A3P030-2QNG68 - ProASIC3 FPGA 30K Gates 68-QFN | Microchip
N.º da peça: A3P030-2QNG68 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.64 | $7,64 |
| 10 | $7.15 | $71,50 |
| 100 | $6.6 | $660,00 |
| 500 | $6.1 | $3.050,00 |
| 1.000 | $5.65 | $5.650,00 |
A3P030-2QNG68 Visão geral
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash cells rather than an external configuration device. Within the programmable logic hierarchy, the ProASIC3 family sits under Microchip's low-density, non-volatile FPGA portfolio, positioning it above CPLDs in gate capacity while avoiding the configuration PROM required by SRAM FPGAs.
Key features include 30,000 system gates (330 logic elements per distributor listings), 310 MHz maximum system performance in the -2 speed grade, single 1.5V core supply, and instant-on operation because configuration data resides in on-chip flash. The 68-VFQFN exposed-pad package (7x7 mm class) provides a small footprint with thermal dissipation through the pad, and 49 user I/O support both 3.3V and lower-voltage I/O banks for mixed-voltage board designs.
Technologically, ProASIC3 uses a 130nm flash process with fine-grained VersTile logic architecture. Because the fabric is live at power-up, designs requiring immediate control-plane or glue-logic function do not need a host microcontroller to load bitstreams, improving system reliability and boot behavior versus SRAM-based FPGAs. Reprogrammability in-system supports field updates without changing hardware.
Typical applications include industrial control and automation glue logic, portable and space-constrained consumer designs, power sequencing and reset management, bridge and interface conversion, and secure single-chip designs where bitstream external storage is undesirable.
Design considerations: the 1.5V core rail must be sequenced and decoupled per the manufacturer datasheet, and the exposed pad must be soldered to a grounded thermal land for reliable operation. Verify I/O bank voltage assignments before layout because QFN pinout is fixed.
This page synthesizes distributor pricing, drop-in alternatives, engineering design notes, and sourcing data not found in the manufacturer datasheet.
Alternativas drop-in para A3P030-2QNG68 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P030-2QNG68 (mesmo formato e footprint) — diferindo em Configuration Memory, Family, Speed Grade, System Gates.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P030-2QNG68I
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →A3P030-QNG68
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P030-1QNG68
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
A3P030-2QNG68 Classificações máximas e características elétricas
| Family | ProASIC3 |
| System Gates | 30K |
| Logic Elements | 330 LEs |
| Number of I/O | 49 |
| Speed Grade | -2 |
| Maximum System Frequency | 310 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm flash |
| Configuration Memory | On-chip flash (non-volatile, single chip) |
| Encapsulamento | 68-VFQFN Exposed Pad |
| Tipo de montagem | Surface Mount |
| Supplier Device Package | 68-QFN |
| Programming | In-system reprogrammable |
Guia de Configuração de Pinos do A3P030-2QNG68 68-qfn
Configuração de pinos para A3P030-2QNG68 (pacote 68-qfn). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3P030-2QNG68.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3P030-2QNG68 é adequado para 6 aplicaçãos: Industrial Control and Automation Glue Logic, Power Sequencing and Reset Management, Portable and Space-Constrained Consumer Devices, Bridge and Interface Conversion, Secure Single-Chip Designs, Test, Measurement and Prototyping Boards.
Industrial Control and Automation Glue Logic
The A3P030-2QNG68 fits industrial control panels where legacy glue logic, address decoding, and handshaking functions are consolidated into one reprogrammable device. Its 30K gate capacity and 49 user I/O cover typical PLC I/O conditioning and backplane interface tasks, while the 1.5V core keeps static power low inside sealed enclosures with limited airflow. Because the flash fabric is live at power-up, the FPGA performs board-level control before any host CPU boots, eliminating boot-time logic gaps. The 68-QFN exposed-pad package solders onto compact 7x7 mm-class land patterns, and the -2 speed grade's 310 MHz capability is far above the 50-100 MHz timing needs of most industrial interfaces, giving generous timing margin across temperature.
Recomendado
Power Sequencing and Reset Management
Multi-rail boards need sequencing logic that is alive before processors start, and the A3P030-2QNG68's instant-on flash fabric is purpose-built for this role. Designers implement rail-monitor comparators, enable-pin sequencing state machines, and reset trees across the 49 I/O, with the 310 MHz fabric easily meeting microsecond-scale timing. Since configuration resides on-chip, there is no external PROM whose absence or corruption would strand rails in an undefined state, improving system-level reliability. The single 1.5V core supply minimizes rail count on the sequencer itself, and the exposed pad grounds thermal dissipation without a heatsink at the low switching activity typical of sequencing logic. Place the QFN adjacent to the supervisor ICs to shorten monitoring traces.
Recomendado
Portable and Space-Constrained Consumer Devices
Handheld and wearable designs benefit from the A3P030-2QNG68's small 68-VFQFN exposed-pad footprint and single-chip non-volatile architecture, which removes the flash configuration device that an SRAM FPGA would require, saving board area and BOM cost. The 1.5V core supports battery-operated power trees, and static power stays low in the 130nm flash process during the long idle periods typical of portable products. The 49 I/O accommodate sensor aggregation, display bridging, and button matrix logic, while the -2 speed grade handles 310 MHz-class internal processing when active. Instant-on behavior lets the device manage key-press wake-up and power-on displays before the application processor is available, improving perceived responsiveness of the product.
