A3P030-2QNG68 - ProASIC3 FPGA 30K Gates 68-QFN | Microchip
MPN: A3P030-2QNG68 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.64 | $7.64 |
| 10 | $7.15 | $71.50 |
| 100 | $6.6 | $660.00 |
| 500 | $6.1 | $3,050.00 |
| 1,000 | $5.65 | $5,650.00 |
Drop-in alternatives for A3P030-2QNG68 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3P030-2QNG68I
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View Datasheet →A3P030-QNG68
✅ Drop-In📋 Reference alternative (not in catalog)
A3P030-1QNG68
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A3P030-2QNG68 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| System Gates | 30K |
| Logic Elements | 330 LEs |
| Number of I/O | 49 |
| Speed Grade | -2 |
| Maximum System Frequency | 310 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm flash |
| Configuration Memory | On-chip flash (non-volatile, single chip) |
| Package | 68-VFQFN Exposed Pad |
| Mounting Type | Surface Mount |
| Supplier Device Package | 68-QFN |
| Programming | In-system reprogrammable |
A3P030-2QNG68 68-qfn Pin Configuration Guide
Complete pinout information for A3P030-2QNG68 (68-qfn package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P030-2QNG68.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P030-2QNG68 is suitable for 6 applications: Industrial Control and Automation Glue Logic, Power Sequencing and Reset Management, Portable and Space-Constrained Consumer Devices, Bridge and Interface Conversion, Secure Single-Chip Designs, Test, Measurement and Prototyping Boards.
Industrial Control and Automation Glue Logic
The A3P030-2QNG68 fits industrial control panels where legacy glue logic, address decoding, and handshaking functions are consolidated into one reprogrammable device. Its 30K gate capacity and 49 user I/O cover typical PLC I/O conditioning and backplane interface tasks, while the 1.5V core keeps static power low inside sealed enclosures with limited airflow. Because the flash fabric is live at power-up, the FPGA performs board-level control before any host CPU boots, eliminating boot-time logic gaps. The 68-QFN exposed-pad package solders onto compact 7x7 mm-class land patterns, and the -2 speed grade's 310 MHz capability is far above the 50-100 MHz timing needs of most industrial interfaces, giving generous timing margin across temperature.
Recommended
Power Sequencing and Reset Management
Multi-rail boards need sequencing logic that is alive before processors start, and the A3P030-2QNG68's instant-on flash fabric is purpose-built for this role. Designers implement rail-monitor comparators, enable-pin sequencing state machines, and reset trees across the 49 I/O, with the 310 MHz fabric easily meeting microsecond-scale timing. Since configuration resides on-chip, there is no external PROM whose absence or corruption would strand rails in an undefined state, improving system-level reliability. The single 1.5V core supply minimizes rail count on the sequencer itself, and the exposed pad grounds thermal dissipation without a heatsink at the low switching activity typical of sequencing logic. Place the QFN adjacent to the supervisor ICs to shorten monitoring traces.
Recommended
Portable and Space-Constrained Consumer Devices
Handheld and wearable designs benefit from the A3P030-2QNG68's small 68-VFQFN exposed-pad footprint and single-chip non-volatile architecture, which removes the flash configuration device that an SRAM FPGA would require, saving board area and BOM cost. The 1.5V core supports battery-operated power trees, and static power stays low in the 130nm flash process during the long idle periods typical of portable products. The 49 I/O accommodate sensor aggregation, display bridging, and button matrix logic, while the -2 speed grade handles 310 MHz-class internal processing when active. Instant-on behavior lets the device manage key-press wake-up and power-on displays before the application processor is available, improving perceived responsiveness of the product.
Recommended
Bridge and Interface Conversion
The A3P030-2QNG68 implements protocol bridges such as SPI-to-parallel, UART-to-I2C, or legacy bus translation using its 330 logic elements and 49 flexible I/O. The -2 speed grade's 310 MHz fabric performance comfortably covers 100 MHz-class source-synchronous interfaces, while the flash fabric guarantees the bridge is functional the moment power is applied, which matters where a host must communicate through the bridge during boot. I/O banks on the QFN support mixed-voltage connections so 3.3V peripherals and lower-voltage processors can be interfaced on one device. Deterministic pin location in the fixed 68-QFN pinout simplifies routing between connectors on opposite board edges, and the exposed pad provides a solid ground reference for signal integrity on fast edges.
