5CSEBA5U19I7SN - 85K LE Cyclone V SE SoC FPGA | Intel / Altera
MPN: 5CSEBA5U19I7SN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $154.48 | $154.48 |
| 10 | $145.5 | $1,455.00 |
| 100 | $132.2 | $13,220.00 |
| 250 | $125.8 | $31,450.00 |
| 500 | $118.4 | $59,200.00 |
Drop-in alternatives for 5CSEBA5U19I7SN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CSEBA5U19I7SN Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Device Variant | 5CSEA5 |
| Logic Elements | 85K |
| Hard Processor System | Single-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Clock | 800 MHz |
| Package | 484-pin UBG (Ultra FineLine BGA, 19x19 mm) |
| Package Designator | U19 |
| Speed/Logic Grade | A5 (mid-tier speed grade) |
| User I/O Count | 66 (per distributor listing); up to 288 in Cyclone V SE family typical |
| Operating Junction Temperature | -40C to +100C (industrial) |
| Process Technology | TSMC 28 nm low-power |
| Configuration | SRAM-based, volatile |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
5CSEBA5U19I7SN u19 Pin Configuration Guide
Complete pinout information for 5CSEBA5U19I7SN (u19 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA5U19I7SN.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA5U19I7SN is suitable for 7 applications: Industrial Motor Control and Drives, Machine Vision and Smart Cameras, Video Surveillance with Analytics, Smart Energy and Grid Edge Monitoring, Software-Defined Radio Front-End, Automotive ADAS Prototyping, Medical Imaging Pre-Processing.
Industrial Motor Control and Drives
The 5CSEBA5U19I7SN is well-suited for industrial motor control applications where its 800 MHz ARM Cortex-A9 hard processor system runs the control loop firmware while the 85K-logic-element FPGA fabric executes field-oriented control (FOC) PWM generation with sub-microsecond latency. With variable-precision DSP blocks available in the Cyclone V SE family, the device handles Park/Clarke transforms and current/voltage PI controllers without consuming all fabric resources. The integrated HPS peripheral set (EtherCAT slave, USB, UART) connects directly to industrial network stacks.
Recommended
Machine Vision and Smart Cameras
The 5CSEBA5U19I7SN's combination of an ARM Cortex-A9 processor for image pipeline processing and FPGA fabric for hardware-accelerated pixel-level operations (Sobel edge detection, color space conversion, defect classification) makes it an ideal single-chip platform for smart cameras and machine vision systems. The 484-pin UBG package exposes high-speed LVDS pairs suitable for direct connection to MIPI CSI-2 image sensors via soft IP bridges. The industrial -40C to +100C operating range ensures reliable operation in factory floor enclosures.
Recommended
Video Surveillance with Analytics
For IP video surveillance NVRs and edge analytics cameras, the 5CSEBA5U19I7SN's HPS runs Linux with ONVIF/TLS stack while the FPGA fabric handles H.264/H.265 decode of incoming streams or pre-processing (motion detection, person/vehicle classification) before forwarding. The 484-pin UBG package provides sufficient user I/O for multiple gigabit Ethernet PHYs and DDR3 memory interfaces. Per Intel's reference designs, the Cyclone V SE SoC delivers 1080p30 analytics at <2 W total power.
Recommended
Smart Energy and Grid Edge Monitoring
In smart energy meters, grid edge monitoring PMUs, and renewable inverter controllers, the 5CSEBA5U19I7SN's hard ARM core runs IEC 61850 or DNP3 protocol stacks while the FPGA fabric implements real-time FFT-based harmonic analysis and anti-aliasing filtering on AC line measurements. The industrial temperature grade ensures reliable operation across outdoor substation ambient ranges. The integrated DDR3 controller and Gigabit Ethernet peripheral simplify BOM by eliminating external memory and PHY ICs.
Recommended
Software-Defined Radio Front-End
The 5CSEBA5U19I7SN supports software-defined radio applications where the FPGA fabric implements digital down-conversion, channelization, and digital predistortion, while the ARM Cortex-A9 HPS runs the MAC layer and network protocol stacks. With transceiver support on the Cyclone V SE device tier, the device interfaces directly to high-speed ADCs like the AD9680 family. The 800 MHz HPS clock and FPGA fabric resources are sufficient for narrowband LTE, LoRa base stations, and private radio waveforms.
Recommended
Automotive ADAS Prototyping
The 5CSEBA5U19I7SN is well-matched to automotive ADAS pre-production prototyping for sensor fusion platforms combining front camera, radar, and LiDAR processing. The FPGA fabric performs real-time object detection on camera streams while the HPS runs sensor fusion algorithms and CAN/Ethernet vehicle network stacks. Per Intel documentation, the Cyclone V SE SoC platform is used as a hardware reference in automotive Tier 1 evaluation kits, and the industrial temperature grade is suitable for cabin-mounted ECUs.
