A3P1000-2FG256M - ProASIC3 FPGA 11K LE 256-FBGA | Microchip
N.º da peça: A3P1000-2FG256M ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $68.5 | $68,50 |
| 10 | $62.3 | $623,00 |
| 100 | $55.9 | $5.590,00 |
| 500 | $50.2 | $25.100,00 |
| 1.000 | $45.1 | $45.100,00 |
A3P1000-2FG256M Visão geral
A flash-based FPGA (Field Programmable Gate Array) is a semiconductor device containing a fabric of programmable logic blocks and interconnects whose configuration is stored in on-chip flash memory. Unlike SRAM FPGAs, flash FPGAs are single-chip, non-volatile solutions that power up instantly without an external configuration PROM, placing them in the hierarchy: FPGA -> programmable logic device -> digital IC -> semiconductor.
Key features of the A3P1000 include reprogrammable flash fabric built on 130nm CMOS technology, a single 1.5V core operating supply, 147456 bits of the device's 1M-gate-class capacity, and industrial-grade operation from 0C to +85C. The '2' speed grade balances performance and cost, while the '-M' suffix denotes the tray packing option. The 256-ball FBGA offers a compact footprint suited to space-constrained boards.
Technically, ProASIC3 devices use a sea-of-modules architecture with VersaTile logic tiles configurable as LUT3, D-type flip-flop, or memory, supporting single-ended (LVCMOS, LVTTL, PCI) and differential (LVDS) I/O standards on banked VCCIB supplies.
Typical applications include industrial automation control, communications and networking line cards, test and measurement instrumentation, and military/aerospace subsystems requiring instant-on, secure, non-volatile configuration.
Design consideration: assign only I/O standards with compatible voltages to the same VCCIB bank, and follow the Microchip ProASIC3 migration application note when future device changes are planned.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone. Pricing shown is as of 2026-08-31.
Alternativas drop-in para A3P1000-2FG256M — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P1000-2FG256M (mesmo formato e footprint) — diferindo em Programmability, System Gates, Technology, I/O Banks, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P1000-2FGG256M
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$25.8 / unidade
Ver ficha técnica →A3P1000-1FGG256M
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1 / unidade
Ver ficha técnica →A3P1000-1FGG256T
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$112.06 / unidade
Ver ficha técnica →A3P1000-FGG256M
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$27.85 / unidade
Ver ficha técnica →A3P1000-FG256M
✅ Drop-In✓ Em estoque
$50.87 / unidade
Ver ficha técnica →A3P1000-2FG256M Classificações máximas e características elétricas
| Family | ProASIC3 |
| Logic Elements | 11000 LE |
| Number of I/Os | 177 I/O |
| System Frequency | 310 MHz |
| Technology | 130 nm CMOS, flash-based |
| Tensão de alimentação de operação | 1.5 V |
| Speed Grade | 2 |
| Encapsulamento / Caixa | FBGA-256 (256-LBGA) |
| Estilo de montagem | SMD/SMT |
| Minimum Operating Temperature | 0 C |
| Maximum Operating Temperature | +85 C |
| Packaging | Tray |
| Programmability | Reprogrammable, non-volatile flash |
| I/O Banks | 4 banks (banked VCCIB) |
| Configuration | Single-chip, instant-on (no external config PROM) |
| Series | A3P1000 |
Guia de Configuração de Pinos do A3P1000-2FG256M fbga-256 (256-lbga)
Configuração de pinos para A3P1000-2FG256M (pacote fbga-256 (256-lbga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3P1000-2FG256M.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3P1000-2FG256M é adequado para 6 aplicaçãos: Industrial Automation and Control, Communications and Networking Line Cards, Test and Measurement Instrumentation, Aerospace and Defense Subsystems, Motor Drive and Power Control, Secure Embedded Sensing and IoT Gateways.
Industrial Automation and Control
The A3P1000-2FG256M fits industrial automation controllers because its 11,000 flash-based logic elements implement deterministic state machines, encoder interfaces, and communication bridges without the configuration delay of SRAM FPGAs. With 177 user I/Os across four banked VCCIB domains, it directly interfaces 5V-tolerant-class LVCMOS/LVTTL peripherals alongside LVDS sensor links. Its 0C to +85C rating covers factory-floor enclosures, and the single-chip non-volatile configuration removes boot PROM cost and improves uptime in systems that must be operational within milliseconds of power application.
Recomendado
Communications and Networking Line Cards
In networking line cards, the A3P1000-2FG256M provides glue logic, bus bridging, and framer interfacing at speed grade 2 timing (system performance up to 310 MHz), which is sufficient for many parallel data-path and backplane interfaces. The FBGA-256 footprint conserves board area on dense cards, while LVDS-capable I/O banks support high-speed differential links between PHYs and switch ASICs. Non-volatile configuration eliminates the external programming flash and its boot-time window, simplifying hot-swap card management and reducing BOM count on cost-sensitive telecom hardware.
