the FPGA fabric is enabled. (4) Forgetting to pull MSEL[2:0] pins to the correct boot mode selection.
For HPS DDR3 interface at 800 MT/s (400 MHz clock), maintain a 4-layer minimum stackup with continuous ground planes beneath the DDR3 signals. Per Intel's external memory interface guidelines, use IBIS simulations for critical nets and target SSO noise below 0.4V peak. The HPS DDR controller supports ZQ calibration — connect the 240-ohm 1% reference resistor to the ZQ pin per datasheet. Use write leveling and read capture training at boot time to compensate for board variation.
Informações de conformidade
RoHS and lead-free per Intel/Altera Cyclone V product family compliance documentation. AEC-Q100 not applicable — this is a commercial/industrial-grade SoC FPGA; AEC-Q100 qualified variants exist as separate ordering part numbers. Halogen-free status not explicitly stated in verified web data.