Recommended
Medical Imaging Pre-Processing
In ultrasound, endoscopy, and portable X-ray imaging equipment, the 5CSEBA5U19I7SN delivers deterministic real-time DSP for beamforming and image reconstruction while the ARM core handles DICOM image transfer and user interface logic. The industrial temperature range supports continuous-duty operation in clinical environments. With 85K logic elements and dedicated DSP blocks, the device can replace discrete DSP + microcontroller architectures, reducing board space by up to 60%.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA5U19I7SN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA5U19I7N | 5CSEBA5U19C7SN | 5CSEBA5U19C8SN | 5CSEBA6U19C7SN | 5CSEBA4U19I7SN |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 484-pin UBG (U19, 19x19 mm) | 484-pin UBG (U19, 19x19 mm) - same | 484-pin UBG (U19, 19x19 mm) - same | 484-pin UBG (U19, 19x19 mm) - same | 484-pin UBG (U19, 19x19 mm) - same | 484-pin UBG (U19, 19x19 mm) - same |
| Logic Elements | 85K | 85K | 85K | 85K | 110K | 40K |
| Speed Grade | A5 (mid-tier) | A5 | A5 | A5 | A6 | A4 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| HPS Processor | Single-core ARM Cortex-A9 @ 800 MHz | Single-core ARM Cortex-A9 @ 800 MHz | Single-core ARM Cortex-A9 @ 800 MHz | Single-core ARM Cortex-A9 @ 800 MHz | Single-core ARM Cortex-A9 @ 800 MHz | Single-core ARM Cortex-A9 @ 800 MHz |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
| Approximate Unit Price (qty 1) | USD 154.48 | Similar tier (USD 150-160) | Slightly lower (commercial grade) | Higher (faster speed grade) | Higher (110K LE density) | Lower (40K LE density) |
Key Differentiators
- Industrial temperature grade in identical pin-compatible footprint (vs 5CSEBA5U19C7SN (commercial temperature variant))
- Mid-density 85K logic element tier for cost-optimized designs (vs 5CSEBA6U19C7SN (110K LE A6 variant))
- Lower LE count with same HPS reduces total power and BOM cost (vs 5CSEBA5U19C8SN (faster speed grade variant))
Design Notes
The 484-pin UBG (Ultra FineLine BGA) package uses a 19x19 mm body with 0.8 mm pitch. Per Intel's Cyclone V Device Datasheet, route all HPS shared I/O banks on the package perimeter using 4 mil trace width and 4 mil spacing with microvia in-pad construction for the breakout. The DDR3 controller pins require matched-length routing within +/-25 mil tolerance to maintain 800 MT/s operation. Decoupling: 1x 10uF + 4x 100nF per power pin pair, with all caps placed within 200 mil of the BGA pad.
Cyclone V SE SoC devices dissipate up to 3.5 W under typical industrial workloads (1 GHz HPS core active, 50% fabric utilization at 200 MHz). The UBG package has theta_JA of approximately 15 C/W with a 4-layer PCB and adequate thermal vias under the package. For enclosed IP65/IP67 enclosures or ambient temperatures above +70C, derate by 25% and add a thermal pad to the enclosure wall. Use Quartus Prime's PowerPlay analyzer early in the design cycle to estimate junction temperature rise and avoid over-temperature shutdown.
HPS pin multiplexer configuration is finalized early in the design — once pin assignments are locked, changes ripple through the entire board layout. Use Platform Designer (formerly Qsys) to generate the HPS pinout table, then map each peripheral function to specific HPS I/O banks before PCB layout begins. Reserve 10-15% of HPS I/O as reconfigurable pins via the HPS GPIO multiplexer for late-stage debugging. Critical: do NOT route high-speed LVDS signals (e.g., MIPI CSI-2 deserialized clock) adjacent to DDR3 byte lanes — keep at least 4x trace-spacing separation.
Common pitfalls with the Cyclone V SoC platform: (1) Attempting to boot from NAND flash with ECC disabled — enable hardware ECC in U-Boot for production-grade reliability. (2) Configuring HPS clocks faster than 800 MHz — the A5 speed grade enforces this ceiling. (3) Skipping the FPGA configuration image load before HPS boot — when using a single shared flash for both HPS preloader and FPGA bitstream, the HPS bootloader must reach the 'load bitstream' stage before the FPGA fabric is enabled. (4) Forgetting to pull MSEL[2:0] pins to the correct boot mode selection.
For HPS DDR3 interface at 800 MT/s (400 MHz clock), maintain a 4-layer minimum stackup with continuous ground planes beneath the DDR3 signals. Per Intel's external memory interface guidelines, use IBIS simulations for critical nets and target SSO noise below 0.4V peak. The HPS DDR controller supports ZQ calibration — connect the 240-ohm 1% reference resistor to the ZQ pin per datasheet. Use write leveling and read capture training at boot time to compensate for board variation.
Compliance Information
RoHS and lead-free per Intel/Altera Cyclone V product family compliance documentation. AEC-Q100 not applicable — this is a commercial/industrial-grade SoC FPGA; AEC-Q100 qualified variants exist as separate ordering part numbers. Halogen-free status not explicitly stated in verified web data.