Recomendado
Bridge and Interface Conversion
The A3P030-2QNG68 implements protocol bridges such as SPI-to-parallel, UART-to-I2C, or legacy bus translation using its 330 logic elements and 49 flexible I/O. The -2 speed grade's 310 MHz fabric performance comfortably covers 100 MHz-class source-synchronous interfaces, while the flash fabric guarantees the bridge is functional the moment power is applied, which matters where a host must communicate through the bridge during boot. I/O banks on the QFN support mixed-voltage connections so 3.3V peripherals and lower-voltage processors can be interfaced on one device. Deterministic pin location in the fixed 68-QFN pinout simplifies routing between connectors on opposite board edges, and the exposed pad provides a solid ground reference for signal integrity on fast edges.
Recomendado
Secure Single-Chip Designs
Because the A3P030-2QNG68 stores its bitstream in on-chip flash, no external configuration device exposes the design image on the bus, an inherent security advantage over SRAM FPGAs for anti-cloning and IP-protection requirements. The 30K gate fabric holds encryption wrappers, authentication state machines, and board-level access control logic, and the 310 MHz -2 performance supports lightweight symmetric ciphers at useful data rates. Instant-on operation means security logic gates access to critical rails or buses before any processor executes, closing boot-time attack windows. The compact 68-QFN package suits tamper-conscious layouts where the FPGA sits under shields or within restricted enclosures, and reprogrammability allows post-deployment security patching in the field.
Recomendado
Test, Measurement and Prototyping Boards
Bench instruments and prototyping carriers use the A3P030-2QNG68 as reconfigurable control logic for stimulus generation, trigger distribution, and fixture handshake. The 49 I/O map cleanly to header banks, and the -2 grade's 310 MHz fabric supports precise pulse generation with sub-10 ns resolution. Non-volatile flash configuration lets an instrument power up with its fixture logic immediately loaded, avoiding host-dependent bitstream download on every power cycle, which shortens test turnaround. The 68-VFQFN exposed-pad footprint is small enough for probe-top and handheld fixture boards, while the 1.5V core keeps on-board regulator count low. In-system reprogrammability allows engineers to revise test logic between fixture revisions without soldering changes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P030-2QNG68 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P030-2QNG68I | A3P030-QNG68 | A3P030-1QNG68 |
|---|---|---|---|---|
| Package | 68-VFQFN Exposed Pad | 68-VFQFN Exposed Pad - same | 68-VFQFN Exposed Pad - same | 68-VFQFN Exposed Pad - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 30K | 30K | 30K | 30K |
| Logic Elements | 330 LEs | 330 LEs | 330 LEs | 330 LEs |
| User I/O | 49 | 49 | 49 | 49 |
| Speed Grade / Max Frequency | -2 / 310 MHz | -2 / 310 MHz | Standard (-1) / lower | -1 / lower |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Commercial | Industrial | Commercial | Commercial |
Principais diferenciais
- Highest guaranteed timing on the 68-QFN A3P030 footprint (vs A3P030-QNG68)
- Industrial temperature option on the identical die (vs A3P030-2QNG68I)
- Single-chip non-volatile configuration (vs SRAM FPGAs of similar density (e.g., Lattice iCE40 class))
Notas de projeto
Supply the A3P030 core from a clean 1.5V rail and I/O banks from their per-bank supplies per the ProASIC3 datasheet power scheme. Decouple each supply pin group with a network of 0.1 uF ceramics placed within 2 mm of the QFN pins, plus bulk capacitance near the regulator. Because the fabric is flash-based and live at power-up, verify that the core rail reaches regulation within the datasheet power-up slew requirements before relying on instant-on logic; a slow-rising rail can affect initialization behavior.
The exposed pad on the 68-VFQFN must be soldered to a grounded land pattern with an array of thermal vias; leaving it unsoldered compromises both thermal dissipation and the ground return for high-speed I/O. Use a non-solder-mask-defined pad with adequate paste segmentation to avoid voiding. Route I/O bank traces respecting bank voltage domains, since the fixed QFN pinout assigns banks to physical pin groups that cannot be reassigned in layout.
A frequent mistake is designing to 100 percent of the 330 logic elements; ProASIC3 timing closure and future revisions become difficult above roughly 80 percent utilization, so reserve headroom or step up to the A3P060. Also confirm speed-grade ordering in Libero timing reports when substituting -1 grade parts for this -2 device - a design that passes at -2 may fail setup timing at the standard grade.
For source-synchronous interfaces approaching the 310 MHz fabric capability, keep FPGA-to-connector traces length-matched and reference a continuous ground plane tied to the exposed pad. The QFN lead inductance is modest but nonzero; series-terminate fast single-ended outputs (22-33 ohm typical estimate) to control overshoot on short traces, and verify I/O standards and drive strengths against the manufacturer datasheet tables before release.
Informações de conformidade
Retrieved distributor data did not include explicit RoHS/REACH/lead-free statements for this exact orderable MPN. Verify compliance certificates on the Microchip A3P030 product page before production release.