Recommended
Secure Single-Chip Designs
Because the A3P030-2QNG68 stores its bitstream in on-chip flash, no external configuration device exposes the design image on the bus, an inherent security advantage over SRAM FPGAs for anti-cloning and IP-protection requirements. The 30K gate fabric holds encryption wrappers, authentication state machines, and board-level access control logic, and the 310 MHz -2 performance supports lightweight symmetric ciphers at useful data rates. Instant-on operation means security logic gates access to critical rails or buses before any processor executes, closing boot-time attack windows. The compact 68-QFN package suits tamper-conscious layouts where the FPGA sits under shields or within restricted enclosures, and reprogrammability allows post-deployment security patching in the field.
Recommended
Test, Measurement and Prototyping Boards
Bench instruments and prototyping carriers use the A3P030-2QNG68 as reconfigurable control logic for stimulus generation, trigger distribution, and fixture handshake. The 49 I/O map cleanly to header banks, and the -2 grade's 310 MHz fabric supports precise pulse generation with sub-10 ns resolution. Non-volatile flash configuration lets an instrument power up with its fixture logic immediately loaded, avoiding host-dependent bitstream download on every power cycle, which shortens test turnaround. The 68-VFQFN exposed-pad footprint is small enough for probe-top and handheld fixture boards, while the 1.5V core keeps on-board regulator count low. In-system reprogrammability allows engineers to revise test logic between fixture revisions without soldering changes.
Recommended
Recommended Products Summary
Engineering reference data for A3P030-2QNG68 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P030-2QNG68I | A3P030-QNG68 | A3P030-1QNG68 |
|---|---|---|---|---|
| Package | 68-VFQFN Exposed Pad | 68-VFQFN Exposed Pad - same | 68-VFQFN Exposed Pad - same | 68-VFQFN Exposed Pad - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 30K | 30K | 30K | 30K |
| Logic Elements | 330 LEs | 330 LEs | 330 LEs | 330 LEs |
| User I/O | 49 | 49 | 49 | 49 |
| Speed Grade / Max Frequency | -2 / 310 MHz | -2 / 310 MHz | Standard (-1) / lower | -1 / lower |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Commercial | Industrial | Commercial | Commercial |
| Unit Price (approx., as of 2026-08-31) | $7.64 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest guaranteed timing on the 68-QFN A3P030 footprint (vs A3P030-QNG68)
- Industrial temperature option on the identical die (vs A3P030-2QNG68I)
- Single-chip non-volatile configuration (vs SRAM FPGAs of similar density (e.g., Lattice iCE40 class))
Design Notes
Supply the A3P030 core from a clean 1.5V rail and I/O banks from their per-bank supplies per the ProASIC3 datasheet power scheme. Decouple each supply pin group with a network of 0.1 uF ceramics placed within 2 mm of the QFN pins, plus bulk capacitance near the regulator. Because the fabric is flash-based and live at power-up, verify that the core rail reaches regulation within the datasheet power-up slew requirements before relying on instant-on logic; a slow-rising rail can affect initialization behavior.
The exposed pad on the 68-VFQFN must be soldered to a grounded land pattern with an array of thermal vias; leaving it unsoldered compromises both thermal dissipation and the ground return for high-speed I/O. Use a non-solder-mask-defined pad with adequate paste segmentation to avoid voiding. Route I/O bank traces respecting bank voltage domains, since the fixed QFN pinout assigns banks to physical pin groups that cannot be reassigned in layout.
A frequent mistake is designing to 100 percent of the 330 logic elements; ProASIC3 timing closure and future revisions become difficult above roughly 80 percent utilization, so reserve headroom or step up to the A3P060. Also confirm speed-grade ordering in Libero timing reports when substituting -1 grade parts for this -2 device - a design that passes at -2 may fail setup timing at the standard grade.
For source-synchronous interfaces approaching the 310 MHz fabric capability, keep FPGA-to-connector traces length-matched and reference a continuous ground plane tied to the exposed pad. The QFN lead inductance is modest but nonzero; series-terminate fast single-ended outputs (22-33 ohm typical estimate) to control overshoot on short traces, and verify I/O standards and drive strengths against the manufacturer datasheet tables before release.
Compliance Information
Retrieved distributor data did not include explicit RoHS/REACH/lead-free statements for this exact orderable MPN. Verify compliance certificates on the Microchip A3P030 product page before production release.