Recomendado
Test and Measurement Instrumentation
Bench and modular instruments benefit from the A3P1000's reprogrammability: test sequencers, trigger logic, and instrument bus glue logic can be field-updated via JTAG using Microchip Libero-generated bitstreams. The 11K-LE fabric implements counters, pattern generators, and capture FIFOs with speed grade 2 timing. Instant-on flash configuration means the instrument is ready as soon as power is applied, an advantage in rack systems where all cards must enumerate within a strict power-up window. Four I/O banks permit mixed-voltage interfacing to legacy TTL instrument backplanes and modern LVDS front ends.
Recomendado
Aerospace and Defense Subsystems
ProASIC3 flash FPGAs are widely used in defense subsystems because the configuration bitstream resides in on-chip non-volatile flash, reducing the risk of bitstream interception and eliminating SEU-prone external configuration memory at boot. The A3P1000-2FG256M handles payload interface control, housekeeping logic, and sensor aggregation with 177 I/Os and deterministic instant-on behavior. While this commercial temperature part is rated 0C to +85C, its architecture carries over to the family's high-reliability heritage, and designs migrate readily across ProASIC3 density and package options via the published Microchip migration notes.
Recomendado
Motor Drive and Power Control
The A3P1000-2FG256M implements PWM generation, dead-time insertion, and rotary/incremental encoder decoding for motor drives, offloading hard-real-time tasks from the host MCU. Its 310 MHz-class fabric allows fine PWM resolution at typical carrier frequencies, and instant-on configuration ensures drive outputs are safely tri-stated and logic active the moment auxiliary power appears. Banked VCCIB supplies let designers tie FPGA I/O directly to 3.3V gate-driver logic and 2.5V feedback circuits on the same device. Supervisory circuitry on board ensures clean sequencing between the 1.5V core and I/O rails.
Recomendado
Secure Embedded Sensing and IoT Gateways
For IoT gateways and secure sensor aggregation, the A3P1000's flash fabric provides hardware-rooted logic that is present from power-up, useful for tamper-detect interlocks and secure boot handshakes with an accompanying MCU. The 11K-LE capacity implements sensor interface glue logic, parallel-to-serial bridges, and crypto-accelerator front-end plumbing, while 177 I/Os connect multiple sensor buses simultaneously. The compact FBGA-256 suits small gateway boards, and field reprogrammability allows feature updates in deployed hardware without changing the PCB, extending product life and reducing maintenance logistics.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P1000-2FG256M — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P1000-2FGG256M | A3P1000-1FGG256M | A3P1000-FGG256M | A3P1000-FG256M |
|---|---|---|---|---|---|
| Package | FBGA-256 | FBGA-256 - same footprint | FBGA-256 - same footprint | FBGA-256 - same footprint | FBGA-256 - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | 11000 LE | 11000 LE | 11000 LE | 11000 LE | 11000 LE |
| User I/O | 177 I/O | 177 I/O | 177 I/O | 177 I/O | 177 I/O |
| Speed Grade | 2 | 2 - same | 1 - slower | standard - slower | standard - slower |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration | Flash, single-chip, instant-on | Flash, single-chip | Flash, single-chip | Flash, single-chip | Flash, single-chip |
Principais diferenciais
- Fastest grade in the 256-ball FG/FGG family on this footprint (vs A3P1000-FG256M)
- Instant-on non-volatile flash configuration (vs SRAM FPGAs of similar density)
- Trade-off: lower speed grade variants cost less on the same footprint (vs A3P1000-1FGG256M)
Notas de projeto
The A3P1000-2FG256M requires a 1.5V core rail plus independent VCCIB rails for each of the four I/O banks. Sequence the core rail before or together with I/O rails per the ProASIC3 power-up guidance in the datasheet, and use a supervisor such as a voltage monitor to hold the FPGA in reset until all rails are valid. Estimated: typical core current for a mid-utilization 11K-LE design is on the order of tens of milliamps, but dynamic current scales with clock frequency and toggle rate, so verify with Libero power estimation for your design.
The 256-ball FBGA with 177 signal I/Os generally requires at least a 4-layer PCB with dedicated power and ground planes to break out balls and provide low-impedance VCCIB bank supplies. Place 100nF decoupling capacitors close to each VCC/VCCIB pin pair plus bulk capacitance per rail. Ball pitch and escape routing follow the footprint available from SnapEDA (Altium, KiCad, Allegro exports) - do not hand-draw the 256-ball land pattern.
Only I/O standards with compatible voltage levels may share the same VCCIB bank; package VCCIBx pins are hard-routed to their banks per the Microchip ProASIC3 migration application note. Assign banks early in pin planning - moving a banked voltage later can force a PCB respin. Also note that substituting a different speed grade (e.g., 1 or standard instead of grade 2) requires re-running static timing analysis in Libero to confirm timing closure.
Informações de conformidade
Compliance status not stated in provided web data; the FGG (lead-free) package variants exist within the same family, suggesting the FG variant may predate full lead-free conversion. Verify on the Microchip product page.
